Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 7 March 2016, 12:42 GMT Diotec Semiconductor AG DUNS-Nummer: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations Autorisiert durch: Udo Steinebrunner, Product Manager, - Deklaration gilt ab: 1 May 2009 [Approved on 7 March 2016, 12:42 GMT] Materialien und Stoffe % w/w des Materials Substances in the material im Artikel Verwendung/Andordnung Material group Chip (die) Other inorganic materials 3.00000% Gold 4.00000% Die attach Encapsulation EP (Epoxy resin) 68.08000% CAS Number % w/w des Stoffs im Artikel Gold 7440-57-5 8.50000% ALUMINIUM 7429-90-5 12.00000% Silicon 7440-21-3 79.50000% Tin 7440-31-5 20.00000% Gold 7440-57-5 80.00000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% 2,2-Bis(4(2',3'1675-54-3 epoxypropoxy)phenyl)propane 0.99000% Epoxy resin 89 26335-320 27.61000% Quartz sand 60676-860 70.30000% Inner preparation Gold 0.14000% Gold 7440-57-5 100.00000% Leadfinish Tin plating 0.68000% Tin 7440-31-5 100.00000% Leadframe Copper (e.g. copper 24.10000% amounts in cable harnesses) Copper 7440-50-8 100.00000% Beigefügte Artikelliste Part number Artikelbezeichnung Artikelmasse Artikelmasse UoM SOD-323 Diode SMD 0.005 g Page 1 Report generated: 7 March 2016, 12:42 GMT