752AC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−16 NB, LESS PIN 15
CASE 752AC−01
ISSUE O
DATE 28 JAN 2011
SCALE 1:1
D
16
A B
9
E
H
0.25
M
B
M
1
8
e
15X
15X
C
b
0.25
C
L
M
T A
S
B
DIM
A
A1
b
C
D
E
e
H
h
L
M
S
A1
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 TOTAL IN EXCESS OF THE b DIMENSION AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
h x 45 _
A
M
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
16
6.40
15X
1
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
9.80
10.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
XXXXXXXXXXXXG
XXXXXXXXXXXXX
AWLYWW
1.12
16
1
15X
0.58
1.27
PITCH
8
9
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON55422E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
SOIC−16 NB, LESS PIN 15
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON55422E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED TO PRODUCTION. REQ. BY M. RAMOS.
DATE
28 JAN 2011
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 01O
Case Outline Number:
752AC
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