BZX584B4V7 Series_A14.pdf

BZX584B4V7 ~ BZX584B20
Taiwan Semiconductor
Small Signal Product
2% Zener Voltage Tolerance SMD Zener Diode
FEATURES
- Wide zener voltage range selection: 4.7V to 20V
- Surface Mount Device type
- Moisture sensitivity level 1
- Pb free and RoHS compliant
- Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
SOD-523F
MECHANICAL DATA
- Case: SOD-523F small outline plastic package
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
- Polarity: Indicated by cathode band
- Weight: 1.3mg ± 20 %
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
Power Dissipation
Forward Voltage
Thermal Resistance (Junction to Ambient)
IF = 10 mA
(Note 1)
Junction Temperature
Junction and Storage Temperature Range
SYMBOL
VALUE
UNIT
PD
VF
RθJA
150
0.9
833
mW
V
TJ
150
o
TSTG
- 55 to + 150
o
o
C/W
C
C
Note1: Valid provided that electrodes are kept at ambient temperature
Zener I vs. V Characteristics
VBR
: Voltage at IZK
IZK
: Test current for voltage VBR
ZZK
: Dynamic impedance at IZK
IZT
: Test current for voltage VZ
VZ
: Voltage at current I
ZZT
: Dynamic impedance at IZT
IZM
: Maximum steady state current
: Voltage at IZM
VZM
Document Number: DS_S1403006
Version: A14
BZX584B4V7 ~ BZX584B20
Taiwan Semiconductor
Small Signal Product
Electrical Characteristics
(Ratings at TA=25oC ambient temperature unless otherwise specified)
Maximum
Zener Voltage Range
Part
Number
Zener Impedance
Maximum
Typical
Reverse
Temperature
Currrent
Coefficent
Marking
VZ
@ IZT
(V)
IZT
ZZT @
IZK
ZZK @
I R @ VR
VR
(mA)
IZT (Ω)
(mA)
IZK (Ω)
(µA)
(V)
Tc @ IZT
o
(mV/ C)
BZX584B4V7
2Z1
Min
4.61
Nom
4.7
Max
4.79
5
80
1
500
3
2.0
Min
-3.5
Max
0.2
BZX584B5V1
2Z2
5.00
5.1
5.20
5
60
1
480
2
2.0
-2.7
1.2
BZX584B5V6
2Z3
5.49
5.6
5.71
5
40
1
400
1
2.0
-2.0
2.5
BZX584B6V2
2Z4
6.08
6.2
6.32
5
10
1
150
3
4.0
0.4
3.7
BZX584B6V8
2Z5
6.66
6.8
6.94
5
15
1
80
2
4.0
1.2
4.5
BZX584B7V5
2Z6
7.35
7.5
7.65
5
15
1
80
1
5.0
2.5
5.3
BZX584B8V2
2Z7
8.04
8.2
8.36
5
15
1
80
0.7
5.0
3.2
6.2
BZX584B9V1
2Z8
8.92
9.1
9.28
5
15
1
100
0.5
6.0
3.8
7.0
BZX584B10
2Z9
9.80
10
10.20
5
20
1
150
0.2
7.0
4.5
8.0
BZX584B11
2Y1
10.78
11
11.22
5
20
1
150
0.1
8.0
5.4
9.0
BZX584B12
2Y2
11.76
12
12.24
5
25
1
150
0.1
8.0
6.0
10.0
BZX584B13
2Y3
12.74
13
13.26
5
30
1
170
0.1
8.0
7.0
11.0
BZX584B15
2Y4
14.70
15
15.30
5
30
1
200
0.1
10.5
9.2
13.0
BZX584B16
2Y5
15.68
16
16.32
5
40
1
200
0.1
11.2
10.4
14.0
BZX584B18
2Y6
17.64
18
18.36
5
45
1
225
0.1
12.6
12.4
16.0
BZX584B20
2Y7
19.60
20
20.40
5
55
1
225
0.1
14.0
14.4
18.0
Document Number: DS_S1403006
Version: A14
BZX584B4V7 ~ BZX584B20
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
Fig. 2 Reverse Current vs Reverse Voltage
Fig. 2 Reverse Current vs Reverse Voltage
Fig.1 Typical Forward Characteristics
100
100
90
90
80
80
70
70
60
60
50
50
40
40
30
30
20
20
10
10
0
0
10
Reverse
ReverseCurrent
Current(mA)
(mA)
Forward Current (mA)
100
Ta=100°C
Ta=25°C
1
0.1
200
300
400
500
600
700
800
900
1000
Ta=25°C
Ta=25°C
Ta=100°C
Ta=100°C
0
0
2
2
4
4
Forward Voltage (mV)
8
10
12
14
16
18
20
8
10
12
14
16
18
20
Reverse Voltage (V)
Reverse Volatge (V)
Fig. 4 Typical Capacitance Characteristics
Fig. 3 Admissible Power Dissipation Curve
50
Capacitance Between Terminals (pF)
200
Power Dissipation (mW)
6
6
150
100
50
0
0
25
50
75
100
Ambient Temperature (°C)
Document Number: DS_S1403006
125
150
40
30
20
10
0
0
2
4
6
8
Reverse Voltage (V)
10
12
14
Version: A14
BZX584B4V7 ~ BZX584B20
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
MANUFACTURE
CODE
BZX584Bxxx
(Note1)
PACKING CODE
(Note 2)
RS
GREEN
COMPOUND
G
PACKAGE
PACKING
SOD-523F
3K / 7" Reel
Note 1: "xxx" is Device Code from "4V7" through "20".
Note 2: Manufacture special control, if empty means no special control requirement.
EXAMPLE
PREFERRED P/N
PART NO.
BZX584B4V7 RSG
BZX584B4V7
MANUFACTURE
BZX584B4V7-M0 RSG BZX584B4V7
Document Number: DS_S1403006
CODE
M0
PACKING CODE
GREEN COMPOUND
CODE
DESCRIPTION
RS
G
Green compound
RS
G
Green compound
Version: A14
BZX584B4V7 ~ BZX584B20
Taiwan Semiconductor
Small Signal Product
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
0.70
0.90
0.028
0.035
B
1.50
1.70
0.059
0.067
C
0.25
0.40
0.010
0.016
D
1.10
1.30
0.043
0.051
E
0.50
0.77
0.020
0.030
F
0.07
0.20
0.003
0.008
SUGGESTED PAD LAYOUT
DIM.
Unit (inch)
Typ.
Typ.
0.60
0.024
X1
2.30
0.091
Y
0.80
0.031
X
Document Number: DS_S1403006
Unit (mm)
Version: A14
BZX584B4V7 ~ BZX584B20
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no
responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property
rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability
whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties
relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling
these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such
improper use or sale.
Document Number: DS_S1403006
Version: A14
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