TSSP77038 www.vishay.com Vishay Semiconductors IR Receiver Modules for Remote Control Systems FEATURES • Up to 2 m for presence sensing • Uses modulated bursts at 38 kHz • 940 nm peak wavelength • PIN diode and sensor IC in one package 4 3 • Low supply current 2 1 • Shielding against EMI • Visible light is suppressed by IR filter • Insensitive to supply voltage ripple and noise 20953 • Supply voltage: 2.5 V to 5.5 V • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 MECHANICAL DATA Pinning: DESCRIPTION 1, 4 = GND, 2 = VS, 3 = OUT The TSSP77038 is a compact infrared detector module for presence sensing applications. It receives 38 kHz modulated signals and has a peak sensitivity of 940 nm. ORDERING CODE Taping: This component has not been qualified according to automotive specifications. TSSP77038TT - top view taped TSSP77038TR - side view taped APPLICATIONS • Reflective sensors for hand dryers, towel or soap dispensers, water faucets, toilet flush • Vending machine fall detection • Security and pet gates • Person or object vicinity activation PARTS TABLE Carrier frequency 38 kHz TSSP77038 Package Heimdall Pinning 1, 4 = GND, 2 = VS, 3 = OUT Dimensions (mm) 6.8 W x 3.0 H x 3.2 D Mounting SMD Application Presence sensors BLOCK DIAGRAM PRESENCE SENSING +3 V 2 33 kΩ IR emitter VS 3 Input AMP Band pass Demodulator Envelope signal OUT 38 kHz +3 V 1, 4 PIN Out to μC GND 16833_17 Rev. 1.5, 14-Apr-16 1 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT VS -0.3 to +6 V Supply voltage Supply current IS 5 mA Output voltage VO -0.3 to (VS + 0.3) V Output current IO 5 mA Tj 100 °C Storage temperature range Junction temperature Tstg -25 to +85 °C Operating temperature range Tamb -25 to +85 °C Ptot 10 mW Power consumption Tamb ≤ 85 °C Note • Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT VS 2.5 - 5.5 V VS = 5 V, Ev = 0 ISD 0.55 0.7 0.9 mA Ev = 40 klx, sunlight ISH - 0.8 - mA Ev = 0, IR diode TSAL6200, IF = 400 mA, test signal see fig. 1 d - 25 - m Output voltage low IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see fig. 1 VOSL - - 100 mV Minimum irradiance Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 Ee min. - 0.7 1.2 mW/m2 Maximum irradiance tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 Ee max. 50 - - W/m2 Angle of half transmission distance ϕ1/2 - ± 50 - deg Supply voltage Supply current Transmission distance Directivity Rev. 1.5, 14-Apr-16 2 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Optical Test Signal (IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms) t tpi * T 10/f0 is recommended for optimal function * tpi VO Output Signal 1) VOH VOL 2) 0.8 ton, toff - Output Pulse Width (ms) Ee 16110 7/f0 < td < 15/f0 tpi - 5/f0 < tpo < tpi + 6/f0 ton 0.7 0.6 0.5 toff 0.4 0.3 0.2 λ = 950 nm, optical test signal, Fig. 3 0.1 0 0.1 td 1) tpo 2) t Fig. 1 - Output Active Low Ee min./Ee - Relative Responsivity tpo - Output Pulse Width (ms) 100 1000 10 000 1.2 Output pulse width 0.9 0.8 Input burst length 0.7 0.6 0.5 0.4 0.3 λ = 950 nm, optical test signal, Fig. 1 0.2 1.0 0.8 0.6 0.4 f = f0 ± 5 % Δf(3 dB) = f0/10 0.2 0.0 0.1 1 10 100 1000 10 000 100 000 0.7 Ee - Irradiance (mW/m2) Ee min. - Threshold Irradiance (mW/m2) t 600 µs t = 60 ms 94 8134 Output Signal, (see fig. 4) VOH VOL t on t off t 1.3 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -30 -10 10 30 50 70 90 Tamb - Ambient Temperature (°C) Fig. 3 - Output Function Rev. 1.5, 14-Apr-16 1.1 Fig. 5 - Frequency Dependence of Responsivity Optical Test Signal 600 µs 0.9 f/f0 - Relative Frequency 16925 Fig. 2 - Pulse Length and Sensitivity in Dark Ambient VO 10 Fig. 4 - Output Pulse Diagram 1.0 Ee 1 Ee - Irradiance (mW/m2) Fig. 6 - Sensitivity vs. Ambient Temperature 3 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 S (λ) rel - Relative Spectral Sensitivity www.vishay.com Vishay Semiconductors 0° 1.0 10° 20° 30° 0.9 0.8 40° 0.7 0.6 1.0 0.5 0.9 50° 0.8 60° 0.4 0.3 0.2 70° 0.1 80° 0 750 800 850 900 0.6 950 1000 1050 1100 1150 λ- Wavelength (nm) 21425 Fig. 7 - Relative Spectral Sensitivity vs. Wavelength 10° 20° 30° 1.0 50° 0.8 60° 70° 80° 0.6 0.4 0.2 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 2 drel - Relative Transmission Distance 21427 0 2.0 40° 0.9 0.2 Fig. 9 - Vertical Directivity Ee min. - Sensitivity (mW/m2) 0° 0.4 drel - Relative Transmission Distance 21428 3 4 5 VS - Supply Voltage (V) Fig. 8 - Horizontal Directivity Fig. 10 - Sensitivity vs. Supply Voltage The typical application of this device is a reflective or beam break sensor with active low “detect” or “no detect” information contained in its output. Applications requiring up to 2 m beam break or 1 m reflective range benefit from the lower gain of these sensors because they are less sensitive to stray signal from the emitter, simplifying the mechanical design. Example for a sensor hardware: IR Receiver TSSP6P38 Emitter TSAL6200 Separation to avoid crosstalk by stray light inside the housing There should be no common window in front of the emitter and detector in order to avoid crosstalk via guided light through the window. Rev. 1.5, 14-Apr-16 4 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 6.8 6.6 ± 0.1 3.2 (3.4) Mold residue Mold residue 2.5 (1.8) 1.2 ± 0.2 3 0.8 2.2 (0.635) (1) 1.27 (3 x) 0.5 ± 0.1 (4 x) technical drawings according to DIN specifications 3 x 1.27 = 3.81 Marking area (2.2) 2.2 Not indicated tolerances ± 0.15 (1.65) Tool separation line Proposed pad layout from component side (for reference only) 3 x 1.27 = 3.81 1.27 Pick and place area 1.8 (R1.3) Drawing-No.: 6.550-5297.01-4 Issue: 4; 13.09.11 0.8 22608 ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handle products only after the temperature has cooled off • Finish soldering within 3 s • Handling after reflow should be done only after the work surface has been cooled off Rev. 1.5, 14-Apr-16 5 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE 300 max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 T (°C) 200 max. 20 s 150 max. 100 s max. 120 s 100 max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s 50 0 0 50 100 150 t (s) 19800 200 250 300 max. 2 cycles allowed 0.3 3.6 TAPING VERSION TSSP..TR DIMENSIONS in millimeters 16 7.5 1.75 1.34 ref. Ø 1.5 4 Direction of feed 8 2 Ø 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5337.01-4 Issue: 2; 06.10.15 Rev. 1.5, 14-Apr-16 6 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors 3.65 0.3 TAPING VERSION TSSP..TT DIMENSIONS in millimeters 16 1.75 7.5 Ø 1.5 4 8 Direction of feed 2 Ø 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5338.01-4 Issue: 4; 12.06.13 Rev. 1.5, 14-Apr-16 7 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters 16734 LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 COVER TAPE REEL STRENGTH LABEL According to DIN EN 60286-3 Standard bar code labels for finished goods 0.1 N to 1.3 N The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. 300 ± 10 mm/min. 165° to 180° peel angle Rev. 1.5, 14-Apr-16 8 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors VISHAY SEMICONDUCTORS GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH - 18 Item-description Item-number INO 8 Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - LOT-/serial-number Packed by Mixed code indicator Origin LONG BAR CODE TOP PCK - MIXED CODE - xxxxxxx+ Company logo TYPE LENGTH Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 TYPE LENGTH Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 SHORT BAR CODE BOTTOM DRY PACKING After more than 72 h under these conditions moisture content will be too high for reflow soldering. The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 125 °C + 5 °C not suitable for reel or tubes. Aluminum bag Label An EIA JEDEC® standard J-STD-020 level 4 label is included on all dry bags. Reel 15973 LEVEL CAUTION This bag contains MOISTURE-SENSITIVE DEVICES FINAL PACKING 4 1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative humidity (RH) The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 °C) must be 2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or 2b. Stored at < 5 % RH RECOMMENDED METHOD OF STORAGE 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or 2a. or 2b. are not met. Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: 4. If baking is required, devices may be baked for: 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or 24 hours at 125 °C ± 5 °C not suitable for reels or tubes Bag Seal Date: (If blank, see barcode label) Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 • Storage temperature 10 °C to 30 °C 22522 EIA JEDEC standard J-STD-020 level 4 label is included on all dry bags • Storage humidity ≤ 60 % RH max. Rev. 1.5, 14-Apr-16 9 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP77038 www.vishay.com Vishay Semiconductors ESD PRECAUTION VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS (example) Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. 22178 Rev. 1.5, 14-Apr-16 10 Document Number: 82470 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors Tape and Reel Standards for SMD IR Receiver Modules Vishay Semiconductor SMD IR receivers are packaged on tape and reel. The following specification is based on IEC publication 286, which takes the industrial requirements for automatic insertion into account. NUMBER OF COMPONENTS A. Panhead SMD: quantity per reel: TT, SMD top view package, 1190 pcs TR, SMD side view package, 1120 pcs Absolute maximum ratings, mechanical dimensions, optical and electrical characteristics for taped devices are identical to the basic catalog types and can be found in the specifications for untaped devices. B. Heimdall: quantity per reel: TT, Heimdall top view package, 2200 pcs TR, Heimdall side view package, 2300 pcs C. Heimdall without lens: quantity per reel: PACKAGING WTT, top view package, 2200 pcs The tapes of components are available on reels. Each reel is marked with labels which contain the following information: WTR, side view package, 2300 pcs D. Belobog: quantity per reel: - Vishay - Type TT1, 1800 pcs - Group TT2, 7000 pcs - Tape code, normally part of type name TR, not available in side view - Production code E. Belobog with shield: quantity per reel: - Quantity TT1, 1500 pcs TT2, 5000 pcs MISSING COMPONENTS Up to 3 consecutive components may be missing if the gap is followed by at least 6 components. A maximum of 0.5 % of the components per reel quantity may be missing. At least 5 empty positions are present at the start and the end of the tape to enable tape insertion. ORDER DESIGNATION The type designation of the device is extended by TT or TT1 for top view or TR for side view. Example: TSOP6238TR (reel packing) Tensile strength of the tape: > 15 N TSOP75238TR (reel packing) TSOP75338WTT (reel packing) TSOP57438TT1 (reel packing) TSOP57238HTT1 (reel packing) Rev. 2.1, 13-Oct-15 1 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors REEL DIMENSIONS FOR PANHEAD SMD AND HEIMDALL in millimeters 16734 Note • The body structure of the reel can vary Rev. 2.1, 13-Oct-15 2 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters A. Panhead SMD (TSOP36...TT, TSSP....TT, TSOP6...TT) 16584 Rev. 2.1, 13-Oct-15 3 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters 3.65 0.3 B. Heimdall SMD (TSOP75...TT, TSOP77...TT, TSSP77...TT) 16 1.75 7.5 Ø 1.5 4 8 Direction of feed 2 Ø 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5338.01-4 Issue: 4; 12.06.13 Rev. 2.1, 13-Oct-15 4 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TT (TOP VIEW) DIMENSIONS in millimeters 3 0.3 C. Heimdall SMD without lens (TSOP75...WTT, TSOP77...WTT, TSSP77...WTT) 16 1.75 7.5 Ø 1.5 4 Direction of feed 8 2 Ø 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5341.01-4 Issue: 3; 06.10.15 Rev. 2.1, 13-Oct-15 5 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TT1, TSOP..TT2 (TOP VIEW) DIMENSIONS in millimeters D. Belobog (TSOP37...TT1, TSOP37...TT2, TSOP57...TT1, TSOP57...TT2) Tape and reel dimensions: Unreel direction TT1 Ø 180 ± 2 = 1800 pcs. TT2 Ø 330 ± 2 = 7000 pcs. Tape position coming out from reel 2± Ø 60 min. Reel size "Y" ØY 0.5 Ø 21 ± 0.8 Ø 13 ± 0.2 Label posted here (12.4) 18.4 max. Empty leader 400 mm min. Parts mounted 100 mm min. with cover tape Leader and trailer tape: Empty trailer 200 mm min. Direction of pulling out Technical drawings according to DIN specifications (Ø 1.5) (2) (5.5) (0.3) (4) Drawing-No.: 9.700-5347.01-4 Issue: 1; 14.11.11 Rev. 2.1, 13-Oct-15 12 ± 0.3 (8) (1.2) (1.75) X 2:1 Not indicated tolerances ± 0.1 6 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TT1, TSOP..TT2 (TOP VIEW) DIMENSIONS in millimeters E. Belobog with shield (TSOP37...HTT1, TSOP37...HTT2, TSOP57...HTT1, TSOP57...HTT2) Tape and Reel dimensions: Reel size "Y" X Unreel direction 2± Ø 60 min. GS 08 Ø 180 ± 2 = 1500 pcs. GS 18 Ø 330 ± 2 = 5000 pcs. Tape position coming out from reel ØY 0.5 Not indicated tolerances ± 0.1 Ø 21 ± 0.8 Ø 13 ± 0.2 Label posted here (12.4) 18.4 max. Parts mounted Empty leader 400 mm min. 100 mm min. with cover tape Leader and trailer tape: Empty trailer 200 mm min. Direction of pulling out Technical drawings according to DIN specifications (Ø 1.5) (2) (5.5) (0.3) (4) Drawing-No.: 9.700-5380.01-4 Issue: 1; 28.10.13 Reel dimensions and tape Rev. 2.1, 13-Oct-15 (12) (8) (1.75) X 2:1 7 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters A. Panhead SMD (TSOP36...TR, TSSP6...TR, TSOP6...TR) 16585 Rev. 2.1, 13-Oct-15 8 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters 0.3 3.6 B. Heimdall SMD (TSOP75..., TSOP77..., TSSP7....) 16 7.5 1.75 1.34 ref. Ø 1.5 4 Direction of feed 8 2 Ø 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5337.01-4 Issue: 2; 06.10.15 Rev. 2.1, 13-Oct-15 9 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors TAPING VERSION TSOP..TR (SIDE VIEW) DIMENSIONS in millimeters 3.6 0.3 C. Heimdall SMD without lens (TSOP75...WTR, TSOP77...WTR, TSSP...WTR) 16 1.75 7.5 Ø 1.5 4 Direction of feed 8 2 Ø 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5342.01-4 Issue: 2; 12.06.13 Rev. 2.1, 13-Oct-15 10 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 COVER TAPE REEL STRENGTH LABEL According to DIN EN 60286-3 Standard bar code labels for finished goods 0.1 N to 1.3 N The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. 300 mm/min. ± 10 mm/min. 165° to 180° peel angle VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 INO 8 Item-number Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - MIXED CODE - xxxxxxx+ Company logo TYPE LENGTH LOT-/serial-number Mixed code indicator Origin LONG BAR CODE TOP Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 TYPE LENGTH Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 SHORT BAR CODE TOP Rev. 2.1, 13-Oct-15 11 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SMD Tape and Reel www.vishay.com Vishay Semiconductors DRY PACKAGING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. LEVEL CAUTION This bag contains MOISTURE-SENSITIVE DEVICES Aluminum bag 4 1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative humidity (RH) 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 °C) must be 2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or 2b. Stored at < 5 % RH Label 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or 2a. or 2b. are not met. 4. If baking is required, devices may be baked for: 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or 24 hours at 125 °C ± 5 °C not suitable for reels or tubes Reel Bag Seal Date: (If blank, see barcode label) 15973 Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 22522 RECOMMENDED METHOD OF STORAGE EIA JEDEC standard JSTD-020 level 4 label is included on all dry bags Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. • Storage temperature 10 °C to 30 °C • Storage humidity 60 % RH max. After more than 72 h under these conditions moisture content will be too high for reflow soldering. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 125 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC® standard JSTD-020 level 4 label is included on all dry bags. 16962 OUTER PACKAGING The sealed reel is packed into a pizza box. CARTON BOX DIMENSIONS in millimeters Length Thickness Width 22127 Pizza Box (SMD and Heimdall) (Taping in reels) Rev. 2.1, 13-Oct-15 THICKNESS WIDTH LENGTH 50 340 340 12 Document Number: 80125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. 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We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000