CR2512

MATERIAL DECLARATION SHEET
Material Number
CR2512 Series
Product Line
Thick Film Chip Resistors
Compliance Date
2014.Feb.5
RoHS Compliant
Yes
MSL
1
No.
Construction
Element (subpart)
Homogeneous
Material
Material
weight [g]
1
Ceramic Substrate
Ceramic
0.03380
2
Conductor Layer
Thick Film
Conductor
0.00051
3
Resistive Element
Thick Film
Resistor
0.00049
4
Over Coating
Epoxy
5
Marking
Epoxy
0.00066
0.00004
End Terminal
NI-CR
0.00001
Ni Plating
Nickel
Sn Plating
Tin
0.00115
0.00102
0.03768
6
7
8
Total weight
Homogeneous
Material\Substances
CASRN
if applicable
Materials
Mass %
Material Mass %
of total unit wt.
Aluminum oxide
Silicon dioxide
Silver
Bismuth
Barium
Silicon
Boron
Ruthenium dioxide
Silver
Palladium
Lead
Epoxy
1344-28-1
14808-60-7
7440-22-4
7440-69-9
7440-39-3
7440-21-3
7440-42-8
12036-10-1
7440-22-4
7440-05-3
7439-92-1
29690-82-2
96%
4%
96%
1%
1%
1%
1%
25%
40%
15%
20%
100%
86.13
3.59
1.28
0.02
0.02
0.02
0.02
0.32
0.52
0.19
0.26
1.74
Epoxy
Nickel
Chromium
Nickel
25085-99-8
7440-02-0
7440-47-3
7440-02-0
100%
80%
20%
100%
0.11
0.02
0.01
3.04
0.11
Tin
7440-31-5
100%
2.71
2.71
Subpart mass
of total wt. (%)
89.72
1.36
1.29
1.74
0.03
3.04
This Document was updated on: 2016-02-08
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I.
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