VS-50MT060WHTAPbF Datasheet

VS-50MT060WHTAPbF
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Vishay Semiconductors
“Half Bridge” IGBT MTP (Warp Speed IGBT), 114 A
FEATURES
• Gen 4 warp speed IGBT technology
• HEXFRED® antiparallel diodes with ultrasoft
reverse recovery
• Very low conduction and switching losses
• Optional SMD thermistor (NTC)
• Very low junction to case thermal resistance
• UL approved file E78996
MTP
• Designed and qualified for industrial level
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
BENEFITS
VCES
600 V
VCE(on) typical at VGE = 15 V
2.3 V
• Optimized for welding, UPS and SMPS applications
IC at TC = 25 °C
114 A
• Low EMI, requires less snubbing
Speed
30 kHz to 100 kHz
Package
MTP
Circuit
Half bridge
• Direct mounting to heatsink
• PCB solderable terminals
• Very low stray inductance design for high speed operation
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
MAX.
UNITS
600
V
TC = 25 °C
114
TC = 109 °C
50
Pulsed collector current
ICM
350
Peak switching current
ILM
350
Diode continuous forward current
IF
A
TC = 109 °C
34
Peak diode forward current
IFM
200
Gate to emitter voltage
VGE
± 20
RMS isolation voltage
VISOL
Maximum power dissipation
PD
V
Any terminal to case, t = 1 min
2500
TC = 25 °C
658
TC = 100 °C
263
W
Revision: 10-Jun-15
Document Number: 94468
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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VS-50MT060WHTAPbF
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
Collector to emitter voltage
Gate threshold voltage
Collector to emitter leaking current
Diode forward voltage drop
Gate to emitter leakage current
SYMBOL
V(BR)CES
VCE(on)
VGE(th)
ICES
VFM
IGES
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
VGE = 0 V, IC = 500 μA
600
-
-
V
VGE = 15 V, IC = 50 A
-
2.3
3.15
VGE = 15 V, IC = 100 A
-
2.5
3.2
VGE = 15 V, IC = 50 A, TJ = 150 °C
-
1.72
2.17
IC = 0.5 mA
3
-
6
VGE = 0 V, IC = 600 A
-
-
0.4
VGE = 0 V, IC = 600 A, TJ = 150 °C
-
-
10
IF = 50 A, VGE = 0 V
-
1.58
1.80
IF = 50 A, VGE = 0 V, TJ = 150 °C
-
1.49
1.68
IF = 100 A, VGE = 0 V, TJ = 25 °C
-
1.9
2.17
VGE = ± 20 V
-
-
± 250
nA
MIN.
TYP.
MAX.
UNITS
-
331
385
VCC = 400 V
VGE = 15 V
-
44
52
-
133
176
Internal gate resistors (see electrical diagram)
IC = 50 A, VCC = 480 V, VGE = 15 V, L = 200 μH
Energy losses include tail and diode reverse
recovery, TJ = 25 °C
-
0.26
-
-
1.2
-
-
1.46
-
-
0.73
-
-
1.66
-
-
2.39
-
-
7100
-
-
510
-
-
140
-
-
82
97
ns
-
8.3
10.6
A
-
340
514
nC
-
137
153
ns
-
12.7
14.8
A
-
870
1132
nC
V
mA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Total gate charge (turn-on)
Qg
Gate to emitter charge (turn-on)
Qge
Gate to collector charge (turn-on)
Qgc
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Ets
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Ets
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
TEST CONDITIONS
IC = 52 A
Internal gate resistors (see electrical diagram)
IC = 50 A, VCC = 480 V, VGE = 15 V, L = 200 μH
Energy losses include tail and diode reverse
recovery, TJ = 150 °C
VGE = 0 V
VCC = 30 V
f = 1.0 MHz
VCC = 200 V, IC = 50 A
dI/dt = 200 A/μs
VCC = 200 V, IC = 50 A
dI/dt = 200 A/μs
TJ = 125 °C
nC
mJ
mJ
pF
Revision: 10-Jun-15
Document Number: 94468
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-50MT060WHTAPbF
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Vishay Semiconductors
THERMISTOR SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
Resistance
R0 (1)
T0 = 25 °C
-
30
-
k
Sensitivity index of the
thermistor material
 (1)(2)
T0 = 25 °C
T1 = 85 °C
-
4000
-
K
MIN.
TYP.
MAX.
UNITS
-40
-
150
-40
-
125
-40
-
125
-
-
0.38
-
-
0.8
Heatsink compound thermal conductivity = 1 W/mK
-
0.06
-
External shortest distance in air between 2 terminals
5.5
-
-
Creepage (1)
Shortest distance along the external surface of the
insulating material between 2 terminals
8
-
-
Mounting torque to heatsink
A mounting compound is recommended and the
torque should be checked after 3 hours to allow for
the spread of the compound. Lubricated threads.
Notes
(1) T , T are thermistor´s temperatures
0
1
R0
1
1
(2) ------- = exp   ----- – ------ , temperature in Kelvin
T
R
T 
1
0
1
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Operating junction 
temperature range
SYMBOL
TEST CONDITIONS
IGBT, Diode
Thermistor
Storage temperature range
TJ
TStg
IGBT
Junction to case
Diode
Case to sink per module
Clearance
RthJC
RthCS
(1)
°C
°C/W
mm
3 ± 10 %
Nm
66
g
Weight
Note
(1) Standard version only i.e. without optional thermistor
100
94468_01
Maximum DC Collector Current (A)
IC - Collector to Emitter Current (A)

VGE = 15 V
20 μs pulse width
10
TJ = 150 °C
TJ = 25 °C
1
0.1
1.0
VCE - Collector to Emitter Voltage (V)
Fig. 1 - Typical Output Characteristics
120
100
80
60
40
20
0
10
25
94468_02
50
75
100
125
150
TC - Case Temperature (°C)
Fig. 2 - Maximum Collector Current vs. Case Temperature
Revision: 10-Jun-15
Document Number: 94468
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-50MT060WHTAPbF
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Vishay Semiconductors
160
IC = 50 A
2.0
120
100
IF = 50 A, TJ = 25 °C
1.5
80
IC = 20 A
20
40
60
80
100
120
140
60
100
160
TJ - Junction Temperature (°C)
94468_03
1000
dIF/dt (A/µs)
94468_06
Fig. 6 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 3 - Typical Collector to Emitter Voltage vs.
Junction Temperature
100
20
VR = 200 V
VCC = 400 V
IC = 52 A
VGE - Gate to Emitter Voltage (V)
IF = 50 A, TJ = 125 °C
IC = 100 A
1.0
16
IF = 50 A, TJ = 125 °C
IRRM (A)
12
8
10
IF = 50 A, TJ = 25 °C
4
1
100
0
0
100
200
300
400
OG - Typical Gate Charge (nC)
94468_04
Fig. 7 - Typical Reverse Recovery Current vs. dIF/dt
2000
100
94468_05
1000
dIF/dt (A/µs)
94468_07
Fig. 4 - Typical Gate Charge vs.
Gate to Emitter Votlage
VR = 200 V
1500
Qrr (nC)
IF - Instantaneous Forward Current (A)
VR = 200 V
140
2.5
trr (ns)
VCE - Typical Collector to Emitter
Voltage (V)
3.0
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
IF = 50 A, TJ = 125 °C
1000
500
IF = 50 A, TJ = 25 °C
1
0.4
0.8
1.2
1.6
2.0
0
100
2.4
VFM - Forward Voltage Drop (V)
Fig. 5 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
94468_08
1000
dIF/dt (A/μs)
Fig. 8 - Typical Stored Charge vs. dIF/dt
Revision: 10-Jun-15
Document Number: 94468
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-50MT060WHTAPbF
www.vishay.com
Vishay Semiconductors
3, 4
3, 4
2
T
10 Ω
11
11
12
10 Ω
12
R
5, 6
1
5, 6
10 Ω
9
Thermistor
option
9
10
10 Ω
10
7, 8
7, 8
Fig. 9 - Functional Diagram
Fig. 10 - Electrical Diagram
ORDERING INFORMATION TABLE
Device code
VS-
50
MT
060
W
H
T
A
PbF
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Current rating (50 = 50 A)
3
-
Essential part number
4
-
Voltage rating (060 = 600 V)
5
-
Speed/type (W = Warp IGBT)
6
-
Circuit configuration (H = Half bridge)
7
-
T = Thermistor
8
-
A = Al2O3 substrate
9
-
Lead (Pb)-free
CIRCUIT CONFIGURATION
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95175
Revision: 10-Jun-15
Document Number: 94468
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For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
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Document Number: 91000