TO252 5

Package Outline Dimensions
TO252-5
E
b3
A
7°±1°
c2
L3
D
e
A2
H
b
b2
0.508
a
GAUGE PLANE
D1
E1
A1
SEATING PLANE
L
2.74REF
TO252-5
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.51 0.71 0.583
b2 0.61 0.79 0.70
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
1.27
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
TO252-5
X1
Dimensions
Y1
C
X
X1
Y
Y1
Y2
Y3
Y2
Y3
Y
X
Value
(in mm)
1.27
1.00
5.73
2.00
6.17
1.64
2.66
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ā€˜Zā€™ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-06-11
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
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