DATASHEET

DG411, DG412, DG413
®
Data Sheet
June 20, 2007
Monolithic Quad SPST, CMOS Analog
Switches
Features
• ON-Resistance (Max). . . . . . . . . . . . . . . . . . . . . . . . . 35Ω
The DG411 series monolithic CMOS analog switches are
drop-in replacements for the popular DG211 and DG212
series devices. They include four independent single pole
throw (SPST) analog switches, and TTL and CMOS
compatible digital inputs.
• Low Power Consumption (PD) . . . . . . . . . . . . . . . . . . <35µW
• Fast Switching Action
- tON (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175ns
- tOFF (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145ns
These switches feature lower analog ON-resistance (<35Ω)
and faster switch time (tON<175ns) compared to the DG211
or DG212. Charge injection has been reduced, simplifying
sample and hold applications.
• Low Charge Injection
The improvements in the DG411 series are made possible
by using a high voltage silicon-gate process. An epitaxial
layer prevents the latch-up associated with older CMOS
technologies. The 44V maximum voltage range permits
controlling 40VP-P signals. Power supplies may be
single-ended from +5V to 44V, or split from ±5V to ±20V.
• Single or Split Supply Operation
The four switches are bilateral, equally matched for AC or
bidirectional signals. The ON-resistance variation with analog
signals is quite low over a ±15V analog input range. The
switches in the DG411 and DG412 are identical, differing only
in the polarity of the selection logic. Two of the switches in the
DG413 (#2 and #3) use the logic of the DG211 and DG411
(i.e., a logic “0” turns the switch ON) and the other two
switches use DG212 and DG412 positive logic. This permits
independent control of turn-on and turn-off times for SPDT
configurations, permitting “break-before-make” or “makebefore-break” operation with a minimum of external logic.
1
FN3282.13
• Upgrade from DG211, DG212
• TTL, CMOS Compatible
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Audio Switching
• Battery Operated Systems
• Data Acquisition
• Hi-Rel Systems
• Sample and Hold Circuits
• Communication Systems
• Automatic Test Equipment
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 1993, 1994, 1997, 1999, 2002, 2004-2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
DG411, DG412, DG413
Ordering Information
PART NUMBER
PART MARKING
TEMP. RANGE (°C)
PACKAGE
PKG. DWG. #
DG411DJ
DG411DJ
-40 to +85
16 Ld PDIP
E16.3
DG411DJZ (Note)
DG411DJZ
-40 to +85
16 Ld PDIP** (Pb-free)
E16.3
DG411DY*
DG411DY
-40 to +85
16 Ld SOIC (150 mil)
M16.15
DG411DYZ* (Note)
DG411DYZ
-40 to +85
16 Ld SOIC (150 mil) (Pb-free)
M16.15
DG411DVZ* (Note)
DG411 DVZ
-40 to +85
16 Ld TSSOP (4.4mm) (Pb-free) M16.173
DG412DJ
DG412DJ
-40 to +85
16 Ld PDIP
E16.3
DG412DJZ (Note)
DG412DJZ
-40 to +85
16 Ld PDIP** (Pb-free)
E16.3
DG412DY*
DG412DY
-40 to +85
16 Ld SOIC (150 mil)
M16.15
DG412DYZ* (Note)
DG412DYZ
-40 to +85
16 Ld SOIC (150 mil) (Pb-free)
M16.15
DG412DVZ* (Note)
DG412 DVZ
-40 to +85
16 Ld TSSOP (4.4mm) (Pb-free) M16.173
DG413DJ
DG413DJ
-40 to +85
16 Ld PDIP
E16.3
DG413DJZ (Note)
DG413DJZ
-40 to +85
16 Ld PDIP** (Pb-free)
E16.3
DG413DY*
DG413DY
-40 to +85
16 Ld SOIC (150 mil)
M16.15
DG413DYZ* (Note)
DG413DYZ
-40 to +85
16 Ld SOIC (150 mil) (Pb-free)
M16.15
DG413DVZ* (Note)
DG413 DVZ
-40 to +85
16 Ld TSSOP (4.4mm) (Pb-free) M16.173
*Add “-T” suffix for tape and reel.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing
applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pin Descriptions
TRUTH TABLE
DG411
LOGIC
DG412
DG413
SWITCH SWITCH
PIN
SYMBOL
1
IN1
Logic Control for Switch 1.
Drain (Output) Terminal for Switch 1.
SWITCH
1, 4
SWITCH
2, 3
2
D1
DESCRIPTION
3
S1
Source (Input) Terminal for Switch 1.
0
On
Off
Off
On
4
V-
Negative Power Supply Terminal.
1
Off
On
On
Off
5
GND
6
S4
Source (Input) Terminal for Switch 4.
7
D4
Drain (Output) Terminal for Switch 4.
8
IN4
Logic Control for Switch 4.
9
IN3
Logic Control for Switch 3.
10
D3
Drain (Output) Terminal for Switch 3.
11
S3
Source (Input) Terminal for Switch 3.
12
VL
Logic Reference Voltage.
NOTE: Logic “0” ≤0.8V. Logic “1” ≥2.4V.
Pinout
DG411, DG412, DG413
(16 LD PDIP, SOIC, TSSOP)
TOP VIEW
Ground Terminal (Logic Common).
IN1 1
16 IN2
13
V+
Positive Power Supply Terminal (Substrate).
D1 2
15 D2
14
S2
Source (Input) Terminal for Switch 2.
S1 3
14 S2
15
D2
Drain (Output) Terminal for Switch 2.
V- 4
13 V+
16
IN2
Logic Control for Switch 2.
GND 5
12 VL
S4 6
11 S3
D4 7
10 D3
IN4 8
9 IN3
2
FN3282.13
June 20, 2007
DG411, DG412, DG413
Functional Diagrams
Four SPST Switches per Package Switches Shown for Logic “1” Input
DG411
DG412
S1
IN1
IN1
D1
S2
IN2
IN1
D2
S3
D3
S4
D3
S4
IN4
IN4
D4
D2
S3
IN3
IN3
D3
S4
IN4
D1
S2
IN2
IN2
IN3
S1
D1
S2
D2
S3
Schematic Diagram
DG413
S1
D4
D4
(1 Channel)
V+
S
VVL
V+
INX
D
GND
V-
3
FN3282.13
June 20, 2007
DG411, DG412, DG413
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44V
GND to V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V
VL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) to (V+) +0.3V
Digital Inputs, VS , VD (Note 1). . . . . (V-) -2V to (V+) + 2V or 30mA,
Whichever Occurs First
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . 100mA
Thermal Resistance (Typical, Note 2)
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20V (Max)
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V (Min)
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20ns
θJA (°C/W)
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
110
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
150
Maximum Junction Temperature (Plastic Packages). . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
(SOIC and TSSOP - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. Signals on SX , DX , or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
2. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: V+ = +15V, V- = -15V, VL = 5V, VIN = 2.4V, 0.8V (Note 3),
Unless Otherwise Specified.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 4)
TYP
(Note 5)
MAX
(Note 4)
UNITS
25
-
110
175
ns
85
-
-
220
ns
25
-
100
145
ns
85
-
-
160
ns
DYNAMIC CHARACTERISTICS
RL = 300Ω, CL = 35pF, VS = ±10V (Figure 1)
Turn-ON Time, tON
Turn-OFF Time, tOFF
Break-Before-Make Time Delay
DG413 Only, RL = 300Ω, CL = 35pF (Figure 2)
25
-
25
-
ns
Charge Injection, Q (Figure 3)
CL = 10nF, VG = 0V, RG = 0Ω
25
-
5
-
pC
OFF Isolation (Figure 5)
RL = 50Ω, CL = 5pF, f = 1MHz
25
-
68
-
dB
25
-
-85
-
dB
25
-
9
-
pF
Drain OFF Capacitance, CD(OFF)
25
-
9
-
pF
Channel ON Capacitance,
CD(ON) + CS(ON)
25
-
35
-
pF
Crosstalk (Channel-to-Channel),
(Figure 4)
Source OFF Capacitance, CS(OFF)
f = 1MHz (Figure 6)
DIGITAL INPUT CHARACTERISTICS
Input Current VIN Low, IIL
VIN Under Test = 0.8V, All Others = 2.4V
Full
-0.5
0.005
0.5
μA
Input Current VIN High, IIH
VIN Under Test = 2.4V, All Others = 0.8V
Full
-0.5
0.005
0.5
μA
±
10mA
Full
-15
-
15
V
±
10mA, VD = ±8.5V, V+ = 13.5V, V- = -13.5V
25
-
25
35
Ω
Full
-
-
45
Ω
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
IS =
Drain-Source ON Resistance,
rDS(ON)
IS =
4
FN3282.13
June 20, 2007
DG411, DG412, DG413
Electrical Specifications
Test Conditions: V+ = +15V, V- = -15V, VL = 5V, VIN = 2.4V, 0.8V (Note 3),
Unless Otherwise Specified. (Continued)
TEST CONDITIONS
V+ = 16.5V, V- = -16.5V, VD = ±15.5V, VS =
Source OFF Leakage Current,
IS(OFF)
±
PARAMETER
15.5V
Drain OFF Leakage Current,
ID(OFF)
V+ = 16.5V, V- = -16.5V, VS = VD = ±15.5V
Channel ON Leakage Current,
ID(ON) + IS(ON)
TEMP
(°C)
MIN
(Note 4)
TYP
(Note 5)
MAX
(Note 4)
UNITS
25
-0.25
±0.1
0.25
nA
Full
-5
-
+5
nA
25
-0.25
±0.1
0.25
nA
Full
-5
-
+5
nA
25
-0.4
±0.1
0.4
nA
Full
-10
-
+10
nA
25
-
0.0001
1
μA
85
-
-
5
μA
25
-1
-0.0001
-
μA
85
-5
-
-
μA
25
-
0.0001
1
μA
85
-
-
5
μA
25
-1
-0.0001
-
μA
85
-5
-
-
μA
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 16.5V, V- = -16.5V, VIN = 0V or 5V
Negative Supply Current, I-
Logic Supply Current, IL
Ground Current, IGND
Electrical Specifications
(Single Supply) Test Conditions: V+ = +12V, V- = 0V, VL = 5V, VIN = 2.4V, 0.8V (Note 3),
Unless Otherwise Specified.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 4)
TYP
(Note 5)
MAX
(Note 4)
UNITS
25
-
175
250
ns
85
-
-
315
ns
25
-
95
125
ns
85
-
-
140
ns
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
RL = 300Ω, CL = 35pF,
VS = 8V, (Figure 1)
Turn-OFF Time, tOFF
Break-Before-Make Time Delay
DG413 Only, RL = 300Ω,
CL = 35pF, VS = 8V
25
-
25
-
ns
Charge Injection, Q
CL = 10nF, VG = 6.0V, RG = 0Ω
25
-
25
-
pC
Full
0
-
12
V
25
-
40
80
Ω
Full
-
-
100
Ω
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
IS = -10mA, VD = 3V, 8V
V+ = 10.8V
Drain-Source ON-Resistance,
rDS(ON)
5
FN3282.13
June 20, 2007
DG411, DG412, DG413
Electrical Specifications
(Single Supply) Test Conditions: V+ = +12V, V- = 0V, VL = 5V, VIN = 2.4V, 0.8V (Note 3),
Unless Otherwise Specified. (Continued)
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 4)
TYP
(Note 5)
MAX
(Note 4)
UNITS
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 13.2V, V- = 0V
VIN = 0V or 5V
Negative Supply Current, I-
Logic Supply Current, IL
Ground Current, IGND
25
-
0.0001
1
μA
85
-
-
5
μA
25
-1
-0.0001
-
μA
85
-5
-
-
μA
25
-
0.0001
1
μA
85
-
-
5
μA
25
-1
-0.0001
-
μA
85
-5
-
-
μA
NOTES:
3. VIN = input voltage to perform proper function.
4. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
5. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Test Circuits and Waveforms
VO is the steady state output with the switch on. Feedthrough via switch capacitance may result in spikes at the leading and trailing
edge of the output waveform.
LOGIC
INPUT
+5V
tr < 20ns
tf < 20ns
3V
50%
SWITCH
INPUT
0V
tOFF
SWITCH
OUTPUT
V+
SWITCH
OUTPUT
D1
S1
VO
IN1
SWITCH
INPUT VS
VO
+15V
VL
90%
90%
RL
LOGIC
INPUT
CL
V-
GND
-15V
0V
NOTE: Logic input waveform is inverted for switches that have the
opposite logic sense.
Repeat test for all IN and S.
For load conditions, see Specifications. CL includes fixture and stray
RL
capacitance.
V O = V S -----------------------------------R L + r DS ( ON )
FIGURE 1A. MEASUREMENTS POINTS
FIGURE 1B. TEST CIRCUIT
tON
FIGURE 1. SWITCHING TIMES
3V
LOGIC
INPUT
SWITCH
OUTPUT
(V01)
VL
0V
VS1
V+
90%
D1
S2
D2
VS2 = 10V
0V
VS2
RL2
300Ω
IN1 , IN2
LOGIC
INPUT
GND
0V
tD
+15V
S1
VS1 = 10V
90%
SWITCH
OUTPUT
VO2
+5V
tD
FIGURE 2A. MEASUREMENT POINTS
V-15V
VO1
VO2
RL1
300Ω
CL1
35pF
CL2
35pF
CL includes fixture and
stray capacitance.
FIGURE 2B. TEST CIRCUITS
FIGURE 2. BREAK-BEFORE-MAKE TIME
6
FN3282.13
June 20, 2007
DG411, DG412, DG413
Test Circuits and Waveforms
(Continued)
SWITCH
OUTPUT
V+
RG
D1
ΔVO
VO
INX
VG
OFF
ON
OFF
OFF
ON
Q = ΔVO x CL
OFF
CL
VVIN = 3V
INX
GND
NOTE: INX dependent on switch configuration, input polarity
determined by sense of switch.
FIGURE 3A. TEST CIRCUIT
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. CHARGE INJECTION
C
SIGNAL
GENERATOR
V+
+15V
C
SIGNAL
GENERATOR
0dBm
VS
VD
50Ω
0V, 2.4V
IN1
IN2
0V, 2.4V
VD
ANALYZER
VS
RL
V-
0V, 2.4V
VD
ANALYZER
C
GND
+15V
INX
NC
RL
0dBm
V+
GND
V-
C
-15V
-15V
FIGURE 4. CROSSTALK TEST CIRCUIT
FIGURE 5. OFF ISOLATION TEST CIRCUIT
+15V
C
V+
VS
INX
0V, 2.4V
IMPEDANCE
ANALYZER
VD
f = 1MHz
GND
V-
C
-15V
FIGURE 6. SOURCE/DRAIN CAPACITANCES TEST CIRCUIT
7
FN3282.13
June 20, 2007
DG411, DG412, DG413
Application Information
Summing Amplifier
When driving a high impedance, high capacitance load such
as shown in Figure 7, where the inputs to the summing
amplifier have some noise filtering, it is necessary to have
shunt switches for rapid discharge of the filter capacitor, thus
preventing offsets from occurring at the output.
Single Supply Operation
The DG411, DG412, DG413 can be operated with unipolar
supplies from 5V to 44V. These devices are characterized
and tested for single supply operation at 12V to facilitate the
majority of applications. To function properly, 12V is tied to
Pins 13 and 0V is tied to Pin 4.
Pin 12 still requires 5V for TTL compatible switching.
R1
R2
VIN1
C1
R5
R3
R4
VIN2
VOUT
+
R6
C2
DG413
FIGURE 7. SUMMING AMPLIFIER
8
FN3282.13
June 20, 2007
DG411, DG412, DG413
Typical Performance Curves
50
40
rDS(ON) (Ω)
35
±5V
±8V
±10V
±12V
±15V
±20V
V+ = 15V, V- = -15V
VL = 5V, VS = 10V
210
A
180
tON , tOFF (ns)
45
240
A:
B:
C:
D:
E:
F:
B
30
C
25
D
E
20
F
15
150
tON
120
tOFF
90
60
10
30
5
TA = +25°C
0
-20
-15
-10
-5
0
5
10
15
0
-55
20
-35
-15
FIGURE 8. ON RESISTANCE vs VD AND POWER SUPPLY
VOLTAGE
45
65
85
105
125
100mA
V+ = 15V, V- = -15V
VL = 5V, TA = +25°C
10mA
20
ID(OFF)
0
IS(OFF)
-10
ID(ON) + IS(ON)
-20
V+ = 15V, V- = -15V
VL = 5V
1mA
ISUPPLY
10
IS , ID (pA)
25
FIGURE 9. SWITCHING TIME vs TEMPERATURE
40
30
5
TEMPERATURE (°C)
DRAIN VOLTAGE (V)
I+, I-
100μA
4SW
10μA
IL
-30
1μA
4SW
-40
100nA
-50
-10
-5
0
VS, VD (V)
5
10
10nA
10
15
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FIGURE 10. LEAKAGE CURRENTS vs ANALOG VOLTAGE
FIGURE 11. SUPPLY CURRENT vs INPUT SWITCHING
FREQUENCY
100
80
1SW
1SW
-60
-15
140
V+ = 15V, V- = -15V
VL = 5V
120
V+ = 15V, V- = -15V
VL = 5V
CL = 10nF
100
60
80
CL = 10nF
Q (pC)
Q (pC)
40
20
CL = 1nF
60
40
20
0
0
-20
CL = 1nF
-20
-40
-60
-15
-40
-10
-5
0
5
10
15
VS (V)
FIGURE 12. CHARGE INJECTION vs SOURCE VOLTAGE
9
-60
-15
-10
-5
0
5
10
15
VD (V)
FIGURE 13. CHARGE INJECTION vs DRAIN VOLTAGE
FN3282.13
June 20, 2007
DG411, DG412, DG413
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
2760mm x 1780mm x 485mm
Type: Nitride
Thickness: 8kÅ ±1kÅ
METALLIZATION:
WORST CASE CURRENT DENSITY:
Type: SiAl
Thickness: 12kÅ ±1kÅ
1.5 x 105 A/cm2
Metallization Mask Layout
DG411, DG412, DG413
D1
(2)
IN1
(1)
IN2
(16)
(15) D2
(14) S2
S1 (3)
(13) V+ SUBSTRATE
V- (4)
(12) VL
GND (5)
(11) S3
S4 (6)
(7)
D4
10
(8)
IN4
(9)
IN3
(10)
D3
FN3282.13
June 20, 2007
DG411, DG412, DG413
Thin Shrink Small Outline Plastic Packages (TSSOP)
M16.173
N
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
E
0.25(0.010) M
E1
2
INCHES
GAUGE
PLANE
-B1
B M
0.05(0.002)
-A-
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.043
-
1.10
-
A1
3
L
A
D
-C-
e
α
A1
b
0.10(0.004) M
0.25
0.010
SEATING PLANE
c
0.10(0.004)
C A M
0.05
0.15
-
A2
0.033
0.037
0.85
0.95
-
b
0.0075
0.012
0.19
0.30
9
c
0.0035
0.008
0.09
0.20
-
B S
0.002
D
0.193
0.201
4.90
5.10
3
0.169
0.177
4.30
4.50
4
0.026 BSC
E
0.246
L
0.020
N
a
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AB, Issue E.
0.006
E1
e
A2
MILLIMETERS
0.65 BSC
0.256
6.25
0.028
0.50
16
0o
-
0.70
6
16
8o
0o
-
6.50
7
8o
Rev. 1 2/02
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
11
FN3282.13
June 20, 2007
DG411, DG412, DG413
Dual-In-Line Plastic Packages (PDIP)
N
E16.3 (JEDEC MS-001-BB ISSUE D)
E1
INDEX
AREA
1 2 3
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N/2
INCHES
-B-
SYMBOL
-AE
D
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
MILLIMETERS
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
L
0.115
0.150
2.93
3.81
4
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
N
16
16
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
12
FN3282.13
June 20, 2007
DG411, DG412, DG413
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
C
0.10(0.004)
0.25(0.010) M
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
α
B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
16
0°
16
8°
0°
7
8°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
13
FN3282.13
June 20, 2007
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