463C-02

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−89, 3 LEAD
CASE 463C−03
ISSUE C
DATE 31 JUL 2003
SCALE 4:1
A
−X−
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 463C−01 OBSOLETE, NEW STANDARD 463C−02.
B −Y− S
K
G
2 PL
D
0.08 (0.003)
M
DIM
A
B
C
D
G
H
J
K
L
M
N
S
3 PL
X Y
N
M
C
J
−T−
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHOD
E
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
SEATING
PLANE
MILLIMETERS
MIN
NOM MAX
1.50
1.60
1.70
0.75
0.85
0.95
0.60
0.70
0.80
0.23
0.28
0.33
0.50 BSC
0.53 REF
0.10
0.15
0.20
0.30
0.40
0.50
1.10 REF
−−−
−−−
10 _
−−−
−−−
10 _
1.50
1.60
1.70
INCHES
NOM MAX
0.063 0.067
0.034 0.040
0.028 0.031
0.011 0.013
0.020 BSC
0.021 REF
0.004 0.006 0.008
0.012 0.016 0.020
0.043 REF
−−−
−−−
10 _
−−−
−−−
10 _
0.059 0.063 0.067
MIN
0.059
0.030
0.024
0.009
GENERIC
MARKING DIAGRAM*
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
3
xx D
1
H
2
H
xx = Specific Device Code
D = Date Code
L
*This information is generic. Please refer to
device data sheet for actual part
marking.
G
RECOMMENDED PATTERN
OF SOLDER PADS
DOCUMENT NUMBER:
STATUS:
98AON11472D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
 Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SC−89, 3 LEAD
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON11472D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PROCUTION. REQ. BY B. PICKARD
04 APR 2002
A
UPDATED DIM K. WAS 0.010 IN/MIN. ADDED NOMINAL DIM’S TO IN AND MM.
REQ. BY D. TRUHITTE
06 MAY 2002
B
ADDED STYLES 1 THRU 4, COPIED FROM CASE 463. ADDED DIM “S” ON DWG.
REQ. BY D. TRUHITTE
07 JAN 2003
C
FIXED TABLE HEADERS
31 JUL 2003
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
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and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
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SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
 Semiconductor Components Industries, LLC, 2003
July, 2003 − Rev. 03C
Case Outline Number:
463C
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