str-x6750f ds en

Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
◆ General description
◆ Package
The STR-X6750F is power IC for quasi-resonant type
switching power supply, incorporating a power MOSFET
and a controller IC. The product achieves high efficiency
and low noise power supply systems by the quasi-resonant
operation.
Package name: TO-3PF-7L
◆ Features
 Quasi-resonant operation mode
Achieves the optimal high efficiency and low noise
power supply systems.
 Current mode control
 Built-in PWM oscillator
The PWM operates with the minimum frequency of
around 22kHz, until the quasi-resonant signal becomes
valid, reduces the stress on components at startup and
load-shorted.
 Built-in soft start function
 Step-drive function, reducing switching noise
 Input compensation at overcurrent
The function reduces the distortion of overcurrent
operation point to AC input voltage change by adding
three components.
 Avalanche energy guaranteed by two chips structure
(Simplification of surge absorbing circuit)
 Protection functions
Overcurrent protection (OCP); Pulse-by-pulse
Overload protection (OLP); latched shutdown
Overvoltage protection (OVP); latched shutdown
◆ Specification
MOSFET
650V(MIN), 0.62Ω(MAX)
◆Application
Switching power supplies for
 LCD-TVs, PDP-TVs, CRT-TVs and Digital consumer
equipment
 Home appliances
 OA equipments
 Industry machines
 Communication devices
◆ Typical application circuit
+B
ErrAmp
P
S1
GND
Standby
ON/OFF
D
VCC
1
D
4
LowB
S2
STR-X6700
Reg
SI
GND
Cont.
ErrAmp:SANKEN SE Series
Reg:
Sanken linear regulator IC, etc.
6
SI:SANKEN Linear Regulator IC
FB
2
S
3
GND
7
5
OCP
/BD
Standby
Out
RX
SS
/OLP
CX
ROCP
Sanken Electric Co., Ltd.
1/11
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Absolute maximum ratings
 The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
 Unless otherwise specified, TA = 25 °C
Item
Pin
Symbol
Ratings
Unit
Remark
Drain Current
1−2
IDpeak(1)
18
A
Single pulse
Maximum Switching Current
1−2
IDMAX(2)
18
A
Ta=-20 to +125°C
Avalanche Energy
1−2
EAS(3)
326
mJ
Control Power Supply Voltage
4−3
VCC
35
V
SS/OLP pin Voltage
5−3
VSSOLP
−0.5~6.0
V
FB pin Inflowing Current
6−3
IFB
10
mA
FB pin Voltage
6−3
VFB
−0.5~9.0
V
OCP/BD pin Voltage
7−3
VOCPBD
−1.5~5.0
V
MOS FET Power Dissipation
1−2
PD1(4)
44
W
By infinite radiator
2.8
W
No radiator
4−3
PD2(5)
0.8
W
Defined by VCC×ICC
−
TF
−20~+125
°C
Refer to recommended
operating temperature
Operating Ambient Temperature
−
TOP
−20~+125
°C
Storage Temperature
−
Tstg
−40~+125
°C
Channel Temperature
−
Tch
+150
°C
Control Power Dissipation
(MIC)
Operating Inner Flame
Temperature
Single pulse
(1)
VDD= 30V, L=50mH
ILpeak=3.53A
Within IFB control
Refer to MOS FET A.S.O. curve
Regarding the maximum switching current
The maximum switching current is drain current IC determined by inner drive voltage and MOS FET Vth.
(3)
Refer to MOS FET Tch-EAS curve
(4)
Refer to MOS FET Ta-PD1 curve
(2)
Sanken Electric Co., Ltd.
2/11
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Electrical characteristics
Electrical characteristics for control part
 The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
 Unless otherwise specified, TA = 25 °C, VCC = 20V
Item
Power supply Start-up Operation
Operation start power supply voltage
Operation stop power supply voltage
Circuit current in operation
Circuit current in non-operation
Oscillation frequency
Soft start operating stop voltage
Soft start operating charging current
Normal Operation
Overcurrent detection threshold
voltage
OCP/BD pin source current
Quasi-resonant operation threshold
voltage 1
Quasi-resonant operation threshold
voltage 2
FB pin threshold voltage
FB pin sink current (Normal operation)
Stand-by Operation
Stand-by operation start voltage
Stand-by operation start voltage
interval
Stand-by non-operation circuit current
FB pin sink current (stand-by
operation)
FB pin threshold voltage (stand-by
operation)
Minimum ON time
Protection Operation
Maximum ON time
OLP operation threshold voltage
Ratings
TYP MAX
Pin
Symbol
4−3
4−3
4−3
4−3
1−2
5−3
5−3
VCC(ON)
VCC(OFF)
ICC(ON)
ICC(OFF)
fOSC
VSSOLP(SS)
ISSOLP(SS)
7−3
VOCPBD(LIM)
7−3
IOCPBD
−250
−100
−40
µA
7−3
VOCPBD(TH1)
0.28
0.40
0.52
V
7−3
VOCPBD(TH2)
0.67
0.80
0.93
V
6−3
6−3
VFB(OFF)
IFB(ON)
1.32
600
1.45
1000
1.58
1400
V
µA
4−3
VCC(S)
10.3
11.2
12.1
V
4−3
VCC(SK)
1.10
1.35
1.65
V
4−3
ICC(S)
−
20
56
µA
6−3
IFB(S)
−
4
14
µA
6−3
VFB(S)
0.55
1.10
1.50
V
1−2
tON(MIN)
0.4
0.7
1.1
µs
1−2
5−3
tON(MAX)
VSSOLP(OLP)
27.5
4.0
32.5
4.9
39.0
5.8
µs
V
ISSOLP(OLP)
VCC(OVP)
ICC(H)
−16
25.5
−
−11
27.7
45
−6
29.9
140
µA
V
µA
VCC(La.OFF)
6.0
7.2
8.5
V
Charge current in OLP operation
5−3
OVP operation power supply voltage
4−3
Latch circuit holding current *
4−3
Latch circuit releasing power supply
4−3
voltage *
*Latch circuit refers to operation during OVP and OLP.
MIN
16.3
8.8
−
−
19
1.1
−710
19.9
10.6
6
100
25
1.4
−390
−0.995 −0.940 −0.895
Sanken Electric Co., Ltd.
3/11
18.2
9.7
−
−
22
1.2
−550
Unit
V
V
mA
µA
kHz
V
µA
V
Remark
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Electrical characteristics for MOSFET part
 Unless otherwise specified, TA = 25 °C,
Ratings
TYP M A X
Item
Pin
Symbol
Drain-to-Source voltage
1−2
VDSS
650
−
−
V
Drain leak current
1−2
IDSS
−
−
300
µA
ON resistance
1−2
RDS(ON)
−
−
0.62
Ω
Switching time
1−2
tf
−
−
500
ns
−
θch−F
−
−
1.09
°C/W
Thermal resistance
MIN
Sanken Electric Co., Ltd.
4/11
Unit
Remark
ChanneltoInternalframe
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Sanken Electric Co., Ltd.
5/11
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Sanken Electric Co., Ltd.
6/11
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Block diagram
Pin function description
Pin number
Symbol
Description
1
D
Drain pin
MOSFET drain
2
S
Source
MOSFET source
3
GND
Ground pin
Ground
4
VCC
Power supply pin
Input for power supply for control circuit
5
SS/OLP
6
FB
7
OCP/BD
Softstart/ overload protection pin
Feedback pin
OCP input/ Bottom detection pin
Sanken Electric Co., Ltd.
7/11
Function
Input for set delay for overload detection and
softstart operation
Input for constant voltage control and
intermittent mode oscillation control signals
Input for overcurrent detection and bottom
detection signals
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Typical application circuit
+B
ErrAmp
P
S1
GND
Standby
ON/OFF
D
VCC
1
D
4
LowB
S2
Reg
SI
GND
Cont.
ErrAmp:SANKEN SE Series
Reg:
Sanken linear regulator IC, etc.
SI:SANKEN Linear Regulator IC
6
FB
2
S
3
GND
7
5
OCP
/BD
Standby
Out
RX
SS
/OLP
CX
ROCP
Sanken Electric Co., Ltd.
8/11
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Package
3.45±0.2
a
b
SK
3
3.3
STR
6.7±0.5
23±0.3
φ3.2
6
±0.2
2 ±0.2
Gate
burr
ゲートバリ
5.5±0.2
5.5±0.2
3.35±0.1
(根元寸法)
between
roots
0.75
+0.2
+0.2
1.89-0.1
R-end
+0.2
5-0.65-0.1
+0.2
2-0.83-0.1
12.5±0.5
+0.2
1.33-0.1
(5.8)
(2-R1)
0.55 -0.1
4xP1.27±0.1=(5.08)
(根元寸法)
between
roots
4.3±0.5
3.6 ±0.5
(先端寸法)
between
tips
(先端寸法)
between
tips
2xP2.54±0.1=(5.08)
(根元寸法)
between
roots
15.6±0.2
0.5
1
2
3 4 5 6 7
0.5
平面状態図
Planar state
Note 1)
part shows the point gate burr (height 0.3 max)
occurred
Pin material: Cu
Pin treatment: Ni plating and solder dip
Product weight (approximate): 6.0g
Dimensions in millimeters
a. Part number
b. Lot number
X6750F
1st letter:The Last digit of year
2nd letter:Month
Jan. to Sep. Arabic number
Oct.
O
Nov.
N
Dec.
D
3rd & 4th letter:day
01-31 Arabic numbers
Sanken Electric Co., Ltd.
9/11
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends
on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set
by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve
the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc.,
environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of
semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into
consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating
value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please observe the
following cautions.
Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power surges
from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the
ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
 When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce excess stress.
 Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone
greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product
life, are indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Inc.
SC102 Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
 When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an
extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For
mounting the products, the mounting surface flatness should be 0.05mm or less.
 Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the
products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole
diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the
products and may cause failures.
 Recommended screw torque: 0.588 to 0.785 N・m (6 to 8 kgf・cm).
 For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress
fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening
with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and
the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with
the specified torque. When using a power driver, torque control is mandatory.
Soldering
 When soldering the products, please be sure to minimize the working time, within the following limits:
• 260 ± 5 °C 10 ± 1 s (Flow, 2 times)
• 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
 Soldering should be at a distance of at least 1.5 mm from the body of the products.
Sanken Electric Co., Ltd.
10/11
Power IC for Quasi-Resonant Type Switching Power Supply
with High Efficiency and Low Noise in Full Load Range
STR-X6750F
Sep. 2013
Electrostatic Discharge
 When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ of
resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
 Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
 When using measuring equipment such as a curve tracer, the equipment should be grounded.
 When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak
voltages generated by them from being applied to the products.
 The products should always be stored and transported in Sanken shipping containers or conductive containers, or be
wrapped in aluminum foil.
IMPORTANT NOTES
 The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure
that this is the latest revision of the document before use.
 Application and operation examples described in this document are quoted for the sole purpose of reference for the use
of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights,
intellectual property rights or any other rights of Sanken or any third party which may result from its use. Unless
otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or implied, as to the
products, including product merchantability, and fitness for a particular purpose and special environment, and the
information, including its accuracy, usefulness, and reliability, included in this document.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of
semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk,
preventative measures including safety design of the equipment or systems against any possible injury, death, fires or
damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety
devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus,
please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is
required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from
all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.
Sanken Electric Co., Ltd.
11/11