DATASHEET

ISL8391, ISL8392, ISL8393
®
Data Sheet
August 2004
Low-Voltage, Single and Dual Supply,
Quad SPST, Analog Switches
Features
• Pin Compatible Replacements for MAX391 - MAX393
The Intersil ISL8391–ISL8393 devices are CMOS, precision,
quad analog switches designed to operate from a single +2V
to +12V supply or from a ±2V to ±6V supply. Targeted
applications include battery powered equipment that benefit
from the devices’ low power consumption (<1µW), low
leakage currents (2.5nA max), and fast switching speeds
(tON = 60ns, tOFF = 30ns). A 4Ω maximum RON flatness
ensures signal fidelity, while channel-to-channel mismatch is
guaranteed to be less than 2Ω.
The ISL8391, ISL8392, and ISL8393 are quad
single-pole/single-throw (SPST) devices. The ISL8391 has
four normally closed (NC) switches; the ISL8392 has four
normally open (NO) switches; the ISL8393 has two NO and
two NC switches and can be used as a dual SPDT, or a dual
2:1 multiplexer.
Table 1 summarizes the performance of this family. For higher
performance, pin compatible versions, see the ISL43143-5
data sheet.
TABLE 1. FEATURES AT A GLANCE
Number of Switches
Configuration
±5V RON
±5V tON/tOFF
5V RON
5V tON/tOFF
3V RON
3V tON/tOFF
Packages
ISL8391
ISL8392
ISL8393
4
4
4
All NC
All NO
2 NC/2 NO
20Ω
20Ω
20Ω
60ns/30ns
60ns/30ns
60ns/30ns
30Ω
30Ω
30Ω
85ns/25ns
85ns/25ns
85ns/25ns
83Ω
83Ω
83Ω
140ns/55ns
140ns/55ns
140ns/55ns
16 Ld SOIC (N)
FN6039.2
• Four Separately Controlled SPST Switches
• Pin Compatible with DG411, DG412, DG413
• ON Resistance (RON) . . . . . . . . . . . . 20Ω(Typ) 35Ω(Max)
• RON Matching Between Channels. . . . . . . . . . . . . . . . . . <1Ω
• Low Power Consumption (PD) . . . . . . . . . . . . . . . . . . . .<1µW
• Low Leakage Current (Max at 85oC) . . . . . . . . . . . . 2.5nA
• Fast Switching Action
- tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60ns
- tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30ns
• Minimum 2000V ESD Protection per Method 3015.7
• TTL, CMOS Compatible
• Pb-free available
Applications
• Battery Powered, Handheld, and Portable Equipment
- Barcode Scanners
- Laptops, Notebooks, Palmtops
• Communications Systems
- Radios
- Base Stations
- RF “Tee” Switches
• Test Equipment
- Ultrasound
- CAT/PET SCAN
- Electrocardiograph
• Audio and Video Switching
• General Purpose Circuits
- +3V/+5V DACs and ADCs
- Digital Filters
- Operational Amplifier Gain Switching Networks
- High Frequency Analog Switching
- High Speed Multiplexing
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Application Note AN557 “Recommended Test Procedures
for Analog Switches”
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL8391, ISL8392, ISL8393
Pinouts
(Note 1)
ISL8391 (SOIC)
TOP VIEW
ISL8392 (SOIC)
TOP VIEW
12 N.C.
NC4 6
11 NC3
12 N.C.
NO4 6
11 NO3
10 COM3
9 IN3
IN4 8
9 IN3
IN4 8
GND 5
COM4 7
10 COM3
COM4 7
13 V+
V- 4
13 V+
V- 4
GND 5
14 NO2
NO1 3
14 NC2
NC1 3
15 COM2
COM1 2
15 COM2
COM1 2
16 IN2
IN1 1
16 IN2
IN1 1
ISL8393 (SOIC)
TOP VIEW
IN1 1
COM1 2
NO1 3
V- 4
16 IN2
15 COM2
14 NC2
13 V+
GND 5
12 N.C.
NO4 6
11 NC3
COM4 7
IN4 8
10 COM3
9 IN3
NOTE:
1. Switches Shown for Logic “0” Input.
Truth Table
ISL8391
LOGIC
Ordering Information
ISL8392
ISL8393
SW 1, 2, 3, 4 SW 1, 2, 3, 4 SW 1, 4 SW 2, 3
0
On
Off
Off
On
1
Off
On
On
Off
NOTE:
Logic “0” ≤ 0.8V. Logic “1” ≥ 2.4V.
Pin Descriptions
PIN
FUNCTION
V+
Positive Power Supply Input
V-
Negative Power Supply Input. Connect to GND for
Single Supply Configurations.
GND
Ground Connection
IN
Digital Control Input
COM
PART NO.
(BRAND)
TEMP.
RANGE (oC)
PACKAGE
ISL8391IB
-40 to 85
16 Ld SOIC (N)
M16.15
ISL8391IBZ
(See Note 2)
-40 to 85
16 Ld SOIC (N)
(Pb-free)
M16.15
ISL8392IB
-40 to 85
16 Ld SOIC (N)
M16.15
ISL8392IBZ
(See Note 2)
-40 to 85
16 Ld SOIC (N)
(Pb-free)
M16.15
ISL8393IB
-40 to 85
16 Ld SOIC (N)
M16.15
ISL8393IBZ
(See Note 2)
-40 to 85
16 Ld SOIC (N)
(Pb-free)
M16.15
PKG. DWG. #
*Add “-T” suffix to part number for tape and reel packaging.
NOTE:
Analog Switch Common Pin
NO
Analog Switch Normally Open Pin
NC
Analog Switch Normally Closed Pin
N.C.
No Internal Connection
2
2. Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J Std-020B.
ISL8391, ISL8392, ISL8393
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 to 0.3V
All Other Pins (Note 3) . . . . . . . . . . . . . .((V-) - 0.3V) to ((V+) + 0.3V)
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, IN, NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV
Thermal Resistance (Typical, Note 4)
θJA (oC/W)
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
115
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Moisture Sensitivity (See Technical Brief TB363)
All Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Storage Temperature Range . . . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL839XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. Signals on NC, NO, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum current ratings.
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications: ±5V Supply
Test Conditions: VSUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified
TEMP
(oC)
(NOTE 6)
MIN
TYP
Full
V-
-
V+
V
25
-
20
35
Ω
Full
-
-
45
Ω
25
-
0.3
2
Ω
Full
-
-
4
Ω
25
-
-
4
Ω
Full
-
-
6
Ω
25
-0.1
-
0.1
nA
Full
-2.5
-
2.5
nA
25
-0.1
-
0.1
nA
Full
-2.5
-
2.5
nA
25
-0.2
-
0.2
nA
Full
-5
-
5
nA
Input Voltage High, VINH
Full
2.4
-
-
V
Input Voltage Low, VINL
Full
-
-
0.8
V
VS = ±5.5V, VIN = 0V or V+
Full
-0.5
-
0.5
µA
VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF,
VIN = 0 to 3V, (See Figure 1)
25
-
60
130
ns
Full
-
-
175
ns
25
-
30
75
ns
Full
-
-
100
ns
25
5
10
-
ns
PARAMETER
TEST CONDITIONS
(NOTE 6)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3.5V,
(See Figure 5)
ON Resistance, RON
RON Matching Between Channels,
∆RON
VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V
RON Flatness, RFLAT(ON)
VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V, 0V,
(Note 8)
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V,
(Note 7)
COM OFF Leakage Current,
ICOM(OFF)
VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V,
(Note 7)
COM ON Leakage Current,
ICOM(ON)
VS = ±5.5V, VCOM = VNO or VNC = ±4.5V, (Note 7)
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF,
VIN = 0 to 3V, (See Figure 1)
Turn-OFF Time, tOFF
VS = ±5.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF,
VIN = 0 to 3V, (See Figure 3)
Break-Before-Make Time Delay
(ISL8393), tD
3
ISL8391, ISL8392, ISL8393
Electrical Specifications: ±5V Supply
PARAMETER
Test Conditions: VSUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified (Continued)
TEST CONDITIONS
TEMP
(oC)
(NOTE 6)
MIN
TYP
(NOTE 6)
MAX
UNITS
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)
25
-
-
5
pC
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
34
-
pF
OFF Isolation
RL = 50Ω, CL = 15pF, f = 1MHz,
VNO or VNC = 1VRMS, (See Figures 4 and 6)
25
-
71
-
dB
25
-
-89
-
dB
Full
±2
-
±6
V
25
-1
0.01
1
µA
Full
-1
-
1
µA
25
-1
0.01
1
µA
Full
-1
-
1
µA
Crosstalk, (Note 9)
POWER SUPPLY CHARACTERISTICS
Power Supply Range
VS = ±5.5V, VIN = 0V or V+, Switch On or Off
Positive Supply Current, I+
Negative Supply Current, I-
NOTES:
5. VIN = Input voltage to perform proper function.
6. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
7. Leakage parameter is 100% tested at high temp, and guaranteed by correlation at 25oC.
8. Flatness is defined as the delta between the maximum and minimum RON values over the specified voltage range. Flatness specifications are
guaranteed only with specified voltages.
9. Between any two switches.
Electrical Specifications: 5V Supply
PARAMETER
Test Conditions: V+ = +4.5V to +5.5V, V- = GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(oC)
MIN
(NOTE 6)
TYP
Full
0
-
V+
V
25
-
30
60
Ω
Full
-
-
75
Ω
25
-
0.8
2
Ω
Full
-
-
4
Ω
25
-
-
6
Ω
Full
-
-
8
Ω
25
-0.1
-
0.1
nA
Full
-2.5
-
2.5
nA
25
-0.1
-
0.1
nA
Full
-2.5
-
2.5
nA
25
-0.2
-
0.2
nA
Full
-5.0
-
5.0
nA
25
-
85
170
ns
Full
-
-
240
ns
25
-
25
50
ns
Full
-
-
100
ns
MAX
(NOTE 6) UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON Resistance, RON
V+ = 4.5V, ICOM = 1.0mA, VNO or VNC = 3.5V,
(See Figure 5)
RON Matching Between Channels,
∆RON
V+ = 5V, ICOM = 1.0mA, VNO or VNC = 3V
RON Flatness, RFLAT(ON)
V+ = 5V, ICOM = 1.0mA, VNO or VNC = 1V, 3V, (Note 8)
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V,
(Note 7)
COM OFF Leakage Current,
ICOM(OFF)
V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V,
(Note 7)
COM ON Leakage Current,
ICOM(ON)
V+ = 5.5V, VCOM = 1V, 4.5V, (Note 7)
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
V+ = 5V, VNO or VNC = 3V, RL = 300Ω, CL = 35pF,
VIN = 0 to 3V, (See Figure 1)
V+ = 5V, VNO or VNC = 3V, RL = 300Ω, CL = 35pF,
VIN = 0 to 3V, (See Figure 1)
Turn-OFF Time, tOFF
4
ISL8391, ISL8392, ISL8393
Electrical Specifications: 5V Supply
PARAMETER
Test Conditions: V+ = +4.5V to +5.5V, V- = GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified (Continued)
TEST CONDITIONS
TEMP
(oC)
MIN
(NOTE 6)
TYP
MAX
(NOTE 6) UNITS
Break-Before-Make Time Delay
(ISL8393), tD
V+ = 5.5V, VNO or VNC = 3V, RL = 300Ω, CL = 35pF,
VIN = 0 to 3V, (See Figure 3)
25
10
-
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)
25
-
1
5
pC
25
-1
0.01
1
µA
Full
-1
-
1
µA
25
-1
0.01
1
µA
Full
-1
-
1
µA
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 5.5V, VIN = 0V or V+, Switch On or Off
Negative Supply Current, I-
Electrical Specifications - 3.3V Supply
PARAMETER
Test Conditions: V+ = +3.0V to +3.6V, V- = GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(oC)
MIN
(NOTE 6)
TYP
MAX
(NOTE 6) UNITS
Full
0
-
V+
V
25
-
83
175
Ω
Full
-
-
275
Ω
25
-
140
400
ns
Full
-
-
500
ns
25
-
55
125
ns
Full
-
-
175
ns
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON Resistance, RON
V+ = 3V, ICOM = 1.0mA, VNO or VNC = 1.5V,
(See Figure 5)
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
V+ = 3.3V, VNO or VNC = 1.5V, RL = 300Ω, CL = 35pF,
VIN = 0 to V+, (See Figure 1)
V+ = 3.3V, VNO or VNC = 1.5V, RL = 300Ω, CL = 35pF,
VIN = 0 to V+, (See Figure 1)
Turn-OFF Time, tOFF
Break-Before-Make Time Delay
(ISL8393), tD
V+ = 3.6V, VNO or VNC = 1.5V, RL = 300Ω, CL = 35pF,
VIN = 0 to 3V, (See Figure 3)
25
20
-
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)
25
-
1
5
pC
25
-1
0.01
1
µA
Full
-1
-
1
µA
25
-1
0.01
1
µA
Full
-1
-
1
µA
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 3.6V, VIN = 0V or V+, Switch On or Off
Negative Supply Current, I-
5
ISL8391, ISL8392, ISL8393
Test Circuits and Waveforms
3V
LOGIC
INPUT
V+
tr < 20ns
tf < 20ns
50%
0V
C
tOFF
COM
VOUT
IN
90%
SWITCH
OUTPUT
VOUT
NO or NC
VNX
SWITCH VNX
INPUT
C
SWITCH
INPUT
90%
RL
300Ω
GND
LOGIC
INPUT
0V
tON
C
V-
Logic input waveform is inverted for switches that have the opposite
logic sense.
CL
35pF
Repeat test for all switches. CL includes fixture and stray
capacitance.
RL
V OUT = V (NO or NC) -----------------------------R L + R ( ON )
FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1. SWITCHING TIMES
V+
SWITCH
OUTPUT
VOUT
∆VOUT
RG
C
VOUT
COM
NO
COM
NC
3V
LOGIC
INPUT
ON
ON
OFF
0V
VG
Q = ∆VOUT x CL
C
V-
Logic input waveform is inverted for switches that have the opposite
logic sense.
FIGURE 2A. MEASUREMENT POINTS
IN
CL
LOGIC
INPUT
Repeat test for all switches. CL includes fixture and stray
capacitance.
NOTE: When testing the NC pin of a device use the NC as VOUT.
When testing the NO pin of a device use the COM as VOUT.
FIGURE 2B. TEST CIRCUIT
FIGURE 2. CHARGE INJECTION
6
GND
ISL8391, ISL8392, ISL8393
Test Circuits and Waveforms (Continued)
V+
C
3V
LOGIC
INPUT
C
0V
VOUT1
NO1
VNX
COM1
VOUT2 RL1
300Ω
NC2
90%
90%
SWITCH
OUTPUT
VOUT1
COM2
IN1
0V
RL2
300Ω
IN2
90%
SWITCH
OUTPUT
VOUT2
CL1
35pF
0V
CL2
35pF
90%
LOGIC
INPUT
GND
tD
tD
C
V-
CL includes fixture and stray capacitance.
Reconfigure accordingly to test SW3 and SW4.
FIGURE 3A. MEASUREMENT POINTS
FIGURE 3B. TEST CIRCUIT
FIGURE 3. BREAK-BEFORE-MAKE TIME (ISL8393 ONLY)
V+
V+
C
C
RON = V1/1mA
SIGNAL
GENERATOR
NO OR NC
NO OR NC
VNX
IN
0V OR 2.4V
1mA
COM
ANALYZER
0.8V OR 2.4V
IN
V1
COM
GND
GND
RL
C
C
V-
V-
Repeat test for all switches.
Repeat test for all switches.
FIGURE 4. OFF ISOLATION TEST CIRCUIT
7
FIGURE 5. RON TEST CIRCUIT
ISL8391, ISL8392, ISL8393
Test Circuits and Waveforms (Continued)
V+
V+
C
SIGNAL
GENERATOR
NO1 OR NC1
NO OR NC
50Ω
COM1
IN
IN1
0V OR 2.4V
IN2 0V OR 2.4V
0V OR 2.4V
IMPEDANCE
ANALYZER
COM
COM2
ANALYZER
NO
CONNECTION
NO2 OR NC2
GND
GND
RL
VC
V-
FIGURE 6. CROSSTALK TEST CIRCUIT
Detailed Description
The ISL8391–ISL8393 quad analog switches offer precise
switching capability from a bipolar ±2V to ±6V or a single 2V
to 12V supply with low on-resistance (20Ω) and high speed
switching (tON = 60ns, tOFF = 30ns). The devices are
especially well suited to portable battery powered equipment
thanks to the low operating supply voltage (2V), low power
consumption (1µW), low leakage currents (2.5nA max). High
frequency applications also benefit from the wide bandwidth,
and the very high OFF isolation and crosstalk rejection.
FIGURE 7. CAPACITANCE TEST CIRCUIT
unaffected by this approach, but the switch resistance may
increase, especially at low supply voltages.
OPTIONAL PROTECTION
DIODE
V+
OPTIONAL
PROTECTION
RESISTOR
INX
VNO OR NC
VCOM
Supply Sequencing And Overvoltage Protection
As with any CMOS device, proper power supply sequencing
is required to protect the device from excessive input
currents which might permanently damage the IC. All I/O
pins contain ESD protection diodes from the pin to V+ and to
V- (see Figure 8). To prevent forward biasing these diodes,
V+ and V- must be applied before any input signals, and
input signal voltages must remain between V+ and V-. If
these conditions cannot be guaranteed, then one of the
following two protection methods should be employed.
Logic inputs can easily be protected by adding a 1kΩ
resistor in series with the input (see Figure 8). The resistor
limits the input current below the threshold that produces
permanent damage, and the sub-microamp input current
produces an insignificant voltage drop during normal
operation.
Adding a series resistor to the switch input defeats the
purpose of using a low RON switch, so two small signal
diodes can be added in series with the supply pins to provide
overvoltage protection for all pins (see Figure 8). These
additional diodes limit the analog signal from 1V below V+ to
1V above V-. The low leakage current performance is
8
VOPTIONAL PROTECTION
DIODE
FIGURE 8. OVERVOLTAGE PROTECTION
Power-Supply Considerations
The ISL839X construction is typical of most CMOS analog
switches, in that they have three supply pins: V+, V-, and
GND. V+ and V- drive the internal CMOS switches and set
their analog voltage limits, so there are no connections
between the analog signal path and GND. Unlike switches
with a 13V maximum supply voltage, the ISL839X 15V
maximum supply voltage provides plenty of room for the
10% tolerance of 12V supplies (±6V or 12V single supply),
as well as room for overshoot and noise spikes.
This family of switches performs equally well when operated
with bipolar or single voltage supplies, and bipolar supplies
need not be symmetrical. The minimum recommended
supply voltage is 2V or ±2V. It is important to note that the
input signal range, switching times, and ON-resistance
degrade at lower supply voltages. Refer to the electrical
ISL8391, ISL8392, ISL8393
specification tables and Typical Performance Curves for
details.
V+ and GND power the internal logic (thus setting the digital
switching point) and level shifters. The level shifters convert
the logic levels to switched V+ and V- signals to drive the
analog switch gate terminals, so switch parameters especially RON - are strong functions of both supplies.
Logic-Level Thresholds
V+ and GND power the internal logic stages, so V- has no
affect on logic thresholds. This switch family is TTL
compatible (0.8V and 2.4V) over a V+ supply range of 2.5V
to 10V. At 12V the VIH level is about 2.7V, so for best results
use a logic family that provides a VOH greater than 3V.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails. Driving
the digital input signals from GND to V+ with a fast transition
time minimizes power dissipation.
High-Frequency Performance
In 50Ω systems, signal response is reasonably flat even past
200MHz (see Figure 15), with a small signal -3dB bandwidth
in excess of 300MHz, and a large signal bandwidth
exceeding 300MHz.
An off switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
feedthrough from a switch’s input to its output. OFF Isolation
is the resistance to this feedthrough, while Crosstalk
indicates the amount of feedthrough from one switch to
another. Figure 16 details the high OFF Isolation and
Crosstalk rejection provided by this family. At 10MHz, OFF
isolation is about 50dB in 50Ω systems, decreasing
approximately 20dB per decade as frequency increases.
Higher load impedances decrease OFF Isolation and
Crosstalk rejection due to the voltage divider action of the
switch OFF impedance and the load impedance.
Leakage Considerations
Reverse ESD protection diodes are internally connected
between each analog-signal pin and both V+ and V-. One
of these diodes conducts if any analog signal exceeds V+
or V-.
Virtually all the analog leakage current comes from the ESD
diodes to V+ or V-. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by either
V+ or V- and the analog signal. This means their leakages
will vary as the signal varies. The difference in the two diode
leakages to the V+ and V- pins constitutes the analog-signalpath leakage current. All analog leakage current flows
between each pin and one of the supply terminals, not to the
other switch terminal. This is why both sides of a given
switch can show leakage currents of the same or opposite
polarity. There is no connection between the analog signal
paths and GND.
Typical Performance Curves TA = 25oC, Unless Otherwise Specified
25
20
15
60
85oC
50
25oC
40
-40oC
30
62.5
V- = 0V
50
85oC
25oC
37.5
25
-40oC
12.5
0
3
4
5
6
7
8
V+ (V)
9
10
11
FIGURE 9. ON RESISTANCE vs SUPPLY VOLTAGE
9
12
ICOM = 1mA
70
RON (Ω)
RON (Ω)
10
80
VCOM = (V+) - 1V
ICOM = 1mA
V- = -5V
85oC
25oC
-40oC
V+ = 2.7V
V- = 0V
20
60
50
85oC
40
25oC
30
V+ = 3.3V
-40oC
V- = 0V
20
35
30
25
20
15
V+ = 5V
85oC
V- = 0V
25oC
-40oC
0
1
2
3
VCOM (V)
4
FIGURE 10. ON RESISTANCE vs SWITCH VOLTAGE
5
ISL8391, ISL8392, ISL8393
Typical Performance Curves TA = 25oC, Unless Otherwise Specified (Continued)
45
ICOM = 1mA
40
35
25oC
30
25
10
-40oC
20
35
VS = ±3V
30
25
5
V+ = 3.3V
85oC
25oC
20
Q (pC)
RON (Ω)
15
VS = ±2V
85oC
-40oC
15
0
V+ = 5V
10
25
20
VS = ±5V
85oC
25oC
VS = ±5V
-5
15
-40oC
10
-10
5
-5
-4
-3
-2
-1
0
1
2
3
4
-5
5
-2.5
0
VCOM (V)
VCOM (V)
125
-40oC
200
VCOM = (V+) - 1V
V- = -5V
25oC
V- = 0V
250
25oC
0
50
V- = 0V
10
0
3
25oC
20
-40oC
2
85oC
30
100
50
-40oC
40
85oC
150
85oC
25
tOFF (ns)
tON (ns)
85oC
0
300
200
25oC
50
-40oC
4
5
6
7
8
9
10
11
V+ (V)
FIGURE 13. TURN - ON TIME vs SUPPLY VOLTAGE
10
12
VCOM = (V+) - 1V
V- = -5V
-40oC
75
25oC
50
25oC
100
150
100
5
FIGURE 12. CHARGE INJECTION vs SWITCH VOLTAGE
FIGURE 11. ON RESISTANCE vs SWITCH VOLTAGE
250
2.5
-40oC
2
3
4
5
6
7
8
9
10
11
V+ (V)
FIGURE 14. TURN - OFF TIME vs SUPPLY VOLTAGE
12
ISL8391, ISL8392, ISL8393
-10
VS = ±5V
VIN = 0.2VP-P
3
10
V+ = 3V to 12V or
-20 VS = ±2V to ±5V
RL = 50Ω
-30
GAIN
0
20
30
VIN = 0.2VP-P
PHASE
VIN = 5VP-P
0
45
90
135
180
RL = 50Ω
1
10
100
FREQUENCY (MHz)
FIGURE 15. FREQUENCY RESPONSE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
VTRANSISTOR COUNT:
ISL8391: 209
ISL8392: 209
ISL8393: 209
PROCESS:
Si Gate CMOS
11
600
CROSSTALK (dB)
-3
-40
40
-50
50
-60
60
ISOLATION
-70
70
-80
80
CROSSTALK
-90
90
-100
100
-110
1k
10k
100k
1M
10M
110
100M 500M
FREQUENCY (Hz)
FIGURE 16. CROSSTALK AND OFF ISOLATION
OFF ISOLATION (dB)
VIN = 5VP-P
PHASE (DEGREES)
NORMALIZED GAIN (dB)
Typical Performance Curves TA = 25oC, Unless Otherwise Specified (Continued)
ISL8391, ISL8392, ISL8393
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
N
INCHES
INDEX
AREA
H
0.25(0.010) M
B M
SYMBOL
E
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.053
0.069
1.35
1.75
-
A1
0.004
0.010
0.10
0.25
-
B
0.014
0.019
0.35
0.49
9
C
0.007
0.010
0.19
0.25
-
D
0.386
0.394
9.80
10.00
3
E
0.150
0.157
3.80
4.00
4
e
µα
A1
MIN
0.050 BSC
1.27 BSC
-
H
0.228
0.244
5.80
6.20
-
h
0.010
0.020
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
α
16
0o
16
7
8o
Rev. 1 02/02
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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12
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