TSP10H45S SERIES_D15.pdf

TSP10H45S - TSP10H60S
Taiwan Semiconductor
CREAT BY ART
10A, 45V - 60V Trench Schottky Rectifiers
FEATURES
- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Low power loss/ high efficiency
- High forward surge capability
- Ideal for automated placement
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
TO-277A (SMPC)
- Halogen-free according to IEC 61249-2-21 definition
TYPICAL APPLICATIONS
Trench Schottky barrier rectifier is designed for high frequency
miniature switched mode power supplies such as adapters,
lighting and on-board DC/DC converters.
MECHANICAL DATA
Case: TO-277A (SMPC)
Molding compound, UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 95mg (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
SYMBOL
TSP10H45S
TSP10H60S
UNIT
Maximum repetitive peak reverse voltage
VRRM
45
60
V
Maximum RMS voltage
VRMS
32
42
V
Maximum average forward rectified current
IF(AV)
10
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
180
A
PARAMETER
IF = 5A
Instantaneous forward voltage (Note 1)
IF = 10A
IF = 5A
IF = 10A
Maximum instantaneous reverse current at rated
reverse voltage
TJ = 25°C
VF
TJ = 125°C
TJ = 25°C
TJ = 125°C
Typical thermal resistance
Operating junction temperature range
Storage temperature range
TYP
MAX
TYP
MAX
0.44
-
0.45
-
0.48
0.57
0.52
0.64
0.34
-
0.36
-
0.41
0.5
0.46
0.63
V
150
μA
25
mA
RθJL
10
°C/W
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
IR
Note 1: Pulse test with pulse width=300μs, 1% duty cycle
Document Number: DS_D1411065
Version: D15
TSP10H45S - TSP10H60S
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PACKING CODE
TSP10HXXS
(Note 1, 2)
S1
PACKING CODE
SUFFIX
PACKAGE
PACKING
SMPC
1,500/ 7" Plastic reel
SMPC
6,000/ 13" Plastic reel
G
S2
Note 1: "XX" defines voltage from 45V (TSP10H45S) to 60V (TSP10H60S)
Note 2: Whole series with green compound (halogen-free)
EXAMPLE
PREFERRED
PART NO.
TSP10H45S S1G
PART NO.
PACKING CODE
TSP10H45S
S1
PACKING CODE
DESCRIPTION
SUFFIX
G
Green compound
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
FIG.2 TYPICAL FORWARD CHARACTERISTICS
FIG.1 FORWARD CURRENT DERATING CURVE
100
12
INSTANTANEOUS FORWARD CURRENT (A)
AVERAGE FORWARD CURRENT (A)
TSP10H45S
10
8
6
4
2
WITH
HEATSINK
30mm x 30mm
4 oz. pad PCB
0
50
10
TJ=150oC
TJ=125oC
1
0.1
TJ=100oC
TJ=25oC
0.01
75
100
125
0
150
0.1
0.2
0.4
0.5
0.6
0.7
0.8
FORWARD VOLTAGE (V)
LEAD TEMPERATURE (oC)
FIG.3 TYPICAL FORWARD CHARACTERISTICS
FIG.4 TYPICAL REVERSE CHARACTERISTICS
100
100
TSP10H60S
TSP10H45S
INSTANTANEOUS REVERSE CURRENT (mA)
INSTANTANEOUS FORWARD CURRENT (A)
0.3
10
TJ=150oC
TJ=125oC
1
0.1
TJ=100oC
TJ=25oC
0.01
0
0.1
0.2
0.3
0.4
0.5
0.6
FORWARD VOLTAGE (V)
Document Number: DS_D1411065
0.7
0.8
TJ=150oC
10
TJ=125oC
TJ=100oC
1
0.1
0.01
TJ=25oC
0.001
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Version: D15
TSP10H45S - TSP10H60S
Taiwan Semiconductor
FIG.5 TYPICAL REVERSE CHARACTERISTICS
FIG.6 TYPICAL JUNCTION CAPACITANCE
10000
TSP10H60S
TJ=150oC
10
TJ=125oC
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT (mA)
100
TJ=100oC
1
0.1
0.01
1000
TJ=25oC
f=1.0MHz
Vslg=50mVp-p
100
0.001
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
0.1
1
10
100
REVERSE VOLTAGE (V)
PEAK FORWARD SURGE CURRENT (A)
FIG. 7- MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
210
8.3ms Single Half Sine Wave
180
150
120
90
60
30
0
1
10
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D1411065
100
Version: D15
TSP10H45S - TSP10H60S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
TO-277A (SMPC)
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
5.650
5.750
0.222
0.226
B
6.350
6.650
0.250
0.262
C
4.550
4.650
0.179
0.183
D
3.540
3.840
0.139
0.151
E
4.235
4.535
0.167
0.179
F
1.850
2.150
0.073
0.085
G
3.170
3.470
0.125
0.137
H
1.043
1.343
0.041
0.053
I
1.000
1.300
0.039
0.051
J
1.930
2.230
0.076
0.088
K
0.175
0.325
0.007
0.013
L
1.000
1.200
0.039
0.047
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
4.80
0.189
B
4.72
0.186
C
1.40
0.055
D
1.27
0.050
E
6.80
0.268
F
1.04
0.041
MARKING DIAGRAM
P/N
= Marking Code
YW
= Date Code
F
= Factory Code
Document Number: DS_D1411065
Version: D15
TSP10H45S - TSP10H60S
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to any
intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for
such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale
and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability,
or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers
using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for
any damages resulting from such improper use or sale.
Document Number: DS_D1411065
Version: D15