RGF20A THRU RGF20M SURFACE MOUNT GLASS PASSIVATED JUNCTION FAST RECOVERY RECTIFIER Reverse Voltage - 50 to 1000 Volts ED T N E T PA Forward Current - 2.0 Amperes SMB/DO-214AA FEATURES 0.150(3.80) 0.087(2.20) 0.130(3.30) 0.075(1.90) * * * * * * * GPRC (Glass Passivated Rectifier Chip) inside Glass passivated cavity-free junction Ideal for surface mount automated applications Fast switching for high efficiency Built-in strain relief Easy pick and place o High temperature soldering guaranteed: 260 C/10 seconds, at terminals * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 0.187(4.75) 0.167(4.24) 0.016(0.40) 0.006(0.15) 0.096(2.43) 0.079(2.00) 0.055(1.40) 0.039(1.00) 0.236(6.00) 0.197(5.00) MECHANICAL DATA Case : JEDEC DO-214AA molded plastic over passivated chip Terminals : Tin plated, solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end Weight : 0.003 ounes , 0.093 gram *Dimensions in inches and (millimeters) TM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS o Ratings at 25 C ambient temperature RGF20 SYMBOLS unless otherwise specified. UNITS A B D G J JA K KA M MA Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 600 800 800 1000 1000 Volts Maximum RMS voltage VRMS 35 70 140 280 420 420 560 560 700 700 Volts VDC 50 100 200 400 600 600 800 800 1000 1000 Volts Maximum DC blocking voltage o Maximum average forward rectified current at TL=100 C I (AV) 2.0 Amps IFSM 65 Amps VF 1.3 Volts IR 5 30 100 uA Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 2.0 A o Maximum DC reverse current at rated DC blocking voltage TA=25 C o TA=125 C o TA=150 C Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range trr CJ R R JA JL TJ,TSTG 150 250 150 500 300 500 nS 300 pF 35 o 55 18 C/W o -65 to +175 C NOTES : (1) Reverse recovery test condition : IF 0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas. REV. 0 Zowie Technology Corporation RATINGS AND CHARACTERISTIC CURVES RGF20A THRU RGF20M FIG.1 - FORWARD CURRENT DERATING CURVE FIG.2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 80 60Hz RESISTIVE OR INDUCTIVE LOAD PEAK FORWARD SURGE CURRENT, AMPERES AVERAGE FORWARD RECTIFIED CURRENT, AMPERES 2.0 1.50 1.00 0.50 0 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 70 60 50 40 30 20 10 0 0 50 75 100 125 150 175 1 200 10 o NUMBER OF CYCLES AT 60Hz FIG.3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG.4 - TYPICAL REVERSE CHARACTERISTICS 100 INSTANTANEOUS REVERSE LEAKAGE CURRENT, MICROAMPERES IINSTANTANEOUS FORWARD CURRENT, AMPERES 10.00 1.00 0.10 o TJ=25 C PULSE WIDTH=300uS 1% DUTY CYCLE 0.01 0.4 0.6 0.8 1.0 1.2 1.4 o TJ = 150 C 10 o TJ = 125 C 1 o TJ = 25 C 0.1 1.6 0 INSTANTANEOUS FORWARD VOLTAGE, VOLTS FIG.5 - TYPICAL JUNCTION CAPACITANCE 40 60 80 100 110 FIG.6 - TYPICAL TRANSIENT THERMAL IMPEDANCE TRANSIENT THERMAL IMPEDANCE( C/W) o TJ = 25 C 100 o 100 JUNCTION CAPACITANCE, pF 20 PERCENT OF RATED PEAK REVERSE VOLTAGE,% 200 60 40 20 10 6 4 2 10 1 0.1 1 .1 .2 .4 1.0 2 4 10 REVERSE VOLTAGE, VOLTS REV. 0 100 LEAD TEMPERATURE, C 20 40 100 0.01 0.10 1.0 10 100 t , PULSE DURATION, sec Zowie Technology Corporation