ESH1DM - ESH1JM Taiwan Semiconductor CREAT BY ART 1A, 200V - 600V Surface Mount Ultrafast Rectifiers FEATURES - Very low profile - typical height of 0.68mm - Reduce switching and conduction loss - Ideal for automated placement - Ultrafast recovery times for high frequency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 APPLICATION Micro SMA ESH1DM to ESH1JM is ideal device for the compact space PCB design. Specially as boost diode in power factor correction circuitry. The device is also intended for use as a free wheeling diode in power supplies For chargers, LED lighting, and other power switching applications. MECHANICAL DATA Case: Micro SMA Molding compound: UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 6mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL Marking code ESH1DM ESH1GM ESH1JM D3 D5 D7 200 400 600 UNIT Maximum repetitive peak reverse voltage VRRM Maximum average forward rectified current IF(AV) 1 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 15 A Maximum instantaneous forward voltage (Note 1) @1A VF Maximum reverse current @ rated VR TJ=25 °C TJ=125 °C IR Maximum reverse recovery time (Note 2) Typical junction capacitance (Note 3) Typical thermal resistance (Note 4) Operating junction temperature range Storage temperature range TYP MAX 1.25 1.5 TYP MAX - 1 5 V V μA 50 trr 25 ns CJ 3 pF RθJM RθJA 40 92 °C/W TJ -55 to +150 °C TSTG -55 to +150 °C Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Test conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Measured at 1 MHz and applied reverse voltage of 4.0 V Note 4: Thermal resistance RθJA - from junction to ambient, RθJM - and junction to mount Version: C1602 ESH1DM - ESH1JM Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. SUFFIX ESH1xM (Note 1, 2) PACKING CODE PACKAGE PACKING G Micro SMA 3,000 / 7" Plastic reel PART NO. PACKING PACKING CODE SUFFIX CODE SUFFIX H RS G PACKING CODE SUFFIX RS H Note 1: "x" defines voltage from 200V (ESH1DM) to 600V (ESH1JM) Note 2: Whole series with green compound EXAMPLE EXAMPLE P/N PART NO. ESH1JMHRSG ESH1JM DESCRIPTION Automotive grade Green compound RATINGS AND CHARACTERISTICS CURVES FIG. 2 MAXIMUM FORWARD SURGE CURRENT FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE 1.2 1 0.8 0.6 0.4 Resistive or inductive load 0.2 0 0 25 50 75 100 125 150 175 PEAK FORWARD SURAGE CURRENT(A) AVERAGE FORWARD CURRENT (A) (TA=25°C unless otherwise noted) 15 8.3ms single half sine wave 10 5 0 1 10 NUMBER OF CYCLES AT 60 Hz LEAD TEMPERATURE (°C) FIG. 3 TYPICAL FORWARD CHARACTERISTICS 1 TJ=25°C 0.1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 FORWARD VOLTAGE (V) 2 2.2 2.4 INSTANTANEOUS REVERSE CURRENT(μA) INSTANTANEOUS FORWARD CURRENT(A) TJ=125°C FIG. 4 TYPICAL REVERSE CHARACTERISTICS 10 10 0 100 1 TJ=125°C 0.1 0.01 TJ=25°C 0.001 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Version: C1602 ESH1DM - ESH1JM Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Micro SMA Unit (mm) DIM. A Unit (inch) Min Max Min Max 2.30 2.70 0.091 0.106 B 2.10 2.30 0.083 0.091 C 0.63 0.73 0.025 0.029 D 0.10 0.20 0.004 0.008 E 1.15 1.35 0.045 0.053 F 0.65 0.85 0.026 0.034 G 1.15 1.35 0.045 0.053 H 0.75 0.95 0.030 0.037 I 1.10 1.50 0.043 0.059 J 0.55 0.75 0.022 0.030 K 0.55 0.75 0.022 0.030 L 0.65 0.85 0.026 0.034 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.1 0.043 B 2.0 0.079 C 0.5 0.020 D 0.8 0.031 E 1.0 0.039 MARKING DIAGRAM P/N = Marking code YW = Date Code Version: C1602 ESH1DM - ESH1JM Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: C1602