DATASHEET

ISL54211
®
Data Sheet
August 25, 2008
FN6662.1
MP3/USB 2.0 High Speed Switch with
Negative Signal Handling/Click and Pop
Suppression
Features
The Intersil ISL54211 dual SPDT (Single Pole/Double Throw)
switches combine low distortion audio and accurate USB 2.0
high speed data (480Mbps) signal switching in the same low
voltage device. When operated with a 2.7V to 5.0V single
supply these analog switches allow audio signal swings
below-ground, allowing the use of a common USB and audio
headphone connector in Personal Media Players and other
portable battery powered devices.
• Low Distortion Negative Signal Capability
• High Speed (480Mbps) and Full Speed (12Mbps)
Signaling Capability per USB 2.0
• Clickless/Popless Audio Switches
• Enable Control Pin (CTRL) to Open all Switches
• Low Distortion Headphone Audio Signals
- THD+N at 1mW into 32Ω Load . . . . . . . . . . . . . 0.014%
• Crosstalk (20Hz to 20kHz). . . . . . . . . . . . . . . . . . . -100dB
• OFF-Isolation (20Hz to 100kHz) . . . . . . . . . . . . . . . 95dB
The ISL54211 logic control pins are 1.8V compatible with a
supply voltage of 2.7V to 3.6V, which allows for control via a
standard µcontroller.
• Single Supply Operation (VDD) . . . . . . . . . . . . 2.7V to 5.0V
• -3dB Bandwidth USB Switch . . . . . . . . . . . . . . . . . 700MHz
The part has an audio enable control pin (CTRL) to open all
in-line switches and activate the audio click and pop circuitry.
The high OFF-isolation and special click/pop circuitry of the
audio switches eliminates click and pops in the head-phones
when the audio CODEC drivers are powering up or down or
when a headphone is inserted or removed from the
headphone jack.
• Available in µTQFN and TDFN Packages
• Compliant with USB 2.0 Short Circuit Requirements
Without Additional External Components
• Pb-Free (RoHS Compliant)
Applications
It’s available in a tiny 10 Ld 1.8mmx1.4mm ultra-thin µTQFN
package and a 10 Ld 3mmx3mm TDFN package. It operates
over a temperature range of -40 to +85°C.
• MP3 and other Personal Media Players
• Cellular/Mobile Phones
• PDA’s
Related Literature
• Audio/USB Switching
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
Application Block Diagram
µCONTROLLER
3.3V
VDD
ISL54211
USB/HEADPHONE JACK
IN
VBUS
LOGIC CONTROL
4MΩ
4MΩ
D-
USB HIGH-SPEED
TRANSCEIVER
COM D+
200kΩ
COM +
200kΩ
CLICK
AND
POP
GND
1
CTRL
R
L
AUDIO CODEC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL54211
Pinouts
(Note 1)
ISL54211
(10 LD 3.0mmx3.0mm TDFN)
TOP VIEW
ISL54211
(10 LD 1.8mmx1.4mm µTQFN)
TOP VIEW
CTRL
VDD
L
7
6
CLICK/POP
8
LOGIC CONTROL
D-
D+
9
10
5
R
4
GND
3
COM +
VDD
1
IN
2
LOGIC
CONTROL
9
D-
8
D+
7
L
6
R
4MΩ
COM -
3
200kΩ
COM +
4
CLICK/
POP
200kΩ
GND
1
10 CTRL
4MΩ
5
2
IN
COM -
NOTE:
1. Switches Shown for IN = Logic “0” and CTRL = Logic “1”.
Truth Table
Pin Descriptions
ISL54211
ISL54211
IN
CTRL
L, R
D+, D-
µTQFN
TDFN
NAME
0
0
OFF
OFF
1
2
IN
0
1
ON
OFF
2
3
COM-
1
X
OFF
ON
3
4
COM+ Voice and Data Common Pin
4
5
GND
5
6
R
Audio Right Input
6
7
L
Audio Left Input
7
8
D+
USB Differential Input
8
9
D-
USB Differential Input
9
10
CTRL
Digital Control Input (Audio Enable)
10
1
VDD
Power Supply
IN, CTRL: Logic “0” when ≤ 0.5V or Floating, Logic “1” when ≥ 1.4V
with 2.7V to 3.6V supply.
FUNCTION
Digital Control Input
Voice and Data Common Pin
Ground Connection
Ordering Information
PART NUMBER
PART MARKING
ISL54211IRUZ-T* (Note 3)
1
TEMP. RANGE
(°C)
-40 to +85
PACKAGE
(Pb-Free)
10 Ld 1.8x1.4mm µTQFN
PKG.
DWG. #
L10.1.8x1.4A
ISL54211IRTZ (Note 2)
4211
-40 to +85
10 Ld 3mmx3mm TDFN
L10.3x3A
ISL54211IRTZ-T* (Note 2)
4211
-40 to +85
10 Ld 3mmx3mm TDFN
L10.3x3A
*Please refer to TB347 for details on reel specifications.
NOTES:
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu
plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2
FN6662.1
August 25, 2008
ISL54211
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
Input Voltages
D+, D-, L, R (Note 4) . . . . . . . . . . . . . . . . . . -2V to ((VDD) + 0.3V)
IN (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to 5.5V
CTRL (Note 4) . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((VDD) + 0.3V)
Output Voltages
COM-, COM+ (Note 4) . . . . . . . . . . . . . . . . -2V to ((VDD) + 0.3V)
Continuous Current (Audio Switches). . . . . . . . . . . . . . . . . ±150mA
Peak Current (Audio Switches)
(Pulsed 1ms, 10% Duty Cycle, Max). . . . . . . . . . . . . . . . ±300mA
Continuous Current (USB Switches). . . . . . . . . . . . . . . . . . . ±40mA
Peak Current (USB Switches)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . ±100mA
ESD Rating
Human Body Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
10 Ld µTQFN Package (Note 5) . . . . .
160
N/A
10 Ld 3x3 TDFN Package (Notes 6, 7)
55
18
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. Signals on D+, D-, L, R, COM-, COM+, CTRL, IN exceeding VDD or GND by specified amount are clamped. Limit current to maximum current
ratings.
5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
6. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
7. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = 1.4V, VINL = 0.5V,
VCTRLH = 1.4V, VCTRLL = 0.5V, (Note 8), Unless Otherwise Specified.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
(Notes 9, 10) (Note 12) (Notes 9, 10) UNITS
ANALOG SWITCH CHARACTERISTICS
Audio Switches (L, R)
Analog Signal Range,
VANALOG
VDD = 2.7V to 3.6V, IN = float, CTRL = 1.4V
Full
-1.5
-
1.5
V
ON-Resistance, rON
VDD = 3.0V, IN = float, CTRL = 1.4V, ICOMx = 40mA, VL
or VR = -0.85V to 0.85V (see Figure 2)
+25
-
2.4
2.8
Ω
Full
-
-
3.8
Ω
rON Matching Between
Channels, ΔrON
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V, ICOMx = 40mA,
VL or VR = Voltage at max rON over signal range of
-0.85V to 0.85V, (Note 13)
+25
-
0.1
0.32
Ω
Full
-
-
0.4
Ω
rON Flatness, RFLAT(ON)
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V, ICOMx = 40mA,
VL or VR = -0.85V to 0.85V, (Note 11)
+25
-
0.02
0.06
Ω
Full
-
-
0.07
Ω
Insertion Loss, GON
VDD = 3.0V, IN = 0.5V, CTRL = VDD, RLOAD = 32Ω
+25
-
-0.78
-
dB
Insertion Loss, GON
VDD = 3.0V, IN = 0.5V, CTRL = VDD, RLOAD = 15Ω
+25
-
-1.5
-
dB
Discharge Pull-Down
Resistance, RL, RR
VDD = 3.6V, IN = 0.5V, CTRL = 0.5V, VCOM- or
VCOM+ = -0.85V, 0.85V, VL or VR = -0.85V, 0.85V,
VD+ and VD- = floating; measure current through the
discharge pull-down resistor and calculate resistance
value.
+25
-
40
-
Ω
Analog Signal Range,
VANALOG
VDD = 2.7V to 3.6V, IN = VDD, CTRL = 0V or VDD
Full
0
-
VDD
V
ON-Resistance, rON
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx = 1mA,
VD+ or VD- = 3.3V (see Figure 3)
+25
-
25
35
Ω
Full
-
-
40
Ω
USB Switches (D+, D-)
3
FN6662.1
August 25, 2008
ISL54211
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = 1.4V, VINL = 0.5V,
VCTRLH = 1.4V, VCTRLL = 0.5V, (Note 8), Unless Otherwise Specified. (Continued)
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
(Notes 9, 10) (Note 12) (Notes 9, 10) UNITS
VDD = 3.3V, IN = 1.4V, CTRL = 0V or VDD,
ICOMx = 40mA, VD+ or VD- = 0V to 400mV
(see Figure 3)
+25
-
5.4
6
Ω
Full
-
-
7.5
Ω
rON Matching Between
Channels, ΔrON
VDD = 3.3V, IN = 1.4V, CTRL = 0V or VDD,
ICOMx = 40mA, VD+ or VD- = Voltage at max rON,
(Note 13)
+25
-
0.02
0.25
Ω
Full
-
-
0.25
Ω
rON Flatness, RFLAT(ON)
VDD = 3.3V, IN = 1.4V, CTRL = 0V or VDD,
ICOMx = 40mA, VD+ or VD- = 0V to 400mV, (Note 9)
+25
-
0.45
0.55
Ω
Full
-
-
0.6
Ω
OFF Leakage Current,
ID+(OFF) or ID-(OFF)
VDD = 3.6V, IN = 0V, CTRL = 3.6V, VCOM- or
VCOM+ = 0.5V, 0V, VD+ or VD- = 0V, 0.5V, VL and
VR = float
+25
-10
4
10
nA
Full
-50
-
50
nA
ON Leakage Current, IDX
VDD = 3.6V, IN = VDD, CTRL = 0V or VDD, VD+ or
VD- = 2.7V, VCOM- or VCOM+ = Float, VL and VR = float;
measuring current through 200k resistor at com side
+25
-20
11
20
µA
Full
-30
-
30
µA
ns
ON-Resistance, rON
DYNAMIC CHARACTERISTICS
USB Turn-ON Time, tON
VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1)
+25
-
43
-
USB Turn-OFF Time, tOFF
VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1)
+25
-
14.5
-
ns
Audio Turn-ON Time, tON
VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1)
+25
-
7.5
-
µs
Audio Turn-OFF Time, tOFF
VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1)
+25
-
130
-
ns
Skew, tSKEW
VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, RL = 45Ω,
CL = 10pF, tR = tF = 750ps at 480Mbps,
(Duty Cycle = 50%) (see Figure 6)
+25
-
50
-
ps
Total Jitter, tJ
VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, RL = 50Ω,
CL = 10pF, tR = tF = 750ps at 480Mbps
+25
-
210
-
ps
Propagation Delay, tPD
VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, RL = 45Ω,
CL = 10pF (see Figure 6)
+25
-
250
-
ps
Audio Crosstalk
R to COM-, L to COM+
VDD = 3.0V, IN = float, CTRL = 3.0V, RL = 32Ω, f = 20Hz
to 20kHz, VR or VL = 0.707VRMS (2VP-P)
(see Figure 5)
+25
-
-100
-
dB
Crosstalk
VDD = 3.0V, RL = 50Ω, f = 100kHz (see Figure 5)
(Audio-to-USB, USB-to-Audio)
+25
-
-100
-
dB
OFF-Isolation
VDD = 3.0V, RL = 50Ω, f = 100kHz
+25
-
95
-
dB
VDD = 3.0V, RL = 15Ω, f = 20Hz to 20kHz
+25
-
111
-
dB
VDD = 3.0V, RL = 32Ω, f = 20Hz to 20kHz
+25
-
105
-
dB
VDD = 3.0V, RL = 1kΩ, f = 20Hz to 20kHz
+25
-
75
-
dB
VDD = 3.0V, RL = 10kΩ, f = 20Hz to 20kHz
+25
-
57
-
dB
Total Harmonic Distortion
Click and Pop
VDD = 3.0V, RL = 100kΩ, f = 20Hz to 20kHz
+25
-
45
-
dB
f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V,
VL or VR = 180mVRMS (509mVP-P), RL = 32Ω
+25
-
0.014
-
%
f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V,
VL or VR = 0.707VRMS (2VP-P), RL = 32Ω
+25
-
0.056
-
%
f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V,
VL or VR = 180mVRMS (509mVP-P), RL = 15Ω
+25
-
0.043
-
%
f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V,
VL or VR = 0.707VRMS (2VP-P), RL = 15Ω
+25
-
0.19
-
%
VDD = 3.3V, CTRL = 0V, IN = float, RL = 1kΩ, VL or
VR = 0 to 1.25V DC step or 1.25V to 0V DC step
(see Figure 7)
+25
-
60
-
µVp
VDD = 3.3V, CTRL = 0.5Hz Square Wave, IN = float,
RL = 30.1Ω or 1kΩ , VL or VR = AC-coupled to ground
(see Figure 8)
+25
-
500
-
µVp
4
FN6662.1
August 25, 2008
ISL54211
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = 1.4V, VINL = 0.5V,
VCTRLH = 1.4V, VCTRLL = 0.5V, (Note 8), Unless Otherwise Specified. (Continued)
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
(Notes 9, 10) (Note 12) (Notes 9, 10) UNITS
USB Switch -3dB Bandwidth
Signal = 0dBm, 0.2VDC offset, RL = 50Ω, CL = 5pF
+25
-
700
-
MHz
D+/D- OFF Capacitance,
CD+OFF, CD-OFF
f = 1MHz, VDD = 3.0V, IN = float, CTRL = 3.0V, VD- or
VD+ = VCOMx = 0V (see Figure 4)
+25
-
4
-
pF
COM ON Capacitance, CCOM- f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, VDor VD+ = VCOMx = 0V, (See Figure 4)
(ON), CCOM+(ON)
+25
-
9
-
pF
POWER SUPPLY CHARACTERISTICS
Full
2.7
Positive Supply Current, IDD
(Audio Mode)
VDD = 3.6V, IN = 0V, CTRL = 3.6V
+25
-
Full
Positive Supply Current, IDD
(USB Mode)
VDD = 3.6V, IN = 3.6V, CTRL = 3.6V
+25
Full
-
-
5
µA
Positive Supply Current, IDD
(Mute Mode)
VDD = 3.6V, IN = 0V, CTRL = 0V
+25
-
2.4
4
µA
Full
-
-
5
µA
Power Supply Range, VDD
3.6
V
7
10
µA
-
-
12
µA
-
2.4
4
µA
DIGITAL INPUT CHARACTERISTICS
IN Voltage Low, VINL
VDD = 2.7V to 3.6V
Full
-
-
0.5
V
IN Voltage High, VINH
VDD = 2.7V to 3.6V
Full
1.4
-
-
V
CTRL Voltage Low, VCTRLL
VDD = 2.7V to 3.6V
Full
-
-
0.5
V
CTRL Voltage High, VCTRLH
VDD = 2.7V to 3.6V
Full
1.4
-
-
V
Input Current, IINL, ICTRLL
VDD = 3.6V, IN = 0V or float, CTRL = 0V or float
Full
-50
2
50
nA
Input Current, IINH
VDD = 3.6V, IN = 3.6V, CTRL = 0V or float
Full
-2
1
2
µA
Input Current, ICTRLH
VDD = 3.6V, IN = 0V or float, CTRL = 3.6V
Full
-2
1
2
µA
IN Pull-Down Resistor, RIN
VDD = 3.6V, IN = 3.6V, CTRL = 0V or float; measure
current through the internal pull-down resistor and
calculate resistance value.
Full
-
4
-
MΩ
CTRL Pull-Down Resistor,
RCTRL
VDD = 3.6V, IN = 0V or float, CTRL = 3.6V; measure
current through the internal pull-down resistor and
calculate resistance value.
Full
-
4
-
MΩ
NOTES:
8. Vlogic = Input voltage to perform proper function.
9. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
10. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
11. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal range.
12. Limits established by characterization and are not production tested.
13. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON
value, between L and R or between D+ and D-.
5
FN6662.1
August 25, 2008
ISL54211
Test Circuits and Waveforms
VINH
LOGIC
INPUT
50%
VINL
CTRL
VINPUT
tOFF
SWITCH
INPUT VINPUT
SWITCH
INPUT
VOUT
AUDIO OR USB
COMx
IN
VOUT
90%
90%
SWITCH
OUTPUT
C
VDD
tr < 20ns
tf < 20ns
VIN
RL
50Ω
GND
CL
10pF
0V
tON
Logic input waveform is inverted for switches that have the opposite
logic sense.
Repeat test for all switches. CL includes fixture and stray
capacitance.
RL
V OUT = V (INPUT) -----------------------R L + r ON
FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1. SWITCHING TIMES
VDD
VDD
C
C
rON = V1/ICOM
rON = V1/40mA
CTRL
D- OR D+
CTRL
L OR R
VD- OR VD+
VL OR VR
IN
V1
40mA
0V OR
FLOAT
IN
V1
ICOM
COMx
VDD
COMx
GND
GND
Repeat test for all switches.
Repeat test for all switches.
FIGURE 2. AUDIO rON TEST CIRCUIT
6
FIGURE 3. USB rON TEST CIRCUIT
FN6662.1
August 25, 2008
ISL54211
Test Circuits and Waveforms (Continued)
VDD
VDD
C
C
CTRL
CTRL
SIGNAL
GENERATOR
AUDIO OR USB
L OR R
32Ω
COMx
IN
IN
0V OR FLOAT
IMPEDANCE
ANALYZER
VINL OR
VINH
COMx
GND
R OR L
COMx
ANALYZER
NC
GND
RL
Repeat test for all switches.
Repeat test for all switches.
FIGURE 5. AUDIO CROSSTALK TEST CIRCUIT
FIGURE 4. CAPACITANCE TEST CIRCUIT
VDD
C
tri
90%
DIN+
10%
CTRL
50%
VINH
tskew_i
15.8Ω
DIN90%
IN
DIN+
50%
15.8Ω
DIN-
OUT+
D+
143Ω
10%
tfi
tro
COM+
CL
COM-
OUT-
DCL
143Ω
45Ω
45Ω
90%
10%
50%
OUT+
OUT-
GND
tskew_o
50%
90%
|tro - tri| Delay Due to Switch for Rising Input and Rising Output Signals.
|tfo - tfi| Delay Due to Switch for Falling Input and Falling Output Signals.
10%
tf0
|tskew_0| Change in Skew through the Switch for Output Signals.
|tskew_i| Change in Skew through the Switch for Input Signals.
FIGURE 6A. MEASUREMENT POINTS
FIGURE 6B. TEST CIRCUIT
FIGURE 6. SKEW TEST
7
FN6662.1
August 25, 2008
ISL54211
Test Circuits and Waveforms (Continued)
3.3V
AUDIO PRECISION
SYSTEM II CASCADE
ANALYZER
CHA
FLOAT
VDD
IN
CHB
COM-
L
CLICK
AND
POP
COM+
R
RLOAD
0V TO 1.25V
DC STEP
OR
1.25V TO 0V
DC STEP
RLOAD
GND
CTRL
Set Audio Analyzer for Peak Detection, 32 Samples/Sec, Aweighted Filter, Manual Range 1X/Y, Units to dBV
FIGURE 7. CLICK AND POP TEST CIRCUIT
3.3V
AUDIO PRECISION
SYSTEM II CASCADE
ANALYZER
CHA
FLOAT
IN
CHB
C
VDD
COM-
L
CLICK
AND
POP
COM+
RLOAD
R
RLOAD
CTRL
GND
0V TO VDD
SQUARE WAVE
Set Audio Analyzer for Peak Detection, 32 Samples/Sec, Aweighted Filter, Manual Range 1X/Y, Units to dBV
FIGURE 8. CLICK AND POP TEST CIRCUIT
Power Supply Turn-On/Turn-Off Click and Pop Transient Test
0V TO 3.0V
DC STEP OR
3.0V TO 0V
DC STEP
1Hz
VDD
L
COMCLICK
AND
POP
COM+
220µF
R
20kΩ
220µF
20kΩ
1.5V OR 0V
GND
IN CTRL
FIGURE 9. CLICK AND POP TEST CIRCUIT #2
8
FN6662.1
August 25, 2008
ISL54211
Typical Application Block Diagrams
3.3V
VDD
ISL54211
IN
µCONTROLLER
CTRL
USB/HEADPHONE JACK
LOGIC CONTROL
VBUS
4MΩ
4MΩ
D-
USB
HIGH-SPEED
D+
TRANSCEIVER
COM 200kΩ
COM +
200kΩ
R
CLICK
AND
POP
L
AUDIO
CODEC
GND
LOGIC CONTROL VIA MICROPROCESSOR
3.3V
VDD
ISL54211
IN
CTRL
µCONTROLLER
USB/HEADPHONE JACK
LOGIC CONTROL
VBUS
500kΩ
4MΩ
4MΩ
DCOM D+
200kΩ
USB
HIGH-SPEED
TRANSCEIVER
COM +
200kΩ
CLICK
AND
POP
R
L
AUDIO
CODEC
GND
LOGIC CONTROL VIA VBUS VOLTAGE FROM COMPUTER OR USB HUB
Detailed Description
The ISL54211 device is a dual single pole/double throw
(SPDT) analog switch that operates from a single DC power
supply in the range of 2.7V to 5.0V. It was designed to
function as dual 2-to-1 multiplexer to select between USB
differential data signals and audio L and R stereo signals. It
9
comes in a tiny µTQFN package for use in MP3 players,
PDAs, cellphones, and other personal media players.
The part consists of two 2.5Ω audio switches and two 5.5Ω
USB switches. The audio switches can accept signals that
swing below ground. They were designed to pass audio left
and right stereo signals, that are ground referenced, with
minimal distortion. The USB switches were designed to pass
FN6662.1
August 25, 2008
ISL54211
high-speed USB differential data signals with minimal edge
and phase distortion.
The ISL54211 was specifically designed for MP3 players,
personal media players and cellphone applications that need
to combine the audio headphone jack and the USB data
connector into a single shared connector, thereby saving
space and component cost. See “Typical Application Block
Diagrams” on page 9 regarding functionality.
The ISL54211 has a single logic control pin (IN) that selects
between the audio and the USB switches. This pin can be
driven low or high to switch between the audio CODEC
drivers and USB transceiver of the MP3 player or cellphone.
The ISL54211 also contains a logic control pin (CTRL) that
when driven low while IN is low, opens all switches and
activates the audio click and pop circuitry.
A detailed description of the two types of switches are
provided in the following sections. In a typical application,
the USB transmission and audio playback are intended to be
mutually exclusive operations.
USB Switches
The two USB switches (D+, D-) are 5.5Ω bidirectional
switches that were specifically designed to pass high-speed
USB differential signals typically in the range of 0V to
400mV. The switches have low capacitance and high
bandwidth to pass USB high-speed signals (480Mbps) with
minimum edge and phase distortion to meet USB 2.0 signal
quality specifications. See Figure 20 for High-speed Eye
Pattern taken with the switch in the signal path.
These switches can also swing rail to rail and pass USB
full-speed signals (12Mbps) with minimal distortion. See
Figure 21 for Full-speed Eye Pattern taken with the switch in
the signal path.
The maximum signal range for the USB switches is from
-1.5V to VDD. The signal voltage at D- and D+ should not be
allow to exceed the VDD voltage rail or go below ground by
more than -1.5V.
The USB switches are active (turned ON) whenever the IN
voltage is ≥ to 1.4V.
Audio Switches
ISL54211 Operation
The two audio switches (L, R) are 2.5Ω switches that can
pass signals that swing below ground. Crosstalk between
the audio switches is <-100dB over the audio band. These
switches have excellent OFF-isolation >105dB over the
audio band with a 32Ω load.
The following sections discuss using the ISL54211 in the
“Typical Application Block Diagrams” on page 9.
Over a signal range of ±1V (0.707VRMS) with VDD > 2.7V,
these switches have an extremely low rON resistance
variation. They can pass ground referenced audio signals
with very low distortion (<0.06% THD+N) when delivering
15.6mW into a 32Ω headphone speaker load. See Figures
16, 17, 18, and 19 (THD+N “Typical Performance Curves”
beginning on page 12).
The audio drivers should be connected at the L and R side of
the switch (pins 5 and 6 for µTQFN; pins 6 and 7 for TDFN)
and the speaker loads should be connected at the COM side
of the switch (pins 2 and 3 for µTQFN; pins 3 and 4 for
TDFN). The switches have click and pop circuitry on the L
and R side that is activated when the IN voltage is ≤ 0.5V or
floating and the CTRL voltage ≤ to 0.5V or floating. The
ISL54211 should be put in this mode before powering down
or powering up of the audio CODEC drivers. In this mode,
both the audio and USB in-line switches will be OFF and the
audio click and pop circuitry will be ON. The high
OFF-isolation of the audio switches along with the click and
pop circuitry will isolate the transients generated during
power-up and power-down of the audio CODECs from
getting through to the headphones, thus eliminating click and
pop noise in the headphones.
The audio switches are active (turned ON) whenever the IN
voltage is ≤ 0.5V or floating and the CTRL voltage ≥ to 1.4V.
10
VDD SUPPLY
The DC power supply connected at VDD (pin 10 for µTQFN,
pin 1 for TDFN) provides the required bias voltage for proper
switch operation. The part can operate with a supply voltage
in the range of 2.7V to 5.0V.
In a typical USB/Audio application for portable battery
powered devices, the VDD voltage will come from a battery
or an LDO and be in the range of 2.7V to 4.3V. For best
possible USB full-speed operation (12Mbps), it is
recommended that the VDD voltage be ≥2.7V in order to get
a USB data signal level above 2.7V.
LOGIC CONTROL
The state of the ISL54211 device is determined by the
voltage at the IN pin (pin 1 for µTQFN; pin 2 for TDFN) and
the CTRL pin (pin 9 for µTQFN, pin 10 for TDFN). These
logic pins are 1.8V logic compatible when VDD is in the
range of 2.7V to 3.6V and can be controlled by a standard
µprocessor. The part has three states or modes of operation:
Audio Mode; USB Mode; and Mute Mode. Refer to “Truth
Table” on page 2.
The IN pin and CTRL pin are internally pulled low through
4MΩ resistors to ground and can be left floating or tri-stated
by the µprocessor. The CTRL control pin is only active when
IN is logic “0”.
Logic Control Voltage Levels
IN = Logic “0” (Low) when ≤ 0.5V or Floating.
IN = Logic “1” (High) when ≥ 1.4V
FN6662.1
August 25, 2008
ISL54211
CTRL = Logic “0” (Low) when ≤ 0.5V or Floating.
CTRL = Logic “1” (High) when ≥ 1.4V
Audio Mode
If the IN pin = Logic “0” and CTRL pin = Logic “1” the part will
be in the Audio mode. In Audio mode the L (left) and R (right)
2.5Ω audio switches are ON, the D- and D+ 5.5Ω switches
are OFF (high impedance) and the audio click and pop
circuitry is OFF (high impedance).
When nothing is plugged into the common connector or a
headphone is plugged into the common connector, the
µprocessor will sense that there is no voltage at the VBUS
pin of the connector and will drive and hold the IN control pin
of the ISL54211 low. As long as the CTRL = Logic “1”, the
ISL54211 part remains in the audio mode and the audio
drivers of the player can drive the headphones and play
music.
USB Mode
If the IN pin = Logic “1” and CTRL pin = Logic “0” or
Logic “1”, the part will go into USB mode. In USB mode the
D- and D+ 5.5Ω switches are ON and the L and R 2.5Ω
audio switches are OFF (high impedance).
When a USB cable from a computer or USB hub is
connected at the common connector, the µprocessor will
sense the presence of the 5V VBUS voltage and drive the IN
pin voltage high. The ISL54211 part will go into the USB
mode. In USB mode the computer or USB hub transceiver
and the MP3 player or cellphone USB transceiver are
connected and digital data will be able to be transmit back
and forth.
When the USB cable is disconnected, the µprocessor will
sense that the 5V VBUS voltage is no longer connected and
will drive the IN pin low and put the part back into the Audio
or Mute mode.
Mute Mode
If the IN pin = Logic “0” and CTRL pin = Logic “0”, the part
will be in the Mute mode. In the Mute mode, the audio
switches and the USB switches are OFF (high impedance)
and the audio click and pop circuitry is ON.
Before powering down or powering up of the audio CODECs
drivers, the ISL54211 should be put in the Mute mode. In
Mute mode, transients present at the L and R signal pins due
to the changing DC voltage of the audio drivers will not pass
to the headphones, preventing clicks and pops in the
headphones.
Before power-up and power-down of the ISL54211, part the
IN and CTRL control pins should be driven to ground or
tri-stated. This will put the switch in the mute state, which
turns all switches OFF and activates the click and pop
circuitry. This will minimize transients at the speaker loads
during power-up and power-down. See Figure 30 in the
“Typical Performance Curves” on page 17.
11
AC-COUPLED CLICK AND POP OPERATION
Single supply audio drivers have their signal biased at a DC
offset voltage, usually at 1/2 the DC supply voltage of the
driver. As this DC bias voltage comes up or goes down
during power-up or power-down of the driver, a transient can
be coupled into the speaker load through the DC blocking
capacitor (see “Typical Application Block Diagrams” on
page 9).
When a driver is OFF and suddenly turned ON, the rapidly
changing DC bias voltage at the output of the driver will
cause an equal voltage at the input side of the switch due to
the fact that the voltage across the blocking capacitor cannot
change instantly. If the switch is in the Audio mode or there is
no low impedance path to discharge the blocking capacitor
voltage at the input of the switch, before turning on the audio
switch, a transient discharge will occur in the speaker,
generating a click/pop noise.
Proper elimination of a click/pop transient at the speaker
loads while powering up or down of the audio drivers
requires that the ISL54211 have its click/pop circuitry
activated by putting the part in the Mute mode. This allows
the transients generated by the audio drivers to be
discharged through the click and pop shunt circuitry.
Once the driver DC bias has reached VDD/2 and the
transient on the switch side of the DC blocking capacitor has
been discharged to ground through the click/pop shunt
circuitry, the audio switches can be turned ON and
connected through to the speaker loads without generating
any undesirable click/pop noise in the speakers.
With a typical DC blocking capacitor of 220µF and the
click/pop shunt circuitry designed to have a resistance of
20Ω to 70Ω, allowing a 100ms wait time to discharge the
transient before placing the switch in the Audio mode will
prevent the transient from getting through to the speaker
load. See Figures 28 and 29 in the “Typical Performance
Curves” page 16.
USING THE COMPUTER VBUS VOLTAGE TO DRIVE THE
“IN” PIN
Rather than using a micro-processor to control the IN logic
pin, one can directly drive the IN pin using the VBUS voltage
from the computer or USB hub. See the “Typical Application
Block Diagrams” on page 9.
When a headphone or nothing is connected at the common
connector, the internal 4MΩ pull-down will pull the IN pin low,
putting the ISL54211 in the Audio or Mute mode, depending
on the condition of the CTRL pin.
When a USB cable is connected at the common connector,
the voltage at the IN pin will be driven to 5V and the part will
automatically go into the USB mode.
When the USB cable is disconnected from the common
connector, the voltage at the IN pin will be pulled low by the
FN6662.1
August 25, 2008
ISL54211
pull-down resistor and return to the Audio or Mute mode,
depending on the condition of the CTRL pin.
Note: The ISL54211 contains an internal diode between the
IN pin and VDD pin. Whenever the IN voltage is greater than
the VDD voltage by more than 0.7V, current will flow through
this diode into the VDD power supply bus. An external series
resistor in the range of 100kΩ to 500kΩ is required at the IN
logic pin to limit the current when driving it with the VBUS
voltage. This allows the VBUS voltage from a computer or
USB hub (4.4V to 5.25V) to drive the IN pin while the VDD
voltage is in the range of 2.7V to 3.6V. A 500kΩ resistor will
limit the current to 3µA to 5µA and still allow the IN logic
voltage to go to around 3V, which is will above the required
VINH level of 1.4V. A smaller series resistor can be used but
more current will flow.
Typical Performance Curves TA = +25°C, Unless Otherwise Specified
2.70
4.0
ICOM = 40mA
ICOM = 40mA
VDD = 3.0V
3.6
VDD = 2.5V
VDD = 3.6V
VDD = 3.3V
2.60
2.55
2.50
-1.5
-1.0
rON (Ω)
rON (Ω)
2.65
3.2
VDD = 4.3V
2.8
VDD = 2.7V
VDD = 5.0V
2.4
VDD = 5.0V
-0.5
0
0.5
1.0
2.0
-1.5
1.5
-1.0
-0.5
0
VCOM (V)
VCOM (V)
FIGURE 10. AUDIO ON-RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
VDD = 3.6V
0.5
1.0
1.5
FIGURE 11. AUDIO ON-RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
25
4
VDD = 3.0V
+85°C
ICOM = 40mA
20
3
rON (Ω)
rON (Ω)
15
+25°C
10
2
+25°C
-40°C
5.0
VDD = 3.0V
ICOM = 40mA
1
-1.5
-1.0
-0.5
0
0.5
1.0
1.5
VCOM (V)
FIGURE 12. AUDIO ON-RESISTANCE vs SWITCH VOLTAGE vs
TEMPERATURE
12
0
-1.5
+85°C
-40°C
-1.0
-0.5
0
0.5
1.0
VCOM (V)
1.5
2.0
2.5
3.0
FIGURE 13. AUDIO ON-RESISTANCE vs SWITCH VOLTAGE vs
TEMPERATURE
FN6662.1
August 25, 2008
ISL54211
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
7.0
7
VDD = 3.3V
ICOM = 40mA
ICOM = 40mA
6.5
+85°C
6
6.0
rON (Ω)
rON (Ω)
VDD = 3.3V
5.0
VDD = 3.6V
4.5
4.0
VDD = 5V
0
0.1
VDD = 4.3V
0.2
VCOM (V)
2
0.3
1
0.4
FIGURE 14. USB ON-RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
0.058
-40°C
4
3
3.5
3.0
+25°C
5
VDD = 2.7V
5.5
0
0.1
0.2
VCOM (V)
0.3
0.4
FIGURE 15. USB ON-RESISTANCE vs SWITCH VOLTAGE vs
TEMPERATURE
0.08
VDD = 2.7V
RLOAD = 32Ω
VDD = 3V
PEAK-TO-PEAK VOLTAGES AT LOAD
3VP-P
2.5VP-P
THD+N (%)
THD+N (%)
0.056
VDD = 3.0V
VDD = 3.3V
0.054
VDD = 3.6V
0.06
2VP-P
0.04
1VP-P
0.052
RLOAD = 32Ω
VLOAD = 0.707VRMS
20
200
2k
FREQUENCY (Hz)
20k
20
FIGURE 16. THD+N vs SUPPLY VOLTAGE vs FREQUENCY
0.20
RLOAD = 32Ω
FREQ = 1kHz
VDD = 3V
0.10
THD+N (%)
THD+N (%)
20k
0.30
RLOAD = 32Ω
FREQ = 1kHz
VDD = 3V
0.10
0.08
0.06
0.08
0.06
0.04
0.04
0.02
0.02
0
0.3
200
2k
FREQUENCY (Hz)
FIGURE 17. THD+N vs SIGNAL LEVELS vs FREQUENCY
0.14
0.12
510mVP-P
0.02
0.6
0.9
1.2
1.5
1.8
2.1
2.3
OUTPUT VOLTAGE (VP-P)
FIGURE 18. THD+N vs OUTPUT VOLTAGE
13
2.6
2.9
0
5
10
15
20
25
30
OUTPUT POWER (mW)
FIGURE 19. THD+N vs OUTPUT POWER
FN6662.1
August 25, 2008
ISL54211
VOLTAGE SCALE (0.1V/DIV)
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
TIME SCALE (0.2ns/DIV)
FIGURE 20. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH
14
FN6662.1
August 25, 2008
ISL54211
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
VOLTAGE SCALE (0.5V/DIV)
VDD = 3.3V
TIME SCALE (10ns/DIV)
-40
VDD = 3.3V
-45 VSIGNAL
= 0.707VRMS
-50
-55
RL = 10kΩ
-60
-65
-70
-75
RL = 1kΩ
-80
-85
-90
-95
-100
RL = 32Ω
-105
-110
-115
-120
20
50
100 200
500
1k
2k
FREQUENCY (Hz)
-60
-65
-70
-80
-85
-90
-95
L TO R
-100
-105
-110
R TO L
-115
5k
10k 20k
FIGURE 22. OFF-ISOLATION AUDIO SWITCHES vs LOADING
15
VDD = 3V
RLOAD = 32Ω
VSIGNAL = 0.707VRMS
-75
CROSSTALK (dB)
OFF- ISOLATION (dB)
FIGURE 21. EYE PATTERN: 12Mbps USB SIGNAL WITH USB SWITCHES IN THE SIGNAL PATH
-120
20
50
100
200
500
1k
2k
FREQUENCY (Hz)
5k
10k 20k
FIGURE 23. AUDIO CHANNEL-TO-CHANNEL CROSSTALK
FN6662.1
August 25, 2008
ISL54211
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
-60
0
VDD = 3V
RLOAD = 50Ω
VSIGNAL = 0.707VRMS
-70
-80
-20
NORMALIZED GAIN (dB)
-90
CROSSTALK (dB)
-100
USB TO AUDIO
-110
-120
-130
AUDIO TO USB
-140
RL = 50Ω
VIN = 0.2VP-P TO 2VP-P
-150
-160
-40
-60
-80
-100
-120
-170
-180
20
50
100 200
500 1k
2k
5k
10k 20k
50k 100k
-140
0.001
0.01
FREQUENCY (Hz)
500M
1
0
USB SWITCH
RL = 50Ω
VIN = 0.2VP-P TO 2VP-P
0
-1
-20
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
100M
FIGURE 25. OFF-ISOLATION USB SWITCHES
FIGURE 24. CHANNEL-TO-CHANNEL CROSSTALK
-10
0.1
1M
10M
FREQUENCY (Hz)
-30
-40
-50
-60
-70
-2
-3
-4
RL = 50Ω
-80
VSIGNAL = 0.2VP-P TO 2VP-P
-90
-100
0.001
0.01
0.1
1M
10M
FREQUENCY (Hz)
100M
1M
500M
FIGURE 26. OFF-ISOLATION AUDIO SWITCHES
MUTE
MUTE
FIGURE 28. 32Ω AC-COUPLED CLICK/POP REDUCTION
16
VOLTAGE (V)
VOLTAGE (V)
TIME (s) 100ms/DIV
2V/DIV
VDD/2 2V/DIV
VDD/2 2V/DIV
LOUT50mV/DIV
1G
FIGURE 27. FREQUENCY RESPONSE
2V/DIV
LIN 200mV/DIV
10M
100M
FREQUENCY (Hz)
LIN
200mV/DIV
LOUT
50mV/DIV
TIME (s) 100ms/DIV
FIGURE 29. 1kΩ AC-COUPLED CLICK/POP REDUCTION
FN6662.1
August 25, 2008
ISL54211
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
Die Characteristics
VDD 1V/DIV
SUBSTRATE POTENTIAL (POWERED UP):
GND
VOLTAGE (V)
TRANSISTOR COUNT:
98
PROCESS:
Submicron CMOS
VIN = 1.5V OR 0V
IN = CTRL = 0V
VOUT 10mV/DIV
TIME (s) 200ms/DIV
FIGURE 30. POWER-UP/POWER-DOWN CLICK AND POP
TRANSIENT
17
FN6662.1
August 25, 2008
ISL54211
Thin Dual Flat No-Lead Plastic Package (TDFN)
L10.3x3A
2X
0.10 C A
A
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
D
MILLIMETERS
2X
0.10 C B
SYMBOL
MIN
NOMINAL
MAX
NOTES
A
0.70
0.75
0.80
-
A1
-
-
0.05
-
E
A3
6
INDEX
AREA
TOP VIEW
B
//
A
C
SEATING
PLANE
0.08 C
b
0.20
0.25
0.30
5, 8
D
2.95
3.0
3.05
-
D2
2.25
2.30
2.35
7, 8
E
2.95
3.0
3.05
-
E2
1.45
1.50
1.55
7, 8
e
0.50 BSC
-
k
0.25
-
-
-
L
0.25
0.30
0.35
8
A3
SIDE VIEW
D2
(DATUM B)
0.10 C
0.20 REF
7
8
N
10
2
Nd
5
3
Rev. 3 3/06
D2/2
NOTES:
6
INDEX
AREA
1
2
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
NX k
3. Nd refers to the number of terminals on D.
(DATUM A)
4. All dimensions are in millimeters. Angles are in degrees.
E2
E2/2
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
NX L
N
N-1
NX b
8
e
(Nd-1)Xe
REF.
BOTTOM VIEW
5
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
0.10 M C A B
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Compliant to JEDEC MO-229-WEED-3 except for D2
dimensions.
CL
NX (b)
(A1)
L1
5
9 L
e
SECTION "C-C"
C C
TERMINAL TIP
FOR ODD TERMINAL/SIDE
18
FN6662.1
August 25, 2008
ISL54211
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA
A
L10.1.8x1.4A
B
N
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
MILLIMETERS
E
SYMBOL
2X
MIN
NOMINAL
MAX
NOTES
0.10 C
1
2X
2
0.10 C
TOP VIEW
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.10 C
C
A
0.05 C
A
0.127 REF
0.15
0.20
0.25
5
D
1.75
1.80
1.85
-
E
1.35
1.40
1.45
-
e
SEATING PLANE
A1
SIDE VIEW
(DATUM A)
PIN #1 ID
NX L
1
NX b 5
10X
0.10 M C A B
0.05 M C
2
L1
5
(DATUM B)
7
-
b
0.40 BSC
-
L
0.35
0.40
0.45
L1
0.45
0.50
0.55
-
N
10
2
Nd
2
3
Ne
3
3
θ
0
-
12
4
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
e
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
BOTTOM VIEW
4. All dimensions are in millimeters. Angles are in degrees.
CL
(A1)
NX (b)
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5
L
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
SECTION "C-C"
e
8. Maximum allowable burrs is 0.076mm in all directions.
TERMINAL TIP
C C
2.20
1.00
0.60
1.00
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
0.50
1.80
0.40
0.20
0.20
0.40
10 LAND PATTERN
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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19
FN6662.1
August 25, 2008
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