Data Sheet

IP4350CX24
9-channel SD memory card interface ESD protection filter to
IEC 61000-4-2 level 4
Rev. 01 — 5 February 2010
Product data sheet
1. Product profile
1.1 General description
The IP4350CX24 is a diode array designed to provide protection to downstream
components against ElectroStatic Discharge (ESD) voltages as high as 15 kV.
The IP4350CX24 integrates 9 pairs of rail-to-rail diodes, 12 Zener diodes and 15 resistors
in a single wafer-level chip-scale package. It is fabricated using monolithic silicon
semiconductor technology and measures only 1.95 mm × 2.11 mm.
These features make the IP4350CX24 ideal for use in applications requiring a high degree
of miniaturization, such as mobile phone handsets, cordless telephones and personal
digital devices.
1.2 Features
n
n
n
n
n
n
n
n
n
n
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
All SD memory card channels with integrated ESD protection, EMI and RF filters
ESD protection up to 15 kV on 9 channels at output terminals
Integrated EMI and RF filters with pull-up resistors on 5 channels
Integrated EMI and RF filters on 4 channels
Additional SD card power supply protection
Wafer level chip-scale package with 0.4 mm pitch
Write protection, card detect biasing resistor integrated
Supports electrical card detection
Also available as IP4352CX24 with different filter behavior, same footprint
1.3 Applications
n
n
n
n
n
SD memory card interfaces in cellular and PCS mobile handsets
Cordless telephones
Digital still and video cameras
Media players
Card readers
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
2. Pinning information
2.1 Pinning
bump A1
index area
IP4350CX24
1
2
3
4
5
A
B
C
D
E
001aaj749
Transparent top view
Fig 1.
Pin configuration IP4350CX24
2.2 Pin description
Table 1.
Pin description
Symbol
Pin
Type[1]
Description
DATA2
A1
I/O
data 2 input or output
DATA3
A2
I/O
data 3 input or output
GND_H
A3
S
supply ground on host side
SDDATA2
A4
I/O
data 2 input or output on SD card side
SDDATA3
A5
I/O
data 3 input or output on SD card side
CD
B1
O
card detect output
CMD
B2
I/O
command input or output on host side
SDCD
B4
I
card detect intput
SDCMD
B5
I/O
command input or output on SD card side
DAT3_PD
C1
I
data 3 pull-down
WP
C2
O
write protect
DAT3_PU
C3
I
data 3 pull-up
SDWP
C4
O
write protect on SD card side
VSD
C5
S
memory card supply voltage
WP+CD
D1
I/O
write protect and card detect
CLK
D2
I/O
clock signal input or output
GND_C
D3
S
card supply ground
SDWP+CD
D4
I/O
write protect and card detect on SD card side
SDCLK
D5
I/O
clock signal on SD card side
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
2 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
Table 1.
Pin description …continued
Symbol
Pin
Type[1]
Description
DATA1
E1
I/O
data 1 input or output
DATA0
E2
I/O
data 0 input or output
GND_C
E3
S
card supply ground
SDDATA1
E4
I/O
data 1 input or output on SD card side
SDDATA0
E5
I/O
data 0 input or output on SD card side
[1]
I = input, O = output, I/O = input and output, S = power supply.
3. Ordering information
Table 2.
Ordering information
Type number
IP4350CX24
Package
Name
Description
Version
WLCSP24
wafer level chip-size package; 24 bumps; 1.95 × 2.11 × 0.61 mm
IP4350CX24/LF
4. Functional diagram
VSD
DAT3_PU
R11
R12
R13
R14
R15
R1
CLK
SDCLK
R2
CMD
SDCMD
R3
DATA0
SDDATA0
R4
DATA1
SDDATA1
R5
DATA2
SDDATA2
R6
DATA3
SDDATA3
R7
CD
SDCD
R8
WP
SDWP
R9
WP+CD
SDWP+CD
R21
DAT3_PD
GND_H
GND_C
001aaj750
Fig 2.
Schematic diagram IP4350CX24
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
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IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VI
input voltage
VESD
electrostatic discharge voltage
Min
Max
Unit
−0.5
+5.0
V
−8
+8
kV
−15
+15
kV
−2
+2
kV
IEC 61000-4-2, level 4; output pins A4,
A5, B4, B5, C4, C5, D4, D5, E4, E5
with pins A3, D3, E3 as ground
[1]
contact discharge
air discharge
IEC 61000-4-2, level 1, all other pins
with A3, D3, E3 as ground
contact discharge
−2
+2
kV
Pch
channel power dissipation
continuous power; Tamb = 70 °C
-
25
mW
Ptot
total power dissipation
Tamb = 70 °C
-
100
mW
Tstg
storage temperature
−55
+150
°C
Treflow(peak)
peak reflow temperature
-
260
°C
Tamb
ambient temperature
−30
+85
°C
air discharge
[1]
10 s maximum
Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the
specified level 4 (8 kV contact discharge).
6. Characteristics
Table 4.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rs(ch)
channel series resistance
R1 to R9
12
15
18
Ω
R11 to R14
35
50
65
kΩ
R15
3.29
4.7
6.11
kΩ
329
47
611
kΩ
each data channel from SD card
to I/O interface
-
8.8
-
pF
CLK channel
-
7.8
-
pF
DAT3_PD
-
6
-
pF
DAT3_PU
-
5
-
pF
R21
channel capacitance
Cch
including diode capacitance;
VI = 0 V; f = 1 MHz
[1]
VSD
-
37
-
pF
VBR
breakdown voltage
II = 1 mA
6
-
-
V
ILR
reverse leakage current
VI = 3 V
-
-
100
nA
[1]
Guaranteed by design.
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
4 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
7. Frequency response
Table 5.
Frequency response
Symbol
Parameter
Conditions
αil
insertion loss
all channels; Rsource = 50 Ω;
RL = 50 Ω
Table 6.
Symbol
Min
Typ
Max
Unit
f < 400 MHz
-
-
3
dB
400 MHz < f < 800 MHz
3
-
6
dB
800 MHz < f < 2.5 GHz
6
-
15
dB
2.5 GHz < f < 6.0 GHz
15
-
25
dB
Conditions
Min
Typ
Max
Unit
load 20 pF || 100 kΩ
-
2.3
-
ns
load 40 pF || 100 kΩ
-
3.4
-
ns
load 20 pF || 100 kΩ
-
2.4
-
ns
load 40 pF || 100 kΩ
-
3.5
-
ns
Time domain response[1]
Parameter
high speed Rsource = 50 Ω; tr = tf = 2
tr
rise time
tf
fall time
ns[2]
[1]
All rise or fall times measured using source with 0 V to 3 V steps, 10 % to 90 %.
[2]
Performed on all high speed lines (channels including R1 to R9, see Figure 2).
8. Application information
8.1 Insertion loss
The insertion loss measurement configuration of a typical NetWork Analyzer (NWA)
system is shown in Figure 3. The insertion loss is measured with a test PCB utilizing laser
drilled micro-via holes that connect the PCB ground plane to the IP4350CX24 ground
pins.
DUT
IN
50 Ω
OUT
TEST BOARD
50 Ω
Vgen
001aai718
Fig 3.
Frequency response set-up
The frequency response curves for all channels at frequencies up to 6 GHz are shown in
Figure 4 to Figure 7.
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
5 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
001aaj751
0
s21
(dB)
−10
(2)
−20
(1)
−30
−40
10−1
1
10
102
103
104
f (MHz)
(1) pin A1 to pin A4
(2) pin A2 to pin A5
Fig 4.
Measured insertion loss magnitudes
001aaj752
0
s21
(dB)
−10
(1)
(2)
−20
(3)
−30
−40
10−1
1
10
102
103
104
f (MHz)
(1) pin B1 to pin B4
(2) pin B2 to pin B5
(3) pin C2 to pin C5
Fig 5.
Measured insertion loss magnitudes
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
6 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
001aak050
0
s21
(dB)
(2)
−10
(1)
−20
−30
−40
10−1
1
10
102
103
104
f (MHz)
(1) pin D1 to pin D4
(2) pin D2 to pin D5
Fig 6.
Measured insertion loss magnitudes
001aak051
0
s21
(dB)
−10
(2)
−20
−30
(1)
−40
10−1
1
10
102
103
104
f (MHz)
(1) pin E1 to pin E4
(2) pin E2 to pin E5
Fig 7.
Measured insertion loss magnitudes
8.2 Crosstalk
The set-up for crosstalk measurements in a 50 Ω NWA system from one channel to
another is shown in Figure 8. Typical examples of crosstalk measurement results are
depicted in Figure 9, Figure 10 and Figure 11. Unused channels are terminated with 50 Ω
to ground.
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
7 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
IN_1
50 Ω
DUT
IN_2
50 Ω
OUT_2
OUT_1
TEST BOARD
50 Ω
50 Ω
Vgen
001aag220
Fig 8.
Crosstalk measurement configuration
001aaj797
−20
αct
(dB)
(1)
−40
(2)
−60
−80
−100
10−1
1
10
102
103
104
f (MHz)
(1) pin A1 to pin B4
(2) pin A1 to pin E4
Fig 9.
Crosstalk behavior between adjacent channels
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
8 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
001aaj795
−20
αct
(dB)
(2)
−40
(1)
−60
−80
−100
10−1
1
10
102
103
104
f (MHz)
(1) pin A2 to pin E5
(2) pin A2 to pin B5
Fig 10. Crosstalk behavior between adjacent channels
001aaj796
−20
αct
(dB)
−40
(2)
−60
(1)
−80
−100
10−1
1
10
102
103
104
f (MHz)
(1) pin C2 to pin E5
(2) pin C2 to pin D5
Fig 11. Crosstalk behavior between adjacent channels
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
9 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
9. Package outline
WLCSP24: wafer level chip-size package; 24 bumps; 1.95 x 2.11 x 0.61 mm
B
D
IP4350CX24
A
bump A1
index area
A2
E
A
A1
detail X
e1
e
b
E
e
D
e2
C
B
A
1
2
3
4
X
5
0
1
Dimensions
Unit
mm
2 mm
scale
A
A1
A2
b
D
E
max 0.66 0.22
0.31 2.00 2.16
nom 0.61 0.20 0.41 0.26 1.95 2.11
min 0.56 0.18
0.21 1.90 2.06
e
e1
e2
0.4
1.6
1.6
ip4350cx24_lf_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
09-04-06
09-07-15
IP4350CX24
Fig 12. Package outline IP4350CX24/LF (WLCSP24)
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
10 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
10. Soldering of WLCSP packages
10.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
10.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
10.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 7.
Table 7.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
11 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
10.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
10.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
10.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
12 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
10.3.4 Cleaning
Cleaning can be done after reflow soldering.
11. Abbreviations
Table 8.
Abbreviations
Acronym
Description
DUT
Device Under Test
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
NWA
NetWork Analyzer
PCB
Printed-Circuit Board
PCS
Personal Communication System
RFI
Radio Frequency Interference
RoHS
Restriction of Hazardous Substances
SD
Secure Digital
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4350CX24_1
20100205
Product data sheet
-
-
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
13 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Non-automotive qualified products — Unless the data sheet of an NXP
Semiconductors product expressly states that the product is automotive
qualified, the product is not suitable for automotive use. It is neither qualified
nor tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
IP4350CX24_1
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 01 — 5 February 2010
14 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use of
the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4350CX24_1
Product data sheet
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Rev. 01 — 5 February 2010
15 of 16
IP4350CX24
NXP Semiconductors
9-channel SD memory card interface ESD protection filter
15. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
4
5
6
7
8
8.1
8.2
9
10
10.1
10.2
10.3
10.3.1
10.3.2
10.3.3
10.3.4
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Frequency response . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 5
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Soldering of WLCSP packages. . . . . . . . . . . . 11
Introduction to soldering WLCSP packages . . 11
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Quality of solder joint . . . . . . . . . . . . . . . . . . . 12
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 February 2010
Document identifier: IP4350CX24_1
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