s13361-2050 series kapd1055e

MPPC® (Multi-Pixel Photon Counter) arrays
S13361-2050 series
MPPC arrays in a chip size package miniaturized
through the adoption of TSV structure
The S13361-2050 series is a MPPC array for precision measurement miniaturized by the use of TSV (through-silicon via) and CSP
(chip size package) technologies. The adoption of a TSV structure made it possible to eliminate wiring on the photosensitive area
side, resulting in a compact structure with little dead space compared with previous products. The four-side buttable structure
allows multiple devices to be arranged side by side to fabricate large-area devices.
They are suitable for applications, such as medical, non-destructive inspection, environmental analysis, and high energy physics
experiment, that require photon counting measurement.
Features
Applications
Low crosstalk
Astro physical application
Low afterpulses
High energy physics experiment
Outstanding photon counting capability (outstanding photon
detection efficiency versus numbers of incident photons)
Nuclear medicine
Compact chip size package with little dead space
Environmental analysis
PET
Low voltage (VBR=53 V typ.) operation
High gain: 105 to 106
Lower noise
When an MPPC detects photons, the output may contain spurious pulses, namely afterpulse and crosstalk, that are separate from the output pulses of the incident photons. Afterpulses are output later than the timing at which the incident light is received. Crosstalk is output
from other pixels at the same time as the detection of light.
Previous products achieved lower afterpulse through the improvement of material and wafer process technology, but with the S13361-2050
series, low crosstalk has been achieved in addition to low afterpulse.
Pulse waveform (S13360-2050VE, typical example)
50 mV
(M=1.7 × 106)
10 ns
www.hamamatsu.com
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MPPC (Multi-Pixel Photon Counter) arrays
S13361-2050 series
Structure
Parameter
Symbol
Number of channels
Effective photosensitive area/channel
Pixel pitch
Number of pixels
Fill factor
Package type
Window
Refractive index of window material
-
S13361-2050NE-04
S13361-2050AE-04
16 (4 × 4)
2×2
50
1584
74
Surface mount
With connector*1
Epoxy resin
1.55
Unit
mm
μm
%
-
*1: A connector made by SAMTEC is mounted on the back side of the board.
ST4-10-1.00-L-D-P-TR
This connector mates with a SAMTEC receptacle (SS4-10-3.00-L-D-K-TR).
See the following URL for detailed information.
http://www.samtec.com/ftppub/pdf/ss4.pdf
Absolute maximum ratings
Parameter
Operating temperature*2
Storage temperature*2
Reflow soldering conditions*3
Symbol
Topr
Tstg
S13361-2050NE-04
Tsol
Peak temperature: 240 °C, twice (see P.6)
S13361-2050AE-04
Unit
°C
°C
-
-
-20 to +60
-20 to +80
*2: No dew condensation
When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation
may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability.
*3: JEDEC level 5a
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the
product within the absolute maximum ratings.
Electrical and optical characteristics (Typ. Ta=25 °C, Vover=3 V, unless otherwise noted)
Parameter
Symbol
Spectral response range
λ
Peak sensitivity wavelength
λp
PDE
Photon detection efficiency (λ=λp)*4
Typ.
Dark count*5
Max.
Terminal capacitance
Ct
Gain
M
Breakdown voltage
VBR
Recommended operating voltage
Vop
Typ.
Vop variation between
channels
Max.
Temperature coefficient of
ΔTVop
recommended operating voltage
Value
320 to 900
450
40
300
900
140
1.7 × 106
53 ± 5
VBR + 3
±0.05
±0.15
54
Unit
nm
nm
%
kcps
pF
V
V
V
mV/°C
*4: Photon detection efficiency does not include crosstalk or afterpulses.
*5: Threshold=0.5 p.e.
Note: The above characteristics were measured the operating voltage that yields the listed gain in this catalog.
(See the data attached to each product.)
2
MPPC (Multi-Pixel Photon Counter) arrays
S13361-2050 series
Photon detection efficiency vs. wavelength (typical example)
(Ta=25 °C)
Photon detection efficiency (%)
50
40
30
20
10
0
200
300
400
500
600
700
800
900
1000
Wavelength (nm)
KAPDB0318EA
Photon detection efficiency does not include crosstalk or afterpulses.
(Ta=25 °C)
6 × 106
Gain
Crosstalk probability
Photon detection
efficiency (λ=450 nm)
Gain
5 × 106
60
50
4 × 106
40
3 × 106
30
2 × 106
20
1 × 106
10
0
0
2
4
6
8
0
10
Crosstalk probability, photon detection efficiency (%)
Overvoltage specifications of gain, crosstalk probability, photon detection efficiency (typical example)
Overvoltage (V)
KAPDB0324EA
MPPC characteristics vary with the operating voltage. Although increasing the operating voltage improves the photon detection efficiency and time resolution, it also increases the dark count and crosstalk at the same time, so an optimum operating voltage must be
selected to match the application.
3
MPPC (Multi-Pixel Photon Counter) arrays
S13361-2050 series
Dimensional outlines (unit: mm)
S13361-2050NE-04
C-1
D-1
A-2
B-2
C-2
D-2
A-3
B-3
C-3
D-3
A-4
B-4
C-4
D-4
9.0
Photosensitive area
(16 ×) 2.0 × 2.0
1.35 ± 0.20
0.1 ± 0.05
Photosensitive
surface
Resin
A (D-1)
1.0 1.2 1.0 1.2 1.0 1.2 1.0
B-1
9.0
A-1
3 × 2.2=(6.6)
3 × 2.2=(6.6)
0.2 ± 0.05
0.2 ± 0.05
[Bottom view]
[Side view]
0.2 ± 0.05
0.2 ± 0.05
[Top view]
A (C-1)
K (D-1)
A (D-2)
A (C-2)
K (D-2)
A (D-3)
Index mark
K (D-4)
A (A-1)
K (A-1)
A (B-2)
K (C-2) K (B-2)
A (C-3)
K (D-3)
A (D-4)
A (B-1)
K (C-1) K (B-1)
A (A-2)
K (A-2)
A (B-3)
K (C-3) K (B-3)
A (C-4)
A (A-3)
K (A-3)
A (B-4)
K (C-4) K (B-4)
Cathode
(16 ×) ϕ0.5
A (A-4)
K (A-4)
1.0 1.2 1.0 1.2 1.0 1.2 1.0
Anode
(16 ×) ϕ0.5
Tolerance unless otherwise noted: ±0.1
A (X-Y): Anode pad of (X-Y) channel.
K (X-Y): Cathode pad of (X-Y) channel.
KAPDA0166EB
4
MPPC (Multi-Pixel Photon Counter) arrays
S13361-2050 series
S13361-2050AE-04
[Side view]
3 × 2.2=(6.6)
B-1
C-1
D-1
A-2
B-2
C-2
D-2
A-3
B-3
C-3
D-3
A-4
B-4
C-4
D-4
0.1 ± 0.05
Photosensitive
surface
(4.0)
9.0
Photosensitive area
(16 ×) 2.0 × 2.0
Connector (SAMTEC)
ST4-10-1.00-L-D-P-TR
Resin
10
9
8
7
6
5
4
3
2
1
0.2 ± 0.05
9.0
A-1
(3.08)
11
12
13
14
15
16
17
18
19
20
(5.58)
0.2 ± 0.05
1.35 ± 0.20
[Bottom view]
3 × 2.2=(6.6)
0.2 ± 0.05
0.2 ± 0.05
[Top view]
(3 ×) Index mark
Tolerance unless otherwise noted: ±0.1
KAPDA0167EB
Pin no.
10
9
8
7
6
5
4
3
2
1
Connection
A (C-1)
A (D-1)
A (C-2)
A (D-2)
A (D-3)
A (C-3)
A (D-4)
A (C-4)
NC
K (common)
Pin no.
11
12
13
14
15
16
17
18
19
20
Connection
A (B-1)
A (A-1)
A (B-2)
A (A-2)
A (A-3)
A (B-3)
A (A-4)
A (B-4)
NC
K (common)
Note: A=Anode, K=Cathode
Cross section detail (unit: mm)
Gap between
photosensitive areas
0.2
Resin
Photosensitive
surface
0.1
Package edge to
photosensitive area
0.2
Chip
Substrate
Electrode
Solder bump
KAPDC0060EA
5
MPPC (Multi-Pixel Photon Counter) arrays
S13361-2050 series
1.0 1.2 1.0 1.2 1.0 1.2 1.0
Recommended land pattern (S13361-2050NE-04, unit: mm)
1.0 1.2 1.0 1.2 1.0 1.2 1.0
(32 ×) ɸ0.5
KAPDC0063EA
Temperature profile measurement example using our experimental hot-air reflow oven (S13361-2050NE-04)
300 °C
240 °C max.
Temperature
220 °C
190 °C
170 °C
Preheat
70 to 90 s
Soldering
40 s max.
Time
KPICB0171EA
∙ This surface mount type package product supports lead-free soldering. After unpacking, store it in an environment at a temperature of
25 °C or less and a humidity of 60% or less, and perform soldering within 24 hours.
∙ The effect that the product is subject to during reflow soldering varies depending on the circuit board and reflow furnace that are used.
Before actual reflow soldering, check for any problems by testing out the reflow soldering methods in advance.
∙ When three or more mounths have passed or if the packing bag has not been stored in an environment described above, perform baking. For the baking method, see the related information “Surface mount type products” precautions.
Precautions
∙ If necessary, incorporate appropriate protective circuits in power supplies, devices, and measuring instruments to prevent overvoltage
and overcurrent.
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MPPC (Multi-Pixel Photon Counter) arrays
S13361-2050 series
Related products
Power supply for MPPC C11204 series
The C11204 series is a high voltage power supply that is optimized for driving MPPCs.
Since it has a temperature compensation function, MPPCs can be driven stably even in environments subject to temperature changes.
C11204-02
C11204-01
Lineup of power supplies for MPPC
Package type
Temperature
stability
(ppm/°C)
Voltage boost
circuit
MR (magnetic resonance)
compatibility
C11204-01
With leads
±10
Yes
-
C11204-02
Surface mount
±10
Yes
-
C11204-03
With leads
±10
-
Yes
C11204-04
Surface mount
±30
-
Yes
Type no.
Features
High precision
Low ripple noise
High precision
Low ripple noise
Compact: 11.5 x 11.5 mm
MR compatible
Low price
MR compatible
Low price
Compact: 11.5 x 11.5 mm
MPPC modules C13369 series
The C13369 series is a photon counting module capable of detecting low light level. This
module consists of a MPPC array, current-to-voltage converter circuit, high-voltage power
supply circuit, and temperature-compensation circuit, etc.
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MPPC (Multi-Pixel Photon Counter) arrays
S13361-2050 series
Related information
www.hamamatsu.com/sp/ssd/doc_en.html
Precautions
∙ Disclaimer
∙ Metal, ceramic, plastic package products
∙ Surface mount type products
Technical information
∙ MPPC
MPPC is a registered trademark of Hamamatsu Photonics K.K.
Information described in this material is current as of April, 2016.
Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the
information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always
contact us for the delivery specification sheet to check the latest specifications.
The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that
one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use.
Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-93581733, Fax: (39) 02-93581741
China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866
Cat. No.KAPD1055E01 Apr. 2016 DN
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