µModule BGA Level 2 Interconnect Reliability Data CONTENTS May 2013 Rider Card Details.…………………………………………….….……….2 Rider Card Reliability Results.………………………………...………….3 Daisy Chain Board Details……………………………………….…….....4 Daisy Chain Board Reliability Results…..…………………………….…5 Vibration Test Results……………………………………………………...6 Rider Card PCB Details PCB Material # Metal Layers Board Size Thickness Pad Type Pad Finish Pad Size Soldermask opening Soldermask thickness Method for Detecting Interconnect Failure FR-4 or Polyimide 4 1 1/2" x 1 1/4" 93 mils SMD NiAu 0.73mm diameter 0.63mm diameter 30µm ATE, Functional test Page 2 RIDER CARD MOUNT TEMP CYCLE DATA FOR THE LTM46XX FAMILY DATE CODE DEVICE TYPE PKG TYPE PKG DIM 1031 LTM4601A BGA-133 15mm x 15mm x 3.42mm 1 LOTS BOARD SAMPLE THICKNESS SIZE 93 mils 77 0 77 CYCLES ON TC -40°C TO ATE REJECTS +125°C 0 1,500 DEVICE CYCLES ON TC -40°C TO SOLDER +125°C PASTE 115,500 SnAgCu 0 115,500 * 10 °C per minute ramp rate * 10 minute dwell time RIDER CARD MOUNT TEMP CYCLE DATA FOR THE LTM80XX FAMILY DATE DEVICE CODE TYPE 1036 1036 LTM8023 LTM8032 2 LOTS PKG TYPE PKG DIM BGA-50 BGA-71 11.25mm x 9mm x 3.42mm 15mm x 9mm x 3.42mm BOARD SAMPLE THICKNESS SIZE 93 mils 93 mils 80 82 0 162 CYCLES ON TC -40°C ATE TO REJECTS +125°C 0 0 500 500 DEVICE CYCLES ON TC -40°C TO SOLDER +125°C PASTE 40,000 41,000 SnAgCu SnAgCu 0 81,000 * 10 °C per minute ramp rate * 10 minute dwell time Page 3 Daisy-Chain PCB Details Material # Metal Layers Board Size Thickness Pad Type Pad Finish Pad Size Soldermask opening Soldermask thickness Test Vehicle FR-4 6 6 1/4" x 6 1/4" 93 mils SMD NiAu 0.5mm diameter 0.4mm diameter Method for Detecting Interconnect Failure Daisy Chain with Real-Time Resistivity Monitor Material # Metal Layers Board Size Thickness Pad Type Pad Finish FR-4 6 6 1/4" x 6 1/4" 93 mils SMD NiAu 0.73mm x 0.73mm / 0.73mm diameter 0.63mm x 0.63mm / 0.63mm diameter Pad Size Soldermask opening Soldermask thickness Test Vehicle Method for Detecting Interconnect Failure 30µm LTM9008 30µm LTM4601A Daisy Chain with Real-Time Resistivity Monitor Page 4 DAISY CHAIN TEMP CYCLE DATA DATE CODE DEVICE TYPE PKG TYPE PKG DIM BOARD THICKNESS SAMPLE SIZE CONT REJS CYCLES ON TC 0°C TO +100°C 0933 1031 1031 1031 1108 1110 LTM9008 LTM4601A LTM4601A LTM4601A LTM9012 LTM2887 BGA-140 BGA-133 BGA-133 BGA-133 BGA-221 BGA-32 11.25mm x 9mm x 2.72mm 15mm x 15mm x 3.42mm 15mm x 15mm x 3.42mm 15mm x 15mm x 3.42mm 15mm x 11.25mm x 2.82mm 15mm x 11.25mm x 3.42mm 93 mils 93 mils 93 mils 93 mils 93 mils 93 mils 40 40 40 40 40 40 0 0 0 0 0 0 6,000 6,000 6,000 6,000 6,000 6,000 6 LOTS 240 0 DEVICE CYCLES ON TC 0°C TO +100°C SOLDER PASTE 240,000 240,000 240,000 240,000 240,000 240,000 SnAgCu SnAgCu SnAgCu PbSn SnAgCu SnAgCu NOTES 0.8mm BGA pitch Square Pad PCB Round Pad PCB 1,440,000 * 10 °C per minute ramp rate * 10 minute dwell time Page 5 VIBRATION TEST DATA • Performed per MIL-STD-202G, METHOD 214A, TEST CONDITION I, LETTER F • 30 minutes per axis • 3 boards tested LTM4601ADC BGA – 1 board Sn/Pb solder, 2 boards SAC305 solder – 20 parts in each board • All 3 boards passed with no fails Page 6