ESH1DM SERIES_C1602.pdf

ESH1DM - ESH1JM
Taiwan Semiconductor
CREAT BY ART
1A, 200V - 600V Surface Mount Ultrafast Rectifiers
FEATURES
- Very low profile - typical height of 0.68mm
- Reduce switching and conduction loss
- Ideal for automated placement
- Ultrafast recovery times for high frequency
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21
APPLICATION
Micro SMA
ESH1DM to ESH1JM is ideal device for the compact space PCB design.
Specially as boost diode in power factor correction circuitry.
The device is also intended for use as a free wheeling diode in power supplies
For chargers, LED lighting, and other power switching applications.
MECHANICAL DATA
Case: Micro SMA
Molding compound: UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 6mg (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code
ESH1DM
ESH1GM
ESH1JM
D3
D5
D7
200
400
600
UNIT
Maximum repetitive peak reverse voltage
VRRM
Maximum average forward rectified current
IF(AV)
1
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
15
A
Maximum instantaneous forward voltage (Note 1)
@1A
VF
Maximum reverse current @ rated VR
TJ=25 °C
TJ=125 °C
IR
Maximum reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance (Note 4)
Operating junction temperature range
Storage temperature range
TYP
MAX
1.25
1.5
TYP
MAX
-
1
5
V
V
μA
50
trr
25
ns
CJ
3
pF
RθJM
RθJA
40
92
°C/W
TJ
-55 to +150
°C
TSTG
-55 to +150
°C
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Test conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and applied reverse voltage of 4.0 V
Note 4: Thermal resistance RθJA - from junction to ambient, RθJM - and junction to mount
Version: C1602
ESH1DM - ESH1JM
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
ESH1xM
(Note 1, 2)
PACKING CODE
PACKAGE
PACKING
G
Micro SMA
3,000 / 7" Plastic reel
PART NO.
PACKING
PACKING CODE
SUFFIX
CODE
SUFFIX
H
RS
G
PACKING CODE
SUFFIX
RS
H
Note 1: "x" defines voltage from 200V (ESH1DM) to 600V (ESH1JM)
Note 2: Whole series with green compound
EXAMPLE
EXAMPLE P/N
PART NO.
ESH1JMHRSG
ESH1JM
DESCRIPTION
Automotive grade
Green compound
RATINGS AND CHARACTERISTICS CURVES
FIG. 2 MAXIMUM FORWARD SURGE CURRENT
FIG.1 MAXIMUM FORWARD CURRENT
DERATING CURVE
1.2
1
0.8
0.6
0.4
Resistive or
inductive load
0.2
0
0
25
50
75
100
125
150
175
PEAK FORWARD SURAGE CURRENT(A)
AVERAGE FORWARD CURRENT (A)
(TA=25°C unless otherwise noted)
15
8.3ms single half sine wave
10
5
0
1
10
NUMBER OF CYCLES AT 60 Hz
LEAD TEMPERATURE (°C)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
1
TJ=25°C
0.1
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
FORWARD VOLTAGE (V)
2
2.2 2.4
INSTANTANEOUS REVERSE CURRENT(μA)
INSTANTANEOUS FORWARD CURRENT(A)
TJ=125°C
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
10
10
0
100
1
TJ=125°C
0.1
0.01
TJ=25°C
0.001
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Version: C1602
ESH1DM - ESH1JM
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
Micro SMA
Unit (mm)
DIM.
A
Unit (inch)
Min
Max
Min
Max
2.30
2.70
0.091
0.106
B
2.10
2.30
0.083
0.091
C
0.63
0.73
0.025
0.029
D
0.10
0.20
0.004
0.008
E
1.15
1.35
0.045
0.053
F
0.65
0.85
0.026
0.034
G
1.15
1.35
0.045
0.053
H
0.75
0.95
0.030
0.037
I
1.10
1.50
0.043
0.059
J
0.55
0.75
0.022
0.030
K
0.55
0.75
0.022
0.030
L
0.65
0.85
0.026
0.034
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.1
0.043
B
2.0
0.079
C
0.5
0.020
D
0.8
0.031
E
1.0
0.039
MARKING DIAGRAM
P/N =
Marking code
YW =
Date Code
Version: C1602
ESH1DM - ESH1JM
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: C1602
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