BAS19 SERIES_B14.pdf

BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
Surface Mount Fast Switching Diode
FEATURES
- Fast switching speed
- Surface mount device type
- High conductance
- For general purpose switching applications
- Packing code with suffix "G" means
green compound (halogen-free)
SOT-23
MECHANICAL DATA
- Case: SOT-23 small outline plastic package
- Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10s
- Weight: 8 ± 0.5 mg
- BAS19 Marking Code: JP
- BAS20 Marking Code: JR
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
Working Peak Reverse Voltage DC Blocking Voltage
SYMBOL
BAS19
BAS20
VRM
100
150
Average Rectifier Output Current
IO
200
Power Dissipation
PD
250
Thermal Resistance Junction to Ambient Air
RθJA
500
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
UNIT
V
mA
mW
o
C/W
o
C
Electrical Characteristics
PARAMETER
Reverse Breakdown Voltage
Peak Reverse Current
Forward Voltage
Junction Capacitance
Reverse Recovery Time
Document Number: DS_S1412038
SYMBOL
BAS19 IR = 100 μA
BAS20 IR = 100 μA
BAS19 VR = 100 V
VR(BR)
MIN
100
150
MAX
UNIT
-
V
0.1
μA
IR
-
VF
-
VR = 0 V , f = 1.0 MHz
CJ
-
5
pF
IF = IR = 30 mA , IRR = 0.1 × IR
trr
-
50.0
ns
BAS20 VR = 150 V
IF = 100 mA
IF = 200 mA
1.0
1.25
V
Version: B14
BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
Fig. 2 Leakage Current VS. Junction temperature
Fig. 1 Forward Characteristics
100
IR, Leakage Current (μA)
IF , Instantaneous Forward Current (mA)
1000
100
10
1
10
1
0.1
0.1
0.01
0.01
0
1
VF , Instantaneous Forward Voltage (V)
Document Number: DS_S1412038
2
0
100
Tj, Junction Temperature
200
(o C)
Version: B14
BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
PACKING
PACKING CODE
SUFFIX (Note 2)
CODE
SUFFIX
PART NO.
BASxx
(Note 1)
-xx
RF
G
R5
PACKAGE
PACKING
3K / 7" Reel
SOT-23
10K / 13" Reel
Note 1: "xx" is Device Code from "19" thru "20".
Note 2: Part No. Suffix „-xx “ would be used for special requirement
EXAMPLE
PREFERRED P/N PART NO.
PART NO.
SUFFIX
BAS19 RF
BAS19
RF
BAS19 RFG
BAS19
RF
BAS19-B0 RFG
BAS19
-B0
PACKING CODE
PACKING CODE
SUFFIX
DESCRIPTION
Multiple manufacture
source
RF
G
Multiple manufacture
source
Green compound
G
Defined manufacture
source
Green compound
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
2.70
3.10
0.106
0.122
B
1.10
1.50
0.043
0.059
C
0.30
0.51
0.012
0.020
D
1.78
2.04
0.070
0.080
E
2.10
2.64
0.083
0.104
F
0.89
1.30
0.035
0.051
G
0.55 REF
0.022 REF
H
0.10 REF
0.004 REF
Unit (mm)
Unit (inch)
Typ.
Typ.
SUGGEST PAD LAYOUT
DIM.
Document Number: DS_S1412038
Z
2.8
0.110
X
0.7
0.028
Y
0.9
0.035
C
1.9
0.075
E
1.0
0.039
Version: B14
BAS19 / BAS20
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1412038
Version: B14
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