Package Outline Dimensions W-DFN3030-16 (Type US) D E Pin #1 ID (Laser Mark) W-DFN3030-16 (Type US) Dim Min Max Typ A 0.70 0.80 0.75 A1 0 0.05 0.02 A3 0.20 REF b 0.18 0.30 0.25 D 2.90 3.10 3.00 D2 1.55 1.80 1.70 e 0.50 BSC E 2.90 3.10 3.00 E2 1.55 1.80 1.70 L 0.30 0.50 0.40 All Dimensions in mm A3 A Seating Plane A1 D2 e/2 E/2 E2 L b e D/2 Suggested Pad Layout W-DFN3030-16 (Type US) X3 X1 Y2 Y1 X2 Y C Dimensions Value (in mm) C 0.500 X 0.350 X1 0.570 X2 1.800 X3 3.300 Y 0.570 Y1 1.800 Y2 3.300 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-08 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated