TSOP75G36 www.vishay.com Vishay Semiconductors IR Receiver Modules for Remote Control Systems FEATURES • Low output pulse jitter, optimized for RCMM code • Very low supply current • Photo detector and preamplifier in one package • Internal filter for PCM frequency 4 • Supply voltage: 2.5 V to 5.5 V 3 2 • Improved immunity against ambient light 1 • Capable of side or top view • Two lenses for high sensitivity and wide receiving angle 20953 • Insensitive to supply voltage ripple and noise • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 MECHANICAL DATA Pinning: DESCRIPTION 1, 4 = GND, 2 = VS, 3 = OUT This product is a SMD IR Receiver module for infrared remote control systems. Two PIN diodes and a preamplifier are assembled on a leadframe, the epoxy package contains an IR filter. ORDERING CODE Taping: The demodulated output signal can be directly connected to a microprocessor for decoding. TSOP75...TT - top view taped TSOP75...TR - side view taped The TSOP75G36 is optimized for the usage with RCMM code with low pulse jitter. It can suppress almost all spurious pulses from energy saving fluorescent lamps, LCD backlighting, and plasma TVs. This component has not been qualified according to automotive specifications. PARTS TABLE Carrier frequency TSOP75G36 (1) 36 kHz Package Heimdall Pinning 1, 4 = GND, 2 = VS, 3 = OUT Dimensions (mm) 6.8 W x 3.0 H x 3.2 D Mounting SMD Application Remote control (1) Best remote control code BLOCK DIAGRAM RCMM APPLICATION CIRCUIT 17170_5 2 VS 3 Input AGC Band pass Demodulator OUT Control circuit GND + VS C1 µC OUT VO GND R1 and C1 are recommended for protection against EOS. Components should be in the range of 33 Ω < R1 < 1 kΩ, C1 > 0.1 µF. 20445-1 Rev. 1.1, 13-Oct-15 VS GND 1, 4 PIN R1 IR receiver Circuit 30 k Ω Transmitter with TSALxxxx 1 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT VS -0.3 to +6.0 V mA Supply voltage Supply current IS 3 Output voltage VO -0.3 to (VS + 0.3) V Output current IO 5 mA Junction temperature Storage temperature range Operating temperature range Tamb ≤ 85 °C Power consumption Tj 100 °C Tstg -25 to +85 °C Tamb -25 to +85 °C Ptot 10 mW Note • Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. VS 2.5 - 5.5 V Ev = 0, VS = 3.3 V ISD 0.27 0.35 0.45 mA Ev = 40 klx, sunlight ISH - 0.45 - mA Ev = 0, test signal see fig. 1, IR diode TSAL6200, IF = 250 mA d - 40 - m 100 mV 0.2 0.4 mW/m2 Supply voltage Supply current Transmission distance Output voltage low IOSL = 0.5 mA, Ee = 0.7 mW/m2, VOSL - Minimum irradiance Pulse width tolerance: tpi - 1/f0 < tpo < tpi + 3.5/f0, test signal see fig. 1 Ee min. - Maximum irradiance tpi - 1/f0 < tpo < tpi + 3.5/f0, test signal see fig. 1 Ee max. 30 - - W/m2 Angle of half transmission distance ϕ1/2 - ± 50 - deg Directivity test signal see fig. 1 UNIT TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Optical Test Signal (IR diode TSAL6200, IF = 0.4 A, N = 6 pulses, f = f0, t = 10 ms) 0.25 tpo - Output Pulse Width (ms) Ee t tpi *) T *) tpi ≥ 6/f0 is recommended for optimal function Output Signal VO 1) 2) VOH 3/f0 < td < 6/f0 tpi - 1/f0 < tpo < tpi + 3.5/f0 Output pulse width 0.20 0.15 Input burst length 0.10 0.05 Optical test signal: λ = 940 nm, f = 36 kHz, N = 6 carrier cycles per burst 0 0.1 VOL td 1) tpo 2) t Fig. 1 - Output Active Low Rev. 1.1, 13-Oct-15 1 10 100 1000 10 000 Ee - Irradiance (mW/m2) Fig. 2 - Pulse Length and Sensitivity in Dark Ambient 2 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Ee min. - Threshold Irradiance (mW/m2) Ee Vishay Semiconductors Optical Test Signal 600 µs t 600 µs t = 60 ms 94 8134 Output Signal, (see fig. 4) VO VOH VOL t off t on t Ee min. - Threshold Irradiance (mW/m2) ton, toff - Output Pulse Width (ms) ton 0.6 toff 0.4 0.3 0.2 λ = 940 nm, optical test signal, fig. 3 0.1 0 0.1 1 10 100 1000 10 000 3.5 3.0 2.5 Wavelength of ambient illumination: λ = 950 nm 2.0 1.5 1.0 0.5 0 0.01 0.1 1 10 100 1.0 0.9 0.8 0.7 f = f0 f = 30 kHz f = 10 kHz f = 100 Hz 0.6 0.5 0.4 0.3 0.2 0.1 0 1 10 100 1000 ΔVS RMS - AC Voltage on DC Supply Voltage (mV) Ee - Irradiance (mW/m2) Fig. 4 - Output Pulse Diagram Fig. 7 - Sensitivity vs. Supply Voltage Disturbances 1.0 Maximum Envelope Duty Cycle 1.2 Ee min./Ee - Rel. Responsivity 4.0 Fig. 6 - Sensitivity in Bright Ambient 0.8 0.5 Correlation with ambient light sources: 10 W/m2 = 1.4 klx (std. ilum. A, T = 2855 K) 10 W/m2 = 8.2 klx (daylight, T = 5900 K) 4.5 Ee - Ambient DC Irradiance (W/m2) Fig. 3 - Output Function 0.7 5.0 1.0 0.8 0.6 0.4 f = f0 ± 5 % f (3 dB) = f0/7 0.2 0.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.7 16926 0.9 1.1 1.3 0 f/f0 - Relative Frequency Fig. 5 - Frequency Dependence of Responsivity Rev. 1.1, 13-Oct-15 20 40 60 80 100 Burst Length (Number of Cycles/Burst) Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length 3 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 Ee min. - Threshold Irradiance (mW/m2) www.vishay.com Vishay Semiconductors 0° 0.50 20° 30° 0.45 0.40 0.35 40° 0.30 1.0 0.25 0.20 0.15 0.9 50° 0.8 60° 0.10 70° 0.05 80° 0 -30 -10 10 30 50 70 90 0.6 Tamb - Ambient Temperature (°C) 0.4 0.2 0 drel - Relative Transmission Distance 21428 Fig. 9 - Sensitivity vs. Ambient Temperature Fig. 12 - Vertical Directivity 0.5 1.0 0.9 Ee min. - Sensitivity (mW/m2) S (λ) rel - Relative Spectral Sensitivity 10° 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 750 0.4 0.3 0.2 0.1 0 800 850 900 950 1000 1050 1100 1150 1 λ- Wavelength (nm) 21425 10° 3 4 5 6 VS - Supply Voltage (V) Fig. 10 - Relative Spectral Sensitivity vs. Wavelength 0° 2 20° Fig. 13 - Sensitivity vs. Supply Voltage 30° 40° 1.0 0.9 50° 0.8 60° 70° 80° 0.6 0.4 0.2 0 drel - Relative Transmission Distance 21427 Fig. 11 - Horizontal Directivity Rev. 1.1, 13-Oct-15 4 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors SUITABLE DATA FORMAT IR Signal This series is designed to suppress spurious output pulses due to noise or disturbance signals. The devices can distinguish data signals from noise due to differences in frequency, burst length, and envelope duty cycle. The data signal should be close to the device’s band-pass center frequency (e.g. 36 kHz) and fulfill the conditions in the table below. When a data signal is applied to the product in the presence of a disturbance, the sensitivity of the receiver is automatically reduced by the AGC to insure that no spurious pulses are present at the receiver’s output. Some examples which are suppressed are: 0 • DC light (e.g. from tungsten bulbs sunlight) 5 • Continuous signals at any frequency 10 15 20 Time (ms) 16920 Fig. 14 - IR Disturbance from Fluorescent Lamp with Low Modulation IR Signal • Strongly or weakly modulated patterns from fluorescent lamps with electronic ballasts (see fig. 14 or fig. 15) 0 16921 5 10 15 20 Time (ms) Fig. 15 - IR Disturbance from Fluorescent Lamp with High Modulation Rev. 1.1, 13-Oct-15 5 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 6.8 6.6 ± 0.1 3.2 (3.4) Mold residue Mold residue 2.5 (1.8) 1.2 ± 0.2 3 0.8 2.2 (0.635) (1) 1.27 (3 x) 0.5 ± 0.1 (4 x) technical drawings according to DIN specifications 3 x 1.27 = 3.81 Marking area 2.2 Not indicated tolerances ± 0.15 (1.65) Tool separation line (2.2) Proposed pad layout from component side (for reference only) 3 x 1.27 = 3.81 1.27 Pick and place area 1.8 (R1.3) Drawing-No.: 6.550-5297.01-4 Issue: 4; 13.09.11 0.8 22608 ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handle products only after the temperature has cooled off • Finish soldering within 3 s • Handling after reflow should be done only after the work surface has been cooled off Rev. 1.1, 13-Oct-15 6 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE 300 max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 T (°C) 200 max. 20 s 150 max. 100 s max. 120 s 100 max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s 50 0 0 50 100 150 t (s) 19800 200 250 300 max. 2 cycles allowed 0.3 3.6 TAPING VERSION TSOP..TR DIMENSIONS in millimeters 16 7.5 1.75 1.34 ref. Ø 1.5 4 Direction of feed 8 2 Ø 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5337.01-4 Issue: 2; 06.10.15 Rev. 1.1, 13-Oct-15 7 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors 3.65 0.3 TAPING VERSION TSOP..TT DIMENSIONS in millimeters 16 1.75 7.5 Ø 1.5 4 8 Direction of feed 2 Ø 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5338.01-4 Issue: 4; 12.06.13 Rev. 1.1, 13-Oct-15 8 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters 16734 LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 COVER TAPE PEEL STRENGTH LABEL According to DIN EN 60286-3 Standard bar code labels for finished goods 0.1 N to 1.3 N The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. 300 ± 10 mm/min. 165° to 180° peel angle Rev. 1.1, 13-Oct-15 9 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 Item-number INO 8 Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - LOT-/serial-number Mixed code indicator Origin Long bar code top MIXED CODE - xxxxxxx+ Company logo Type Length Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 Short bar code bottom Type Length Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 DRY PACKING After more than 72 h under these conditions moisture content will be too high for reflow soldering. The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 125 °C + 5 °C not suitable for reel or tubes. Aluminum bag Label An EIA JEDEC® standard J-STD-020 level 4 label is included on all dry bags. Reel LEVEL CAUTION This bag contains MOISTURE-SENSITIVE DEVICES 15973 FINAL PACKING 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 °C) must be 2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or 2b. Stored at < 5 % RH The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or 2a. or 2b. are not met. RECOMMENDED METHOD OF STORAGE 4. If baking is required, devices may be baked for: 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or 24 hours at 125 °C ± 5 °C not suitable for reels or tubes Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: Bag Seal Date: (If blank, see barcode label) Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 22522 • Storage temperature 10 °C to 30 °C EIA JEDEC standard J-STD-020 level 4 label is included on all dry bags • Storage humidity ≤ 60 % RH max. Rev. 1.1, 13-Oct-15 4 1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative humidity (RH) 10 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP75G36 www.vishay.com Vishay Semiconductors VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. 22178 Rev. 1.1, 13-Oct-15 11 Document Number: 82733 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000