ROHM GROUP Memory Catalog DRAM / EEPROM / FeRAM / NOR Flash / P2ROMTM ROHM offers a broad portfolio of memory products, from DRAM to non-volatile memory, optimized for a variety of applications and requirements. Proven quality / Stable supply Superior data retention DRAM NOR Flash Proven quality / Stable supply FeRAM Shorter lead times / No inventory required P2ROMTM * * Guaranteed delivery / High reliability EEPROM 01 Production Programmed ROM ROHM GROUP Memory Catalog Volatile Memory DRAM P.03 FP/EDO [4Mb/16Mb/64Mb, 5V/3.3V] SDRAM [16Mb-256Mb, 3.3V] SDRAM for SiP (Bare Chips) Video Memory [3Mb/4Mb/5Mb/6Mb/10Mb/26Mb, 5V/3.3V] Non-Volatile Memory EEPROM P.07 I2C BUS (2-Wire) Microwire BUS (3-Wire) SPI BUS Ultra-Compact WL-CSP Plug&Play EEPROM FeRAM P.13 Parallel BUS FeRAM [256Kb, 3.3V] I2C BUS FeRAM [64Kb-1Mb, 3.3V] SPI BUS FeRAM [32Kb-2Mb, 3.3V] NOR Flash P.15 Parallel BUS NOR Flash [64Mb-1Gb, 3.3V] P2ROMTM Parallel BUS Standard P2ROMTM [8Mb-512Mb, 3.3V] Parallel BUS Page Mode P2ROMTM [16Mb-16Gb, 3.3V] SPI BUS P2ROMTM [16Mb-128Mb, 3.3V] 02 P.17 DRAM Series Lineup Broad DRAM Lineup [Capacity] bit 4M FP/EDO Series Asynchronous Clock Automotive-Grade High-Speed EDO Low Power Copper Frame Standard Package Stable Supply 16M MSM514xxxx Series MSM5416258B Series MSM51V4xxxx Series MSM54V16258B Series MSM514400xP Series MSM514260EP Series MSM51V4xxxxP Series MSM54V16258BP Series 37 models SDRAM Series Synchronous Clock Automotive-Grade Expanded Temp JEDEC Standard Driveability Setting Copper Frame 166MHz Operation Stable Supply No damping R needed DRAM Bare Chip Guaranteed KGD Automotive-Grade SiP Failure Analysis Test Program Offered Chip Traceability Assembly Solutions 32 models 9 models MD56V62160M Series 4 models AAAAAA MUSIC CCCCCcccccc DDD E_EEE Frame memory 1 4 7 C 2 8 5 0 4 models Frame memory Car Navigation Displays, Communication Equipment Surveillance Cameras Data buffers Business Printers Broadcast/Industrial Equipment 3 6 9 Set Medical Equipment Frame memory Data buffers PC,Gaming, Communication Gaming Systems/PC Peripherals Home Communication Sound buffers, shock-proof designs AV Systems 11 models MD56V72160C Series Car Audio BBBbbbbb Displays, communication equipment Frame memory, sound buffers 8 models 5 models Shock-proof designs Automotive Industrial Equipment MD56V62xxxx Series MD56V72160C Series MD56V82160A Series MD56V62xxxx-xxTAP Series MD56V72160C-xxTAP Series MD56V82160A-xxTAP Series MD56V62160M-xxTAP Series MD58W82160A Series (DDR) MSM56V16160x Series Application Examples 256M 2 models 12 models 166MHz Operation 128M MD51V65165E Series MSM56V16800F Series MSM56V16160x Series MSM56V16160xP Series SDRAM for SiP Series 16Mbit Industry-Small Size 64M MSM511xxxxx Series MSM51V1xxxxx Series MSM511816xFP Series MSM51V1xxxxxP Series Data buffers TVs/Compact Panels Component Audio Sound buffers Data buffer Sound buffers, shock-proof designs Business Communication Frame/work memory Frame memory Musical Instruments Wide video memory lineup optimized for a range of panel types, from compact to full HD 3M Video Memory Series FIFO Asynchronous IN/OUT Clock IN/OUT Clock Rate Independent Control Self-Refresh Function Automotive-Grade 2-Port Independent Clock Write Master Function Cascade Function 4M MSM8104160A Series MS81V04160A Series MS81V04166A Series MS81V04160AP Series MSM5412222B Series MSM54V12222B Series MS81V03120 Series Top Address Designation 5M/6M 6 models MS81V05200-13TAZ03 MS81V06160 Series 8 models 3 models 10M 26M MS81V10160 Series Compact Panels/Image Processing Equipment 1 4 7 Sample Panel Sizes C 2 8 5 Set 3 6 9 0 Surveillance Cameras/Broadcast•Industrial Equipment/Commercial Printers Medical Equipment NTSC / PAL Half HD VGA / WVGA www.lapis-semi.com/en 3 models Car Navigation Frame memory Industrial Equipment MS81V26000 Series MS81V26000-25TPZP3 2 models Application Examples AV Systems / Automotive [Capacity] bit XGA 03 Full HD DRAM DRAM FP/EDO Series FP/EDO Series ×4 4Mb ×8 ×4 16Mb ×8 ×16 ×4 4Mb ×8 ×16 ×4 3.3V 1K 512 4K 2K 4K 1K 1K 4K 4K 64Mb 1K 16Mb 4Mb 3.3V 16Mb Icon Descriptions ×4 ×16 1K 512 1K ×4 1K ×16 512 ×4 2K ×16 1K DRAM type Thin Other Features Package TSOP(II)28 TSOP(II)28 MSM514265E MSM5416258B TSOP(II)44/40 TSOP(II)44/40 TSOP(II)26/24 MSM5117405F MSM5117805F TSOP(II)26/24 TSOP(II)28 TSOP(II)50/44 MSM5118165F TSOP(II)50/44 TSOP(II)26/20 TSOP(II)28 MSM54V16258B MSM54V16258BSL MSM51V4265E MSM51V16400F TSOP(II)44/40 TSOP(II)44/40 TSOP(II)44/40 TSOP(II)26/24 MSM51V16405F MSM51V17400F TSOP(II)26/24 TSOP(II)26/24 MSM51V17405F MSM51V17805F MSM51V17800F MSM51V16160F TSOP(II)26/24 TSOP(II)28 TSOP(II)50/44 MSM51V16165F MSM51V18160F TSOP(II)50/44 TSOP(II)50/44 MSM51V18165F MD51V65165E MSM514400DP/EP MSM514260EP MSM5118160FP TSOP(II)50/44 TSOP(II)50 TSOP(II)26/20 TSOP(II)44/40 TSOP(II)50/44 MSM5118165FP MSM51V4400EP TSOP(II)50/44 TSOP(II)26/20 MSM54V16258BP MSM51V4265EP MSM51V17400FP High-speed EDO access function Access Time TSOP(II)26/20 MSM5116400F MSM5117400F MSM5117800F MSM5116160F MSM5118160F MSM51V4400E MSM51V4800E Pin-Compatible with Standard Packages I/O ×4bit 4Mbit 16Mbit Capacity (H=1.2mm) Features/Part No. MSM514400E MSM514800E MSM514800ESL MSM514260E 4K Automotive 5V FP (Fast Page) DRAM and EDO (Extended Data Out) DRAM are asynchronous clock-type CMOS DRAM products. A broad lineup and stable, long-term supply eliminate customer supply concerns. 512 ×8 ×16 4Mb Extensive lineup / Stable, long-term supply Features/Part No. 2K 16Mb Video Memory Series When ordering, please include the part number along with the access time and package type. Refresh Cycle ×16 5V SDRAM for SiP Series TSOP(II)44/40 TSOP(II)44/40 TSOP(II)26/24 MSM51V18165FP Low power (Refresh Current) to ×8bit 4Mbit / 16Mbit 4Mbit TSOP(II)50/44 Access time Operating temp. Copper frame *Actual size shown ×16bit 16Mbit 64Mbit 300mill 1.27mm Pitch 300mill 1.27mm Pitch 400mill 1.27mm Pitch 400mill 0.8mm Pitch 400mill 0.8mm Pitch 400mill 0.8mm Pitch TSOP(II)26/20 TSOP(II)26/24 TSOP(II)28 TSOP(II)44/40 TSOP(II)50/44 TSOP(II)50 04 www.lapis-semi.com/en DRAM Standard Supply Memory Data Voltage Capacity Bits DRAM SDRAM Series DRAM DRAM FP/EDO Series Standard When ordering, please include the part number(s) along with the access time(s) and package(s). Note: xx in the part number are placeholders for the cycle time rank. ×8 16Mb 4K/ 64 ×16 64Mb 2.5V 256Mb ×16 8K/ 64 Automotive DRAM 16Mb 64Mb 3.3V 4K/ 64 ×16 4K/16 4K/64 128Mb 4K/16 8K/16 256Mb 8K/64 Icon Descriptions Video Memory Series SDRAM (Synchronous DRAM) is a synchronous-clock-type CMOS DRAM product. A broad lineup and stable, long-term supply eliminate customer supply concerns. Max. Frequency Supply Memory Data Refresh Cycles Voltage Capacity Bits (cycles/ms) Features/Part No. 128Mb SDRAM for SiP Series Extensive lineup / Stable, long-term supply SDRAM Series 3.3V DRAM SDRAM Series DRAM Type MSM56V16800F MSM56V16160F MSM56V16160K MSM56V16161N MD56V62160E MD56V62160M MD56V72160C MD56V82160A MD58W82160A Thin Package Other Features TSOP(II)44 TSOP(II)50 TSOP(II)50 TSOP(II)50 TSOP(II)54 TSOP(II)54 TSOP(II)54 TSOP(II)54 TSOP(II)66 MSM56V16160FP MSM56V16160KP MSM56V16161NP MD56V62160E-10TAP MD56V62160M-xxTAP MD56V62161M-xxTALQ1L MD56V72160C-xxTAP MD56V72161C-xxTALQ1L MD56V82160A-xxTALQ3L MD56V82160A-xxTAP to Max. Operating Frequency TSOP(II)50 TSOP(II)50 TSOP(II)50 TSOP(II)54 TSOP(II)54 TSOP(II)54 TSOP(II)54 TSOP(II)54 TSOP(II)54 TSOP(II)54 Cycle Time to Copper Frame Pin-Compatible with Standard Packages (JEDEC Standard) I/O ×8bit 16Mbit Capacity (H=1.2mm) Cycle Time Driveability Adjustment Halogenfree Operating Temperature *Actual size shown 16Mbit ×16bit 64Mbit /128Mbit / 256Mbit Top Top Top 400mill 0.8mm Pitch 400mill 0.8mm Pitch 400mill 0.8mm Pitch TSOP(II)50 TSOP(II)54 TSOP(II)44 *JEDEC (JEDEC Solid State Technology Association) is a trade organization for the standardization of semiconductor technologies. DRAM Stable, long-term supply / Guaranteed KGD DRAM for SiP Series DRAM for SiP (System in Package) applications that achieve greater space savings and lower costs are offered as bare dies (wafers) that provide the same level of reliability as packaged products (KGD). (Bare Chip) Standard *Part numbers of SDRAM products for SiP will become custom part numbers for each customer. Max. Frequency Supply Memory Data Refresh Cycles Voltage Capacity Bits (cycles/ms) Features/Part No. 16Mb 3.3V 64Mb 128Mb ×16 4K/ 32 MSM56V16160K MSM56V16160N MD56V62160M MD56V72160C 4K/ 32 MSM56V16160K MSM56V16160N MD56V62160M MD56V72160C Automotive 16Mb 3.3V 64Mb 128Mb Icon Descriptions ×16 DRAM Type www.lapis-semi.com/en Max. Operating Frequency to Cycle Time 05 Operating Temp. Cycle Time Guaranteed KGD Other Features DRAM 2-Port CLK 2 Port CLK 3Mb ×12 2 4Mb ×16 Port CLK 3.3V 5Mb ×10 6Mb ×16 10Mb 26Mb ×24 Automotive 4Mb ×16 3.3V 26Mb ×24 Max. Frequency Access/Cycle Times Features/Part No. 2 Port CLK Other Features MSM5412222B MS8104160A MSM54V12222B MS81V03120 MS81V04160A MS81V04166A MS81V05200 MS81V06160 MS81V10160 MS81V26000 TSOP(II)44 MS81V04160AP MS81V26000-25TPZP3 QFP100 QFP100 TSOP(II)44 TSOP(II)70 QFP100 QFP100 TSOP(II)70 TSOP(II)70 TSOP(II)70 TQFP100 TQFP100 Max. operating frequency to DRAM type Operating temperature to Copper frame Access/cycle times 2-port WCLK pin setting *Actual size shown Capacity 4Mbit Standard FIFO cascade connection function Top address designation Pin-Compatible with Standard Packages Capacity Package DRAM 3Mb ×12 4Mb ×16 Icon Descriptions LAPIS Semiconductor’s DRAM video memory series features FIFO (First In First Out) technology that enables independent serial read/write control of each dedicated clock using differing and asynchronous clock rates. In addition, a self-refresh control circuit is built in that eliminates the need for external refresh, making them ideal for processing video data. When ordering, please include the part number along with the access time and package type. Supply Memory Data Voltage Capacity Bits 5V Video Memory Series SDRAM for SiP Series Supports a variety of panels (i.e. compact, full HD) / Stable long-term supply Video Memory Series Standard DRAM SDRAM Series DRAM FP/EDO Series 14mm × 14mm 0.5mm Pitch QFP100 3Mbit / 5Mbit / 6Mbit / 10Mbit Thin 26Mbit 400mill 0.8mm Pitch 400mill 0.5mm Pitch TSOP(II)44 TSOP(II)70 (H=1.2mm Max.) 14mm × 14mm 0.5mm Pitch TQFP100 External Dimensions [Unit: mm] 0.80 0.10 0.17±0.05 25 +0.08 0.37 -0.07 0.16 0.10 SEATING PLANE 0.16 M INDEX MARK 1 MIRROR FINISH 0.71 TYP. 18.41±0.10 0.10 0.08 0.22 +-0.07 0.17±0.05 0.10 SEATING PLANE M 0.17±0.05 25 +0.08 0.37 -0.07 0.16 M 26 0.145±0.050 1 25 +0.08 -0.07 0.80 75 0.32 0.16 M SEATING PLANE 50 26 100 25 0.22±0.05 51 76 26 0.50 20.95±0.10 0.10 50 1 0.16 M SEATING PLANE ●P-QFP100-1414-0.50-K 51 0.08 M 0.08 SEATING PLANE 06 INDEX MARK MIRROR FINISH 0.88 TYP. SEATING PLANE 100 INDEX MARK MIRROR FINISH 1.00 TYP. 0.145±0.05 10.76±0.2 11.76±0.2 10.16±0.1 50 ●TQFP100-P-1414-0.50-K 75 0.17±0.05 ●TSOP II 50-P-400-0.80-1K 26 76 22 0.37 +0.08 -0.07 0.80 0.10 10.76 0.10 36 35 0.50 0.80 SEATING PLANE 11.76±0.20 10.16±0.10 0.145±0.05 INDEX MARK 1 MIRROR FINISH 0.88TYP. M ●TSOP II 70-P-400-0.50-K 70 20.95±0.1 50 1 INDEX MARK 1 MIRROR FINISH 1.0±0.2 0.17±0.05 25 0.5 0.10 0.22±0.05 1.4±0.2 0~10° 0.25 27 + 0.08 0.32 -0.07 0.80 23 11.76±0.20 10.16±0.10 0.10 26 18.41±0.1 □16.8±0.2 □14.0±0.1 INDEX MARK 1 MIRROR FINISH 0.88 TYP. 0.16 M 28 11.76±0.20 10.16±0.10 INDEX MARK MIRROR FINISH 0.71 TYP. 1 20.95±0.10 INDEX MARK MIRROR FINISH 0.81 TYP. SEATING PLANE ●TSOP II 50-P-400-0.80-K 10.76 10.76 0.17±0.05 0.08 0.37 +-0.07 ●TSOP II 54-P-400-0.80-K 22.22±0.10 SEATING PLANE 11.76±0.20 10.16±0.10 50 0.10 SEATING PLANE 54 0.20 M 22 0.145±0.050 0.32 +0.08 -0.07 0.16 M 0.80 11.76±0.2 10.16±0.1 23 22 0.80 INDEX MARK 1 MIRROR FINISH 0.81 TYP. 0.17±0.05 +0.08 0.4 -0.07 ●TSOP II 50/44-P-400-0.80-K 11.76±0.2 10.16±0.1 INDEX MARK 1 MIRROR FINISH 0.81 TYP. 14 1.27 0.10 ●TSOP II 44-P-400-0.80-K 18.41±0.1 1 44 23 1.00 TYP. INDEX MARK MIRROR FINISH 0.95 TYP. 0.10 SEATING PLANE 44 44 10.76±0.2 13 0.17±0.05 + 0.08 0.42 -0.07 0.21 M 18.41±0.10 □16.00±0.20 □14.00±0.10 1.27 ●TSOP II 44/40-P-400-0.80-K ●TSOP II 44-P-400-0.80-1K 15 11.76±0.2 10.16±0.1 INDEX MARK 1 MIRROR FINISH 0.95 TYP. 28 14 9.22±0.2 7.62±0.1 26 18.41±0.1 1.0±0.2 2.4MAX. 0.05~0.25 2.1±0.10 ●TSOP II 28-P-400-1.27-K 17.14±0.1 11.76±0.20 10.16±0.10 ●TSOP II 26/24-P300-1.27-3K 0.6TYP. 0.67±0.15 0.08 M SEATING PLANE www.lapis-semi.com/en Serial EEPROM Series Lineup [Capacity] bit 1K 2 I C BUS MicroWire BUS 4K 8K 16K 32K 64K BR24G04xxx-3 Series BR24G08xxx-3 Series BR24G16xxx-3 Series BR24G32xxx-3 Series BR24G64xxx-3 Series 128K 256K 512K 1M Consumer (fSCL=400kHz) BR24G01xxx-3 BR24G02xxx-3 Series Series Consumer (fSCL=1MHz) BR24G01xxx-3A BR24G02xxx-3A BR24G04xxx-3A BR24G08xxx-3A BR24G16xxx-3A BR24G32xxx-3A BR24G64xxx-3A BR24G128xxx-3A BR24G256xxx-3A BR24G512xxx-3A BR24G1Mxxx-3A Series Series Series Series Series Series Series Series Series Series Series Automotive-Grade BR24A01xxx-WM BR24A02xxx-WM BR24A04xxx-WM BR24A08xxx-WM BR24A16xxx-WM BR24A32xxx-WM BR24A64xxx-WM Series Series Series Series Series Series Series Consumer (Selectable bit format) BR93G46xxx-3 BR93G56xxx-3 Series Series Consumer (BR93xxRxx-W series compatibility) Consumer (Different pin layout) Automotive-Grade Consumer SPI BUS 2K Automotive-Grade BR93G66xxx-3 Series BR93G76xxx-3 Series BR24G128xxx-3 BR24G256xxx-3 Series Series BR93G86xxx-3 Series BR93G46xxx-3A BR93G56xxx-3A BR93G66xxx-3A BR93G76xxx-3A BR93G86xxx-3A Series Series Series Series Series BR93G46xxx-3B BR93G56xxx-3B BR93G66xxx-3B BR93G76xxx-3B BR93G86xxx-3B Series Series Series Series Series BR93H46Rxxx-2C BR93H56Rxxx-2C BR93H66Rxxx-2C BR93H76Rxxx-2C BR93H86Rxxx-2C Series Series Series Series Series BR25L010xxx-W BR25L020xxx-W BR25L040xxx-W BR25L080xxx-W BR25L160xxx-W BR25G320xxx-3 BR25G640xxx-3 BR25G128xxx-3 BR25G256xxx-3 BR25G512xxx-3 BR25G1Mxxx-3 Series Series Series Series Series Series Series Series Series Series Series BR25H010xxx-2C BR25H020xxx-2C BR25H040xxx-2C BR25H080xxx-2C BR25H160xxx-2C BR25H320xxx-2C BR25H640xxx-2C BR25H128xxx-2C Series Series Series Series Series Series Series Series BR25A256xxx-3M BR25A512xxx-3M BR25A1Mxxx-3M Series Series Series Application Examples TVs TV STBs STB DEGITAL CATV SLRs AV Equipment DVCs DVD/BD Players Refrigerators Washing Machines Printers MFPs 2:13 Searc Mobile Phones/Fax Machines PC Peripherals glekripip Ente forigprip opoew@ r Num vk0rg9- bd;::see pc@pv@ ber sdf:lv@ b@: ;rpogiei rwmc.a; pwvkp;@ w:q:;]]x; k0fe9g- d-fg0^ro 9-0^0^\- bh@:re co[wep[ c \fewlt:w ow0visi Mail v @eo[@ e4@ we[^gv Call 090 123 456 Pho ne Boo Music h el Yamada 2345 2ldirpv Internet 78 Canc k Hanako 0901 Alarm 678 @kfdo Phone p.ne.jp Book Mail Kyoto Nagur a kouen Call Gaming Systems Mice/Keyboards Monitors 18:30 19:15 Arrival Time × 100m G 60km/hr Menu IC ○○ 521m 000 ○○ Hot Springs 442 Car AV/Navigation 3km 1000m C EEPROM EEPROM AC Home Appliances Cancel Navigation Car AC Instrument Clusters Automotive 40 50 60 100 120 80 70 30 130 60 80 20 140 40 10 160 20 0 0 1356 C 230km H E 230km F Body/ECU Powertrain ABS LCD Panels Camera Modules Modules Wi-fi/BT Modules Power Supply Modules Memory Modules Power Meters XXX XXX XXX XXX XXXXXXXXXXXXXXXXX 111111111111111111 Industrial Equipment Security Cameras Inverters www.rohm.com 07 EEPROM I2C BUS (2-Wire) Series SPI BUS Series Ultra-Compact WL-CSP Plug & Play EEPROM Standard 2-wire serial EEPROMs I2C BUS (2-Wire) Series Standard Microwire BUS (3-Wire) Series I2C BUS simplifies wiring configuration, making it ideal for a variety of applications, from AV and industrial equipment to PCs and peripherals. ROHM’s broad lineup includes both standard 400kHz models as well as high-speed 1MHz units. −40℃ to +85℃ Operation BR24Gxxxxxx-3 Series (fSCL=400kHz) Part No. Features Functions BR24G01 BR24G02 BR24G04 BR24G08 BR24G16 BR24G32 BR24G64 BR24G128 BR24G256 Package Type and Package Code (Suffix) SOP-J8 TSSOP-B8 MSOP8 DIP-T8 SOP8 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 -3 F-3 FJ-3 FVT-3 DIP-T8 SOP8 -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A -3A F-3A FJ-3A VSON008X2030 BR24Gxxxxxx-3A Series (fSCL=1MHz) Functions BR24G01 BR24G02 BR24G04 BR24G08 BR24G16 BR24G32 BR24G64 BR24G128 BR24G256 BR24G512 BR24G1M Automotive Package Type and Package Code (Suffix) SOP-J8 TSSOP-B8 MSOP8 VSON008X2030 EEPROM Part No. Features −40°C to +105°C Operation BR24Axxxxxx-WM Series Part No. Features Functions SOP8 F-WM BR24A01A BR24A02 BR24A04 BR24A08 BR24A16 BR24A32 BR24A64 Icon Descriptions to Package Type and Package Code (Suffix) SOP-J8 F-WM F-WM F-WM F-WM F-WM F-WM Capacity (bits) 400kHz operation possible at Vcc=1.6V Double-cell construction 1MHz operation possible at Vcc=1.7V Double-reset configuration Supply voltage range Operating temp. range Write time Page Write function included ESD tolerance (HBM) *Actual size shown DIP-T8 SOP8 SOP-J8 TSSOP-B8 MSOP8 VSON008X2030 Package Lineup 08 XX www.lapis-semi.com www.rohm.com EEPROM I2C BUS (2-Wire) Series Plug & Play EEPROM Ultra-Compact WL-CSP ROHM serial EEPROMs feature Microwire BUS I/F and a wide guaranteed operating temperature range (+80C/+125C max.). Original double cell construction and double reset functionality provide superior reliability. The BR93Hxx series also delivers an electrostatic discharge resistance of 6kV, making it ideal for applications with stringent reliability requirements such as automotive systems. −40℃ to +85℃ Operation BR93Gxxxxx-3/-3A/-3B Series Features SPI BUS Series Standard 3-wire serial EEPROMs Microwire BUS (3-Wire) Series Standard Microwire BUS (3-Wire) Series Part No. Functions BR93G46 BR93G56 BR93G66 BR93G76 BR93G86 Package Type and Package Code (Suffix) SOP-J8 TSSOP-B8 DIP-T8 SOP8 MSOP8 VSON008X2030 -3/-3A/-3B F-3/-3A/-3B FJ-3/-3A/-3B FVT-3/-3A/-3B FVM-3/-3A/-3B NUX-3/-3A/-3B -3/-3A/-3B F-3/-3A/-3B FJ-3/-3A/-3B FVT-3/-3A/-3B FVM-3/-3A/-3B NUX-3/-3A/-3B -3/-3A/-3B F-3/-3A/-3B FJ-3/-3A/-3B FVT-3/-3A/-3B FVM-3/-3A/-3B NUX-3/-3A/-3B -3/-3A/-3B F-3/-3A/-3B FJ-3/-3A/-3B FVT-3/-3A/-3B FVM-3/-3A/-3B NUX-3/-3A/-3B -3/-3A/-3B F-3/-3A/-3B FJ-3/-3A/-3B FVT-3/-3A/-3B FVM-3/-3A/-3B NUX-3/-3A/-3B Pin Layout CS VCC CS VCC DU SK DU SK DU VCC NC CS GND SK DI BR93Gxx-3 DO ORG DI GND DO Selectable bit format (8bit or 16bit) Automotive BR93Gxx-3A BR93LxxRxx-W series compatible Functions EEPROM DO DI Capacity (bits) Ready/Busy status display function Double cell construction MSOP8 RF-2C RFJ-2C RFVT-2C RFVM-2C RF-2C RFJ-2C RFVT-2C RFVM-2C RF-2C RFJ-2C RFVT-2C RFVM-2C RF-2C RFJ-2C RFVT-2C RFVM-2C RF-2C RFJ-2C RFVT-2C RFVM-2C Supply voltage range Double reset configuration Noise cancellation function Package Type and Package Code (Suffix) SOP-J8 TSSOP-B8 SOP8 BR93H46 BR93H56 BR93H66 BR93H76 BR93H86 to GND −40℃ to +85℃ Operation Part No. Icon Descriptions BR93Gxx-3B Rotated pin layout BR93Hxxxxxx-2C Series Features NC Operating temp. range Write time Write All function ESD tolerance (HBM) *Actual size shown DIP-T8 SOP8 SOP-J8 TSSOP-B8 Package Lineup www.rohm.com 09 MSOP8 VSON008X2030 EEPROM I2C BUS (2-Wire) Series Plug & Play EEPROM ROHM offers EEPROMs that feature SPI BUS I/F for universal compatibility and a maximum operation frequency of 20MHz, ensuring support for applications requiring high-speed operation. In addition, original double cell construction and double reset functionality result in unmatched reliability. −40℃ to +85℃ Operation BR25L/Gxxxxxx-W/3 Series Features Ultra-Compact WL-CSP Ideal for high-speed, multi-function applications SPI BUS Series Standard SPI BUS Series Microwire BUS (3-Wire) Series Part No. Function BR25L010 BR25L020 BR25L040 BR25L080 BR25L160 BR25G320 BR25G640 BR25G128 BR25G256 BR25G512 BR25G1M Automotive Package Type and Package Code (Suffix) SOP-J8 TSSOP-B8 MSOP8 SOP8 F-W FJ-W F-W FJ-W F-W FJ-W F-W FJ-W F-W FJ-W F-3 FJ-3 F-3 FJ-3 F-3 FJ-3 F-3 FJ-3 F-3 FJ-3 F-3 FJ-3 VSON008X2030 −40°C to +105°C Operation BR25Axxxxxx-3M Series Part No. Function BR25A256 BR25A512 BR25A1M Automotive Package Type and Package Code (Suffix) SOP-J8 SOP8 F-3M FJ-3M F-3M FJ-3M F-3M FJ-3M EEPROM Features −40°C to +125°C Operation BR25Hxxxxxx-2C Series Features Part No. Function BR25H010 BR25H020 BR25H040 BR25H080 BR25H160 BR25H320 BR25H640 BR25H128 Icon Descriptions to Capacity (bits) Built-in status register Double cell structure Ready/Busy status display function Package Type and Package Code (Suffix) SOP-J8 TSSOP-B8 SOP8 FJ-2C F-2C FJ-2C F-2C FJ-2C F-2C FJ-2C F-2C FJ-2C F-2C FJ-2C F-2C FJ-2C F-2C FJ-2C Operating temp. range Supply voltage range Double reset configuration F-2C 10MHz operation possible at Vcc=4.5V Write time 20MHz operation possible at Vcc=4.5V MSOP8 Page Write function ESD tolerance (HBM) *Actual size shown SOP8 SOP-J8 TSSOP-B8 MSOP8 VSON008X2030 Package Lineup 10 www.rohm.com EEPROM I2C BUS (2-Wire) Series SPI BUS Series ROHM’s ultra-compact WL-CSP EEPROMs are designed for applications with space restrictions such as camera and communication modules. A broad lineup is offered for optimum compatibility. Size (mm) Part No. Functions SPI BUS I/F I2C BUS I/F Operating temp. range Page Write function Write time Pull-Up Resistor Resin Package Y (Typ.) Height (Max.) φ Pitch 1.27 1.50 0.55 0.25 0.5 VCSP50L1 1.95 1.06 0.55 0.25 0.5 VCSP50L1 1.60 1.00 0.55 0.25 0.5 VCSP50L1 0.94 0.94 0.33 0.20 0.4 UCSP30L1 1.30 0.77 0.35 0.20 0.4 UCSP30L1 1.10 1.15 0.55 0.25 0.4 UCSP50L1 1.30 0.77 0.40 0.20 0.4 UCSP35L1 1.45 0.77 0.33 0.20 0.4 UCSP30L1 1.50 1.00 0.35 0.20 0.4 1.50 1.00 0.30 0.20 0.4 UCSP25L1 1.50 1.00 0.36 0.20 0.4 UCSP25L1 2.44 1.99 0.55 0.25 0.5 VCSP50L2 2.09 1.85 0.55 0.25 0.5 VCSP50L2 1.74 1.65 0.55 0.25 0.5 VCSP50L1 2.00 2.63 0.40 0.25 0.5 VCSP35L2 1.60 1.00 0.55 0.25 0.5 VCSP50L1 to Microwire I/F Solder Ball (mm) X (Typ.) WP Double cell construction Capacity (bits) UCSP30L1 Double reset configuration Ready/Busy status display function Built-in status register External Dimensions [Unit: mm] www.rohm.com 3 4 0.2±0.1 S 1.27 0.42±0.1 0.1 S 1.27 0.4±0.1 0.15±0.1 0.1 1 2 3 4 (0.52) 11 0.15±0.1 S 0.1 S 0.65 +0.06 0.22 -0.04 0.08 M 0.65 9 0.3MIN 7 5.0±0.2 6.4±0.3 4.4±0.2 1 0.3MIN 7 16 6.4 ± 0.3 4.4 ± 0.2 1 8 0.15 ± 0.1 0.1 0.22 ± 0.1 1.15±0.1 0.1S 0.42±0.1 2 14 1 0.10 1.27 1 1.15 ± 0.1 S 0.545 0.10 +0.1 0.17 -0.05 0.3MIN 4 ●SSOP-B16 5.0 ± 0.2 8 7 6 5 6.4 ±0.3 4.4 ±0.2 3 8 0.1 1.15±0.1 1 14 ●SSOP-B14 3.0±0.2 (MAX 3.35 include BURR) 0.3MIN 2 6.2±0.3 4.4±0.2 0.595 ●SSOP-B8 8.7±0.2 (MAX 9.05 include BURR) 6.2±0.3 4.4±0.2 5 0.45MIN 6 6.0±0.3 3.9±0.2 7 0.3MIN 0.9±0.15 8 ●SOP14 4.9±0.2 (MAX 5.25 include BURR) 4°+6° -4° 8 7 6 5 1.5±0.1 0.11 ●SOP-J8 +6° 4°-4° 1.375±0.1 0.175 ●SOP8 5.0±0.2 (MAX 5.35 include BURR) 1.5±0.1 0.11 EEPROM BU9833GUL-W BU9847GUL-W BU9889GUL-W BRCB008GWZ-3 BRCA016GWZ-W BRCB016GWL-3 BRCD016GWZ-3 BRCB032GWZ-3 BRCB064GWZ-3 BRCE064GWZ-3 BRCG064GWZ-3 BU9897GUL-W BU9832GUL-W BU9829GUL-W BR25S128GUZ-W BU9891GUL-W Icon Descriptions Plug & Play EEPROM Ideal for compact modules Ultra-Compact WL-CSP Features Ultra-Compact WL-CSP Microwire BUS (3-Wire) Series 0.65 8 0.1 0.22±0.1 0.15±0.1 Package Image EEPROM I2C BUS (2-Wire) Series SPI BUS Series Plug & Play EEPROMs for Memory Modules Features Microwire BUS (3-Wire) Series Optimized for specialized applications These EEPROMs are specifically designed for Plug & Play memory modules. Write Protect TSSOP-B8 Write Protect function via one-time ROM FVT-W Set/cancel-enabled Write Protect, Write Protect via one-time ROM FVT-3 Functions Part No. BR34L02 BR34E02 Icon Descriptions Double cell construction Capacity (bits) I2C BUS I/F Plug & Play EEPROM Ultra-Compact WL-CSP VSON008X2030 Supports Serial Presence Detect Double reset configuration For DDR1/2/3 *Actual size shown TSSOP-B8 VSON008X2030 Package Lineup EEPROM Plug & Play EEPROMs for Displays These EEPROMs are designed for Plug & Play display applications. BR24C21 BU9882 BU9883 BU99022 DDC1TM/DDC2TM compatible EEPROM for displays SOP8 SOP-J8 SSOP-B8 F FJ FV DDC2TM compatible dual-port EEPROM for displays SOP14 SSOP-B14 F-W FV-W 2Kbit x 3ch EEPROM for HDMI ports NUX-3 DDC1/2B compatibility Double reset configuration Double cell construction SSOP-B16 VSON008X2030 Package FV-W 2Kbit x 2ch EEPROM Bit structure and no. of ch. Icon Descriptions Package Type and Package Code (Suffix) Feature Descriptions Functions Part No. HDMI support *Actual size shown SOP8 SOP-J8 SSOP-B8 SOP14 SSOP-B14 SSOP-B16 Package Lineup S 0.08 S +0.05 0.65 0.245 -0.04 0.08 M 0.65 1PIN MARK S +0.05 0.22 -0.04 0.08 S +0.05 0.145 -0.03 0.08 S 1.5±0.1 C0.25 0.5 1 8 0.25 4 5 +0.05 0.25 -0.04 8 5 1 4 S 12 6.5±0.3 1PIN MARK 3.4±0.3 0.51MIN 2 3 4 3.0±0.1 0.29±0.15 0.6±0.2 4.0±0.2 2.8±0.1 1 9.3±0.3 3.2±0.2 1.2MAX 1.0±0.05 0.1±0.05 +0.05 0.145 -0.03 0.475 ●DIP-T8 2.0±0.1 +0.03 0.02 -0.02 (0.12) 1 2 34 0.525 1PIN MARK 8 7 6 5 0.9MAX 0.75±0.05 0.08±0.05 6.4±0.2 4.4±0.1 0.5±0.15 1.0±0.2 8765 4±4 ●VSON008X2030 +6° 4° -4° 1.4±0.1 2.9±0.1 (MAX 3.25 include BURR) 0.6MAX ●MSOP8 3.0±0.1 (MAX 3.35 include BURR) 0.3±0.1 ●TSSOP-B8 VSON008X2030 7.62 0.3±0.1 2.54 0°-15° 0.5±0.1 www.rohm.com EEPROM Features Optimized for specialized applications FeRAM Series Lineup Optimized for continuous data logging and emergency backup applications [Capacity] bit 32K 256K MR44V064A I 2C SPI 64K 1M 2M MR44V100A MR44V064B MR45V032A MR45V064B MR45V256A Parallel MR45V100A MR45V200A MR48V256C Car Navigation Automotive AAAAAA BBBbbbbb CCCCCcccccc DDD E_EEE MUSIC Car Audio Body Electrical Systems (i.e. power windows, seats) PLCs (Programmable Controllers) Industrial Equipment Copiers and MFPs Smart Meters (Electricity/Gas/Water) Surveillance Cameras Gaming Systems FeRAM Gaming/Entertainment www.lapis-semi.com/en 13 XXX XXX XXX XXX XXXXXXXXXXXXXXXXX 111111111111111111 FeRAM FeRAM Series High endurance (>1 trillion times) / 150ns Write speed non-volatile memory FeRAM Series Compared to conventional flash memory, ROHM’s non-volatile FeRAM provides 100,000 times faster rewrite speed and 1,000,000 times the endurance, making it ideal for data backup during power outages and frequent data logging. Parallel Bus FeRAM MR48Vxxxx Series Supply Voltage Memory Capacity 2.7V to 3.6V Data Bits Functions ×8 256Kb Max. Operating Frequency Part No. No. of Read/ Write Cycles Data Retention Period Other Features MR48V256C Package TSOP(I)28 I2C Bus FeRAM MR44Vxxxx Series 2.5V to 3.6V 2.0V to 3.6V 2.0V to 3.6V 64Kb MR44V064A MR44V064B MR44V100A ×8 1Mb SOP8 SOP8 SOP8 SPI Bus FeRAM MR45Vxxxx Series 2.7V to 3.6V 2.0V to 3.6V 3.0V to 3.6V 2.0V to 3.6V 2.7V to 3.6V 32Kb MR45V032A MR45V064B MR45V256A MR45V100A MR45V200A 64Kb 256Kb ×8 1Mb 2Mb Icon Descriptions I2C BUS I/F Parallel I/F SOP8 SOP8 SOP8 SOP8 / DIP8 DIP8 Max. operating frequency SPI BUS I/F Endurance (no. of cycles) Data retention Operating temp. range *Actual size shown SOP8 TSOP(I)28 Package Lineup 6mm × 4.9mm 1.27 pitch 6.5mm × 9.2mm 2.54 pitch FeRAM 8mm × 13.4mm 0.55 pitch DIP8 1.27 0.10 0.42±0.10 0.42MIN SEATING PLANE 15 0.80±0.20 0~8 0.50 TYP. 0.60±0.15 6.5±0.2 INDEX MARK 8 1 5 4 2.7±0.2 14 0.17±0.05 9.2±0.2 0.10 8±0.10 0~10 0.20+0.05/-0.01 INDEX MARK MIRROR FINISH 28 5.29 4 11.8±0.10 1 ●DIP8 2.55 TYP. 1 1.375±0.10 5 0.175 6.00±0.30 3.90±0.20 INDEX MARK 0.545 8 13.4±0.20 0.55 0.425 TYP. +0.08 0.22 -0.07 0.10 M ●TSOP(I)28 4.90±0.20 5.25MAX(include BURR) 1.20 MAX. 1.00±0.05 0.05~0.15 0.25 ●SOP8 SEATING PLANE External Dimensions [Unit: mm] 1.5±0.1 7.6 0.5 TYP. 2.54 8.8 14 +0.11 0.25 -0.05 XX www.lapis-semi.com/en NOR Flash Series Lineup [Capacity] bit Memory Capacity 64M 128M 256M 512M Application Examples Store programs, bitmaps, and font data T Vs Store sound data Electronic Musical Instruments AV Equipment STBs DEGITAL CATV Store programs DVD Players/DVCs Store programs Store programs, fonts, and user manuals Printers PC Peripherals l Electronic Dictionaries and Translators Save contents and gaming data Electrica Book Store programs and translations Gaming Systems Store program, voice, and video data Electronic Toys Educational Toys Store programs and contents Entertainment (Control Programs) Entertainment Entertainment (Audio Data) Store program, audio, and video data Entertainment (Image Data) Car Navigation Automotive Car Audio AAAAAA MUSIC BBBbbbbb CCCCCcccccc DDD E_EEE Power Windows Usage Examples Control Program Storage Font/Bitmap Data Storage Content Storage NOR Flash 2G MR29VXXX12B Series MR29VXXX52B Series NOR Flash Gaming Systems and Toys 1G Manual/Advertising Storage Configuration Storage www.lapis-semi.com/en 15 NOR Flash NOR Flash Series NOR Flash Series NOR Flash memory provides worry-free data retention characteristics ROHM’s NOR Flash memory utilizes a floating gate structure for superior data retention characteristics and integrates an ECC circuit that further improves quality and reliability for automotive applications. Standard Parallel Bus NOR Flash Data Bits Supply Memory Voltage Capacity 1Gb Planned 512Mb Planned Planned Page Size (Word x bit) 2.7V to 3.6V 128Mb MR39V01G12B MR39V51212B MR39V25612B MR29V12812B MR29V06412B 8×16 64Mb Planned Cell Type Part No. 16×16 ×8×16 256Mb Functions Data Bits 1Gb Planned 512Mb Planned Planned Page Size (Word x bit) 2.7V to 3.6V 256Mb ×8×16 64Mb Icon Descriptions Flash function type TSOP(I)56 TSOP(I)48 Cell Type Address Access Time Page Access Time Other Features Package TSOP(I)56 TSOP(I)56 TSOP(I)56 TSOP(I)56 TSOP(I)48 Access time Memory cell type Package TSOP(I)56 MR39V01G52B MR39V51252B MR39V25652B MR29V12852B MR29V06452B 8×16 Other Features TSOP(I)56 Part No. 16×16 128Mb Planned Functions Page Access Time TSOP(I)56 Parallel Bus NOR Flash with ECC Supply Memory Voltage Capacity Address Access Time Page access time Error correction function Operating temp. range *Actual size shown TSOP48(I) 14mm×20mm 0.5mm Pitch 12mm×20mm 0.5mm Pitch NOR Flash Package Lineup TSOP56(I) 29 SEATING PLANE 0.10 0.50 28 +0.06 0.15 -0.05 56 1.20MAX. 1.00±0.05 0.05~0.15 0.25 0.80±0.20 0~5 0.50TYP. 0.60±0.15 20.00±0.20 18.40±0.10 0.25TYP. 0.22±0.05 0.10 M 25 INDEX MARK MIRROR FINISH 1 14.00±0.10 24 +0.06 0.15 -0.05 48 ●TSOP56(I) SEATING PLANE 0.10 1 0.25 12.00±0.10 INDEX MARK MIRROR FINISH 20.00±0.20 18.40±0.10 1.20MAX. 1.00±0.05 0.05~0.15 ●TSOP48(I) 0.50 0.25TYP. +0.08 0.22 -0.07 0.10 M External Dimensions [Unit: mm] 0.80±0.20 0~5 0.50TYP. 0.60±0.15 16 XX www.lapis-semi.com/en Non-Volatile Memory P2ROMTM (Production Programmed ROM) Lineup [Capacity] bit Memory Capacity Standard Parallel BUS P2ROMTM 8M 16M 32M 64M 128M 256M 512M 1G 2G MR26T51203L MR27T802F MR27V802F MR27T25603L MR27T12800L MR27Txxx02L Series MR26V6455J Parallel BUS Page Mode P2ROMTM MR27V12850L MR36V01G52B MR37Vxxx52x Series MR26V51252R MR27Vxxx52x Series MR37V12841A SPI BUS P2ROMTM MR27Vxxx41L Series Application Examples Store program, bitmap, and font data TVs Store sound data Electronic Musical Instruments AV Equipment STBs DIGITAL CATV Store programs DVD Players/DVCs Store programs Store programs, fonts and user manuals Printers PC Peripherals Electronic Dictionaries/Interpreters Store content data l Electrica Book Gaming Systems Store program, audio, and video data Electronic Toys Gaming Systems and Toys Store program and content data Educational Toys Store program and content data Entertainment (Control Programs) Entertainment Entertainment (Audio Data) Store program, audio, and video data Usage Examples Entertainment (Video Data) Control Program Storage Font/Bitmap Data Storage P2ROMTM Content Storage Manual/Advertising Storage Configuration Data Storage www.lapis-semi.com/en 17 P2ROM Standard Parallel BUS P2ROMTM Series TM Standard Parallel BUS P2ROMTM Series 2.7V to 3.6V 512Mb 256Mb Data Bits ×8 ×16 Functions SPI BUS P2ROMTM Series Ideal for NOR Flash and Mask ROM applications that do not require rewriting Users seeking basic performance can select from a range of capacities (8Mbit to 512Mbit) to suit set requirements. In addition to memory featuring an original pin layout and Mask ROM compatible products, LAPIS Semiconductor has been focused on supplying memory capable of x8bit/x16bit BUS switching that are pin-compatible with NOR Flash. Plus, superior data reliability eliminates the need for ECC required with NAND Flash. Original Pin Layout Supply Memory Voltage Capacity Parallel BUS Page Mode P2ROMTM Series 3.0V Access Time Part No. 2.7V Access Time Other Features Package MR26T51203L MR27T25603L TSOP(II)50 TSOP(II)50 Mask ROM Compatible Pin Layout 2.7V to 3.6V 128Mb ×8 ×16 MR27T12800L TSOP(I)48 NOR Flash Compatible Pin Layout 128Mb 64Mb 2.7V to 3.6V 3.0V to 3.6V 32Mb 16Mb ×8 ×16 8Mb MR27T12802L MR27T6402L MR27T3202L MR27T1602L MR27T802F MR27V802F Bare Chip 64Mb 32Mb 16Mb Thin SOP44 / TSOP(I)48 / TFBGA48 SOP44 / TSOP(I)48 SOP44 / TSOP(I)48 ×8 ×16 P2ROMTM type MR27V12800L-xxxWE MR27V6402L-xxxWE MR27V3202L-xxxWE MR27V1602L-xxxWE MR27V802F-xxxWA to Access time Pin-Compatible with Standard Packages Capacity SOP44 / TSOP(I)48 / TFBGA48 Pad Size 8Mb Icon Description SOP44 / TSOP(I)48 / TFBGA48 xxx in the part numbers are placeholders for the ROM code 128Mb 3.0V to 3.6V TSOP(I)56 Chip Chip Chip Chip Operating temperature Pad size *Actual size shown 8Mbit / 16Mbit / 32Mbit / 64Mbit / 128Mbit 128Mbit / 256Mbit 256Mbit / 512Mbit Top Top Top 12mm×20mm 0.5mm Pitch 14mm×20mm 0.5mm Pitch 400mill 0.8mm Pitch TSOP(I)56 TSOP(II)50 TSOP(I)48 Capacity Chip 5 8Mbit / 16Mbit / 32Mbit / 64Mbit 16Mbit / 32Mbit Capacity 64Mbit Top Top Bottom Top Bottom 6.4mm × 10mm 0.8mm Pitch 6.0mm × 8.0mm 0.8mm Pitch Compact TFBGA48 TFBGA48 SOP44 P2ROMTM Standard 600mill 1.27mm Pitch 18 www.lapis-semi.com/en P2ROM Standard Parallel BUS P2ROMTM Series TM Parallel BUS Page Mode P2ROMTM Series Parallel BUS Page Mode P2ROMTM Series SPI BUS P2ROMTM Series Ideal replacements for NOR Flash and Mask ROM In addition to x8/x16bit BUS switchable parallel interface page mode memory widely used in NOR Flash and Mask ROM Flash applications, ROHM offers high-speed, large capacity products that feature expanded BUS width memory ideal for storing audio and video data. Original Pin Layout Supply Voltage Memory Capacity Data Bits Page Size (Word x bit) 3.0V to 3.6V 64Mb ×16 ×32 8×32 Functions 3.0V Access Time Part No. Page Access Time Other Features Package MR26V6455J SSOP70 MR27V12850L TSOP(I)48 Mask ROM Compatible Pin Layout 3.0V to 3.6V 128Mb ×8 ×16 8×16 NOR Flash Compatible Pin Layout MR36V01G52B MR26V51252R MR37V25652T MR27V12852L MR37V12852B MR37V6452B MR27V6452L MR27V3252J MR27V1652L 1Gb 512Mb 256Mb 3.0V to 3.6V 128Mb ×8 ×16 8×16 64Mb 32Mb 16Mb Bare Chips TSOP(I)56 TSOP(I)56 TSOP(I)56 TSOP(I)56 TSOP(I)56 TSOP(I)48 SOP44/TSOP(I)48 / TSOP(I)56 SOP44 / TSOP(I)48 SOP44 / TSOP(I)48 xxx in the part numbers below are placeholders for the ROM code Pad Size 256Mb 3.0V to 3.6V 128Mb 64Mb ×8 ×16 MR27V25653L-xxxWA MR27V12850L-xxxWE MR27V6452L-xxxWE MR27V1652L-xxxWA 8×16 16Mb Icon Descriptions P2ROMTM Type Access time to 16Mbit / 32Mbit / 64Mbit / 256Mbit / 512Mbit / 1Gbit / 2Gbit / 4Gbit / 8Gbit I/O Capacity to Pin-compatible with standard packages ×8bit / ×16bit / ×32bit I/O Capacity Top 500mill 0.8mm Pitch 600mill 1.27mm Pitch SSOP70 SOP44 www.lapis-semi.com www.lapis-semi.com/en Chip Chip Chip Operating temperature *Packages shown are 40% of actual size Thin ×8bit / ×16bit 16Mbit / 32Mbit / 64Mbit / 128Mbit / 256Mbit / 512Mbit / 1Gbit Top Top 12mm × 20mm 0.5mm Pitch 14mm × 20mm 0.5mm Pitch TSOP(I)48 TSOP(I)56 P2ROMTM Standard Top Page access time Chip 19 Pad size P2ROM Standard Parallel BUS P2ROMTM Series TM Supply Memory Voltage Capacity Data Bits 128Mb 3.0V to 3.6V 64Mb 32Mb ×1 16Mb SPI BUS P2ROMTM Series Contributes to greater space savings, reduced noise, and lower material costs SPI BUS P2ROMTM Series SPI Bus Parallel BUS Page Mode P2ROMTM Series These P2ROMTM series utilize SPI (Serial Peripheral Interface) for broad compatibility. A wide range of memory capacities (16Mbit to 128Mbit) is available in a single package type, making it easy to change memory size without board requiring board modifications. Functions Fast Read Part No. MR37V12841A MR27V6441L MR27V3241L MR27V1641L Bare Chips Read Other Features Package SOP16 SOP16 SOP16 SOP16 xxx in the part numbers below are placeholders for the ROM code Pad Size 3.0V to 3.6V 64Mb 32Mb ×1 16Mb Icon Descriptions MR27V6441L-xxxWA MR27V3241L-xxxWE MR27V1641L-xxxWA Operating frequency P2ROMTM Type Chip Chip Chip Operating temperature Pad size Pin-compatible with standard packages *Actual size shown ×1bit ×2bit ×4bit I/O 16Mbit / 32Mbit / 64Mbit / 128Mbit Capacity Top 375mill 1.27mm Pitch Standard P2ROMTM SOP16 XX 20 www.lapis-semi.com/en www.lapis-semi.com P2ROM Standard Parallel BUS P2ROMTM Series TM Parallel BUS Page Mode P2ROMTM Series SPI BUS P2ROMTM Series External Dimensions [Unit: mm] 0.15 S B 6.4 0.8 1.2 SEATING PLANE 0.10 1 0.80 +0.05 0.16 -0.04 22 +0.08 0.37 -0.07 0.16 M 48 1 24 25 +0.06 0.15 -0.05 0.10 SEATING PLANE 0.10 S 20.95±0.10 0.10 SEATING PLANE SEATING PLANE ●SOP44-P-600-1.27-K 14.00±0.10 0.50 0.17±0.05 25 +0.08 0.37 -0.07 0.16 M 0.80±0.20 0~8 +0.06 0.15 -0.05 70 P2ROMTM +0.08 0.32 -0.07 0.16 SEATING PLANE 0.86TYP. 0.10 28.60±0.15 36 15.90±0.20 12.70±0.10 70 0.80 0.17±0.05 35 +0.08 0.32-0.07 0.16 M 3.05 MAX. 2.70±0.20 1 INDEX MARK MIRROR FINISH 1.60±0.20 SEATING PLANE 21 0.05~0.25 0.25 0~8 0.10 0.80 0.90±0.10 M 1.60±0.20 0~8 0.25 0.80±0.20 0.70TYP. 0.17±0.05 35 0.80 0.70TYP. 0~10 ●SSOP70-P-500-0.80-K www.lapis-semi.com/en 1 0.05~0.25 2.70±0.20 SEATING PLANE 0.20 M INDEX MARK MIRROR FINISH 1.50±0.20 0.25 0.10 +0.08 0.42 -0.07 3.10MAX. 1.27 0.74TYP. 0.17±0.05 0.05~0.25 2.65±0.20 22 36 12.70±0.10 15.90±0.20 15.24 13.00±0.20 23 1 0~5 0.50TYP. 0.60±0.15 0.85TYP. 28.60±0.15 28.15±0.20 16.00±0.30 29 28 0.50±0.10 0.60 ●P-SSOP70-500-0.80-EK-MC 44 INDEX MARK MIRROR FINISH 56 1.20MAX. 1.00±0.05 0.05~0.15 0.16 M 0.80 0.95±0.05 1 INDEX MARK MIRROR FINISH 0.88TYP. 0.17±0.05 1 3.05MAX. 0.10 +0.08 0.37-0.07 0.25 25 0.80 0.05~0.25 1 20.00±0.20 18.40±0.10 INDEX MARK MIRROR FINISH 10.76 11.76±0.20 10.16±0.10 10.76 11.76±0.2 10.16±0.1 INDEX MARK MIRROR FINISH 0.88TYP. 26 0.22±0.05 50 26 1.20MAX. 20.95±0.1 50 0.85TYP. ●P-TSOP I 56-1420-0.50-K-MC 0.25TYP. ●P-TSOP II 50-400-0.80-K-MC 0.10 M ●TSOP II 50-P-400-0.80-K SEATING PLANE 20.00±0.20 18.40±0.10 INDEX MARK MIRROR FINISH 23 0.10 0.10 S 0.25 INDEX MARK MIRROR FINISH 0.81TYP. f0.08 M S AB 0.10 f0.08 M S AB INDEX MARK f0.51±0.05 0.50 0.25TYP. +0.08 0.22-0.07 0.10 M f0.51±0.05 HGFEDCBA 1.20MAX. 1.00±0.05 0.05~0.15 (1.0) HGFEDCB A 6 5 4 3 2 1 SEATING PLANE 0.20 S 0.50TYP. 0.60±0.15 12.00±0.10 6 5 4 3 2 1 0.20 S S A ●TSOP I 48-P-1220-0.50-1K 18.41±0.1 44 A B 0.35±0.05 1.2MAX. S x4 0.15 0~5 10.76 6.0 INDEX MARK 0.80 (1.2) 0.15 S A 0.80±0.20 ●TSOP II 44-P-400-0.80-K 11.76±0.2 10.16±0.1 8.0 0.80 0.15 S B ●P-TFBGA48-6.0X8.0-0.80 ×4 0.15 0.8 B 0.25 +0.06 0.15 -0.05 0.15 S A 2.2 0.35±0.05 1.1±0.1 28 SEATING PLANE 0.10 0.10 M 29 10.0 INDEX MARK MIRROR FINISH 0.25 0.80TYP. 0.88±0.15 56 1.20MAX. 1.00±0.05 0.05~0.15 M 1 0.22±0.05 1.27 20.00±0.20 18.40±0.10 0.50 0.42+0.08/-0.07 0.12 0.705 TYP. INDEX MARK MIRROR FINISH 14.00±0.10 8 INDEX MARK MIRROR FINISH 1.41±0.20 0.17±0.05 1 8.53 TYP. 10.32±0.20 7.50±0.10 9 0.15±0.10 4 ±4 0.25 10.30±0.20 16 ●P-TFBGA48-6.4X10.0-0.80 0.25TYP. ●P-TSOP I 56-1420-0.50-K 2.50±0.15 2.35±0.20 ●P-SOP16-375-1.27-K 0.80 0.90±0.10 0~5 0.50TYP. 0.60±0.15 Major ROHM Group Offices/Centers (Japan) Sales Offices R&D Centers Kyoto Nagoya Tokyo Fukuoka Yokohama Matsumoto Mito Nishi-Tokyo Kyoto Technology Center (Head Office) Kyoto Technology Center (Kyoto Ekimae) Yokohama Tecnology Center LAPIS Semiconductor (Shin-Yokohama) LAPIS Semiconductor Miyazaki Design Center Sendai Takasaki Utsunomiya Production Facilities ROHM Hamamatsu Co., Ltd. LAPIS Semiconductor Miyagi Co., Ltd. LAPIS Semiconductor Miyazaki Co., Ltd. ROHM Wako Co., Ltd. ROHM Apollo Co., Ltd. AGLED Co., Ltd. ROHM Mechateck Co., Ltd. QA Centers Kyoto QA Center Yokohama QA Center ROHM Mechatech LAPIS Semiconductor Miyagi Kyoto (HQ) Takasaki Sendai ROHM Wako Matsumoto Utsunomiya Fukuoka ROHM Apollo AGLED Nagoya ROHM Hamamatsu LAPIS Semiconductor Miyazaki Design Center LAPIS Semiconductor Miyazaki Sales Offices Mito NishiTokyo Production Facilities Tokyo Yokohama/ LAPIS Semiconductor (HQ) R&D Centers QA Centers Trade Name / LAPIS Semiconductor Co., Ltd. Address / 2-4-8 Shinyokohama,Kouhoku-ku, Yokohama 222-8575, Japan TEL+81-45-476-9212 Date of Establishment / October 1, 2008 President: Noriaki Okada Major ROHM Group Offices/Centers (Global) Production Facilities Sales Offices ASIA ROHM Semiconductor Korea Corporation ROHM Semiconductor Trading (Dalian) Co., Ltd. ROHM Semiconductor (Shanghai) Co., Ltd. ROHM Semiconductor (Shenzhen) Co., Ltd. ROHM Semiconductor Hong Kong Co., Ltd. ROHM Semiconductor Taiwan Co., Ltd. ROHM Semiconductor Singapore Pte. Ltd. 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R&D Centers QA Centers Korea Design Center Shanghai Design Center Shenzhen Design Center Taiwan Design Center India Design Center AMERICA America Design Center (Santa Clara) America Design Center (San Diego) EUROPE Europe Design Center ASIA Korea QA Center Shanghai QA Center Shenzhen QA Center Taiwan QA Center Singapore QA Center Thailand QA Center AMERICA USA QA Center EUROPE Europe QA Center ASIA ROHM Semiconductor(China) ROHM Mechatech (Tianjin) GmbH ROHM Integrated Systems(Thailand) ROHM Mechatech (Thailand) SiCrystal Dalian ROHM Electronics Dalian Hong Kong Thailand Korea ROHM Korea Shanghai Taiwan Shenzhen India U.S.A. Santa Clara Detroit Kionix San Diego Philippines ROHM-Wako Electronics (Malaysia) Malaysia Singapore ROHM Electronics Philippines ROHM Mechatech Philippines 22 Brazil www.rohm.com • All DRAM, FeRAM, NOR Flash, and P2ROMTM products that appear in this catalog have been developed and manufactured by LAPIS Semiconductor • P2ROMTM is a trademark of LAPIS Semiconductor • All products mentioned in this catalog (including LAPIS Semiconductor products) are sold by ROHM Co., Ltd. • P2ROMTM is a trademark of LAPIS Semiconductor PDF