Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 11 March 2016, 10:02 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 1 May 2009 [Approved on 11 March 2016, 10:04 GMT] Materials and substances % w/w of material in the part Use/Location Material group Chip (die) Other inorganic materials 0.50000% Gold plating 0.12000% Die attach Encapsulation EP (Epoxy resin) 52.10000% Substances in the material CAS Number % w/w of substance in the material Gold 7440-57-5 8.50000% ALUMINIUM 7429-90-5 12.00000% Silicon 7440-21-3 79.50000% Tin 7440-31-5 20.00000% Gold 7440-57-5 80.00000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% 2,2-Bis(4(2',3'1675-54-3 epoxypropoxy)phenyl)propane 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz sand 60676-86-0 70.30000% Inner preparation Gold 0.04500% Gold 7440-57-5 100.00000% Leadfinish Tin plating 0.90000% Tin 7440-31-5 100.00000% Silver 7440-22-4 0.48000% Leadframe Copper (e.g. copper amounts in cable harnesses) Copper 7440-50-8 0.95000% Iron 7439-89-6 98.57000% 46.33500% Attached parts list Part number Part name Part Mass Part Mass UoM TO-92 TO-92 0.18 g Page 1 Report generated: 11 March 2016, 10:02 GMT