631AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−723
CASE 631AA−01
ISSUE D
DATE 10 AUG 2009
SCALE 4:1
−X−
D
b1
A
−Y−
3
E
1
2X
HE
2
2X
e
b
C
0.08 X Y
3X
1
3X
DIM
A
b
b1
C
D
E
e
HE
L
L2
SIDE VIEW
TOP VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
L
GENERIC
MARKING DIAGRAM*
L2
BOTTOM VIEW
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHODE
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.40
2X
MILLIMETERS
MIN
NOM
MAX
0.45
0.50
0.55
0.15
0.21
0.27
0.25
0.31
0.37
0.07
0.12
0.17
1.15
1.20
1.25
0.75
0.80
0.85
0.40 BSC
1.15
1.20
1.25
0.29 REF
0.15
0.20
0.25
0.27
STYLE 5:
PIN 1. GATE
2. SOURCE
3. DRAIN
XX M
1
XX
M
= Specific Device Code
= Date Code
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
PACKAGE
OUTLINE
1.50
3X
0.52
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON12989D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
SOT−723
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON12989D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
07 AUG 2003
A
CHANGED DIMS A, b, b1, C, AND D. REQ. BY D. TRUHITTE.
11 NOV 2003
B
CHANGED DIMS b AND b1. REQ. BY D. TRUHITTE.
15 MAR 2004
C
ADDED STYLE 5. REQ. BY S. WINSTON.
01 AUG 2006
D
ADDED BOTTOM VIEW. CHANGED DIMENSION L TO L2. ADDED NEW L DIMENSION. UPDATED SOLDER FOOTPRINT. REQ. BY D. TRUHITTE.
10 AUG 2009
ON Semiconductor and
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may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
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© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 01D
Case Outline Number:
631AA
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