AIC FLIPTOPMOD5-TECH10 rev3

Mod5 Series 0.50mm Pitch
Flip-Top™ BGA Socket
www.advanced.com
The Mod5 Series Flip-Top™ BGA
Socket is designed for test, debug,
and validation of 0.50mm pitch BGA
devices. The compact design requires
no tooling or mounting holes in the
target PC board, maximizing real
estate while reducing board costs.
Flip-Top™ BGA Socket provides a
surface mount test solution for microBGA chipsets used in applications
such as handheld, mobile, and wireless product development. Precision
machined spring probes with industry
proven solder balls ensure high
TYPICAL APPLICATIONS
reliability performance.
■
Test, validation, and debug of 0.50mm pitch BGA devices
■
System and wafer test
■
Failure analysis
■
Package and chip qualification
■
Production prototype
How It Works
Chip
Support Plate
Features
■
Model shown accommodates BGA packages up to 12mm sq.
(22 x 22 rows) – larger sizes available upon request
■
Precision machined spring probes offer high bandwidth with
very low insertion loss
■
Compact size (small keepout zone) enables
use on existing board layouts
■
Flip-Top BGA Socket’s easy actuation with
simple cover and turn-screw heat sink
enables quick insertion and extraction
■
SMT design eliminates the cost of hardware and mounting
holes and their associated interference with traces on the PCB
■
Modular design of lower assembly enables simple reflow
process and is compatible with lead-free reflow profiles
■
Metallic probes offer proven reliability over elastomeric sockets
and long-life (spring probe contact system life is 200,000 cycles
minimum)
■
Additional mounting options and custom designs available
BGA Device
Upper
Assembly
Lower
Assembly
Solder lower assembly to PC board
Attach upper assembly using four
supplied screws.
Insert BGA device by hand or with the
aid of a vacuum pen (recommended).
Place device-specific chip support
plate (supplied) over device, close lid,
and screw down heat sink actuator for
device engagement.
© 2010-2016, Advanced Interconnections Corp. Specs. subject to change without notice. inch/(mm)
5 Energy Way, West Warwick, Rhode Island 02893 USA
Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723
E-mail: [email protected] | Web: www.advanced.com
Item FLIPTOPMOD5-TECH10 (Rev. 3)
Mod5 Series 0.50mm Pitch
Flip-Top ™ BGA Socket
www.advanced.com
Performance
Table of Models
Durability
Actuation cycles: 500 minimum
MOUNTING OPTIONS
SMT Standard
Current Carrying Capacity
2.8 Amps Max.
Terminal Type -860
Sn/Ag/Cu Solder Ball
.170
(4.32)
Note 1
Terminal Type -861
Sn/Pb Solder Ball
■
Probe Contact Force
18 g (per position)
Note 1: See Application Spec.
for recommended adhesive
(epoxy) instructions*
.012 Dia.
(0.30)
Bottom View
Probe Contact Resistance
80 mOhms
Return Loss*
Differential
-10db @ 2.6 GHz
-15db @ 1.3 GHz
MOUNTING/TERMINAL TYPE DESIGNATION
SMT/Screw Mount
Terminal Type -864
Sn/Ag/Cu Solder Ball
.170
(4.32)
Note 2
Single-Ended
-10db @ 8.0 GHz
-15db @ 3.5 GHz
Terminal Type -865
Sn/Pb Solder Ball
■
Note 2: Screws provided for
additional strain relief when
needed; reflow still required*
.012 Dia.
(0.30)
Bottom View
Insertion Loss*
Differential
-0.6db @ 2.6 GHz
-0.2db @ 1.3 GHz
SMT Plus
Terminal Type -862
Sn/Ag/Cu Solder Ball
Single-Ended
-2.1db @ 8.0 GHz
-0.9db @ 3.5 GHz
.170
(4.32)
Note 3
Terminal Type -863
Sn/Pb Solder Ball
■
*Complete SI Simulation Report
available online
.012 Dia.
(0.30)
Bottom View
Note 3: Additional solder balls
provided for strain relief in low
pin count SMT applications*
*See product Application Specification for complete mounting details.
Specifications
How To Order
For Device Packages up to 12mm Square
Body Size
0.79/(20mm) W x 1.06/(27mm) L
Height
0.68/(17.4mm)* approx. (*will vary based on
16 FR M
064 - 860 GG CS
Footprint Dash #
Turn-Screw Heat Sink
If Applicable*
CS - 1 Fin (standard)
HS - 3 Fins
Model Type
FR - Flip-Top™ BGA Socket
reflow profile, paste volume, etc.)
Terminal Plating
(Probe Termination)
GG - Gold
Pitch
M = .0197/(0.50mm)
Guide Box
Number of Positions
High Temp. Glass Filled Thermoplastic (PPS)
Screws: 18-8 Stainless Steel
*Footprints available online
Terminal Type
(Includes Mounting Option)
See Lead-free (RoHS) and Tin/Lead options
for each mounting style
Base Socket
FR-4 Glass Epoxy, U.L. Rated 94V-0
Lid, Latch, Heat Sink, and Support Plate
Anodized Aluminum
Spring Probe Terminals
Crown-point Plunger: Tool Steel, Gold Plated
Spring: Stainless Steel, Gold Plated
Terminal: Brass (C36000), Gold Plated
Solder Ball (Board Interface)
Lead-free (RoHS Compliant):
96.5Sn/3.0Ag/0.5Cu (SAC305)
■
4-point crown tip spring probes accurately align device solder balls,
leaving only minimal witness marks to preserve the solder ball integrity
■
Visit www.advanced.com to select a footprint or submit your device
mechanical specifications to [email protected]
■
Device mechanical specifications are required prior to ordering to
ensure accuracy of device-specific chip support plate
Tin/Lead:
63Sn/37Pb
5 Energy Way, West Warwick, Rhode Island 02893 USA
Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723
E-mail: [email protected] | Web: www.advanced.com
© 2010-2016, Advanced Interconnections Corp. Specs. subject to change without notice. inch/(mm)
For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents
Item FLIPTOPMOD5-TECH10 (Rev. 3)
Similar pages