Application Note Samsung Electronics LM561B (5630 G2) rev1.0 Index Page 1. Introduction 1.1 Product Description 1.1.1 Essential & Elementary light source (LM561B) 4 1.2 Product Information 1.2.1 Feature and Dimension 5 1.2.2 Product code and binning 6 1.2.3 Spectrum Distribution 9 1.2.4 Polar Intensity Diagram 9 2. Package Characteristics 2.1 Measurement DUT for Package Design Guide 10 2.2 Electrical Characteristics 11 2.3 Optical Characteristics 2.3.1 luminous Flux & Efficacy Ratio vs Current & Ts 12 2.3.2 Color Shift vs. Current & Ts 13 2.3.3 Viewing angle vs. CCT 14 2.4 Mechanical Characteristics 2.4.1 Thermal Resistance 15 2.4.2 Derating Curve 17 2 3. Caution 3.1 Mechanical Considerations 3.1.1 Handling Guide 19 3.1.2 Recommended Land Pattern 20 3.1.3 SMT Set 21 3.1.4 Reflow Profile 22 23 4. Revision History 3 1.1 Product Description 1.1.1 Essential & Elementary light source (LM561B) LM561B is up-graded basic lighting source from the original LED package LM561A. LM561B can contribute superior performance to illumination maker. LM561B satisfies global standard package form factor and has high luminous efficacy and harsh reliability properties. [ LM561B] LM561B LED package is adjustable to residential high-end LED-tube, FPL (Flat Panel LED), Bulb lighting and various non-directional applications. Traditional lamp LED illumination Incandescent Street MR PAR Fluorescent Bulb Down Light L-tube LED Lighting source LH351A LM561B 4 FPL 1.2 Product Information 1.2.1 Feature and Dimension With global standard package dimension, designer can get superior performance from LM561B. - Lead Frame Type LED Package : 5.6 x 3.0 x 0.8t mm - Four pad’s facilitate self-alignment in SMT process Anode (+) LED Zener Diode Cathode (-) LM561B is very attractive solution for the competitive TCO (total cost of ownership). - GaN / Al2O3 Chip & SMD type package - Eco-friendly : RoHS compliant Cathode(-) Anode(+) 0.8 (+) (+) 0.7 2.34 (-) 0.4 5.0 5.6 Anode mark [Side View] [ LM561B Package Dimension ] 5 0.98 [Bottom View] 0.8 [Top View] 1.68 0.25 (-) 2.3 3.0 4.6 0.97 1.01 0.32 Unit : ㎜ Tolerance : ±0.1 1.2 Product Information 1.2.2 Product code and binning LM561B has full color line-up. Product Code CCT [K] CRI (Min.) SPMWHT541MD5 WAW0S0 2700 80 SPMWHT541MD5 WAV0S0 3000 80 SPMWHT541MD5 WAU0S0 3500 80 SPMWHT541MD5 WAT0S0 4000 80 SPMWHT541MD5 WAR0S0 5000 80 SPMWHT541MD5 WAQ0S0 5700 80 SPMWHT541MD5 WAP0S0 6500 80 - Color CIE binning is according to ANSI bin and suitable for lighting application. - As for 5000K, 5700K, 6500K, 10 sub bins are operated. As for 2700K, 3000K, 3500K, 4000K, 16 sub bins are operated. 0.45 W V 2700K 0.43 U T 0.41 R Cy 0.39 0.37 0.35 Q P 3000K 3500K 4000K Black Body Locus ANSI C78.377A 5000K 5700K 6500K 0.33 0.31 0.29 0.29 6 0.33 0.37 0.41 Cx 0.45 0.49 LM561B has 3 kinds of parameter binning, - Voltage, Flux, Color - Luminous flux (Iv (Φv)) is divided by 3 rank – S1, S2, S3 @If=65mA Ts=25℃ 33 31 S3 29 27 S2 25 S1 (80Ra) P0-6500K (80Ra) Q0-5700K (80Ra) R0-5000K (80Ra) T0-4000K (80Ra) U0-3500K (80Ra) V0-3000K (80Ra) 23 W0-2700K Luminous Flux [lm] Luminous Flux Rank - S1. S2,S3 At the same typical forward voltage, luminous efficacy (lm/W) at each flux rank can be drawn as below graph. Luminous Efficacy @65mA @If=65mA Ts=25℃ 160 150 S3 140 S2 130 S1 120 7 (80Ra) P0-6500K (80Ra) Q0-5700K (80Ra) R0-5000K (80Ra) T0-4000K (80Ra) U0-3500K (80Ra) V0-3000K (80Ra) 110 W0-2700K Luminous Efficacy [lm/W] 170 2.6 2.7 AZ 2.8 A1 2.9 8 A2 3 A3 3.1 Forward Voltage [V] (80Ra) P0-6500K (80Ra) Q0-5700K (80Ra) R0-5000K (80Ra) T0-4000K (80Ra) U0-3500K (80Ra) V0-3000K (80Ra) W0-2700K Luminous Efficacy [lm/W] (80Ra) P0-6500K (80Ra) Q0-5700K (80Ra) R0-5000K (80Ra) T0-4000K (80Ra) U0-3500K (80Ra) V0-3000K (80Ra) W0-2700K Luminous Efficacy [lm/W] Luminous Efficacy @100mA 170 @If=100mA Ts=25℃ 160 150 140 S3 130 S2 120 S1 110 Luminous Efficacy @150mA 170 160 @If=150mA Ts=25℃ 150 140 S3 130 S2 120 110 S1 - Forward voltage(VF) is divided to 5 rank - A1,A2,A3,A4,A5 A4 3.2 3.3 1.2 Product Information 1.2.3 Spectrum Distribution Optical spectra of LM561B are shown as below at each CCT 3000K and 5000K. Measured data is just for representative reference only. ※ CCT: 3000K (X: 0.4350, Y: 0.3995) ※ CCT: 5000K (X: 0.3453, Y: 0.3564) 1.2.4 Polar Intensity Diagram Viewing angle describes the spatial distribution and the value is 120°(FWHM, Full width at half maximum), FWHM is the difference between the angles corresponding to 50% of the maximum intensity. 9 2.1 Measurement DUT for Package Design Guide CCT 5000K, CRI min. 80 CCT 2700K, CRI min. 80 McPCB (Metal printed circuit board) Thermal resistance : Thermal resistance : Thermal resistance : Thermal resistance : FR-PCB (FR4 printed circuit board) Ts point When choosing lighting source, designer deeply considers basic information of LED Copper electropackage such as physical dimension, thermal pad luminous flux rank, color binning, forward voltage and thermal properties. Datasheet of LM561B provides these official data and information to illumination designer. Beside datasheet, in this application note, more detail characteristics of LM561B are presented about electrical, optical, thermal and mechanical point of view. For this, several measurements are experimented and some graphs and tables are produced from these real testament. Therefore the purpose of these data is just for relative reference not official value. Each 2700K and 5000K CCT of LM561B are mounted on Metal-PCB and FRPCB individually. All data is measured at Ts point which is located on cathode copper area of PCB. Ts is a temperature of solder point beside package lead. DUT(Device under Test) is made up like as above picture. When LED is measured by pulse waves, electrical and optical characteristics have almost similar outputs in accordance with each color and PCB case(Metal, FR4). But color coordinate shows different migration from each color CCT. 10 2.2 Electrical Characteristics 160 Forward Current (mA) If constant current is driven into LED 140 package, forward voltage of the LED would be dropped as temperature 120 goes up, therefore IV curve would shift 100 left side. In right side graph, IV curve of 25℃ LM561B is shown at each Ts 50℃ 80 temperature. 75℃ Let us consider about power 60 85℃ consumption. From IV curve, power 40 consumption could be represented by 2.7 2.8 2.9 3.0 3.1 3.2 3.3 forward current or forward voltage. Forward Voltage (V) Below two graphs show these relations. [Forward Current vs. And these graphs show very Forward Voltage] meaningful point of driving. If driving mode is set by constant current mode, the variation of power consumption becomes more less than constant voltage mode over Ts temperature . In order to get stable lighting output, LED should be driven by constant current driving method. Forward Current vs. Power Consumption Forward Voltage vs. Power Consumption 3.3 Forward Voltage (V) Forward Current (mA) 160 140 120 100 25℃ 50℃ 75℃ 85℃ 80 60 40 3.2 3.1 3.0 25℃ 50℃ 75℃ 85℃ 2.9 2.8 2.7 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Power Consumption (W) 0.0 0.1 0.2 0.3 0.4 0.5 Power Consumption (W) [Power consumption with constant current mode] [Power consumption with constant voltage mode] 11 0.6 2.3 Optical Characteristics 2.3.1 luminous Flux & Efficacy Ratio vs. Current & Ts 220% 110% 25℃ Relative Efficacy Ratio (%) 210% 200% 190% 180% 170% Relative Luminous Flux Ratio (%) 160% 150% 140% 50℃ 100% 75℃ 85℃ 90% 80% 70% 40 50 60 70 80 90 100 110 120 130 140 150 130% Forward Current (mA) 120% 110% 25℃ 100% 50℃ [Relative Efficacy Ratio vs. Forward Current] 75℃ 90% At datasheet, luminous flux of each rank is presented. In left side graph, 70% relative luminous flux ratio is presented depending on each Ts temperature. 60% Each color CCT has similar flux ratio 50% between 2700K and 5000K. The 40% reference point of 100% flux ratio is 40 50 60 70 80 90 100 110 120 130 140 150 when driving current is 65mA, typical Forward Current (mA) operating current. Therefore we can [Relative Luminous Flux Ratio estimate 180% luminous flux ratio at vs. Forward Current] 140mA, 85℃ Ts. Voltage binning is also presented at datasheet. If under the same typical voltage of 2.95V, relative luminous efficacy ratio could be presented like as right side graph. At 60℃ Ts, 100mA, roughly 90% efficacy ratio could be expected. 85℃ 80% 12 2.3 Optical Characteristics 2.3.2 Color Shift vs. Current & Ts 0.410 0.44 WG 0.43 0.41 Cy Black Body Locus 0.40 Cy 0.42 0.39 0.408 WD 40mA 65mA 100mA 150mA 0.404 W4 W1 0.406 ANSI C78.377A 0.402 0.452 0.38 0.43 0.44 0.45 0.46 0.47 0.48 0.49 Cx 0.454 0.456 Cx 0.458 0.460 [2700K color shift vs. current & Ts] At datasheet, the variation of X,Y coordination over current is presented. In this note, the variation is shown on CIE coordination with current and Ts temperature. As driving current and Ts temperature increase, each color coordination is shift. These tendencies are come from the thermal effects of blue chip wavelength and phosphor. 0.39 0.38 RA 0.37 R6 R9 R4 R5 0.35 0.34 R3 R1 0.33 R7 R2 R8 ANSI C78.377A 0.32 0.33 Black Body Locus 0.34 Cx 0.35 0.36 Cy Cy 0.36 0.365 0.363 0.361 0.359 0.357 0.355 0.353 0.351 0.349 0.347 0.345 0.340 40mA 65mA 100mA 150mA 0.342 [5000K color shift vs. current & Ts] 13 0.344 Cx 0.346 0.348 2.3 Optical Characteristics 2.3.3 Viewing angle vs. color shift (Cx, Cy) X-asix Y-asix Y-asix 0.06 Cx 0.05 Cy 0.04 0.03 0.02 0.01 0.00 -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 Angle (degree) DCx, DCy (relative to Center) DCx, DCy (relative to Center) X-asix 0.06 Cx 0.05 Cy 0.04 0.03 0.02 0.01 0.00 -90-75-60-45-30-15 0 15 30 45 60 75 90 Angle (degree) [2700K Viewing Angle vs. Color Shift] 0.06 X-asix Y-asix 0.05 Cx 0.04 Cy 0.03 0.02 0.01 0.00 -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 Angle (degree) DCx, DCy (relative to Center) DCx, DCy (relative to Center) X-asix 0.06 Y-asix 0.05 Cx 0.04 Cy 0.03 0.02 0.01 0.00 -90-75-60-45-30-15 0 15 30 45 60 75 90 Angle (degree) [5000K Viewing Angle vs. Color Shift] 14 2.4 Mechanical Characteristics 2.4.1 Thermal Resistance [JESD 51-1, 51-14 DUT] Generally LED generates 2 kinds of major outputs. One is optic light and the other is heat. This property means that there is some relations between light output and heat dissipation. Therefore luminous flux, efficacy and color shift are related with real thermal conditions. Even though in a same LED packages, the properties of LED could be different with their thermal resistance. How fast heat dissipate and how much heat can be accumulated in a system are major design factor in LED illumination designing. In this note, the thermal resistance of LM561B is measured according to JEDEC Standards, JESD51-1, 51-14. We use T3Ster to evaluate thermal resistance and this is structure functions of LM561B. 15 1000000 K(W2s/K2) 10000 100 5000K_McPCB 2700K_McPCB 5000K_FRPCB 2700K_FRPCB Ⓓ Ⓑ Ⓒ Ⓐ Ⓔ 1 0.01 0.0001 1E-06 0 10 20 LED Chip Chip attach material to substrate Lead-Frame (substrate) Molding Solder to PCB PCB Solder Pads PCB Dielectric layer 30 Rth [K/W] 40 50 60 Phosphor Bonding wire PLED : Thermal Source TJ : Junction Temp. RJ-LF TLF : Lead Frame substrate RLF-S TS : Solder Temp. RJS : Junction-Solder RSB : Solder to Board TB : Board Temp. Aluminium Plate Classical TIM to heat-sink TC : Case Temp. RBC : Board to Case Heat Sink RCA : Case to Air TA : Ambient Temp. Tambient : Thermal Ground We could notice that thermal resistances are different from PCB type. Thermal resistance of LED Package itself is the sum of Ⓐ + Ⓑ. Then Rth of junction to solder is the sum of Ⓐ + Ⓑ + Ⓒ, 15℃/W, and LED Package have similar Rth. But Rth of System is different with PCB type. Rth of Metal PCB is the sum of Ⓐ + Ⓑ + Ⓒ + Ⓓ, and Rth of FR PCB is the sum of Ⓐ + Ⓑ + Ⓒ + Ⓔ. CCT 5000K, CRI min. 80 FR-PCB Rth (Package) Rth (System) McPCB CCT 2700K, CRI min. 80 FR-PCB McPCB Ⓐ+Ⓑ+Ⓒ Ⓐ+Ⓑ+Ⓒ Ⓐ+Ⓑ+Ⓒ Ⓐ+Ⓑ+Ⓒ Ⓐ+Ⓑ+Ⓒ+Ⓔ Ⓐ+Ⓑ+Ⓒ+Ⓓ Ⓐ+Ⓑ+Ⓒ+Ⓔ Ⓐ+Ⓑ+Ⓒ+Ⓓ 16 2.4 Mechanical Characteristics Forward current [mA] 2.4.2 Derating Curve 200 175 150 Rth(j-a) 50″/W 125 100 Rth(j-a) 100″/W 75 Rth(j-a) 150″/W 50 Rth(j-a) 200″/W 25 0 0 10 20 30 40 50 60 70 80 90 Ambient Temperature [℃] Max current level should be adopted differently to illumination system. In case of LH351A, the performance of max current doesn’t equal to every system conditions. Its performance is closely associated with system thermal resistance that is effected by total power consumption, ambient temperature and several material and mechanical aspects. At the worst condition, max current should be prohibited, more lower level of current should be applied to the LED. Therefore user needs a certain boundary curve in order to find optimal current level. Usually derating curve is used for these role and made by a linear function. in a certain LED module, thermal resistance of system might be equated like as (A). If thermal resistance(Rj-a), max junction temperature(Tj) and max operating current(If_max) are known, we can find a linear function(D) – X-axis is ambient temperature(Ta) and Y-axis is reliable forward current(If). Rj a If Tj Ta P Tj Ta V f R j a Tj Ta I f V f I f V f R j a Tf Ta ------ (B) ------ (A) Tj 1 Ta ------ (C) V f R j a V f R j a I f a Ta b ------ (D) 17 1 cons tan t a Vf Rj a Tj cons tan t b Vf Rj a CASE IF [mA] Module Circuit Thermal System P [W] /LED TJ [℃] Ts [℃] Ta [℃] [℃/W] ① 100 6S*3P FR-PCB 0.3 115 110 25 300 ② 100 6S*3P McPCB 0.3 70 65 25 150 ③ 150 6S*3P McPCB 0.45 92 85 25 150 ④ 100 6S*6P McPCB 0.3 95 90 25 240 ⑤ 150 6S*6P McPCB 0.45 124 117 25 220 ⑥ 150 6S*6P McPCB + H/S 0.45 75 68 25 110 CASE ① ②, ③ ④, ⑤ 200 ⑥ 175 6S*3P 6S*3P 6S*6P 6S*6P IF [mA] 150 Top view Rj-a ③⑤⑥ 125 100 75 ①②④ 50 25 Bottom / Side view 0 0 10 20 30 40 50 60 70 80 90 FR-PCB McPCB McPCB + Heat Sink Ta[℃] To understand derating curve, several cases are tested. In case of ①, 18EA of LM561B are connected as 6 series and 3 parallel and LM561B is driven 100mA each. Ambient temperature(Ta) and LED solder temperature(Ts) could be measured. Then LED chip junction temperature(TJ) could be calculated from the thermal resistance of LM561B and power consumption. From these information, system thermal resistance becomes 300℃/W and TJ saturated at 115℃ which temperature slightly over TJ _max 110℃. Even though max current is 150mA, In this system max current must become 100mA not 150mA. As current increase over 100mA, TJ also increase beyond TJ _max 110℃ and then reliability of LED should be affected seriously by fatal damage. If user wants to increase driving current, system thermal resistance should be lower than before. In metal PCB Case ② ③, as thermal resistance becomes lower than 150℃/W, TJ also becomes lower than 70℃ and 92℃. Therefore user could acquire more margin from TJ _max . 18 3.1 Mechanical Considerations 3.1.1 Handling Guide Please use tweezers to grab LM561B at the base. Do not touch the silicon mold side with the tweezers or fingers. Correct Handling Incorrect Handling 19 3.1 Mechanical Considerations 3.1.2 Recommended Land Pattern 20 3.1 Mechanical Considerations 3.1.3 SMT Set Taping Anode Mark (Cutting) Start End More than 40 mm Unloaded tape Mounted with More than 100~200mm Flash LED Unloaded tape Leading part more than (200~400)mm (1) Quantity : The quantity/reel to be 2,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2㎜ (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7 N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package 21 3.1 Mechanical Considerations 3.1.4 Reflow Profile Reflow conditions and work guide Below reflow profile is recommended for reflow soldering. Conditions can be changed in various soldering equipment and PCB. It is recommended that users follow the reflow guide line of a solder manufacturer For Manual Soldering Not more than 5 seconds @MAX300 ℃, under soldering iron. 22 Writer Date Revision History 2013.01.17 New Version 23 Drawn Approved Y.J. Lee D.M. Jeon