TSP10H200S Taiwan Semiconductor 10A, 200V Trench Schottky Rectifier FEATURES - Patented Trench Schottky technology - Excellent high temperature stability - Low forward voltage - Low power loss/ high efficiency - High forward surge capability - Ideal for automated placement - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC TO-277A (SMPC) - Halogen-free according to IEC 61249-2-21 definition TYPICAL APPLICATIONS Trench Schottky barrier rectifier is designed for high frequency miniature switched mode power supplies such as adapters, lighting and on-board DC/DC converters. MECHANICAL DATA Case: TO-277A (SMPC) Molding compound, UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: As marked Weight: 95mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER TSP10H200S SYMBOL Marking code UNIT 10H200 Maximum repetitive peak reverse voltage VRRM 200 V Maximum average forward rectified current (Note 1) IF(AV) 10 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 180 A Maximum instantaneous forward voltage (Note 2) IF = 5A IF = 10A IF = 5A IF = 10A Maximum instantaneous reverse current at rated reverse voltage TJ = 25°C VF TJ = 125°C TJ = 25°C TJ = 125°C Typical thermal resistance Operating temperature range Storage temperature range IR MIN TYP MAX - 0.75 - - 0.80 0.91 - 0.59 - - 0.66 0.74 - 5 100 μA - 3 20 mA V RθJL 15 °C/W TJ - 55 to +150 °C TSTG - 55 to +150 °C Note 1: Mounted on 30 mm x 30 mm 4 oz. pad PCB Note 2: Pulse Test with Pulse Width=300μs, 1% Duty Cycle Document Number: DS_D1411066 Version: D15 TSP10H200S Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE TSP10H200S S1 S2 PACKING CODE SUFFIX G PACKAGE PACKING SMPC SMPC 1,500/7" Plastic reel 6,000/13" Plastic reel Note: Whole series with green compound EXAMPLE PREFERRED PART NO. TSP10H200S S1G PART NO. PACKING CODE TSP10H200S S1 PACKING CODE DESCRIPTION SUFFIX G Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG. 2- TYPICAL FORWARD CHARACTERISTICS FIG.1- FORWARD CURRENT DERATING CURVE 100 10 7.5 5 WITH HEATSINK 30mm x 30mm 4 oz. pad PCB 2.5 0 0 25 50 75 100 125 150 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) 12.5 TJ=125°C TJ=25°C 0.1 0 0.2 0.4 0.6 0.8 1 FORWARD VOLTAGE (V) FIG. 4- TYPICAL JUNCTION CAPACITANCE FIG. 3- TYPICAL REVERSE CHARACTERISTICS 10000 10 TJ=150°C JUNCTION CAPACITANCE (pF) A INSTANTANEOUS REVERSE CURRENT (mA) TJ=100°C 1 LEAD TEMPERATURE (°C) 1 TJ=125°C 0.1 TJ=150°C 10 TJ=100°C 0.01 0.001 f=1.0MHz Vsig=50mVp-p 1000 100 TJ=25°C 0.0001 10 0.00001 10 20 30 40 50 60 70 80 90 100 0.1 1 10 REVERSE VOLTAGE (V) 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Document Number: DS_D1411066 Version: D15 TSP10H200S PEAK FORWARD SURGE CURRENT (A) Taiwan Semiconductor FIG. 5 MAXIMUM NON-REPETITIVE FORWARD PEAK SURGE CURRENT 200 8.3ms Single Half Sine Wave 150 100 50 0 1 10 100 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1411066 Version: D15 TSP10H200S Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS TO-277A (SMPC) DIM. A Unit (mm) Unit (inch) Min Max Min Max 5.650 5.750 0.222 0.226 B 6.350 6.650 0.250 0.262 C 4.550 4.650 0.179 0.183 D 3.540 3.840 0.139 0.151 E 4.235 4.535 0.167 0.179 F 1.850 2.150 0.073 0.085 G 3.170 3.470 0.125 0.137 H 1.043 1.343 0.041 0.053 I 1.000 1.300 0.039 0.051 J 1.930 2.230 0.076 0.088 K 0.175 0.325 0.007 0.013 L 1.000 1.200 0.039 0.047 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 4.80 0.189 B 4.72 0.186 C 1.40 0.055 D 1.27 0.050 E 6.80 0.268 F 1.04 0.041 MARKING DIAGRAM P/N = Marking Code YW = Date Code F = Factory Code Document Number: DS_D1411066 Version: D15 TSP10H200S Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1411066 Version: D15