Package Outline Dimensions V-DFN3030-8 (Type M) A1 A3 A Seating Plane D D/2 k k1 E2 D2 E2a E D2a E/2 L V-DFN3030-8 (Type M) Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.203 BSC b 0.27 0.37 0.32 D 2.95 3.05 3.00 D2 2.50 2.70 2.60 D2a 2.50 2.70 2.60 e 0.65 BSC E 2.95 3.05 3.00 E2 0.59 0.79 0.69 E2a 0.59 0.79 0.69 L 0.30 0.40 0.35 k 0.180 0.280 0.230 k1 0.205 0.305 0.255 z 0.365 BSC All Dimensions in mm e z b Suggested Pad Layout V-DFN3030-8 (Type M) X3 X Y X2 X1 Y1 Y3 G Y2 G2 G1 C Dimensions Value (in mm) C 0.650 C1 0.688 G 0.260 G1 0.180 G2 0.325 X 0.370 X1 0.470 X2 0.545 X3 2.700 X4 2.470 Y 0.550 Y1 0.790 Y2 0.790 Y3 3.300 C1 X4 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-08 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated