str5a464d ds en

For Non-Isolated
Off-Line PWM Controllers with Integrated Power MOSFET
STR5A460 Series
Data Sheet
Description
Package
The STR5A460 Series is power ICs for switching
power supplies, incorporating a MOSFET and a current
mode PWM controller IC for non-isolated buck
converter and inverting-converter.
The low standby power is accomplished by the
automatic switching between the PWM operation in
normal operation and the burst-oscillation under light
load conditions. The product achieves high
cost-performance power supply systems with few
external components.
DIP8
FB
1
8
S/GND
VCC
2
7
S/GND
6
S/GND
S/GND
D/ST
4
5
VCC
1
8
S/GND
FB
2
7
S/GND
6
S/GND
5
S/GND
SOIC8
Features
●
●
●
●
●
●
●
●
●
●
●
Buck Converter
Inverting Converter
Auto Standby Function
Operation
Normal Operation : PWM Mode
Light Load Operation : Green Mode
Standby : Burst Oscillation Mode
Build-in Startup Function
(reducing power consumption at standby operation,
shortening the startup time)
Current Mode Type PWM Control
Build-in Error Amplifier for Phase Compensation
Random Switching Function
Leading Edge Blanking Function
Soft Start Function
Protections
Overload Protection (OLP): Auto-restart
Overvoltage Protection (OVP): Auto-restart
Thermal Shutdown with hysteresis (TSD): Auto-restart
D/ST
Not to scale
STR5A460 Series
● Electrical Characteristics
fOSC(AVG) = 60 kHz
VD/ST = 700V (max.)
Products
STR5A464D
STR5A464S
FB
S/GND
VCC
S/GND
2
8
C4
R1
13.6 Ω
0.41 A
Package
DIP8
SOIC8
Input Voltage
D/ST Input
≥ 40 V
Voltage
Output Voltage
> 11 V
> – 27.5 V
Range*
< 27.5 V
< – 11 V
*Add zener diode or transistor (dropper) to VCC pin
when target output voltage is high.
D2
STR5A400D
1
IDLIM
(typ.)
Buck
Inverting
Converter
Converter
AC 85 V to AC 265 V
R3
R2
RDS(ON)
(max.)
Recommended Operating Condition
Typical Application (Buck Convertor, DIP8)
D1
4
C3
7
6
S/GND
VOUT
L1
DR1
5
4
D/ST
S/GND
(+)
L2
VAC
C1
C2
D3
C5
R4
DR2
(-)
TC_STR5A400_1_R2
Applications
● White goods
● Auxiliary power supply (lighting equipment with
microcomputer, etc.)
● Power supply for motor control (actuator, etc.)
● Telecommunication equipment (convertible from
48VDC to 15VDC)
● Other Switchung mode power supply, SMPS
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
1
STR5A460 Series
CONTENTS
Description ------------------------------------------------------------------------------------------------------ 1
CONTENTS ---------------------------------------------------------------------------------------------------- 2
1. Absolute Maximum Ratings----------------------------------------------------------------------------- 3
2. Electrical Characteristics -------------------------------------------------------------------------------- 3
3. Performance Curves -------------------------------------------------------------------------------------- 5
4. Block Diagram --------------------------------------------------------------------------------------------- 6
5. Pin Configuration Definitions --------------------------------------------------------------------------- 6
6. Typical Application --------------------------------------------------------------------------------------- 7
7. External Dimensions and Marking Diagram -------------------------------------------------------- 8
7.1 DIP8 ---------------------------------------------------------------------------------------------------- 8
7.2 SOIC8-------------------------------------------------------------------------------------------------- 9
8. Operational Description ------------------------------------------------------------------------------- 10
8.1 Startup Operation of IC ------------------------------------------------------------------------- 10
8.2 Undervoltage Lockout (UVLO) ---------------------------------------------------------------- 10
8.3 Power Supply Startup and Soft Start Function --------------------------------------------- 10
8.4 Constant Voltage (CV) Control----------------------------------------------------------------- 11
8.4.1
Buck Converter Operation ---------------------------------------------------------------- 12
8.4.2
Inverting Converter Operation ----------------------------------------------------------- 13
8.5 Leading Edge Blanking Function -------------------------------------------------------------- 14
8.6 Random Switching Function -------------------------------------------------------------------- 14
8.7 Auto Standby Function--------------------------------------------------------------------------- 14
8.8 Overload Protection (OLP)---------------------------------------------------------------------- 14
8.9 Overvoltage Protection (OVP) ------------------------------------------------------------------ 15
8.10 Thermal Shutdown (TSD) ----------------------------------------------------------------------- 15
9. Design Notes ---------------------------------------------------------------------------------------------- 16
9.1 External Components ---------------------------------------------------------------------------- 16
9.1.1
Input and Output Electrolytic Capacitor ----------------------------------------------- 16
9.1.2
Inductor --------------------------------------------------------------------------------------- 16
9.1.3
VCC Pin Peripheral Circuit --------------------------------------------------------------- 16
9.1.4
FB Pin Peripheral Circuit ----------------------------------------------------------------- 16
9.1.5
Freewheeling diode -------------------------------------------------------------------------- 17
9.1.6
Bleeder resistance --------------------------------------------------------------------------- 17
9.2 D/ST Pin --------------------------------------------------------------------------------------------- 17
9.3 Output Inductor Value Setting ----------------------------------------------------------------- 18
9.3.1
Buck Converter ------------------------------------------------------------------------------ 19
9.3.2
Inverting Converter ------------------------------------------------------------------------- 22
9.4 PCB Trace Layout -------------------------------------------------------------------------------- 25
10. Pattern Layout Example (DIP8)---------------------------------------------------------------------- 27
10.1 Buck Converter ------------------------------------------------------------------------------------ 27
10.2 Inverting Converter ------------------------------------------------------------------------------- 28
11. Reference Design of Power Supply ------------------------------------------------------------------ 29
11.1 Buck Converter ------------------------------------------------------------------------------------ 29
11.2 Inverting Converter ------------------------------------------------------------------------------- 30
IMPORTANT NOTES ------------------------------------------------------------------------------------- 31
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
2
STR5A460 Series
1.
Absolute Maximum Ratings
● The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
● Unless otherwise specified, TA = 25 °C, all S/GND pins (5 pin to 8pin) are shorted.
● The pin number of SOIC8 package products is shown in bracket.
Parameter
Symbol
FB Pin Voltage
VFB
VCC Pin Voltage
VCC
D/ST Pin Voltage
VD/ST
Drain Peak Current(1)
IDP
Maximum Switching Current
IDMAX
MOSFET Power Dissipation
PD1
Test Conditions
Pins
1–5
(2 – 5)
2–5
(1 – 5)
4–5
Single pulse,
Within 500 ns pulse
4–5
Negative: Within 2 μs
pulse width
4–5
(2)
Rating
Units
− 0.3 to 7
V
− 0.3 to 32
V
− 0.3 to 700
V
1.7
A
− 0.2 to 0.97
− 0.2 to 0.91
1.55
–
5A464D
5A464S
5A464D
W
1.51
5A464S
TOP
–
− 40 to 125
°C
Storage Temperature
Tstg
–
− 40 to 125
°C
Junction Temperature
Tj
–
150
°C
(2)
2.
5A464D
5A464S
A
Operating Ambient Temperature
(1)
Notes
Refer to MOS FET Ta-PD curve.
When embedding this hybrid IC onto the printed circuit board (cupper area in a 15mm×15mm)
Electrical Characteristics
● The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
● Unless otherwise specified, TA = 25 °C, all S/GND pins (5 pin to 8pin) are shorted.
● The pin number of SOIC8 package products is shown in bracket.
Parameter
Symbol
Test
Conditions
Pins
Min.
Typ.
Max.
Units
13.6
15.0
16.6
V
7.3
8.0
8.7
V
–
–
2.0
mA
19
29
39
V
− 2.7
− 1.5
− 0.5
mA
4–5
53
60
67
kHz
Notes
Power Supply Startup Operation
Operation Start Voltage
VCC(ON)
Operation Stop Voltage
VCC(OFF)
Circuit Current in Operation
ICC(ON)
VCC = 12 V
2–5
(1 – 5)
2–5
(1 – 5)
2–5
(1 – 5)
4–5
2–5
(1 – 5)
Startup Circuit Operation Voltage
VSTARTUP
VCC = 13.5 V
Startup Current
ISTARTUP
VCC = 13.5 V
VD/ST = 100 V
PWM Operation
Average PWM Switching
Frequency
Switching Frequency Modulation
Deviation
fOSC(AVG)
VFB= 2.44 V
Δf
4–5
–
2.8
–
kHz
Feedback Reference Voltage
VFB(REF)
1–5
(2 – 5)
2.44
2.50
2.56
V
STR5A460-DSE Rev.2.2
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© SANKEN ELECTRIC CO.,LTD. 2013
3
STR5A460 Series
Parameter
Symbol
Test
Conditions
Pins
Min.
Typ.
Max.
Units
− 2.4
− 0.8
−
μA
–
–
2.5
μs
Feedback Current(1)
IFB(OP)
Minimum Sampling Time
tFBMS
1–5
(2 – 5)
1–5
(2 – 5)
Standby Drain Current
IDSTB
4–5
–
50
–
mA
Standby Operation Cycle
TSTBOP
4–5
530
740
940
μs
Maximum ON Duty
DMAX
4–5
50
57
64
%
tBW
–
–
230
–
ns
IDLIM
4–5
0.37
0.41
0.45
A
27.5
29.3
31.3
V
–
72
–
ms
4–5
3.5
5.2
6.8
ms
Tj(TSD)
–
135
–
–
°C
Tj(TSDHYS)
–
–
70
–
°C
Tj = 125 °C
VD/ST = 584 V
4–5
–
–
50
µA
ID = 41 mA
4–5
–
11.0
13.6
Ω
tf
4–5
–
–
250
ns
θj-C
–
–
–
15
–
–
16
VFB = 2.3 V
Notes
5A464D
5A464S
Protection
Leading Edge Blanking Time(1)
Drain Current Limit
OVP Threshold Voltage
OLP Delay Time at Startup
Standby Blanking Time at
Startup
Thermal Shutdown Operating
Temperature(1)
Thermal Shutdown Hysteresis(1)
VCC(OVP)
tOLP
tSTB(INH)
VFB= 0 V
VFB= 2.6 V
2–5
(1 – 5)
4–5
5A464D
5A464S
5A464D
5A464S
Power MOSFET
Drain Leakage Current(1)
On Resistance
Switching Time
IDSS
RDS(ON)
5A464D
5A464S
Thermal Characteristics
Thermal Resistance Junction to
Case(1)(2)
(1)
(2)
5A464D
°C/W
5A464S
Design assurance
Case temperature (TC) measured at the center of the case top surface
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
4
STR5A460 Series
3.
Performance Curves
● STR5A464D
Ambient Temperature versus
Power Dissipation Curve
1.00
0.75
0.50
0.25
1
θj-c (°C /W)
Power Dissipation, PD (W)
1.25
10
Transient Thermal Resistance
PD_STR5A464D_R1
PD = 1.55 W
1.50
0.00
0
25
50
75
100
125
TR_STR5A464D_R1
Transient Thermal Resistance Curve
1.75
0.1
0.01
150
1μ
10μ
Ambient Temperature, TA (°C )
100μ
1m
10m
100m
10m
100m
Time (s)
● STR5A464S
Ambient Temperature versus
Power Dissipation Curve
1.00
0.75
0.50
0.25
0.00
θj-c (°C /W)
1
0.1
0.01
0
25
50
75
100 125 150
TR_STR5A464S_R1
Power Dissipation, PD (W)
1.25
10
Transient Thermal Resistance
PD = 1.51 W
1.50
Transient Thermal Resistance Curve
PD_STR5A464S_R1
1.75
1μ
10μ
Ambient Temperature, TA (°C )
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
100μ
1m
Time (s)
5
STR5A460 Series
4.
Block Diagram
● The pin number of SOIC8 package products is shown in bracket.
2
(1)
VCC
STARTUP
D/ST
4
UVLO
OVP
REG
PROTECTION
TSD
DRV
PWM
OSC
S Q
R
OCP
1
(2)
FB
S/H
E/A
VFB(REF)
Feedback
Control
LEB
S/GND
5, 6, 7, 8
BD_STR5A400_R2
5.
Pin Configuration Definitions
● DIP8
FB
1
VCC
2
D/ST
4
Pin
Name
8
S/GND
1
FB
7
S/GND
2
VCC
6
S/GND
3
–
5
S/GND
4
D/ST
5~8
S/GND
Pin
Name
1
VCC
2
FB
3
–
4
D/ST
5~8
S/GND
Descriptions
Constant voltage control signal input
Power supply voltage input for control part
and Overvoltage Protection (OVP) signal
input
(Pin removed)
MOSFET drain and startup current input
MOSFET source and ground
● SOIC8
VCC
1
8
S/GND
FB
2
7
S/GND
6
S/GND
5
S/GND
D/ST
4
Descriptions
Power supply voltage input for control part
and Overvoltage Protection (OVP) signal
input
Constant voltage control signal input
(Pin removed)
MOSFET drain and startup current input
MOSFET source and ground
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
6
STR5A460 Series
6.
Typical Application
Figure 6-1 and Figure 6-2 are the example circuits of DIP8 products. In order to enhance the heat dissipation, the wide
pattern layout of S pin (5 through 8 pin) is recommended.
When the target output voltage |VOUT|is higher than 27.5 V, zener diode DZ1 is connected to D1 in serial as
shown in Figure 6-3. The output voltage should be in the range of equation (1) or (2) according to the configuration,
where VZ is the zener voltage.
Buck converter:
(1)
Inverting converter:
(2)
D1
FB
S/GND
VCC
S/GND
2
R3
R2
STR5A400D
1
D2
8
7
R1
C4
C3
6
S/GND
L2
L1
DR1
D/ST
C1
VOUT
5
4
S/GND
(+)
C5
C2
R4
D3
VAC
DR2
(-)
TC_STR5A400D_2_R2
Figure 6-1 Buck converter
D1
FB
S/GND
VCC
S/GND
2
R3
R2
STR5A400D
1
D2
8
7
R1
C4
C3
NC
6
S/GND
L1
DR1
D/ST
C1
D3
5
4
VOUT
(-)
S/GND
C5
C2
VAC
R4
L2
DR2
(+)
TC_STR5A400D_3_R2
Figure 6-2 Inverting converter
D1
DZ1
D2
(+)
VCC
2
C4
S
C3
5,6,7,8
STR5A400D
TC_STR5A400D_4_R2
Figure 6-3 Absolute value of target output voltage |VOUT| is high
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
7
STR5A460 Series
7.
7.1
External Dimensions and Marking Diagram
DIP8
● External Dimensions
NOTES:
1) Units: mm (inch)
2) Control dimension is in inches. (values in mm are for reference)
3) Pb-free. Device composition compliant with the RoHS directive
● Marking Diagram
DIP8
8
5A46×D
Part Number
SKYMD
1
Lot Number
Y = Last Digit of Year (0-9)
M = Month (1-9,O,N or D)
D = Period of days (1 to 3)
1 : 1st to 10th
2 : 11th to 20th
3 : 21st to 31st
Sanken Control Number
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
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© SANKEN ELECTRIC CO.,LTD. 2013
8
STR5A460 Series
7.2
SOIC8
● External Dimensions
NOTES:
1) Units: mm
2) Control dimension is in inches.
(values in mm are for reference)
3) Pb-free. Device composition compliant with the
RoHS directive
Land Pattern Example (not to scale)
1.6
(0.063)
3.8
(0.15)
1.27
(0.0500)
0.61
(0.024)
Unit: mm (inch)
● Marking Diagram
SOIC8
8
5A46×S
Part Number
SKYMD
1
Lot Number
Y = Last Digit of Year (0-9)
M = Month (1-9,O,N or D)
D = Period of days (1 to 3)
1 : 1st to 10th
2 : 11th to 20th
3 : 21st to 31st
Sanken Control Number
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
9
STR5A460 Series
8.
Operational Description
All of the parameter values used in these descriptions
are typical values, unless they are specified as minimum
or maximum. With regard to current direction, "+"
indicates sink current (toward the IC) and "–" indicates
source current (from the IC).
The reference ground of the value of voltage is
S/GND pin in this section.
In Section 8, the pin number of SOIC8 package
products in the circuits is shown in bracket.
8.1
Figure 8-1 shows the circuit around VCC pin.
ISTRTUP
Startup
D1
D2
STARTUP
Normal
Operation
Contro1
VCC 2(1)
C3
C4
S/GND
L2
5~8
Undervoltage Lockout (UVLO)
Figure 8-2 shows the relationship of VCC pin voltage
and circuit current ICC. When VCC pin voltage increases
to VCC(ON) = 15.0 V, the control circuit starts switching
operation and the circuit current ICC increases.
When VCC pin voltage decreases to VCC(OFF) = 8.0 V,
the control circuit stops operation by Undervoltage
Lockout (UVLO) circuit, and reverts to the state before
startup.
VOUT
(+)
4
D/ST
(4)
8.2
Startup Operation of IC
U1
stored in the inductor, L2. When the MOSFET turns off,
C4 is charged by the inductor current through D1 and
D2.
In normal operation, the voltage between VCC pin
and S/GND pin is calculated as follows, where VFD1,
VFD2 and VFD3 are the forward voltage of D1, D2 and D3
respectively:
Circuit current, ICC
VIN
D3
C5
R4
Stop
(-)
Start
C2
Figure 8-1 VCC pin peripheral circuit in buck converter
The IC incorporates the startup circuit. The circuit is
connected to D/ST pin. When D/ST pin voltage reaches
to Startup Circuit Operation Voltage V STARTUP = 29 V,
the startup circuit starts operation.
During the startup process, the constant current,
ISTARTUP = − 1.5 mA, charges C4 at VCC pin. When
VCC pin voltage increases to VCC(ON) = 15.0 V, the
control circuit starts switching operation.
After switching operation begins, the startup circuit
turns off automatically so that its current consumption
becomes zero.
The approximate startup time tSTART is calculated as
follows:
(3)
where,
tSTART is startup time of IC (s),
VCC(INT) is initial voltage on VCC pin (V).
Figure 8-1 shows the current path in normal operation.
During the on state of internal MOSFET, the energy is
VCC(OFF)
VCC pin
VCC(ON) voltage
Figure 8-2 Relationship between
VCC pin voltage and ICC
8.3
Power Supply Startup and Soft Start
Function
The IC has the Soft Start Function. This function
reduces the voltage and the current stress of MOSFET
and freewheel diode.
Figure 8-3 shows the startup waveforms.
Since the voltage of internal comparator is low at
startup, the IC is in no load condition.
The IC has the Standby Blanking Time at Startup,
tSTB(INH), that inhibits the burst oscillation mode so that
the soft start is operated after the IC starts.
The IC activates the soft start circuitry during the
startup period. Soft start time is fixed (about 5.2 ms).
During the soft start period, the over current threshold is
increased step-wisely (7 steps). The IC does switching
operation by the frequency responding to FB pin voltage
STR5A460-DSE Rev.2.2
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STR5A460 Series
until the output becomes setting voltage.
The tLIM is the period until FB pin voltage reaches
1.6 V after the IC starts. When tLIM is tOLP of 72 ms and
more, the IC stops switching operation. Thus, it is
necessary to adjust the value of output electrolytic
capacitor, C5 so that the tLIM is less than tOLP.
If VCC pin voltage reaches VCC(OFF) and a startup
failure occurs as shown in Figure 8-4, increase the C4
value or decrease the C5 value. Since the larger
capacitance causes the longer startup time of IC, it is
necessary to check and adjust the startup process based
on actual operation in the application. Since the Leading
Edge Blanking Function (refer to Section 8.5) is
deactivated during the soft start period, there is the case
that ON time is less than the leading edge blanking time,
tBW = 230 ns.
8.4
Constant Voltage (CV) Control
The IC achieves the constant voltage (CV) control of
the power supply output by using the peak-current-mode
control method, which enhances the response speed and
provides the stable operation. The IC controls the peak
value of the voltage of build-in sense resistor (VROCP) to
be close to target voltage (VSC), comparing VROCP with
VSC by internal FB comparator. The IC sampless the FB
pin voltage at the sampling point that is tFBFS = 2.5 μs
(max.) after the power MOSFET turns off, by
pulse-by-pulse. Feedback Control circuit receives the
target voltage, VSC, reversed FB pin voltage by an error
amplifier (refer to Figure 8-5 and Figure 8-6).
U1
Feedback
Control
FB comp
Startup of IC
VCC pin
voltage
VSC
R2 R3
E/A
+
-
1(2)
S/H
FB
Normal opertion
Startup of SMPS
tSTART
R1
PWM
Control
VCC(ON)
VCC(OFF)
+
ROCP
4
L2
VOUT
(+)
5~8
S/GND
D/ST
tSTB(INH)
Time
C3
VROCP
ION
D3
C2
R1
C5
(-)
Soft start period
approximately 5.2 ms (fixed)
D/ST pin
current, ID
Figure 8-5 FB pin peripheral circuit in buck converter
Time
FB pin voltage
VFB(REF)
tLIM < tOLP
-
VSC
+
VROCP
FB comparator Voltage on both side of ROCP
1.6V
Time
Drain current,
ION
Figure 8-3 Startup waveforms
VCC pin
voltage
Figure 8-6 Drain current ID and FB comparator
in steady operation
Startup success
IC starts operation
Target operating
voltage
VCC(ON)
Increase with rising of
output voltage
VCC(OFF)
Startup failure
Time
Startup time of IC, tSTART
Figure 8-4 VCC pin voltage during startup period
● Light Load Conditions
The FB pin voltage increases with the increase of the
output voltage when the output load becomes light.
Accordingly, the output voltage of internal error
amplifier (target voltage VSC) decreases. As a result,
the peak value of VROCP is controlled to be lower so
that the peak of the drain current decreases. This
control prevents the output voltage from increasing.
● Heavy Load Conditions
The control circuit performs reverse operations to the
former. The target voltage VSC of internal comparator
STR5A460-DSE Rev.2.2
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STR5A460 Series
8.4.1
Buck Converter Operation
Figure 8-7 shows the output current path in the buck
converter. Figure 8-8 shows the operational waveforms.
In this case, the operation range satisfies the
Equation (5), (6), (7), and (8)
back electromotive force in the inductor, L2 and D3
turns on. Then the energy stored in L2 during the
PWM on-time flows through the IOFF path shown in
Figure 8-7.
After the Average PWM Switching Cycle, 1 /
fOSC(AVG), the internal power MOSFET turns-on
again, and the PWM on-time period repeats as
shown in Figure 8-8
U1
VCC 2(1)
Contro1
becomes higher and the peak drain current increases.
This control prevents the output voltage from
decreasing.
(5)
D2
D1
FB 1(2)
C3
C4
VROCP
4
S/GND
VL
(6)
C2
VOUT
(+)
L2
5~8
D/ST
VIN
IL
ROCP
ION
(MOSFET ON) D3
IOFF
(MOSFET OFF)
R4
C5
(7)
(8)
where,
VIN is C2 voltage,
VOUT is output voltage,
DMAX is maximum ON Duty,
VRON is on voltage of internal MOSFET,
VSTARTUP (max.) is maximum value of Startup Circuit
Operation Voltage,
VCC(OFF) (max.) is maximum value of Operation Stop
Voltage,
VCC(OVP) (min.) is minimum value of OVP Threshold
Voltage,
VFD1 is forward voltage of D1,
VFD2 is forward voltage of D2, and
VFD3 is forward voltage of D3.
(-)
Figure 8-7 Output current flow in the buck converter
VL
ON
VIN-VRON-VOUT
0
t
-(VOUT-VFD3)
IL
t
ION
t
IOFF
t
In the buck converter, the current control of internal
PWM is described in the following.
1) PWM On-Time Period
At startup or during normal operation before the
current reaches the target level, internal power
MOSFET turns on and the current flows through the
ION path shown in Figure 8-7. When ION flows
through the internal current detection resistor, ROCP,
IC detects VROCP that is the voltage between both
ends of ROCP. The divided voltage of C3 is input to
FB pin. The target voltage, VSC is made from FB pin
voltage. When the current detection voltage, VROCP,
reaches to VSC, the power MOSFET turns off.
MOSFET
ON
OFF
1/fOSC(AVG)
Figure 8-8 Operational waveforms in the buck converter
2) PWM Off-Time Period
When the internal power MOSFET turns off, the
freewheeling diode, D3, is forward biased by the
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8.4.2
Inverting Converter Operation
Figure 8-9 shows the output current path in the
inverting converter. Figure 8-10 shows the operational
waveforms.
In this case, the operation range satisfies the Equation
(9), (10), (11), and (12).
shown inFigure 8-9.
After the Average PWM Switching Cycle, 1 /
fOSC(AVG), the internal power MOSFET turns-on
again, and the PWM on-time period repeats as
shown in Figure 8-10.
In the inverting converter, the output current is
supplied only in the off period. Thus, output ripple
becomes larger compared with the buck converter.
(9)
VCC
2(1)
FB
1(2)
Contro1
U1
(10)
D2
D1
C3
C4
VROCP
ROCP
4
(11)
S/GND
IL
C2
VIN
ION
(MOSFET ON) VL
IOFF
(MOSFET OFF)
C5
R4
L2
(12)
where,
VIN is C2 voltage,
VOUT is output voltage,
DMAX is maximum ON Duty,
VRON is on voltage of internal MOSFET,
VSTARTUP (max.) is maximum value of Startup Circuit
Operation Voltage,
VCC(OFF) (max.) is maximum value of Operation Stop
Voltage,
VCC(OVP) (min.) is minimum value of OVP Threshold
Voltage,
VFD1 is forward voltage of D1,
VFD2 is forward voltage of D2, and
VFD3 is forward voltage of D3.
VOUT
(-)
D3
5~8
D/ST
(+)
Figure 8-9 Output current flow in inverting converter
VL
MOSFET
ON
OFF
ON
VIN‐VRON
t
0
-(VOUT-VFD3)
IL
t
ION
In the inverting converter, the current control of
internal PWM is described in the following.
1) PWM On-Time Period
At startup or during normal operation before the
current reaches the target level, internal power
MOSFET turns on and the current flows through the
ION path shown in Figure 8-9.
When ION flows through the internal current
detection resistor, ROCP, the IC detects VROCP that is
the voltage of both end of ROCP. The divided voltage
of C3 is input to FB pin. The target voltage, VSC is
made from FB pin voltage.
When the current detection voltage, VROCP, reaches
to VSC, the power MOSFET turns off.
2)
t
IOFF
t
1/fOSC(AVG)
Figure 8-10 Operational waveforms in inverting
converter
PWM Off-Time Period
When the internal power MOSFET turns off, the
freewheeling diode, D3, is forward biased by the
back electromotive force in the inductor, L2 and
D3 turns on. Then the energy stored in L2 during
the PWM on-time flows through the IOFF path
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8.5
Leading Edge Blanking Function
Since the IC uses the peak-current-mode control
method for the constant voltage control of output, there
is a case that the power MOSFET turns off due to
unexpected response of FB comparator or overcurrent
protection circuit (OCP) to the steep surge current in
turning on a power MOSFET.
In order to prevent this response to the surge voltage
in turning-on the power MOSFET, the Leading Edge
Blanking (tBW = 230 ns) is built-in.
Switching
Frequency,
fOSC
Normal operation
60kHz
B
About
23kHz
A
Burst
oscillation mode
Green mode
TSTBOP = 740 µs
Light load
Output power
PO(MAX)
Figure 8-12 Relationship between PO and fOSC
tBW
Point A
ID
TSTBOP
Time
Surge pulse voltage width at turning on
Point B
ID
TSTBOP
Figure 8-11 Leading Edge Blanking
Time
8.6
Random Switching Function
The IC modulates its switching frequency randomly
by superposing the modulating frequency on fOSC(AVG) in
normal operation. This function reduces the conduction
noise compared to others without this function, and
simplifies noise filtering of the input lines of power
supply.
8.7
Auto Standby Function
Auto Standby Function automatically changes the
oscillation mode to green mode or burst oscillation mode,
when the output load becomes lower, the drain current
ID decreases and the oscillation frequency becomes
lower gradually (Green Mode) as shown in Figure 8-12.
In order to reduce the switching loss, the number of
switching is reduced in green mode and the switching
operation is stopped during a constant period in burst
oscillation mode.
Figure 8-13 shows the drain current waveforms of
point A and B in Figure 8-12
The burst oscillation mode operates by the Standby
Operation Cycle, TSTBOP = 740 ms. In light load, the
number of minimum switching times is one in T STBOP as
shown in Figure 8-13.
Since the oscillator of burst oscillation cycle setting
and the oscillator of switching oscillation frequency
setting are not synchronized each other, the switching
frequency may be high.
Figure 8-13 Switching waveform at burst oscillation
mode
8.8
Overload Protection (OLP)
When output power reaches certain power, the drain
current of a power MOSFET is limited by IDLIM and the
output voltage decreases. Thus, the current characteristic
is as shown in Figure 8-14. The switching frequency is
decreased with decreasing output voltage in order to
inhibit increasing output current at low output voltage.
When output voltage decreases in the state such as
output short mode, FB pin voltage decreases.
When the FB pin voltage keeps less than 1.6 V,
Overload Protection (OLP) is activated, and the IC stops
switching operation. When VCC pin voltage decreases
to VCC(OFF), the control circuit stops operation. After that,
the IC starts operation when VCC pin voltage increases
to VCC(ON) by startup current. Thus, the intermittent
operation by UVLO is repeated in OLP state.
The switching time in the intermittent operation is
OLP Delay Time at Startup, tOLP = 72 ms (Refer to
Figure 8-15).
This intermittent operation reduces the stress of parts
including a power MOSFET and a free wheel diode. In
addition, this operation reduces power consumption
because the switching period in this intermittent
operation is short compared with oscillation stop period.
When the abnormal condition is removed, the IC returns
to normal operation automatically.
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8.10 Thermal Shutdown (TSD)
Output voltage,
VOUT
CV mode
Output current, IOUT
Figure 8-14 Overload characteristics
Non-switching interval
VCC pin voltage
VCC(ON)
VCC(OFF)
Drain current,
ID
tOLP
Figure 8-16 shows the Thermal Shutdown (TSD)
operational waveforms.
When the temperature of control circuit increases to
Tj(TSD) = 135 °C (min.) or more, the TSD is activated,
and the IC stops switching operation. After that, VCC
pin voltage decreases. When the VCC pin voltage
decreases to about 9.4 V, the Bias Assist Function is
activated and the VCC pin voltage is kept to over the
VCC(OFF).
When the temperature reduces to less than
Tj(TSD)−Tj(TSD)HYS, the Bias Assist Function is disabled
and the VCC pin voltage decreases to VCC(OFF). At that
time, the IC stops operation by the Undervoltage
Lockout (UVLO) circuit and reverts to the state before
startup. After that, the startup circuit is activated, the
VCC pin voltage increases to VCC(ON), and the IC starts
switching operation again. In this way, the intermittent
operation by TSD and UVLO is repeated while there is
an excess thermal condition.
When the fault condition is removed, the IC returns to
normal operation automatically.
tOLP
Junction Temperature,
Tj
Tj(TSD)
Figure 8-15 OLP operational waveform
8.9
Tj(TSD)−Tj(TSD)HYS
Bias assist
function
Overvoltage Protection (OVP)
When a voltage between VCC pin and S/GND
terminal increases to VCC(OVP) = 29.3 V or more,
Overvoltage Protection (OVP) is activated and stops
switching operation. The intermittent operation by
UVLO is repeated in OVP state. When the abnormal
condition is removed, the IC returns to normal operation
automatically.
The approximate value of output voltage VOUT(OVP) in
OVP condition is calculated by using Equation (13).
ON
ON
OFF
OFF
VCC pin voltage
VCC(ON)
VCC(BIAS)
VCC(OFF)
Drain current
ID
Figure 8-16 TSD operational waveforms
(13)
where,
VOUT(OVP) is voltage of between VOUT(+) and VOUT(−),
VFD1 is forward voltage of D1,
VFD2 is forward voltage of D2, and
VFD3 is forward voltage of D3.
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STR5A460 Series
9.
9.1.2
Design Notes
9.1
External Components
Take care to use properly rated, including derating as
necessary and proper type of components.
Figure 9-1 shows the peripheral circuit of IC. The pin
number of SOIC8 package products in the circuits is
shown in bracket.
D1
9.1.3
STR5A400
1(2)
2(1)
FB
VCC
S/GND
S/GND
8
C4
R1
C3
7
6
S/GND
VOUT
L1
DR1
Apply proper design margin to core temperature rise by
core loss and copper loss.
The value of inductor should be designed so that the
inductor current does not saturate.
The on time must be longer than Leading Edge Blanking
Time in order to control the output voltage constantly. In
the universal input voltage design, the on time becomes
short in the condition of maximum AC input voltage and
light road. Be careful not to reduce the value of inductor
( ≥ 820 μH recommended) too much.
D2
R3
R2
Inductor
VCC Pin Peripheral Circuit
The reference value of C4 (see Figure 9-1) is
generally from 10 μF to 47 μF. The startup time is
determined by the value of C4 (refer to Section 8.1
Startup Operation).
5
4
D/ST
S/GND
(+)
L2
VAC
C1
C2
D3
C5
9.1.4
R4
DR2
(-)
Figure 9-1 Peripheral circuit of IC
9.1.1
Input and Output Electrolytic
Capacitor
Apply proper derating to ripple current, voltage, and
temperature rise.
The value of output electrolytic capacitor, C5, should
be set to fulfill as following conditions:
- The specification of output ripple is fulfilled.
- The output voltage rising time in startup is enough
shorter than the OLP Delay Time at Startup,
tOLP = 72 ms.
Use of low impedance types, designed for switch
mode power supplies, is recommended.
The ESR of C5 should be set within the range of
Equation (14).
FB Pin Peripheral Circuit
The divided voltage of output voltage, VOUT(+), is
input to FB pin as shown in Figure 9-1.
C3 is capacitor for smoothing of output. The value of
C3 depends on the value of output electrical capacitor
and is 0.022 μF to 0.22 μF.
When C3 value is set larger, the line regulation
characteristic becomes better. But the dynamic response
of the output voltage becomes worse.
R1, R2 and R3 is set by the reference voltage,
VFB(REF) = 2.50 V, and the output voltage, VOUT. When
S/GND pin is ground reference, there is the relationship
as following Equation (15).
The target value of R1 is about 10 kΩ to 22 kΩ. R2
and R3 should be adjusted in actual operation condition.
(15)
(14)
where,
ZCO is ESR of Electrolytic capacitor at
fOSC(AVG)(min.) = 53 kHz (Since the ESR in most
general catalog is the value of 100 kHz, check the
frequency specification.),
ΔVOR is output ripple voltage specification, and
IRP is the peak current of inductor (see Section 9.3).
where,
VFD2 is forward voltage of D2, and
VFD3 is forward voltage of D3.
The VF of D2 and D3 affects the output voltage. Thus,
diodes of the low VF should be selected.
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9.1.5
Freewheeling diode
D3 is freewheeling diode shown in Figure 9-1. When
the internal power MOSFET turns on, recovery current
flows through D3. Recovery current affects power loss
and noise. The VF affects the output voltage. Thus, fast
recovery and low VF characteristic diode should be
selected.
9.1.6
Bleeder resistance
For light load application, the breeder resistance, R4,
should be connected to both ends of output capacitor, C5,
as shown in Figure 9-1, in order to prevent the increase
of output voltage.
The value of R4 should satisfy Equation (16). R4
should be adjusted in actual operation condition.
(16)
9.2
D/ST Pin
The internal power MOSFET connected to D/ST pin
is permanently damaged when the D/ST pin voltage and
the current exceed the Absolute Maximum Ratings.
The D/ST pin voltage is tuned to be less than about
90 % of the Absolute Maximum Ratings (630 V) in all
condition of actual operation, and the value of
transformer and components should be selected based on
actual operation in the application.
And the D/ST pin voltage in normal operation is tuned
to be less than 560 V.
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9.3
Output Inductor Value Setting
In general, the inductance value is set so that the inductance current becomes Discontinues Condition Mode (DCM)
or Continuous Conduction Mode (CCM) in normal operation. Table 9-1 shows the operating condition and the features
of DCM and CCM.
On duty, D, is set within the range of Equation (17);
(17)
where,
tON(MIN) is minimum on time, ≥ 400 ns,
fOSC(AVG) is average PWM Switching Frequency, 60 kHz, and
DMAX(min.) is minimum value of Maximum ON Duty, 50 %.
Table 9-1 Comparison of DCM and CCM operation
Discontinues Condition Mode (DCM)
Continuous Conduction Mode (CCM)
IL
IL
IRP
Inductor current, IL
ΔIOFF
ΔION
ΔIOFF
IR
IL(AVG)
IR
IRL
ΔION
IL(AVG)
IRL 0
t
t
tON
tOFF
IRP
tIDL
tON
tOFF
Operating condition
Feature
Smaller Inductor size.
Lower switching losses.
Lower output current ripple.
Higher output power.
in Table 9-1,
IL(AVG) is average inductor current,
IR is output ripple current (In DCM mode, IR = IL(AVG). In CCM mode, IR = 0.2 × IO(AVG) to 0.5 × IO(AVG) ),
IRP is maximum ripple current,
IRL is minimum ripple current,
tON is the period in which the power MOSFET is on status and D3 is off status,
tOFF is the period in which the power MOSFET is off status and D3 is on status, and
tIDL is the period in which the power MOSFET and D3 are off status.
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9.3.1
Buck Converter
Figure 9-2 shows the output current flow in the buck converter. Figure 9-3 and Figure 9-4 show the DCM and the
CCM operational waveforms.
In the following equations, IRL is zero in the DCM operation and tIDL is zero in CCM operation.
U1
VL
D/ST
L2
S/GND
(+)
IL
VRON
ION
VIN
VFD3
C2
VOUT
IOFF
D3
C5 R4
(-)
Figure 9-2 The output current flow in the buck converter
VL
VL
VIN-VRON-VOUT
VIN-VRON-VOUT
t
0
-(VOUT+VFD3)
IL
t
0
-(VOUT+VFD3)
IL
IRP
ΔIOFF
ΔION
ΔIOFF
IR
IL(AVG)
IR
IRL
ΔION
IL(AVG)
t
t
0
tON
tOFF
tIDL
Figure 9-3 DCM operational waveforms in the buck
converter
IRP
tON
tOFF
Figure 9-4 CCM operational waveforms in the buck
converter
1) The average Output Current, IO(AVG)
The average output current, IO(AVG) is inductor current. IO(AVG) is expressed as follows:
(18)
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STR5A460 Series
2) On Duty, D
ΔION is inductor current during tON. ΔIOFF is inductor current during tOFF. ΔION and ΔIOFF are expressed as follows:
(19)
(20)
where,
VIN is input voltage (C2 voltage),
VFD3 is forward voltage of D3,
VOUT is output voltage,
VRON is the voltage between the D/ST pin and the S/GND pin during on time, and
L is inductance value of L2.
Ripple current, IR, is expressed as follows:
(21)
The on duty, D is expressed as follows:
(22)
From Equation (19), (20), and (21), Equation (23) is converted into following equation.
(23)
3) Inductance Value, L
The average frequency, fOSC(AVG) is as follows:
(24)
From Equation (22), and (24), the on duty, D is converted into following equation.
From Equation (19), (20), (21), and (23), the inductance value, L is expressed as follows:
(25)
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STR5A460 Series
4) Peak Current of The Inductor, IRP
Ripple current, IR is expressed as follows:
From Equation (18), (19), (20), and (21), the peak current of the inductor, IRP is expressed as follows:
(26)
Table 9-2 shows the circuit characteristics of DCM operation and CCM operation for buck converter. These are the
result of the calculation from the operating condition of Table 9-1 and Equation (18), (23), (25), and (26).
Table 9-2 Circuit characteristics (Buck converter)
Parameter
Operation
mode
Circuit characteristics
DCM
IO(AVG)
CCM
DCM
D
CCM
DCM
L
CCM
DCM
IRP
CCM
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STR5A460 Series
9.3.2
Inverting Converter
Figure 9-5 shows the output current flow in the inverting converter. Figure 9-6 and Figure 9-7 show the DCM and the
CCM operational waveforms.
In the following equations, IRL is zero in the DCM operation and tIDL is zero in CCM operation. Since output current
is flowed when the power MOSFET is off status, the output ripple becomes larger than the buck converter.
U1
VFD3
4 D/ST
S/GND 5~8
(-)
D3
VRON
ION
VIN
C5 R4
IL
VL
C2
IOFF
VOUT
L2
(+)
Figure 9-5 The output current flow in the inverting converter
VL
VL
VIN-VRON
VIN-VRON
t
0
-(VOUT+VFD3)
IL
t
0
-(VOUT+VFD3)
IL
IRP
ΔIOFF
ΔION
ΔIOFF
IR
IL(AVG)
IR
IRL
ΔION
IL(AVG)DCM
t
t
0
tON
tOFF
tIDL
Figure 9-6 DCM operational waveforms in the inverting
converter
IRP
tON
tOFF
Figure 9-7 CCM operational waveforms in the inverting
converter
1) The average Output Current, IO(AVG)
The average output current, IO(AVG) is average inductor current during off time of the power MOSFET. IO(AVG) is
expressed as follows:
(27)
where, IL(AVG) is average inductor current.
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STR5A460 Series
2) On Duty, D
ΔION is inductor current during tON. ΔIOFF is inductor current during tOFF. ΔION and ΔIOFF are expressed as follows:
(28)
(29)
where,
VIN is input voltage (C2 voltage),
VFD3 is forward voltage of D3,
VOUT is output voltage,
VRON is the voltage between the D/ST pin and the S/GND pin during on time, and
L is inductance value of L2.
Ripple current, IR, is expressed as follows:
(30)
The on duty, D is expressed as follows:
(31)
From Equation (28), (29), and (30), Equation (32) is converted into following equation.
(32)
3) Inductance Value, L
The average frequency, fOSC(AVG) is as follows:
(33)
From Equation (31), and (33), the on duty, D is converted into following equation.
From Equation (28), (29), (30), and (32), the inductance value, L is expressed as follows:
(34)
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STR5A460 Series
4) Peak Current of The Inductor, IRP
Ripple current, IR is expressed as follows:
From Equation (27), (28), (29), and (30), the peak current of the inductor, IRP is expressed as follows:
(35)
Table 9-3 shows the circuit characteristics of DCM operation and CCM operation for the inverting converter. These
are the result of the calculation from the operating condition of Table 9-1 and Equation (27), (32), (34), and (35).
Table 9-3 Circuit characteristics (Inverting converter)
Parameter
Operation
mode
Circuit characteristics
DCM
IO(AVG)
CCM
DCM
D
CCM
DCM
L
CCM
DCM
IRP
CCM
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STR5A460 Series
9.4
point grounding.
PCB Trace Layout
Since the PCB circuit trace design and the component
layout significantly affects operation, EMI noise, and
power dissipation, the high frequency PCB trace should
be low impedance with small loop and wide trace.
In addition, the ground traces affect radiated EMI
noise, and wide, short traces should be taken into
account.
Figure 9-8 and Figure 9-9 show the circuit design
example.
1) Main Circuit Trace Layout
This is the main trace containing switching currents,
and thus it should be as wide trace and small loop as
possible.
2) Freewheeling Loop Layout
This is the trace for the current of freewheeling
diode, D3, and thus it should be as wide trace and
small loop as possible.
3) Control Ground Trace Layout
Since the operation of IC may be affected from the
large current of the main trace that flows in control
ground trace, the control ground trace should be
separated from main trace and connected at single
4) VCC Trace Layout
This is the trace for supplying power to the IC, and
thus it should be as small loop as possible. If C4 and
the IC are distant from each other, placing a
capacitor such as film capacitor Cf (about 0.1 μF to
1.0 μF) close to the VCC pin and the S/GND pin is
recommended.
5) FB Trace Layout
The divided voltage by R2, R3 and R1 of output
voltage is input to the FB pin.
In order to increase the detection accuracy, R3 and
R1 should be connected to bottom of C3 and the
S/GND pin, The trace between R1, R2 and the FB
pin should be as short as possible.
6) Thermal Considerations
Because the power MOSFET has a positive thermal
coefficient of RDS(ON), consider it in thermal design.
Since the copper area under the IC and the S/GND pin
trace act as a heatsink, its traces should be as wide as
possible.
(6) Trace of S/GND pin should be wide
for heat release
D1
D2
(4) Loop of the power supply should be small
R3
(5) The trace between
R1, R2 and FB pin
should be as short as
possible.
R2
1
FB
S/GND
2
VCC
S/GND
8
C3
C4
R1
7
6
S/GND
VOUT
5
4
D/ST
(+)
S/GND
L2
U1
C2
C5
D3
R4
(-)
(1)Main trace should be wide
trace and small loop
(2) Freewheeling Loop trace should be
wide trace and small loop
(3) Control GND trace should be
connected at a single point
Figure 9-8 Peripheral circuit example around the IC for the buck converter (DIP8)
STR5A460-DSE Rev.2.2
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Nov. 11, 2015
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© SANKEN ELECTRIC CO.,LTD. 2013
25
STR5A460 Series
(6) Trace of S/GND pin should be wide
for heat release
D1
D2
(4) Loop of the power supply should be small
R3
(5) The trace between
R1, R2 and FB pin
should be as short as
possible.
R2
1
FB
S/GND
VCC
S/GND
2
8
C3
C4
R1
7
6
S/GND
D/ST
VOUT
D3
5
4
(-)
S/GND
U1
C2
C5
R4
L2
(+)
(1)Main trace should be wide
trace and small loop
(2) Freewheeling Loop trace should be
wide trace and small loop
(3) Control GND trace should be
connected at a single point
Figure 9-9 Peripheral circuit example around the IC for the inverting converter (DIP8)
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
26
STR5A460 Series
10. Pattern Layout Example (DIP8)
10.1 Buck Converter
The following show the PCB pattern layout example and the schematic of circuit using STR5A460D series. The parts
in Figure 10-2 are only used. The PCB pattern layout example of STR5A460S series is same except for some pin
arrangements.
Figure 10-1 PCB circuit trace layout example for the buck converter
Z1
1
FB
S/GND
VCC
S/GND
2
D5
JW10
R2
R3
D6
8
7
R1
C4
C5
6
S/GND
L2
L1
D/ST
VAC
D4
S/GND
D3
C1
VOUT
5
4
C2
(+)
D7
C6
R6
F1
JW9
D2
D1
(-)
TC_STR5A400D_5_R1
Figure 10-2 Circuit schematic for PCB circuit trace layout for the buck converter
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
27
STR5A460 Series
10.2 Inverting Converter
The following show the PCB pattern layout example and the schematic of circuit using STR5A460D. The PCB
pattern layout example of STR5A460S series is same except for some pin arrangements.
Figure 10-3 PCB circuit trace layout example for the inverting converter circuit
D5
R2
Z1
1
FB
S/GND
VCC
S/GND
2
D6
R3
8
7
R1
C4
C5
6
S/GND
L1
JW1
D/ST
VAC
DR4
S/GND
(-)
DR3
C1
C2
F1
DR2
VOUT
D7
5
4
L2
DR1
C6
C7
R6
L3
(+)
TC_STR5A400D_6_R2
Figure 10-4 Circuit schematic for PCB circuit trace layout for the inverting converter circuit
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
28
STR5A460 Series
11. Reference Design of Power Supply
11.1 Buck Converter
As an example, the following show the power supply specification, the circuit schematic, the bill of materials, and the
transformer specification.
● Power supply specification
IC
Input voltage
Maximum output power
Output voltage
Output current
STR5A464D
85 VAC to 265 VAC
3 W (max.)
15 V
0.2 A
● Circuit schematic
D1
R2
U1
1
FB
S/GND
VCC
S/GND
2
D2
R3
8
7
R1
C4
C3
6
S/GND
F1
L2
L1
DR1
D/ST
C1
VOUT
5
4
S/GND
(+)
C5
C2
VAC
R4
D3
DR2
(-)
TC_STR5A400D_7_R1
● Bill of materials
Symbol
Part type
Ratings(1)
Recommended Sanken Parts
DR1
General
600 V, 1 A
AM01A
DR2
General
600 V, 1 A
AM01A
F1
Fuse
250 V, 1 A
(2)
CM inductor
L1
680μH
Inductor
L2
1 mH
C1
Electrolytic
400 V, 4.7 μF
C2
Electrolytic
400 V, 4.7μF
C3
Ceramic
50 V, 0.22 µF
C4
Electrolytic
50 V, 10 µF
C5
Electrolytic, Low impedance
50 V, 220 µF
R1
General
10 kΩ
(2)
R2
General
47 kΩ
(2)
R3
General
5.6 kΩ
(2)
R4
General
4.7 kΩ
D1
Fast recovery
200V, 1 A
SJPL-D2
D2
Fast recovery
500 V, 1 A
SJPD-D5
D3
Fast recovery
500 V, 1 A
SJPD-D5
U1
IC
STR5A464D
(1)
Unless otherwise specified, the voltage rating of capacitor is 50 V or less and the power rating of resistor is 1/8 W or less.
(2)
It is necessary to be adjusted based on actual operation in the application.
STR5A460-DSE Rev.2.2
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Nov. 11, 2015
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STR5A460 Series
11.2 Inverting Converter
As an example, the following show the power supply specification, the circuit schematic, the bill of materials, and the
transformer specification.
● Power supply specification
IC
Input voltage
Maximum output power
Output voltage
Output current
STR5A464D
85 VAC to 265 VAC
3 W (max.)
− 15 V
0.2 A
● Circuit schematic
D1
R2
U1
1
FB
S/GND
VCC
S/GND
2
D2
R3
8
7
R1
C4
C3
6
S/GND
L1
F1 DR1
D/ST
C1
D3
5
4
VOUT
S/GND
(-)
C5
C2
VAC
R4
L2
DR2
(+)
TC_STR5A400D_8_R1
● Bill of materials
Symbol
Part type
Ratings(1)
Recommended Sanken Parts
DR1
General
600 V, 1 A
AM01A
DR2
General
600 V, 1 A
AM01A
F1
Fuse
250 V, 1 A
(2)
CM inductor
L1
680μH
Inductor
L2
1 mH
C1
Electrolytic
400 V, 10 μF
C2
Electrolytic
400 V, 10 μF
C3
Ceramic
50 V, 0.22 µF
C4
Electrolytic
50 V, 10 µF
C5
Electrolytic, Low impedance
50 V, 220 µF
R1
General
10 kΩ
(2)
R2
General
47 kΩ
(2)
R3
General
5.6 kΩ
(2)
R4
General
4.7 kΩ
D1
Fast recovery
200 V, 1 A
SJPL-D2
D2
Fast recovery
500 V, 1 A
SJPD-D5
D3
Fast recovery
500 V, 1 A
SJPD-D5
U1
IC
STR5A464D
(1)
Unless otherwise specified, the voltage rating of capacitor is 50 V or less and the power rating of resistor is 1/8 W or less.
(2)
It is necessary to be adjusted based on actual operation in the application.
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO.,LTD. 2013
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STR5A460 Series
IMPORTANT NOTES
● All data, illustrations, graphs, tables and any other information included in this document as to Sanken’s products listed herein (the
“Sanken Products”) are current as of the date this document is issued. All contents in this document are subject to any change
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before use.
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appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products,
please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to
Sanken. If considering use of the Sanken Products for any applications that require higher reliability (transportation equipment and
its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety devices, etc.), you
must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal,
on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. Any use
of the Sanken Products without the prior written consent of Sanken in any applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
● In the event of using the Sanken Products by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the same, you must duly consider all possible risks that may result from all such
uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the
occurrence of any failure or defect in semiconductor products at a certain rate. You must take, at your own responsibility,
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evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of use of the
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from any possible errors or omissions in connection with the contents included herein.
● Please refer to the relevant specification documents in relation to particular precautions when using the Sanken Products, and refer
to our official website in relation to general instructions and directions for using the Sanken Products.
STR5A460-DSE Rev.2.2
SANKEN ELECTRIC CO.,LTD.
Nov. 11, 2015
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© SANKEN ELECTRIC CO.,LTD. 2013
31