SM-LP-5001

MATERIAL DECLARATION SHEET
Material Number
SM-LP-5001
Product Line
600.600 Transformer
Compliance Date
March 27, 2005
RoHS Compliant
Yes
No.
Construction
Element (subpart)
MSL
Homogeneous
Material
1
Material
weight
[g]
1
Core
Lamination
1.28
2
Solder
Solder
0.1
3
Can
Phenolic molding
compound
0.25
4
Copper wire
Enamelled copper
wire
0.17
5
6
Potting compound
Epoxy
Bobbin
Copper pins
Tin plating
Liquid Crystal
Polymer
Total weight
0.49
0.03
0.26
Homogeneous
Material\
Substances
Nickel
Iron
Molybdenum
Manganese
Tin
Silver
Copper
Phenol polymer
Glass fiber
Stearic acid
Carbon black
if applicable
Materials
Mass %
7440-02-0
7439-89-6
7439-98-7
7439-96-5
7440-31-5
7440-22-4
7440-50-8
9003-35-4
65997-17-3
61790-38-3
1333-86-4
80
15.3
4.2
0.5
96.5
3
0.5
40
55
2.5
2.5
Material
Mass % of
total unit wt.
39.69
7.59
2.08
0.25
3.73
0.12
0.02
3.88
5.33
0.24
0.24
Copper
7440-50-8
95
6.26
Polyester resin
68604-67-1
5
0.33
Modified epoxy
Aluminum hydroxide
Ammonium
pyrophosphate
Carbon black
Copper
Tin
Aromatic polyester
resin
25085-99-8
21645-51-2
51
28
9.68
5.32
68333-79-9
18
3.42
1333-86-4
7440-50-8
7440-31-5
3
96
4
0.57
1.12
0.05
6008-52-0
100
10.08
CASRN
Subpart
mass of total
wt. (%)
49.61
3.87
9.69
6.59
18.99
1.17
10.08
2.58
This Document was updated on: March 10, 2008
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