846AM

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
MSOP8 EP, 3x3
CASE 846AM
ISSUE O
SCALE 1:1
A
8
E
PIN ONE
INDICATOR
D
ÏÏ
ÏÏ
e
1
F
B
5
E1
L
L2
DETAIL A
C
4
8X
b
0.08
TOP VIEW
M
C B
S
A
S
DATE 27 FEB 2014
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.10 MM IN
EXCESS OF MAXIMUM MATERIAL CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15
MM PER SIDE. DIMENSION E DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 MM PER SIDE.
DIMENSIONS D AND E ARE DETERMINED AT DATUM F.
5. DATUMS A AND B TO BE DETERMINED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE
SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE
BODY.
DETAIL A
A
DIM
A
A1
b
c
D
D2
E
E1
E2
e
L
L2
A1
0.10 C
C
c
END VIEW
SEATING
PLANE
SIDE VIEW
D2
MILLIMETERS
MIN
MAX
−−−
1.10
0.05
0.15
0.25
0.40
0.13
0.23
2.90
3.10
1.78 REF
4.75
5.05
2.90
3.10
1.42 REF
0.65 BSC
0.40
0.70
0.254 BSC
GENERIC
MARKING DIAGRAM*
E2
8
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
8X
8X
0.42
0.85
1
5.35
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
XXXX
AYWG
G
98AON82708F
XXXX
A
Y
W
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present and may be in
either location.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
MSOP8 EP, 3X3
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON82708F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. LIU.
DATE
27 FEB 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
February, 2014 − Rev. O
Case Outline Number:
846AM
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