DATASHEET

ISL34341
®
Data Sheet
October 8, 2010
FN6827.1
WSVGA 24-Bit Long-Reach Video
SERDES with Bi-directional Side-Channel
Features
The ISL34341 is a serializer/deserializer of LVCMOS parallel
video data. The video data presented to the serializer on the
parallel LVCMOS bus is serialized into a high-speed
differential signal. This differential signal is converted back to
parallel video at the remote end by the deserializer. It also
transports auxiliary data bi-directionally over the same link
during the video vertical retrace interval.
• 6MHz to 40MHz pixel clock rates
I2C bus mastering allows the placement of external slave
devices on the remote side of the link. An I2C controller can
be placed on either side of the link allowing bi-directional I2C
communication through the link to the external devices on
the other side. Both chips can be fully configured from a
single controller or independently by local controllers.
Ordering Information
PART
NUMBER
(Note)
• Bi-directional auxiliary data transport without extra
bandwidth and over the same differential pair
• I2C Bus Mastering to the remote side of the link with a
controller on either the serializer or deserializer
• 40MHz PCLK transports
- SVGA 800x600 @ 70fps, 16% blanking
- WSVGA 1024x600 @ 60fps, 8% blanking
• Internal 100Ω termination on high-speed serial lines
• DC balanced with industry standard 8b/10b line code
allows AC-coupling
- Provides immunity against ground shifts
• Hot plugging with automatic resynchronization every line
TEMP.
RANGE
(°C)
PART
MARKING
• 24-bit RGB transport over single differential pair
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL34341INZ* ISL34341INZ -40 to +85 64 Ld EPTQFP Q64.10x10C
*Add “-T13” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach materials,
and 100% matte tin plate plus anneal (e3 termination finish, which is
RoHS compliant and compatible with both SnPb and Pb-free soldering
operations). Intersil Pb-free products are MSL classified at Pb-free peak
reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
• 16 programmable settings each for transmitter amplitude
boost and pre-emphasis and receiver equalization allow
for longer cable lengths and higher data rates
• Programmable power-down of the transmitter and the
receiver
• Same device for serializer and deserializer simplifies
inventory
• I2C communication interface
• 8kV ESD rating for serial lines
• Pb-free (RoHS compliant)
Applications
• Navigation and display systems
• Video entertainment systems
• Industrial computing terminals
• Remote cameras
RSTB/PDB
VDD_CR
VDD_CDR
VDD_P
I2CA0
REF_RES
3.16 KΩ
GND_IO
GND_CDR
GND_TX
GND_P
GND_AN
VSYNC
HSYNC
D ATAEN
PC LK _O UT
V ID E O
S IN K
VIDEO_TX
VDD_AN
VDD_IO
ISL34341
PC LK _IN
GND_CR
VIDEO_TX
I2CA0
REF_RES
3.16 KΩ
GND_IO
GND_CDR
24
RG BA/B/C
SER IO N
REF_C LK
1
VDD _IO
27nF
27nF
SER IO N
VD D_IO
1.8V
SERIO P
27nF
ISL34341
GND_TX
GND_P
GND_AN
10m D IFFER EN TIAL CABLE
SERIO P
VSYN C
HSYN C
DATAEN
PC LK _IN
GND_CR
VDD_TX
27nF
RG BA/B/C
V ID E O
SOURCE
3.3V
RSTB/PDB
VDD_CR
VDD _IO
VDD_CDR
VDD_P
1.8V
VDD_IO
24
VDD_AN
VDD_TX
3.3V
VD D_IO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2008, 2010. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL34341
Pinout
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
I2CA2
I2CA3
SDA
SCL
VDD_P
GND_P
PCLK_IN
VSYNCPOL
HSYNCPOL
VSYNC
HSYNC
DATAEN
VDD_CR
VDD_CR
GND_CR
GND_CR
VDD_IO
RGBB4
RGBB5
RGBB6
RGBB7
RGBC0
RGBC1
RGBC2
RGBC3
RGBC4
RGBC5
RGBC6
RGBC7
STATUS
TEST_EN
RSTB/PDB
VIDEO_TX
VDD_IO
PCLK_OUT
RGBA0
RGBA1
RGBA2
RGBA3
RGBA4
RGBA5
RGBA6
RGBA7
RGBB0
RGBB1
RGBB2
RGBB3
GND_IO
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
GND_IO
VDD_CDR
VDD_CDR
GND_CDR
GND_CDR
VDD_TX
GND_TX
SERIOP
SERION
GND_TX
VDD_AN
GND_AN
REF_RES
MASTER
I2CA0
I2CA1
ISL34341
(64 LD TQFP)
TOP VIEW
Block Diagram
SCL
SDA
I2C
VCM
GENERATOR
RAM
SERIOP
PREEMPHASIS
TX
3
V/H/DE
TDM
8b/10b
RGB
SERION
MUX
DEMUX
24
RX
EQ
VIDEO_TX
(HI)
CDR
PCLK_IN
(REF_CLK WHEN
VIDEO_TX IS LO)
x30
PCLK_OUT
÷30
2
FN6827.1
October 8, 2010
ISL34341
Absolute Maximum Ratings
Thermal Information
Supply Voltage
VDD_P to GND_P, VDD_TX to GND_TX,
VDD_IO to GND_IO . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.6V
VDD_CDR to GND_CDR, VDD_CR to GND_CR . . -0.5V to 2.5V
Between any pair of GND_P, GND_TX,
GND_IO, GND_CDR, GND_CR . . . . . . . . . . . . . -0.1V to 0.1V
3.3V Tolerant LVTTL/LVCMOS
Input Voltage . . . . . . . . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V
Differential Input Voltage . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V
Differential Output Current . . . . . . . . . . . . . . Short Circuit Protected
LVTTL/LVCMOS Outputs . . . . . . . . . . . . . . . . Short Circuit Protected
ESD Rating
Human Body Model
All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4kV
SERIOP/N (all VDD Connected, all GND Connected) . . . . .8kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200V
Thermal Resistance (Typical, Notes 1, 2)
θJA
θJC (°C/W)
EPTQFP. . . . . . . . . . . . . . . . . . . . . . . .
40
12
Maximum Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 327mW
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Unless otherwise indicated, all data is for: VDD_CDR = VDD_CR = 1.8V, VDD_IO = 3.3V,
VDD_TX = VDD_P = VDD_AN = 3.3V, TA = +25°C, Ref_Res = 3.16kΩ, High-speed AC-coupling
capacitor = 27nF.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VDD_CDR, VDD_CR
1.7
1.8
1.9
V
VDD_TX, VDD_P, VDD_AN, VDD_IO
3.0
3.3
3.6
V
POWER SUPPLY VOLTAGE
SERIALIZER POWER SUPPLY CURRENTS
Analog TX Supply Current
IDDTX
Analog CDR Supply Current
IDDCDR
VIDEO_TX = 1
PCLK_IN = 40MHz
17
mA
57
mA
Digital I/O Supply Current
IDDIO
1
Digital Supply Current
IDDCR
20
mA
IDDP
17
mA
IDDAN
5.5
mA
PLL/VCO Supply Current
Analog Bias Supply Current
2
mA
Total 1.8V Supply Current
77
90
mA
Total 3.3V Supply Current
40
46
mA
DESERIALIZER POWER SUPPLY CURRENTS
Analog TX Supply Current
IDDTX
Analog CDR Supply Current
IDDCDR
VIDEO_TX = 0
REF_CLK = 40MHz
24
mA
45
mA
Digital I/O Supply Current
IDDIO
17
Digital Supply Current
IDDCR
32
mA
IDDP
17
mA
IDDAN
5.4
mA
PLL/VCO Supply Current
Analog Bias Supply Current
25
mA
Total 1.8V Supply Current
77
90
mA
Total 3.3V Supply Current
64
80
mA
3
FN6827.1
October 8, 2010
ISL34341
Electrical Specifications
Unless otherwise indicated, all data is for: VDD_CDR = VDD_CR = 1.8V, VDD_IO = 3.3V,
VDD_TX = VDD_P = VDD_AN = 3.3V, TA = +25°C, Ref_Res = 3.16kΩ, High-speed AC-coupling
capacitor = 27nF. (Continued)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER-DOWN SUPPLY CURRENT
Total 1.8V Power-Down Supply Current
RSTB = GND;
spec is per device
Total 3.3V Power-Down Supply Current
0.5
mA
1
mA
PARALLEL INTERFACE
High Level Input Voltage
VIH
Low Level Input Voltage
VIL
Input Leakage Current
IIN
2.0
-10
High Level Output Voltage
VOH
IOH = -2.0mA, VDD_IO = 3V 0.8*VDD_IO
Low Level Output Voltage
VOL
IOL = 2.0mA, VDD_IO = 3V
Output Short Circuit Current
IOSC
Output Rise and Fall Times
tOR/tOF
V
±0.01
0.8
V
10
µA
V
0.2*VDD_IO
V
50
mA
Slew rate control set to min,
CL = 8pF
1
ns
Slew rate control set to max,
CL = 8pF
4
ns
SERIALIZER PARALLEL INTERFACE
PCLK_IN Frequency
fIN
6
PCLK_IN Duty Cycle
tIDC
40
Parallel Input Setup Time
tIS
3.6
ns
Parallel Input Hold Time
tIH
1.6
ns
PCLK_OUT Frequency
fOUT
6
PCLK_OUT Duty Cycle
tODC
50
40
MHz
60
%
DESERIALIZER PARALLEL INTERFACE
PCLK_OUT Period Jitter (rms)
PCLK_OUT Spread Width
Time to Parallel Output Data Valid
Deserializer Output Latency
40
MHz
50
%
tOJ
Clock randomizer off
0.5
%tPCLK
tOSPRD
Clock randomizer on
±20
%tPCLK
tDV
tCPD
Relative to PCLK_OUT
Part-to-part,
side-channel disabled
-4.7
4
9
5.5
ns
14
PCLK
DESERIALIZER REFERENCE CLOCK (REF_CLK IS FED INTO PCLK_IN)
REF_CLK Lock Time
tPLL
REF_CLK to PCLK_OUT Maximum Frequency
Offset
100
µs
ppm
PCLK_OUT is the
recovered clock
1500
5000
TXCN = 0x00
600
825
HIGH-SPEED TRANSMITTER
HS Differential Output Voltage, Transition Bit
VODTR
mVP-P
TXCN = 0x0F
1170
mVP-P
TXCN = 0xF0
975
mVP-P
TXCN = 0xFF
1300
mVP-P
HS Differential Output Voltage, Non-Transition Bit VODNTR TXCN = 0x00
4
990
600
825
990
mVP-P
TXCN = 0x0F
460
mVP-P
TXCN = 0xF0
975
mVP-P
TXCN = 0xFF
600
mVP-P
FN6827.1
October 8, 2010
ISL34341
Electrical Specifications
Unless otherwise indicated, all data is for: VDD_CDR = VDD_CR = 1.8V, VDD_IO = 3.3V,
VDD_TX = VDD_P = VDD_AN = 3.3V, TA = +25°C, Ref_Res = 3.16kΩ, High-speed AC-coupling
capacitor = 27nF. (Continued)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
HS Generated Output Common Mode Voltage
VOCM
2.35
HS Common Mode Serializer-Deserializer
Voltage Difference
ΔVCM
20
120
mV
HS Differential Output Impedance
ROUT
80
100
120
Ω
4
7
10
PCLK
HS Output Latency
tLPD
Part-to-part
HS Output Rise and Fall Times
tR/tF
20% to 80%
V
150
ps
tSKEW
<10
ps
HS Output Random Jitter
tRJ
13.4
psrms
HS Output Deterministic Jitter
tDJ
40
psP-P
HS Differential Skew
HIGH SPEED RECEIVER
HS Differential Input Voltage
VID
HS Generated Input Common Mode Voltage
HS Differential Input Impedance
150
VICM
mVP-P
2.32
RIN
80
HS Maximum Jitter Tolerance
100
V
Ω
120
0.52
UIP-P
I2C
I2C Clock Rate (on SCL)
fI2C
100
400
kHz
I2C Clock Pulse Width (HI or LO)
1.3
I2C Clock Low to Data Out Valid
0
I2C Start/Stop Setup/Hold Time
0.6
µs
I2C Data in Setup Time
100
ns
I2C Data in Hold Time
100
ns
I2C Data out Hold Time
100
ms
µs
1
µs
Pin Descriptions
DESCRIPTION
PIN NUMBER
52 to 63,
2 to 13
PIN NAME
SERIALIZER
DESERIALIZER
RGBA[7:0],
Parallel video data LVCMOS inputs
RGBB[7:0], RGBC[7:0]
Parallel video data LVCMOS outputs
22
HSYNC
Horizontal (line) Sync LVCMOS input
Horizontal (line) Sync LVCMOS output
23
VSYNC
Vertical (frame) Sync LVCMOS input
Vertical (frame) Sync LVCMOS output
21
DATAEN
Video Data Enable LVCMOS input
Video Data Enable LVCMOS output
26
PCLK_IN
Pixel clock LVCMOS input
PLL reference clock LVCMOS input
51
PCLK_OUT
Default; not used
Recovered clock LVCMOS output
SERIOP, SERION
High speed differential serial I/O
High speed differential serial I/O
24
HSYNCPOL
CMOS input for HSYNC
1: HSYNC is active low
0: HSYNC is active high
25
VSYNCPOL
CMOS input for VSYNC
1: VSYNC is active low
0: VSYNC is active high
41, 40
5
FN6827.1
October 8, 2010
ISL34341
Pin Descriptions (Continued)
DESCRIPTION
PIN NUMBER
PIN NAME
SERIALIZER
DESERIALIZER
49
VIDEO_TX
CMOS input for video flow direction
1: video serializer
0: video deserializer
29, 30
SCL, SDA
I2C Interface Pins (I2C DATA, I2C CLK)
31 to 34
I2CA[3:0]
I2C Device Address
35
MASTER
I2C Master Mode
1: Master
0: Slave
16
RSTB/PDB
CMOS input for Reset and Power-down. For normal operation, this pin must be forced high. When
this pin is forced low, the device will be reset. If this pin stays low, the device will be in PD mode.
14
STATUS
CMOS output for Receiver Status:
1: Valid 8b/10b data received
0: otherwise
Note: serializer and deserializer switch roles during side-channel reverse traffic
36
REF_RES
Analog bias setting resistor connection; use 3.16kΩ ±1% to ground
27
GND_P
PLL Ground
48, 64
GND_IO
Digital (Parallel and Control) Ground
44, 45
GND_CDR
Analog (Serial) Data Recovery Ground
39, 42
GND_TX
Analog (Serial) Output Ground
37
GND_AN
Analog Bias Ground
17, 18
GND_CR
Core Logic Ground
19, 20
VDD_CR
Core Logic VDD
43
VDD_TX
Analog (Serial) Output VDD
38
VDD_AN
Analog Bias VDD
46, 47
VDD_CDR
Analog (Serial) Data Recovery VDD
1, 50
VDD_IO
Digital (Parallel and Control) VDD
28
VDD_P
PLL VDD
15
TEST_EN
Must be connected to ground
Exposed Pad
Must be connected to ground
Exposed Pad
NOTES:
3. Pins with the same name are internally connected together. However, this connection must NOT be used for connecting together external
components or features.
4. The various differently-named Ground pins are internally weakly connected. They must be tied together externally. The different names are
provided to assist in minimizing the current loops involved in bypassing the associated supply VDD pins. In particular, for ESD testing, they
should be considered a common connection.
6
FN6827.1
October 8, 2010
ISL34341
Diagrams
VODTR
VODNTR
TXCN
0x00
0x0F
0xF0
0xFF
FIGURE 1. VOD vs TXCN SETTING
1/fIN
VIDEO_TX = 1
tIDC
PCLK_IN
tIH
tIS
RGB[A:C][7:0]
VALID DATA
VALID DATA
DATA
DATA
tIS
VALID DATA
tIH
HSYNC
VSYNC
DATAEN
FIGURE 2. PARALLEL VIDEO INPUT TIMING [HSYNCPOL = 0, VSYNCPOL = 0, PCLKPOL (reg) = 0]
7
FN6827.1
October 8, 2010
ISL34341
VIDEO_TX = 0
tOR
1/fOU
tOF
TODC
PCLK_OUT
tDV
VALID DATA
RGB[A:C][7:0]
VALID DATA
DATA HELD AT PREVIOUS
VALID DATA
tDV
HSYNC
VSYNC
DATAEN
FIGURE 3. PARALLEL VIDEO OUTPUT TIMING [HSYNCPOL = 0, VSYNCPOL = 0, PCLKPOL (reg) = 0]
Applications
The high bit rate of the differential serial data requires
special care in the layout of traces on PCBs, in the choice
and assembly of connectors, and in the cables themselves.
Overview
A pair of ISL34341 SERDES transports 24-bit parallel video
(16-bit parallel video for the ISL34321) along with auxiliary
data over a single 100Ω differential cable either to a display
or from a camera. Auxiliary data is transferred in both
directions and can be used for remote configuration and
telemetry.
The benefits include lower EMI, lower costs, greater
reliability and space savings. The same device can be
configured to be either a serializer or deserializer by setting
one pin (VIDEO_TX), simplifying inventory. RGBA/B/C,
VSYNC, HSYNC, and DATAEN pins are inputs in serializer
mode and outputs in deserializer mode.
The video data presented to the serializer on the parallel
LVCMOS bus is serialized into a high-speed differential
signal. This differential signal is converted back to parallel
video at the remote end by the deserializer. The Side
Channel data is transferred between the SERDES pair
during two lines of the vertical video blanking interval.
When the side-channel is enabled, there will be a number of
PCLK cycles uncertainty from frame-to-frame. This should
not cause sync problems with most displays, as this occurs
during the vertical front porch of the blanking period. When
properly configured, the SERDES link supports end-to-end
transport with fewer than one error in 1010 bits.
Differential Signals and Termination
The ISL34341 serializes the 24-bit parallel data along with
3 sync signals at 30x the PCLK_IN frequency. The ISL34321
serializes the 16-bit parallel data plus 3 sync signals at 20x
the PCLK_IN frequency. The extra 2 bits per word come
from the 8b/10b encoding scheme which helps create the
highest quality serial link.
8
PCB traces need to be adjacent and matched in length (so
as to minimize the imbalanced coupling to other traces or
elements) and of a geometry to match the impedance of the
transmitter and receiver to minimize reflections. Similar care
needs to be applied to the choice of connectors and cables.
SERIOP and SERION pins incorporate internal differential
termination of the serial signal lines.
SERIO Pin AC-Coupling
AC-coupling minimizes the effects of DC common mode
voltage difference and local power supply variations
between two SERDES. The serializer outputs DC balanced
8b/10b line code, which allows AC-coupling.
The AC-coupling capacitor on SERIO pins must be 27nF on
the serializer board and 27nF on the deserializer board. The
value of the AC-coupling capacitor is very critical since a
value too small will attenuate the high speed signal at low
clock rate. A value too big will slow down the turn around
time for the side-channel.
Receiver Reference Clock (REF_CLK)
The reference clock (REF_CLK) for the PLL is fed into
PCLK_IN pin. REF_CLK is used to recover the clock from
the high speed serial stream. REF_CLK is very sensitive to
any instability. The following conditions must be met at all
times after power is applied to the deserializer, or else the
deserializer may need a manual reset:
• REF_CLK frequency must be within the limits specified
• REF_CLK amplitude must be stable.
A simple 3.3V CMOS crystal oscillator can be used for
REF_CLK.
FN6827.1
October 8, 2010
ISL34341
Power Supply Sequencing
The 3.3V supply must be higher than the 1.8V supply at all
times, including during power-up and power-down. To meet
this requirement, the 3.3V supply must be powered up
before the 1.8V supply.
supplies are tied together, the PCB layout should be
arranged to emulate this arrangement, at least for the
smaller value (high frequency) capacitors, as much as
possible.
For the deserializer, REF_CLK must not be applied before
the device is fully powered up. Applying REF_CLK before
power-up may require the deserializer to be manually reset.
A 10ms delay after the 1.8V supply is powered up
guarantees normal operation.
Power Supply Bypassing
The serializer and deserializer functions rely on the stable
functioning of PLLs locked to local reference sources or
locked to an incoming signal. It is important that the various
supplies (VDD_P, VDD_AN, VDD_CDR, VDD_TX) be well
bypassed over a wide range of frequencies, from below the
typical loop bandwidth of the PLL to approaching the signal
bit rate of the serial data. A combination of different values of
capacitors from 1000pF to 5µF or more with low ESR
characteristics is generally required.
The parallel LVCMOS VDD_IO supply is inherently less
sensitive, but since the RGB and SYNC/DATAEN signals
can all swing on the same clock edge, the current in these
pins and the corresponding GND pins can undergo
substantial current flow changes, so once again, a
combination of different values of capacitors over a wide
range, with low ESR characteristics, is desirable.
A set of arrangements of this type is shown in Figure 4,
where each supply is bypassed with a ferrite-bead-based
choke, and a range of capacitors. A “choke” is preferable to
an “inductor” in this application, since a high-Q inductor will
be likely to cause one or more resonances with the shunt
capacitors. This potentially causes problems at or near those
frequencies, while a “lossy” choke will reflect a high
impedance over a wide frequency range.
The higher value capacitor, in particular, needs to be chosen
carefully with special care regarding its ESR. Very good
results can be obtained with multilayer ceramic capacitors,
available from many suppliers, and generally in small
outlines (such as the 1210 outline suggested in the
schematic shown in Figure 4), which provide good bypass
capabilities down to a few mΩ at 1MHz to 2MHz. Other
capacitor technologies may also be suitable (perhaps
niobium oxide), but “classic” electrolytic capacitors
frequently have ESR values of above 1Ω, that nullify any
decoupling effect above the 1kHz to 10kHz frequency range.
Capacitors of 0.1µF offer low impedance in the 10MHz to
20MHz region, and 1000pF capacitors in the 100MHz to
200MHz region. In general, one of the lower value capacitors
should be used at each supply pin on the IC. Figure 4 shows
the grounding of the various capacitors to the pin
corresponding to the supply pin. Although all the ground
9
FIGURE 4. POWER SUPPLY BYPASSING
I2C Interface
The I2C interface allows access to internal registers used to
configure the SERDES and to obtain status information. A
serializer must be assigned a different address than its
deserializer counterpart. The upper 3 bits are permanently
set to 011 and the lower 4 bits determined by pins as follows:
0
1
1
I2CA3 I2CA2 I2CA1 I2CA0
R/W
Thus, 16 SERDES can reside on the same bus. By
convention, when all address pins are tied low, the device
address is referred to as 0x60.
SCL and SDA are open drain to allow multiple devices to
share the bus. If not used, SCL and SDA should be tied to
VDD_IO.
Side Channel Interface
The Side Channel is a mechanism for transferring data
between the two chips on each end of the link. This data is
transferred during video blanking so none of the video
bandwidth is used. It has three basic uses:
• Data exchanges between two processors
• Master Mode I2C commands to remote slaves
• Remote SERDES configuration
This interface allows the user to initialize registers, control
and monitor both SERDES chips from a single
micro-controller which can reside on either side of the serial
link. This feature is used to automatically transport the
remote side chip’s status which is available in a local
register. The Side Channel needs to be enabled for this to
work which is the default mode. In the case where there is a
FN6827.1
October 8, 2010
ISL34341
micro-controller on each side of the of the link data can be
buffered and exchanged between the two. Up to 224 bytes
can be sent in each direction during each VSYNC active
period.
Master Mode
This is a mode activated by strapping the MASTER pin to a
‘1’ on the 34341 on the remote side of the controller. This is
a virtual extension of the I2C interface across the link that
allows the local processor to read and write slave devices
connected to the remote side I2C bus. No additional wires or
components are needed other than the serial link. The I2C
commands and data are transferred during video blanking
causing no interruptions in the video data. Data is
transported by the Side Channel across the link so the
maximum throughput would be the same.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure
you have the latest Rev.
DATE
REVISION
CHANGE
06/19/08
FN6827.1
Changed Tja and Tjc in Thermal Information from 33 and 4.5 to 40 and 12.
12/15/08
FN6827.0
Initial Release to web.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
FN6827.1
October 8, 2010
ISL34341
Thin Plastic Quad Flatpack Exposed Pad Plastic Packages (EPTQFP)
Q64.10x10C (JEDEC MS-026ACD-HU ISSUE D)
64 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED
PAD PACKAGE
D
D1
-D-
MILLIMETERS
SYMBOL
EJECTOR PIN MARK
NOT PIN #1 ID
-B-
-A-
E E1
e
PIN 1
TOP VIEW
MIN
MAX
NOTES
A
-
1.20
-
A1
0.05
0.15
-
A2
0.95
1.05
-
b
0.16
0.28
6
b1
0.17
0.23
-
D
11.80
12.20
3
D1
9.90
10.10
4, 5
D2
2.90
3.10
-
E
11.80
12.20
3
E1
9.90
10.10
4, 5
E2
2.90
3.10
-
L
0.45
0.75
-
N
64
7
e
0.50 BSC
Rev. 0 10/08
NOTES:
11o-13o
0.020
0.008 MIN
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
0o MIN
2. All dimensions and tolerances per ANSI Y14.5M-1982.
A2 A1
GAGE
PLANE
0o-7o
L
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
11o-13o
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
0.25
0.010
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
PIN 1
7. “N” is the number of terminal positions.
EJECTOR PIN MARK
NOT PIN #1 ID
-H-
A
SEATING
PLANE
0.08
0.003
E2
-C0.08
M
0.003
D S
C A-B S
b
EJECTOR PIN MARK
NOT PIN #1 ID
b1
0.09/0.16
0.004/0.006
D2
BOTTOM VIEW
11
BASE METAL
WITH PLATING
0.09/0.20
0.004/0.008
FN6827.1
October 8, 2010
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