DATASHEET

NS
ESI G S
D
NE W
ART
FO R M E N T P
D
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EN D
A CE
03
OMM D REPL 07, X600
C
E
E
R
Sheet
September 16, 2009
E ND
L210
NOT Data
OMM 21090, IS
C
E
R
ISL
High Voltage Input Precision, Low Noise
FGA™ Voltage References
The ISL21009 FGA™ voltage references are extremely low
power, high precision, and low noise voltage references
fabricated on Intersil’s proprietary Floating Gate Analog
technology. The ISL21009 features very low noise (4.5µVP-P
for 0.1Hz to 10Hz), low operating current (180µA, Max), and
3ppm/°C of temperature drift. In addition, the ISL21009
family features guaranteed initial accuracy as low as
±0.5mV.
This combination of high initial accuracy, low power and low
output noise performance of the ISL21009 enables versatile
high performance control and data acquisition applications
with low power consumption.
Available Options
ISL21009
FN6327.7
Features
• Output Voltages . . . . . . . .1.250V, 2.500V, 4.096V, 5.000V
• Initial Accuracy . . . . . . . . . . . . . .±0.5mV, ±1.0mV, ±2.0mV
• Input Voltage Range. . . . . . . . . . . . . . . . . . . 3.5V to 16.5V
• Output Voltage Noise . . . . . . . . .4.5µVP-P (0.1Hz to 10Hz)
• Supply Current . . . . . . . . . . . . . . . . . . . . . . . .180µA (Max)
• Temperature Coefficient . . . 3ppm/°C, 5ppm/°C, 10ppm/°C
• Output Current Capability. . . . . . . . . . . . . . . Up to ±7.0mA
• Operating Temperature Range. . . . . . . . . -40°C to +125°C
• Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ld SOIC
• Pb-Free (RoHS Compliant)
Applications
• High Resolution A/Ds and D/As
VOUT
OPTION
(V)
INITIAL
ACCURACY
(mV)
TEMPCO.
(ppm/°C)
ISL21009BFB812Z
1.250
±0.5
3
ISL21009CFB812Z
1.250
±1.0
5
ISL21009DFB812Z
1.250
±2.0
10
• Battery Management/Monitoring
ISL21009BFB825Z
2.500
±0.5
3
• Industrial/Instrumentation Equipment
ISL21009CFB825Z
2.500
±1.0
5
Pinout
ISL21009DFB825Z
2.500
±2.0
10
ISL21009BFB841Z
4.096
±0.5
3
ISL21009CFB841Z
4.096
±1.0
5
ISL21009DFB841Z
4.096
±2.0
10
GND OR NC 1
8 DNC
ISL21009BFB850Z
5.000
±0.5
3
VIN 2
7 DNC
ISL21009CFB850Z
5.000
±1.0
5
DNC 3
6 VOUT
ISL21009DFB850Z
5.000
±2.0
10
GND 4
5 TRIM OR NC
PART NUMBER
1
• Digital Meters
• Bar Code Scanners
• Basestations
ISL21009
(8 LD SOIC)
TOP VIEW
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a trademark of Intersil Americas Inc.
FGA is a trademark of Intersil Corporation. Copyright Intersil Americas LLC 2007, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL21009
Pin Descriptions
PIN NUMBER
PIN NAME
DESCRIPTION
1
GND or NC
2
VIN
Power Supply Input Connection
4
GND
Ground Connection
5
TRIM or NC
6
VOUT
3, 7, 8
DNC
Can be either Ground or No Connect
Allows user trim typically ±2.5%. Leave Unconnected when unused.
Voltage Reference Output Connection
Do Not Connect; Internal Connection – Must Be Left Floating
Ordering Information
PART NUMBER
(Notes 1, 2)
PART
MARKING
VOUT OPTION
(V)
GRADE
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG. DWG. #
ISL21009BFB812Z
21009BF Z12
1.250
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009CFB812Z
21009CF Z12
1.250
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009DFB812Z
21009DF Z12
1.250
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009BFB825Z
21009BF Z25
2.500
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009CFB825Z
21009CF Z25
2.500
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009DFB825Z
21009DF Z25
2.500
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009BFB841Z
21009BF Z41
4.096
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009CFB841Z
21009CF Z41
4.096
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009DFB841Z
21009DF Z41
4.096
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009BFB850Z
21009BF Z50
5.000
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009CFB850Z
21009CF Z50
5.000
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21009DFB850Z
21009DF Z50
5.000
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD020.
2. Add “-TK” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2
FN6327.7
September 16, 2009
ISL21009
1
+5V
2
C1
10µF
3
4
GND
NC
VIN
NC
NC
VOUT
NC
GND
8
7
6
5
ISL21009-25
SPI BUS
X79000
1
2
3
4
5
6
7
8
9
10
SCK
CS
A0
CLR
A1
VCC
A2
VH
SI
VL
SO
RDY
VREF
VSS
UP
VOUT
DOWN
VBUF
OE
VFB
20
19
18
17
16
C1
0.001µF
15
14
13
12
LOW NOISE DAC OUTPUT
11
FIGURE 1. TYPICAL APPLICATION PRECISION 12-BIT SUB-RANGING DAC
3
FN6327.7
September 16, 2009
ISL21009
Absolute Voltage Ratings
Thermal Information
Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +18V
Max Voltage VOUT to GND (10s) . . . . . . . . . . . . . -0.5V to VOUT +1V
Voltage on “DNC” pins . . . . No connections permitted to these pins.
ESD Ratings
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6kV
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV
Thermal Resistance (Typical, Note 3)
JA (°C/W)
8 Ld SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
115
Storage Temperature Range . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-free Reflow Profile (Note 4). . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature Range (Industrial) . . . . . . . . . . . . . . . -40°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at
the specified temperature and are pulsed tests, therefore: TJ = TC = TA
NOTES:
3. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. Post-reflow drift for the ISL21009 devices will range from 100µV to 1.0mV based on experimental results with devices tested in sockets and also
on FR4 multi-layer PC boards. The design engineer must take this into account when considering the reference voltage after assembly.
Common Electrical Specifications (ISL21009-12, -25, -41, -50) TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
PARAMETER
VOA
TC VOUT
DESCRIPTION
VOUT Accuracy @ TA = +25°C
Output Voltage Temperature
Coefficient (Note 5)
IIN
Supply Current
VOUT / VOUT
Trim Range
ISC
Short Circuit Current
tR
CONDITIONS
MIN
TYP
MAX
UNIT
ISL21009B
-0.5
+0.5
mV
ISL21009C
-1.0
+1.0
mV
ISL21009D
-2.0
+2.0
mV
ISL21009B
3
ppm/°C
ISL21009C
5
ppm/°C
ISL21009D
10
ppm/°C
180
µA
95
±2.0
±2.5
%
TA = +25°C, VOUT tied to GND
10
mA
Turn-on Settling Time
VOUT = ±0.1%
100
µs
Ripple Rejection
f = 10kHz
60
dB
eN
Output Voltage Noise
0.1Hz  f 10Hz
4.5
µVP-P
VN
Broadband Voltage Noise
10Hz  f 1kHz
2.2
µVRMS
Electrical Specifications (ISL21009-12, VOUT = 1.250V) VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
PARAMETER
DESCRIPTION
VOUT
Output Voltage
VIN
Input Voltage Range
VOUT/VIN
Line Regulation
VOUT/IOUT
CONDITIONS
MIN
TYP
MAX
1.250
Load Regulation
3.5
UNIT
V
16.5
V
3.5V < VIN < 5.5V
50
150
µV/V
5.5V < VIN < 16.5V
10
50
µV/V
Sourcing: 0mA  IOUT  7mA
10
50
µV/mA
Sinking: -7mA  IOUT 0mA
20
100
µV/mA
VOUT/TA
Thermal Hysteresis (Note 6)
TA = +165°C
50
ppm
VOUT/t
Long Term Stability (Note 7)
TA = +25°C
50
ppm
4
FN6327.7
September 16, 2009
ISL21009
Electrical Specifications (ISL21009-25, VOUT = 2.50V)
PARAMETER
DESCRIPTION
VOUT
Output Voltage
VIN
Input Voltage Range
VOUT/VIN
Line Regulation
VOUT/IOUT
VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.
CONDITIONS
MIN
TYP
MAX
2.500
Load Regulation
3.5
UNIT
V
16.5
V
3.5V < VIN < 5.5V
50
150
µV/V
5.5V < VIN < 16.5V
10
50
µV/V
Sourcing: 0mA  IOUT  7mA
10
50
µV/mA
Sinking: -7mA  IOUT 0mA
20
100
µV/mA
VOUT/TA
Thermal Hysteresis (Note 6)
TA = +165°C
50
ppm
VOUT/t
Long Term Stability (Note 7)
TA = +25°C
50
ppm
Electrical Specifications (ISL21009-41, VOUT = 4.096V)
PARAMETER
DESCRIPTION
VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0 unless otherwise
specified.
CONDITIONS
VOUT
Output Voltage
VIN
Input Voltage Range
VOUT/VIN
Line Regulation
4.5V < VIN < 16.5V
VOUT/IOUT
Load Regulation
MIN
TYP
MAX
4.096
4.5
UNIT
V
16.5
V
50
200
µV/V
Sourcing: 0mA  IOUT  5mA
20
100
µV/mA
Sinking: -5mA  IOUT 0mA
20
150
µV/mA
VOUT/TA
Thermal Hysteresis (Note 6)
TA = +165°C
50
ppm
VOUT/t
Long Term Stability (Note 7)
TA = +25°C
50
ppm
Electrical Specifications (ISL21009-50, VOUT = 5.0V)
PARAMETER
DESCRIPTION
VIN = 10.0V, TA = -40°C to +125°C, IOUT = 0 unless otherwise specified.
CONDITIONS
VOUT
Output Voltage
VIN
Input Voltage Range
VOUT/VIN
Line Regulation
5.5V < VIN < 16.5V
VOUT/IOUT
Load Regulation
MIN
TYP
MAX
5.000
5.5
UNIT
V
16.5
V
20
90
µV/V
Sourcing: 0mA  IOUT  7mA
10
100
µV/mA
Sinking: -7mA  IOUT 0mA
20
150
µV/mA
VOUT/TA
Thermal Hysteresis (Note 6)
TA = +165°C
50
ppm
VOUT/t
Long Term Stability (Note 7)
TA = +25°C
50
ppm
NOTES:
5. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the
temperature range; in this case, -40°C to +125°C = +165°C.
6. Thermal Hysteresis is the change of VOUT measured @ TA = +25°C after temperature cycling over a specified range, TA. VOUT is read initially
at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference
between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For  TA = +165°C, the device under test is cycled
from +25°C to +125°C to -40°C to +25°C.
7. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/(1kHrs).
5
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-12) (REXT = 100k)
100
110
105
95
UNIT 3
IIN (µA)
IIN (µA)
100
95
UNIT 2
+25°C
-40°C
90
+125°C
90
UNIT 1
85
80
85
5
7
9
11
13
15
80
17
5
7
9
FIGURE 2. IIN vs VIN, 3 UNITS
UNIT 2
20
0
UNIT 3
-20
-40
5.5
7.5
9.5
11.5
13.5
(NORMALIZED TO VIN = 5.0V)
40
VOUT (µV)
VOUT (µV)
NORMALIZED TO VIN = 5V
15
17
60
UNIT 1
-60
3.5
+25°C
40
20
-40°C
0
-20
+125°C
-40
-60
-80
-100
3.5
15.5
5.5
7.5
VIN (V)
VOUT (V) NORMALIZED TO 1.250V
0.06
0.04
+25°C
+125°C
0.00
-40°C
-0.02
-0.04
-0.06
-0.08
-0.10
-6
-5
SINKING
-4
-3
-2
-1
0
1
2
3
OUTPUT CURRENT (mA)
FIGURE 6. LOAD REGULATION
6
11.5
13.5
15.5
FIGURE 5. LINE REGULATION OVER-TEMPERATURE
0.08
0.02
9.5
VIN (V)
FIGURE 4. LINE REGULATION, 3 UNITS
VOUT (mV)
13
FIGURE 3. IIN vs VIN, 3 TEMPERATURES
60
-0.12
-7
11
VIN (V)
VIN (V)
4
5
6
SOURCING
7
1.25020
1.25015
UNIT 1
UNIT 2
1.25010
1.25005
1.25000
1.24995
UNIT 3
1.24990
1.24985
1.24980
-40
-15
10
35
60
85
110
TEMPERATURE (°C)
FIGURE 7. VOUT vs TEMPERATURE, 3 UNITS
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-12) (REXT = 100k)
(Continued)
X = 10µs/DIV
Y = 200mV/DIV
0
500kHz PEAK
VIN (DC) = 10V
-10
-20
NO LOAD
PSRR (dB)
-30
-40
-50
-60
10nF
-70
100nF
-80
1nF
-90
-100
1
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FIGURE 8. PSRR AT DIFFERENT CAPACITIVE LOADS
FIGURE 9. LINE TRANSIENT RESPONSE, NO CAPACITIVE
LOAD
X = 5µs/DIV
Y = 20mV/DIV
VIN
VREF
X = 100µs/DIV
Y = 1V/DIV
FIGURE 10. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
FIGURE 11. TURN-ON TIME
GAIN IS x1000,
NOISE IS 4.5µVP-P
200
180
160
1nF LOAD
120
2mV/DIV
ZOUT ( )
140
NO LOAD
100
80
60
10nF LOAD
40
20
0
1
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FIGURE 12. ZOUT vs FREQUENCY
7
FIGURE 13. VOUT NOISE, 0.1Hz TO 10Hz
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-12) (REXT = 100k)
X = 5µs/DIV
Y = 50mV/DIV
(Continued)
X = 10µs/DIV
Y = 500mV/DIV
+7mA
+50µA
-50µA
-7mA
FIGURE 14. LOAD TRANSIENT RESPONSE
FIGURE 15. LOAD TRANSIENT RESPONSE
Typical Performance Curves (ISL21009-25) (REXT = 100k)
140
UNIT 1
120
UNIT 2
120
IIN (µA)
IIN (µA)
100
80
UNIT 3
60
40
+125°C
+25°C
110
100
-40°C
90
20
0
3.5
5.5
7.5
9.5
11.5
13.5
80
3.5
15.5
5.5
7.5
VIN (V)
13.5
15.5
FIGURE 17. IIN vs VIN, 3 TEMPERATURES
2.50010
60
UNIT 2
2.50005
2.50000
VOUT (µV)
UNIT 3
UNIT 1
2.49995
2.49990
2.49985
5.50
7.50
9.50
11.5
VIN (V)
FIGURE 18. LINE REGULATION
8
13.5
15.5
(NORMALIZED TO VIN = 5.0V)
VOUT (V)
(NORMALIZED TO 2.50V AT VIN = 5V)
11.5
VIN (V)
FIGURE 16. IIN vs VIN, 3 UNITS
2.49980
3.50
9.5
40
+25°C
20
-40°C
0
-20
+125°C
-40
-60
-80
-100
3.5
5.5
7.5
9.5
11.5
VIN (V)
13.5
15.5
FIGURE 19. LINE REGULATION OVER-TEMPERATURE
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-25) (REXT = 100k)
0.10
2.5002
0.08
2.5001
0.06
2.5000
0.04
UNIT 3
2.4999
+125°C
0.02
VOUT (V)
VOUT (mV)
(Continued)
-40°C
0.00
-0.02
2.4998
UNIT 2
2.4997
2.4996
-0.04
+25°C
-0.06
UNIT 1
2.4995
2.4994
-0.08
-0.10
-7
-6
-5
-4
-3
SINKING
-2
-1
0
1
2
3
4
OUTPUT CURRENT (mA)
5
6
7
2.4993
-40
0
-20
500kHz PEAK
VIN (DC) = 10V
0
20
40
60
80
100
120
140
TEMPERATURE (°C)
FIGURE 20. LOAD REGULATION
-10
-20
SOURCING
FIGURE 21. VOUT vs TEMPERATURE
NO LOAD
PSRR (dB)
-30
-40
-50
-60
10nF
-70
100nF
-80
1nF
-90
-100
1
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FIGURE 23. LINE TRANSIENT RESPONSE, NO CAPACITIVE
LOAD
VIN AND VOUT (V)
FIGURE 22. PSRR AT DIFFERENT CAPACITIVE LOADS
5.2
4.8
4.4
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
VIN
HIGH IIN
MEDIUM IIN
LOW IIN
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
TIME (ms)
FIGURE 24. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
9
FIGURE 25. TURN-ON TIME
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-25) (REXT = 100k)
(Continued)
GAIN IS x1000, NOISE
IS 4.5µVP-P
160
140
10nF
1nF
100
2mV/DIV
ZOUT ()
120
NO LOAD
80
60
100nF
40
20
0
1
10
100
1k
10k
FREQUENCY (Hz)
100k
1M
FIGURE 26. ZOUT vs FREQUENCY
FIGURE 27. VOUT NOISE, 0.1Hz TO 10Hz
NO OUTPUT CAPACITANCE
NO OUTPUT CAPACITANCE
7mA
+50µA
-50µA
-7mA
FIGURE 28. LOAD TRANSIENT RESPONSE
FIGURE 29. LOAD TRANSIENT RESPONSE
Typical Performance Curves (ISL21009-41) (REXT = 100k)
100
110
105
95
UNIT 3
IIN (µA)
IIN (µA)
100
95
UNIT 2
+25°C
-40°C
90
+125°C
90
UNIT 1
85
80
85
5
7
9
11
13
VIN (V)
FIGURE 30. IIN vs VIN, 3 UNITS
10
15
17
80
5
7
9
11
13
15
17
VIN (V)
FIGURE 31. IIN vs VIN, 3 TEMPERATURES
FN6327.7
September 16, 2009
ISL21009
300
4.0962
250
4.0962
4.0961
UNIT 2
UNIT 1
4.0961
UNIT 3
4.0960
4.0960
4.0959
6.5
8.5
10.5
VIN (V)
12.5
14.5
VOUT (V) NORMALIZED TO 4.096V
VOUT (mV)
+125°C
+25°C
-40°C
50
0
-50
0.00
+25°C
-40°C
-0.05
+125°C
-0.10
-0.15
-0.20
-7
-6
-5
-4
-3
SINKING
-2
-1
0
1
2
3
OUTPUT CURRENT (mA)
4
5
6
7
SOURCING
FIGURE 34. LOAD REGULATION
VIN (DC) = 5V
6.5
8.5
10.5
VIN (V)
12.5
14.5
16.5
FIGURE 33. LINE REGULATION OVER-TEMPERATURE
0.05
4.0970
4.0965
4.0960
UNIT 2
4.0955
UNIT 3
4.0950
4.0945
-40
UNIT 1
-25
-10
5
20
35
50
65
80
95
110 125
TEMPERATURE (°C)
FIGURE 35. VOUT vs TEMPERATURE
NO LOAD
VIN (AC) RIPPLE = 50mVP-P
-20
100
-200
4.5
16.5
0.10
0
150
-150
4.0958
4.5
-10
200
-100
4.0959
FIGURE 32. LINE REGULATION, 3 UNITS
PSRR (dB)
(Continued)
4.0963
VOUT (µV)
NORMALIZED TO VIN = 5.0V
VOUT (V)
NORMALIZED TO 4.096V AT VIN = 5.0V
Typical Performance Curves (ISL21009-41) (REXT = 100k)
100nF LOAD
-30
-40
10nF LOAD
-50
-60
-70
-80
1nF LOAD
1
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FIGURE 36. PSRR AT DIFFERENT CAPACITIVE LOADS
11
X = 10µs/DIV
Y = 200mV/DIV
FIGURE 37. LINE TRANSIENT RESPONSE, NO CAPACITIVE
LOAD
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-41) (REXT = 100k)
(Continued)
VIN
VREF
X = 50µs/DIV
X = 10µs/DIV
Y = 200mV/DIV
Y = 2V/DIV
FIGURE 39. TURN-ON TIME
FIGURE 38. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
GAIN IS x10,000
NOISE IS 4.5µVP-P
200
180
160
ZOUT ( )
20mV/DIV
1nF LOAD
140
120
NO LOAD
100
80
60
10nF LOAD
40
20
0
1
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
1s/DIV
FIGURE 40. ZOUT vs FREQUENCY
FIGURE 41. VOUT NOISE, 0.1Hz TO 10Hz
7mA
+50µA
-50µA
-7mA
NO OUTPUT CAPACITANCE
X = 5µs/DIV
Y = 50mV/DIV
FIGURE 42. LOAD TRANSIENT RESPONSE
12
NO OUTPUT CAPACITANCE
X = 5µs/DIV
Y = 500mA/DIV
FIGURE 43. LOAD TRANSIENT RESPONSE
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-50) (REXT = 100k)
140
110
112µA
104µA
120
100
80
IIN (µA)
IIN (µA)
100
+25°C
95µA
60
+125°C
90
40
-40°C
20
0
5.5
6.5
7.5
8.5
80
5.5
9.5 10.5 11.5 12.5 13.5 14.5 15.5 16.5
6.5
7.5
8.5
FIGURE 45. IIN vs VIN, 3 TEMPERATURES
5.0001
VOUT (µV)
(NORMALIZED TO VIN = 10.0V)
100
5.0000
4.9999
4.9998
104µA
4.9997
4.9996
95µA
4.9995
112µA
6.5
7.5
8.5
9.5
0
-100
+25°C
-200
-40°C
+125°C
-300
-400
-500
-600
-700
5.50 6.5
10.5 11.5 12.5 13.5 14.5 15.5 16.5
7.5
8.5
9.5 10.5 11.5 12.5 13.5 14.5 15.5 16.5
VIN (V)
VIN (V)
FIGURE 46. LINE REGULATION
FIGURE 47. LINE REGULATION OVER-TEMPERATURE
0.10
-40°C
0.05
0.00
VOUT (mV)
VOUT (V)
(NORMALIZED TO 5.0V AT VIN = 10V)
FIGURE 44. IIN vs VIN, 3 UNITS
4.9994
5.5
9.5 10.5 11.5 12.5 13.5 14.5 15.5 16.5
VIN (V)
VIN (V)
-0.05
+25°C
-0.10
+125°C
-0.15
-0.20
-0.25
-7 -6 -5
SINKING
-4
-3 -2 -1 0 1 2 3
OUTPUT CURRENT (mA)
4
5 6 7
SOURCING
FIGURE 48. LOAD REGULATION
13
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-50) (REXT = 100k)
0
5.001
NORMALIZED TO +25°C
5.001
UNIT 1
UNIT 2
5.000
4.999
4.999
-20
VIN (DC) = 10V
-20
VIN (AC) RIPPLE = 50mVP-P
-40
-50
-60
10nF
-70
100nF
-80
UNIT 3
4.998
-40
NO LOAD
-10
-30
PSRR (dB)
5.000
VOUT (V)
(Continued)
1nF
-90
0
20
40
60
80
100
120
-100
1
140
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
TEMPERATURE (°C)
FIGURE 50. PSRR AT DIFFERENT CAPACITIVE LOADS
FIGURE 49. VOUT vs TEMPERATURE
VIN = 10V
VIN = 10V
DVIN = 1V
DVIN = 1V
FIGURE 52. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
12
120
10
100
1nF
VIN
8
6
ZOUT (W)
VIN (V) AND VOUT (V)
FIGURE 51. LINE TRANSIENT RESPONSE, NO CAPACITIVE
LOAD
450nA
4
60
NO LOAD
40
2
0
80
270nA
0
50
100
150
200
TIME (µs)
FIGURE 53. TURN-ON TIME
14
10nF
20
340nA
250
300
0
1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 54. ZOUT vs FREQUENCY
FN6327.7
September 16, 2009
ISL21009
Typical Performance Curves (ISL21009-50) (REXT = 100k)
(Continued)
GAIN IS x1000
NOISE IS 4.5µVP-P
2mV/DIV
50µA
-50µA
FIGURE 55. VOUT NOISE, 0.1Hz TO 10Hz
FIGURE 56. LOAD TRANSIENT RESPONSE
7mA
-7mA
FIGURE 57. LOAD TRANSIENT RESPONSE
Applications Information
FGA Technology
The ISL21009 voltage reference uses floating gate
technology to create references with very low drift and supply
current. Essentially the charge stored on a floating gate cell is
set precisely in manufacturing. The reference voltage output
itself is a buffered version of the floating gate voltage. The
resulting reference device has excellent characteristics, which
are unique in the industry: very low temperature drift, high
initial accuracy, and almost zero supply current. Also, the
reference voltage itself is not limited by voltage bandgaps or
zener settings, so a wide range of reference voltages can be
programmed (standard voltage settings are provided, but
customer-specific voltages are available).
15
The process used for these reference devices is a floating
gate CMOS process and the amplifier circuitry uses CMOS
transistors for amplifier and output transistor circuitry. While
providing excellent accuracy, there are limitations in output
noise level and load regulation due to the MOS device
characteristics. These limitations are addressed with circuit
techniques discussed in other sections.
Micropower Operation
The ISL21009 consumes extremely low supply current due
to the proprietary FGA technology. Low noise performance is
achieved using optimized biasing techniques. Supply current
is typically 95µA and noise is 4.5µVP-P benefitting precision,
low noise portable applications such as handheld meters
and instruments.
FN6327.7
September 16, 2009
ISL21009
Data Converters in particular can utilize the ISL21009 as an
external voltage reference. Low power DAC and ADC
circuits will realize maximum resolution with lowest noise.
Board Mounting Considerations
For applications requiring the highest accuracy, board
mounting location should be reviewed. The device uses a
plastic SOIC package, which will subject the die to mild
stresses when the Printed Circuit (PC) board is heated and
cooled, slightly changing the shape. Placing the device in
areas subject to slight twisting can cause degradation of the
accuracy of the reference voltage due to these die stresses.
It is normally best to place the device near the edge of a
board, or the shortest side, as the axis of bending is most
limited at that location. Mounting the device in a cutout also
minimizes flex. Obviously mounting the device on flexprint or
extremely thin PC material will likewise cause loss of
reference accuracy.
Board Assembly Considerations
FGA references provide high accuracy and low temperature
drift but some PC board assembly precautions are
necessary. Normal Output voltage shifts of 100µV to 1mV
can be expected with Pb-free reflow profiles or wave solder
on multi-layer FR4 PC boards. Precautions should be taken
to avoid excessive heat or extended exposure to high reflow
or wave solder temperatures, this may reduce device initial
accuracy.
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized
or avoided. If x-ray inspection is required, it is advisable to
monitor the reference output voltage to verify excessive shift
has not occurred. If large amounts of shift are observed, it is
best to add an X-ray shield consisting of thin zinc (300µm)
sheeting to allow clear imaging, yet block x-ray energy that
affects the FGA reference.
Special Applications Considerations
In addition to post-assembly examination, there are also
other X-ray sources that may affect the FGA reference long
term accuracy. Airport screening machines contain X-rays
and will have a cumulative effect on the voltage reference
output accuracy. Carry-on luggage screening uses low level
X-rays and is not a major source of output voltage shift,
although if a product is expected to pass through that type of
screening over 100 times it may need to consider shielding
with copper or aluminum. Checked luggage X-rays are
higher intensity and can cause output voltage shift in much
fewer passes, so devices expected to go through those
machines should definitely consider shielding. Note that just
two layers of 1/2 ounce copper planes will reduce the
received dose by over 90%. The leadframe for the device
which is on the bottom also provides similar shielding.
If a device is expected to pass through luggage X-ray
machines numerous times, it is advised to mount a 2-layer
(minimum) PC board on the top, and along with a ground
16
plane underneath will effectively shield it from from 50 to 100
passes through the machine. Since these machines vary in
X-ray dose delivered, it is difficult to produce an accurate
maximum pass recommendation.
Noise Performance and Reduction
The output noise voltage in a 0.1Hz to 10Hz bandwidth is
typically 4.5µVP-P. The noise measurement is made with a
bandpass filter made of a 1-pole high-pass filter with a corner
frequency at 0.1Hz and a 2-pole low-pass filter with a corner
frequency (3dB) at 8.2Hz to create a filter with a 9.9Hz
bandwidth. Noise in the 10Hz to 1kHz bandwidth is
approximately 2.2µVP-P with no capacitance on the output.
This noise measurement is made with a 2 decade bandpass
filter made of a 1-pole high-pass filter with a corner frequency
at 1/10 of the center frequency and 1-pole low-pass filter with
a corner frequency at 10x the center frequency. Load
capacitance up to 1000pF can be added but will result in only
marginal improvements in output noise and transient
response.
The output stage of the ISL21009 does not drive heavily
capacitive loads well, so for load capacitances above
0.001µF, the noise reduction network shown in Figure 58 is
recommended. This network reduces noise significantly over
the full bandwidth. Noise is reduced to less than 15µVP-P from
1Hz to 1kHz using this network with a 0.01µF capacitor and a
2k resistor in series with a 10µF capacitor. Also, transient
response is improved. The 0.01µF value can be increased for
better load transient response with little sacrifice in output
stability.
Higher output capacitor values can be used without the RC
network to address transient loads without stability
problems, although there will be more overshoot an longer
settling times with values up to 1.0µF. Output capacitor
values greater than 1.0µF are not recommended for the
ISL21009.
.
VIN = 5.0V
10µF
0.1µF
VIN
VO
ISL21009-25
GND
2k
0.01µF
10µF
FIGURE 58. HANDLING HIGH LOAD CAPACITANCE
Turn-On Time
The ISL21009 devices have low supply current and thus, the
time to bias up internal circuitry to final values will be longer
than with higher power references. Normal turn-on time is
typically 100µs, as shown in Figure 25. Circuit design must
take this into account when looking at power-up delays or
sequencing.
FN6327.7
September 16, 2009
ISL21009
Temperature Coefficient
Output Voltage Adjustment
The limits stated for temperature coefficient (tempco) are
governed by the method of measurement. The overwhelming
standard for specifying the temperature drift of a reference is to
measure the reference voltage at two temperatures, take the
total variation, (VHIGH – VLOW), and divide by the temperature
extremes of measurement (THIGH – TLOW). The result is
divided by the nominal reference voltage (at T = +25°C) and
multiplied by 106 to yield ppm/°C. This is the “Box” method for
specifying temperature coefficient.
The output voltage can be adjusted up or down by 2.5% by
placing a potentiometer from VOUT to GND and connecting the
wiper to the TRIM pin. The TRIM input is high impedance so no
series resistance is needed. The resistor in the potentiometer
should be a low tempco (<50ppm/°C) and the resulting voltage
divider should have very low tempco <5ppm/°C. A digital
potentiometer such as the ISL95810 provides a low tempco
resistance and excellent resistor and tempco matching for trim
applications.
Typical Application Circuits
VIN = +5.0V
R = 200
2N2905
VIN
VOUT
ISL21009
VOUT = 2.50V
GND
2.5V/50mA
0.001µF
FIGURE 59. PRECISION 2.5V, 50mA REFERENCE
+3.5V TO 16.5V
0.1µF
10µF
VIN
VOUT
ISL21009-25
VOUT = 2.50V
GND
0.001µF
VCC
RH
VOUT
X9119
2-WIRE BUS
+
SDA
EL8178
SCL
VSS
(UNBUFFERED)
–
VOUT
(BUFFERED)
RL
FIGURE 60. 2.5V FULL SCALE LOW-DRIFT, LOW NOISE, 10-BIT ADJUSTABLE VOLTAGE SOURCE
17
FN6327.7
September 16, 2009
ISL21009
Typical Application Circuits (Continued)
+3.5V TO 16.5V
0.1µF
10µF
VIN
EL8178
+
VOUT
VOUT SENSE
–
ISL21009-25
LOAD
GND
FIGURE 61. KELVIN SENSED LOAD
10µF
+3.5V TO 16.5V
0.1µF
VIN
2.5V ±2.5%
VOUT
ISL21009-25
TRIM
GND
I2C
BUS
SDA
VCC
SCL
ISL95810
VSS
RH
RL
FIGURE 62. OUTPUT ADJUSTMENT USING THE TRIM PIN
18
FN6327.7
September 16, 2009
ISL21009
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
INDEX
AREA
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
H
0.25(0.010) M
B M
INCHES
E
SYMBOL
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e

B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
a
NOTES:
MILLIMETERS
8
0°
8
8°
0°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
7
8°
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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19
FN6327.7
September 16, 2009
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