TSOP572..H, TSOP574..H Datasheet

TSOP572..H, TSOP574..H
www.vishay.com
Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Improved immunity against HF and RF noise
• Height of 0.8 mm
• ± 75° half angle sensitivity
• Low supply current
• Photo detectors and preamplifier in one package
• Internal filter for PCM frequency
• Supply voltage: 2.5 V to 5.5 V, typically even
2.0 V to 5.5 V is possible
• Improved immunity against optical noise
• Insensitive to supply voltage ripple and noise
• External metal shield
22594
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ORDERING CODE
Taping:
DESCRIPTION
TSOP57...HTT1 - top view taped
The TSOP57...H series are miniaturized SMD IR receiver
modules for infrared remote control systems. A PIN diode
and a preamplifier are assembled on a PCB, the epoxy
package contains an IR filter.
TSOP57...HTT2 - top view taped
The demodulated output signal can be directly connected to
a microprocessor for decoding.
The TSOP574..H series devices are optimized to suppress
almost all spurious pulses from Wi-Fi and CFL sources.
They may suppress some data signals if continuously
transmitted.
The TSOP572..H series devices are provided primarily for
compatibility with old AGC2 designs. New designs should
prefer the TSOP574..H series containing the newer AGC4.
These components have not been qualified according to
automotive specifications.
PARTS TABLE
LEGACY, FOR
LONG BURST REMOTE CONTROLS (AGC2)
RECOMMENDED FOR
LONG BURST CODES (AGC4)
36 kHz
TSOP57236H
TSOP57436H (1)(2)(3)
38 kHz
TSOP57238H
TSOP57438H (4)(5)
40 kHz
TSOP57240H
TSOP57440H
56 kHz
TSOP57256H
TSOP57456H (6)(7)
AGC
Carrier
frequency
Package
Belobog shield
Pinning
1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS
Dimensions (mm)
4.3 W x 4.3 H x 1.0 D
Mounting
SMD
Application
Best remote control code
Rev. 1.4, 10-Nov-15
Remote control
(1)
RC-5
(2)
RC-6
(3)
Panasonic
1
(4)
NEC
(5)
Sharp
(6)
r-step
(7)
Thomson RCA
Document Number: 82646
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TSOP572..H, TSOP574..H
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Vishay Semiconductors
BLOCK DIAGRAM
APPLICATION CIRCUIT
17170-10
4, 5
Transmitter
with
TSALxxxx
VS
33 kΩ
Input
OUT
Demodulator
Band
pass
AGC
VS
VO
GND
GND
Control circuit
µC
OUT
2, 3,
6, 7, 8
PIN
+ VS
C1
Circuit
1
R1
IR receiver
GND
The external components R1 and C1 are optional
to improve the robustness against electrical overstress
(typical values are R1 = 100 Ω, C1 = 0.1 µF).
20445-6
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
Supply voltage
TEST CONDITION
VS
-0.3 to +6
V
Supply current
IS
5
mA
Output voltage
VO
-0.3 to (VS + 0.3)
V
Output current
IO
5
mA
Junction temperature
Tj
100
°C
Tstg
-25 to +85
°C
Tamb
-25 to +85
°C
Ptot
10
mW
Storage temperature range
Operating temperature range
Power consumption
Tamb ≤ 85 °C
UNIT
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
VS
2.5
-
5.5
V
VS = 5 V, Ev = 0
ISD
0.55
0.7
0.9
mA
Ev = 40 klx, sunlight
ISH
-
0.8
-
mA
Ev = 0,
IR diode TSAL6200,
IF = 250 mA,
test signal see fig. 1
d
-
40
-
m
Output voltage low
IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see fig. 1
VOSL
-
-
100
mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see Fig. 1
Ee min.
-
0.2
0.4
mW/m2
Maximum irradiance
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee max.
50
-
-
W/m2
Directivity
Angle of half transmission
distance
ϕ1/2
-
± 75
-
deg
Supply voltage
Supply current
Transmission distance
Rev. 1.4, 10-Nov-15
2
UNIT
Document Number: 82646
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TSOP572..H, TSOP574..H
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Vishay Semiconductors
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Optical Test Signal
0.8
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms)
ton, toff - Output Pulse Width (ms)
Ee
t
tpi *
* tpi
T
10/f0 is recommended for optimal function
Output Signal
VO
1)
7/f0 < td < 15/f0
2) t - 5/f < t < t + 6/f
pi
0
po
pi
0
VOH
VOL
16110
ton
0.7
0.6
0.5
0.3
0.2
0
0.1
td 1)
tpo 2)
102
103
104
105
1.2
Ee min./Ee - Relative Responsivity
tpo - Output Pulse Width (ms)
10
Fig. 4 - Output Pulse Diagram
Output pulse width
0.9
0.8
Input burst length
0.7
0.6
0.5
0.4
0.3
0.2
λ = 950 nm,
optical test signal, fig.1
0.1
0
0.1
1
Ee - Irradiance (mW/m2)
t
1.0
1.0
0.8
0.6
0.4
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
0.0
1
10
102
103
104
0.7
Ee - Irradiance (mW/m2)
0.9
1.1
1.3
f/f0 - Relative Frequency
16925
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Fig. 5 - Frequency Dependance of Responsivity
Ee min. - Threshold Irradiance (mW/m2)
Optical Test Signal
600 µs
t
600 µs
t = 60 ms
VO
λ = 950 nm,
optical test signal, fig. 3
0.1
Fig. 1 - Output Active Low
Ee
toff
0.4
94 8134
Output Signal, (see fig. 4)
VOH
VOL
t on
t off
Correlation with ambient light sources:
4.5 10 W/m2 = 1.4 klx (std. illum. A, T = 2855 K)
2
4.0 10 W/m = 8.2 klx (daylight, T = 5900 K)
3.5
3.0
Wavelength of ambient
illumination: λ = 950 nm
2.5
2.0
1.5
1.0
0.5
0
0.01
0.1
1
10
100
Ee - Ambient DC Irradiance (W/m2)
t
Fig. 3 - Output Function
Rev. 1.4, 10-Nov-15
5.0
Fig. 6 - Sensitivity in Bright Ambient
3
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TSOP572..H, TSOP574..H
Vishay Semiconductors
1.0
1.0
S(λ)rel - Relative Spectral Sensitivity
Ee min. - Threshold Irradiance (mW/m2)
www.vishay.com
f = f0
0.9
0.8
0.7
f = 30 kHz
0.6
0.5
f = 20 kHz
0.4
f = 10 kHz
0.3
0.2
0.1
f = 100 Hz
0
1
10
100
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750 800 850 900 950 1000 1050 1100 1150
1000
ΔVsRMS - AC Voltage on DC Supply Voltage (mV)
λ - Wavelength (nm)
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
0.8
Max. Envelope Duty Cycle
0.7
-20°
TSOP572..H
0.6
-10°
0°
10°
20°
-30°
30°
-40°
0.5
40°
-50°
0.4
50°
60°
-60°
0.3
-70°
0.2
TSOP574..H
70°
-80°
80°
0.1
2
0
f = 38 kHz, Ee = 2 mW/m
0
20
40
60
80
100
0.1
21947
120
0.3
0.5
0.7
0.9
Burst Length (number of cycles/burst)
Fig. 11 - Horizontal Directivity
0.40
0.8
0.35
0.7
Ee min. - Sensitivity (mW/m2)
Ee min. - Sensitivity (mW/m2)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
0.30
0.25
0.20
0.15
0.10
0.05
0
-30
-10
10
30
50
70
0.5
0.4
0.3
0.2
0.1
0
1.5
90
Tamb - Ambient Temperature (°C)
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VS - Supply Voltage (V)
Fig. 9 - Sensitivity vs. Ambient Temperature
Rev. 1.4, 10-Nov-15
0.6
Fig. 12 - Sensitivity vs. Supply Voltage
4
Document Number: 82646
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TSOP572..H, TSOP574..H
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Vishay Semiconductors
SUITABLE DATA FORMAT
IR Signal
The TSOP572..H, TSOP574..H series is designed to
suppress spurious output pulses due to noise or
disturbance signals. The devices can distinguish data
signals from noise due to differences in frequency, burst
length, and envelope duty cycle. The data signal should be
close to the device’s band-pass center frequency
(e.g. 38 kHz) and fulfill the conditions in the table below.
When a data signal is applied to the TSOP572..H,
TSOP574..H in the presence of a disturbance, the sensitivity
of the receiver is automatically reduced by the AGC to insure
that no spurious pulses are present at the receiver’s output.
Some examples which are suppressed are:
0
• DC light (e.g. from tungsten bulbs sunlight)
5
• Continuous signals at any frequency
10
15
20
Time (ms)
16920
Fig. 13 - IR Signal from Fluorescent Lamp
with Low Modulation
• Strongly or weakly modulated patterns from fluorescent
lamps with electronic ballasts (see fig. 13 or fig. 14)
IR Signal
• 2.4 GHz and 5 GHz Wi-Fi
0
5
10
15
20
Time (ms)
16921
Fig. 14 - IR Signal from Fluorescent Lamp
with High Modulation
TSOP572..H
TSOP574..H
Minimum burst length
10 cycles/burst
10 cycles/burst
After each burst of length
a minimum gap time is required of
10 to 70 cycles
≥ 10 cycles
10 to 42 cycles
≥ 10 cycles
70 cycles
> 4 x burst length
42 cycles
> 10 x burst length
For bursts greater than
a minimum gap time in the data stream is needed of
Maximum number of continuous short bursts/second
800
1300
NEC code
Yes
Preferred
RC5/RC6 code
Yes
Preferred
Thomson 56 kHz code
Yes
Preferred
Mild disturbance patterns
are suppressed (example:
signal pattern of fig. 13)
Complex and critical disturbance patterns
are suppressed (example: signal pattern
of fig. 14 or highly dimmed LCDs)
Suppression of interference from fluorescent lamps
Note
• For data formats with short bursts please see the datasheet for TSOP573..H, TSOP575..H.
Rev. 1.4, 10-Nov-15
5
Document Number: 82646
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TSOP572..H, TSOP574..H
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
4 x 0.75 = 3
(0.7)
(0.3)
(0.4)
(2.85)
(1.8)
(0.95)
0.475
0.55
(0.3)
(0.3)
0.75 ± 0.05
(2) Pins connected internally.
It is not necessary to connect
externally.
1.5
Pinning from Topview
GND
1 ± 0.2
3
7
(2)
6
(GND)
8
GND
0.55
(8 x)
0.35 ± 0.05
Allowed offset
outer edge of shield
to solder pads of
molded device
± 0.1 mm
4
5
(2)
(4.3)
(0.45)
(4.3)
4 x 0.75 = 3
(2.75)
Marking area
Drawing-No.: 6.550-5316.01-4
Issue: 2; 12.02.14
3
(2)
(0.8) (3 x)
(1.2)
(2.9) (1)
Pin 1 identification
2
(2)
Proposed pad layout from
component side
(dim. for reference only)
4.3 ± 0.2
(1.7) (1)
1
Vs
(3.25)(1)
(Vs)
Out
4.3 ± 0.2
(GND)
All dimensions in mm
Not indicated tolerances ± 0.1
(1) optically effective area
(GND)
0.15
technical drawings
according to DIN
specifications
(3 x) (0.35)
Rev. 1.4, 10-Nov-15
6
Document Number: 82646
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ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
19800
50
100
150
t (s)
200
250
300
max. 2 cycles allowed
ORDERING INFORMATION
ORDERING CODE
TSOP57..HTT1
TSOP57..HTT2
PACKAGING
Tape and reel
VOLUME (1)
MOQ: 1500 pcs
MOQ: 5000 pcs
REMARKS
3.95 mm x 3.95 mm x 0.75 mm
Note
(1) MOQ: minimum order quantity
Rev. 1.4, 10-Nov-15
7
Document Number: 82646
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TAPING VERSION TSOP57..H DIMENSIONS in millimeters
Tape and Reel dimensions:
Reel size "Y"
X
Unreel direction
2±
Ø 60 min.
GS 08 Ø 180 ± 2 = 1500 pcs.
GS 18 Ø 330 ± 2 = 5000 pcs.
Tape position
coming out from reel
ØY
0.5
Not indicated tolerances ± 0.1
Ø 21 ± 0.8
Ø 13 ± 0.2
Label posted here
(12.4)
18.4 max.
Parts mounted
Empty leader 400 mm min.
100 mm min. with cover tape
Leader and trailer tape:
Empty trailer 200 mm min.
Direction of pulling out
Technical drawings
according to DIN
specifications
(Ø 1.5)
(2)
(5.5)
(0.3)
(4)
Drawing-No.: 9.700-5380.01-4
Issue: 1; 28.10.13
Reel dimensions and tape
Rev. 1.4, 10-Nov-15
(12)
(8)
(1.75)
X 2:1
8
Document Number: 82646
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LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
LOT-/serial-number
Mixed code indicator
Origin
Long bar code top
MIXED CODE
-
xxxxxxx+
Company logo
Type
Length
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
Short bar code bottom
Type
Length
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
DRY PACKING
RECOMMENDED METHOD OF STORAGE
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Aluminum bag
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
Label
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
Reel
FINAL PACKING
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
An EIA JEDEC® standard J-STD-020 level 3 label is included
on all dry bags.
15973
Rev. 1.4, 10-Nov-15
9
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Vishay Semiconductors
Caution
This bag contains
MOISTURE-SENSITIVE DEVICES
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
LEVEL
3
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
If blank, see adjacent
bar code label
1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%
relative humidity (RH)
260
2. Peak package body temperature:_______________________°C
If blank, see adjacent bar code label
BAR CODE PRODUCT LABEL (example)
3. After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
168
a) Mounted within:___________________hours
of factory conditions
If blank, see adjacent bar code label
≤30°C/60% RH, or
b) Stored per J-STD-033
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b are not met
5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure
22178
Bag Seal Date:_________________________________________
If blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
22650
EIA JEDEC standard J-STD-020 level 3 label
is included on all dry bags
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
Rev. 1.4, 10-Nov-15
10
Document Number: 82646
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Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000