BGA Board Level Reliability

µModule BGA
Level 2 Interconnect
Reliability Data
CONTENTS
May 2013
Rider Card Details.…………………………………………….….……….2
Rider Card Reliability Results.………………………………...………….3
Daisy Chain Board Details……………………………………….…….....4
Daisy Chain Board Reliability Results…..…………………………….…5
Vibration Test Results……………………………………………………...6
Rider Card PCB Details
PCB Material
# Metal Layers
Board Size
Thickness
Pad Type
Pad Finish
Pad Size
Soldermask opening
Soldermask
thickness
Method for
Detecting
Interconnect Failure
FR-4 or Polyimide
4
1 1/2" x 1 1/4"
93 mils
SMD
NiAu
0.73mm diameter
0.63mm diameter
30µm
ATE,
Functional test
Page 2
RIDER CARD MOUNT TEMP CYCLE DATA FOR THE LTM46XX FAMILY
DATE
CODE
DEVICE
TYPE
PKG
TYPE
PKG DIM
1031
LTM4601A
BGA-133
15mm x 15mm x 3.42mm
1
LOTS
BOARD
SAMPLE
THICKNESS
SIZE
93 mils
77
0
77
CYCLES
ON TC
-40°C
TO
ATE
REJECTS +125°C
0
1,500
DEVICE
CYCLES
ON TC
-40°C
TO
SOLDER
+125°C
PASTE
115,500
SnAgCu
0
115,500
* 10 °C per minute ramp rate
* 10 minute dwell time
RIDER CARD MOUNT TEMP CYCLE DATA FOR THE LTM80XX FAMILY
DATE DEVICE
CODE TYPE
1036
1036
LTM8023
LTM8032
2
LOTS
PKG
TYPE
PKG DIM
BGA-50
BGA-71
11.25mm x 9mm x
3.42mm
15mm x 9mm x 3.42mm
BOARD
SAMPLE
THICKNESS
SIZE
93 mils
93 mils
80
82
0
162
CYCLES
ON TC
-40°C
ATE
TO
REJECTS +125°C
0
0
500
500
DEVICE
CYCLES
ON TC
-40°C
TO
SOLDER
+125°C
PASTE
40,000
41,000
SnAgCu
SnAgCu
0
81,000
* 10 °C per minute ramp rate
* 10 minute dwell time
Page 3
Daisy-Chain PCB Details
Material
# Metal Layers
Board Size
Thickness
Pad Type
Pad Finish
Pad Size
Soldermask opening
Soldermask
thickness
Test Vehicle
FR-4
6
6 1/4" x 6 1/4"
93 mils
SMD
NiAu
0.5mm diameter
0.4mm diameter
Method for
Detecting
Interconnect Failure
Daisy Chain
with Real-Time Resistivity
Monitor
Material
# Metal Layers
Board Size
Thickness
Pad Type
Pad Finish
FR-4
6
6 1/4" x 6 1/4"
93 mils
SMD
NiAu
0.73mm x 0.73mm /
0.73mm diameter
0.63mm x 0.63mm /
0.63mm diameter
Pad Size
Soldermask opening
Soldermask
thickness
Test Vehicle
Method for
Detecting
Interconnect Failure
30µm
LTM9008
30µm
LTM4601A
Daisy Chain
with Real-Time Resistivity
Monitor
Page 4
DAISY CHAIN TEMP CYCLE DATA
DATE
CODE
DEVICE
TYPE
PKG
TYPE
PKG DIM
BOARD
THICKNESS
SAMPLE
SIZE
CONT
REJS
CYCLES
ON TC
0°C TO
+100°C
0933
1031
1031
1031
1108
1110
LTM9008
LTM4601A
LTM4601A
LTM4601A
LTM9012
LTM2887
BGA-140
BGA-133
BGA-133
BGA-133
BGA-221
BGA-32
11.25mm x 9mm x 2.72mm
15mm x 15mm x 3.42mm
15mm x 15mm x 3.42mm
15mm x 15mm x 3.42mm
15mm x 11.25mm x 2.82mm
15mm x 11.25mm x 3.42mm
93 mils
93 mils
93 mils
93 mils
93 mils
93 mils
40
40
40
40
40
40
0
0
0
0
0
0
6,000
6,000
6,000
6,000
6,000
6,000
6
LOTS
240
0
DEVICE
CYCLES
ON TC
0°C TO
+100°C
SOLDER
PASTE
240,000
240,000
240,000
240,000
240,000
240,000
SnAgCu
SnAgCu
SnAgCu
PbSn
SnAgCu
SnAgCu
NOTES
0.8mm BGA pitch
Square Pad PCB
Round Pad PCB
1,440,000
* 10 °C per minute ramp
rate
* 10 minute dwell time
Page 5
VIBRATION TEST DATA
• Performed per MIL-STD-202G, METHOD 214A, TEST CONDITION I, LETTER F
• 30 minutes per axis
• 3 boards tested LTM4601ADC BGA
– 1 board Sn/Pb solder, 2 boards SAC305 solder
– 20 parts in each board
• All 3 boards passed with no fails
Page 6
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