VLMPG31L1M2 Datasheet

VLMPG31L1M2
www.vishay.com
Vishay Semiconductors
Standard SMD LED PLCC-2
FEATURES
• SMD LEDs with exceptional brightness
• Luminous intensity categorized
• Compatible
equipment
with
automatic
placement
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase and
wave solder processes according to
CECC 00802 and J-STD-020
948553
DESCRIPTION
• Available in 8 mm tape
This device has been designed to meet the increasing
demand for surface mounting technology.
• Low profile package
• Non-diffused lens: excellent for coupling to light pipes and
backlighting
The package of the VLMPG31-series is the PLCC-2.
It consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled up
with clear epoxy.
• Low power consumption
PRODUCT GROUP AND PACKAGE DATA
• Preconditioning according to JEDEC® level 2a
• Product group: LED
• ESD-withstand voltage: up to 2 kV according to
JESD22-A114-B
• Luminous intensity
IVmax./IVmin. ≤ 1.6
• Package: SMD PLCC-2
ratio
in
one
packaging
unit
• AEC-Q101 qualified
• Product series: standard
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
• Angle of half intensity: ± 60°
APPLICATIONS
• Automotive: Backlighting in dashboards and switches
• Telecommunication:
telephone and fax
Indicator
and
backlighting
in
• Indicator and backlight for audio and video equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches, and symbols
• General use
PARTS TABLE
PART
COLOR
LUMINOUS
INTENSITY
(mcd)
at IF
(mA)
MIN. TYP. MAX.
WAVELENGTH
(nm)
FORWARD
VOLTAGE
(V)
at IF
(mA)
MIN. TYP. MAX.
at IF
TECHNOLOGY
(mA)
MIN. TYP. MAX.
VLMPG31L1M2-GS08
Pure green
11.2
18
28
20
555
559
565
20
-
2.0
2.6
20
AIlnGaP on GaAs
VLMPG31L1M2-GS18
Pure green
11.2
18
28
20
555
559
565
20
-
2.0
2.6
20
AIlnGaP on GaAs
Rev. 1.4, 03-Aug-15
Document Number: 81653
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMPG31L1M2
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
VLMPG31L1M2
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VR
5
V
mA
Reverse voltage (1)
DC forward current
Surge forward current
Tamb ≤ 85 °C
IF
30
tp ≤ 10 μs
IFSM
0.2
A
PV
80
mW
Power dissipation
Tj
125
°C
Tamb
-40 to +100
°C
Storage temperature range
Tstg
-40 to +100
°C
Thermal resistance junction / ambient Mounted on PC board (pad size > 16 mm2)
RthJA
400
K/W
Junction temperature
Operating temperature range
Note
(1) Driving LED in reverse direction is suitable for short term application.
OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
VLMPG31L1M2, PURE GREEN
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN.
TYP.
MAX.
UNIT
Luminous intensity (1)
IF = 20 mA
VLMPG31L1M2
IV
11.2
18
28
mcd
Dominant wavelength
IF = 20 mA
λd
555
559
565
nm
Peak wavelength
IF = 20 mA
λp
-
565
-
nm
deg
Angle of half intensity
IF = 20 mA
ϕ
-
± 60
-
Forward voltage
IF = 20 mA
VF
-
2.0
2.6
V
Reverse voltage
IR = 10 μA
VR
5
-
-
V
Note
(1) In one packing unit I
Vmax./IVmin. ≤ 1.6
LUMINOUS INTENSITY CLASSIFICATION
GROUP
STANDARD
COLOR CLASSIFICATION
LIGHT INTENSITY (mcd)
DOMINANT WAVELENGTH (nm)
OPTIONAL
MIN.
MAX.
1
2
1
2
11.2
14.0
18.0
22.4
14.0
18.0
22.4
28.0
L
M
Note
• Luminous intensity is tested at a current pulse duration of 25 ms
and an accuracy of ± 11 %.
The above type numbers represent the order groups which
include only a few brightness groups. Only one group will be
shipped on each reel (there will be no mixing of two groups on
each reel). In order to ensure availability, single brightness
groups will not be orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped
on any one reel.
In order to ensure availability, single wavelength groups will not
be orderable.
Rev. 1.4, 03-Aug-15
GROUP
PURE GREEN
MIN.
MAX.
0
555
559
1
558
561
2
560
563
3
562
565
Note
• Wavelengths are tested at a current pulse duration of 25 ms.
Document Number: 81653
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMPG31L1M2
www.vishay.com
Vishay Semiconductors
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
100
40
IF - Forward Current (mA)
IF - Forward Current (mA)
35
30
25
20
15
10
5
10
0
10
20
30
40
50
60
70
80
1
90 100
1
Tamb - Ambient Temperature (°C)
16615
95 10878
0°
10°
20°
40°
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
IV rel - Relative Luminous Intensity
30°
1.0
80°
0.6
0.4
0.2
1.5
2
2.5
3
VF - Forward Voltage (V)
Fig. 4 - Forward Current vs. Forward Voltage
Fig. 1 - Forward Current vs. Ambient Temperature
IV rel - Relative Luminous Intensity
0
3.0
pure green
2.5
2.0
1.5
1.0
0.5
0.0
- 50
0
95 10319
18616
Fig. 2 - Relative Luminous Intensity vs. Angular Displacement
- 25
0
25
50
75
100
Tamb - Ambient Temperature (°C)
Fig. 5 - Relative Luminous Intensity vs. Ambient Temperature
IV rel - Relative Luminous Intensity
1.2
pure green
1.0
0.8
0.6
0.4
0.2
0.0
510
18648
530
550
570
590
610
λ - Wavelength (nm)
Fig. 3 - Relative Luminous Intensity vs. Wavelength
Rev. 1.4, 03-Aug-15
Document Number: 81653
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMPG31L1M2
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
0.9
1.75±0.1
3.5±0.2
0.8
Technical drawings
according to DIN
specifications
C
A
2.2
2.8±0.15
Pin identification
Dimensions in mm
Drawing-No.: 6.541-5067.01-4
Issue: 6; 23.09.13
Ø2.4
3
+0.15
Mounting Pad Layout
Area covered
with solderresist
4
2.6 (2.8)
1.2
1.6 (1.9)
4
Dimensions: Reflow and vapor phase (wave soldering)
Rev. 1.4, 03-Aug-15
Document Number: 81653
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMPG31L1M2
www.vishay.com
Vishay Semiconductors
METHOD OF TAPING / POLARITY AND TAPE AND REEL
SMD LED (VLM.3...-SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO) 564) for automatic component insertion. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
10.4
8.4
120°
4.5
3.5
Adhesive tape
13.00
12.75
2.5
1.5
Blister tape
Component cavity
62.5
60.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
14.4 max.
321
329
18857
Fig. 8 - Reel Dimensions - GS18
94 8670
SOLDERING PROFILE
TAPING OF VLM.3...
3.5
3.1
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
2.2
2.0
Preconditioning acc. to JEDEC level 2a
300
8.3
7.7
1.85
1.65
1.6
1.4
4.1
3.9
0.25
4.1
3.9
Temperature (°C)
3.6
3.4
4.0
3.6
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp down 6 °C/s
max. ramp up 3 °C/s
50
2.05
1.95
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
5.75
5.25
0
0
50
100
94 8668
150
Time (s)
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
TTW Soldering (acc. to CECC00802)
300
10.0
9.0
250
13.00
12.75
63.5
60.5
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
Temperature (°C)
2.5
1.5
300
Fig. 9 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
5s
4.5
3.5
250
max. 2 cycles allowed
19885
Fig. 6 - Tape Dimensions in mm for PLCC-2
120°
200
235 °C
to 260 °C
first wave
200
lead temperature
second
full line: typical
wave
dotted line: process limits
ca. 200 K/s
150
100 °C
to 130 °C
ca. 2 K/s
100
2 K/s
ca. 5 K/s
50
forced cooling
0
0
948626-1
180
178
14.4 max.
50
100
150
200
250
Time (s)
Fig. 10 - Double Wave Soldering of Opto Devices (all Packages)
94 8665
Fig. 7 - Reel Dimensions - GS08
Rev. 1.4, 03-Aug-15
Document Number: 81653
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMPG31L1M2
www.vishay.com
Vishay Semiconductors
BAR CODE PRODUCT LABEL (example)
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
106
A
H
VISHAY
37
B
C
D
E
F
G
RECOMMENDED METHOD OF STORAGE
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
19788
A. Type of component
B. Manufacturing plant
C. SEL - selection code (bin):
e.g.: K1 = code for luminous intensity group
4 = code for color group
D. Date code year / week
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label is
included on all dry bags.
E. Day code (e.g. 2: Tuesday)
F. Batch no.
G. Total quantity
L E V E L
H. Company code
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Aluminum bag
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
a)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
b)
2a or 2b is not met.
Label
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
o
or
96 hours at 60±5 Cand <5%RH
For all device containers
24 hours at 100±5°C
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Reel
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Example of JESD22-A112 level 2a label
15973
FINAL PACKING
ESD PRECAUTION
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABEL
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Rev. 1.4, 03-Aug-15
Document Number: 81653
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
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Revision: 02-Oct-12
1
Document Number: 91000