Data Sheet

PCF8545
Universal LCD driver for multiplex rates up to 1:8
Rev. 1 — 13 November 2013
Product data sheet
1. General description
The PCF8545 is a peripheral device which interfaces to almost any Liquid Crystal Display
(LCD)1 with low multiplex rates. It generates the drive signals for any multiplexed LCD
containing up to eight backplanes, and up to 320 elements. The PCF8545 is compatible
with most microcontrollers and communicates via the two-line bidirectional I2C-bus
(PCF8545A) or a three line unidirectional SPI-bus (PCF8545B). Communication
overheads are minimized using a display RAM with auto-incremented addressing.
For a selection of NXP LCD segment drivers, see Table 40 on page 61.
2. Features and benefits











Single-chip 320 elements LCD controller and driver
Wide range for digital power supply: from 1.8 V to 5.5 V
LCD supply range from 2.5 V up to 5.5 V
LCD and logic supplies may be separated
Low power consumption
Selectable backplane drive configuration: 4, 6, or 8 backplane multiplexing
Selectable display bias configuration
320-bit RAM for display data storage
400 kHz I2C-bus interface (PCF8545A)
5 MHz SPI-bus interface (PCF8545B)
Programmable frame frequency in the range of 60 Hz to 300 Hz in steps of 10 Hz;
factory calibrated
 320 segments driven allowing:
 up to 40 7-segment alphanumeric characters
 up to 20 14-segment alphanumeric characters
 any graphics of up to 320 elements
 Manufactured in silicon gate CMOS process
3. Applications
 Industrial and consumer products
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 21.
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
4. Ordering information
Table 1.
Ordering information
Type number
Interface Package
type
Name
PCF8545ATT
I2C-bus
TSSOP56 plastic thin shrink small outline
SOT364-1
package; 56 leads; body width 6.1 mm
PCF8545BTT
SPI-bus
TSSOP56 plastic thin shrink small outline
SOT364-1
package; 56 leads; body width 6.1 mm
Description
Version
4.1 Ordering options
Table 2.
Ordering options
Product type number
Sales item (12NC)
Orderable part
number
IC
revision
Delivery form
PCF8545ATT/A
935302987118
PCF8545ATT/AJ
1
tape and reel, 13 inch
PCF8545BTT/A
935302988118
PCF8545BTT/AJ
1
tape and reel, 13 inch
5. Marking
Table 3.
Marking codes
Type number
PCF8545
Product data sheet
Marking code
PCF8545ATT/A
PCF8545ATT
PCF8545BTT/A
PCF8545BTT
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
6. Block diagram
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Block diagram of PCF8545A
PCF8545
Product data sheet
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Rev. 1 — 13 November 2013
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3 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 2.
Block diagram of PCF8545B
PCF8545
Product data sheet
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© NXP B.V. 2013. All rights reserved.
4 of 72
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NXP Semiconductors
Product data sheet
PCF8545
7. Pinning information
7.1 Pinning
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
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Top view. For mechanical details, see Figure 45.
Pin configuration for TSSOP56 (PCF8545ATT)
9''
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Top view. For mechanical details, see Figure 45.
Fig 4.
Pin configuration for TSSOP56 (PCF8545BTT)
PCF8545
5 of 72
© NXP B.V. 2013. All rights reserved.
9''
966
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6 Universal LCD driver for multiplex rates up to 1:8
Rev. 1 — 13 November 2013
All information provided in this document is subject to legal disclaimers.
6
6
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
7.2 Pin description
Table 4.
Pin description of PCF8545ATT and PCF8545BTT
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
Pin
Symbol
Type
Description
1 to 11
S9 to S19
output
LCD segment
20 to 31
S20 to S31
output
LCD segment
43
RESET
input
active LOW reset input
44
VSS
supply
ground supply voltage
45
VDD
supply
supply voltage
46
OSCCLK
input/output
external clock input/internal oscillator
output
47
VLCD[1]
supply
LCD supply voltage
48 to 56
S0 to S8
output
LCD segment
Pin layout depending on backplane swap configuration[2]
BPS = 0[3]
BPS = 1
12
BP0
S32
13
BP1
S33
14
BP2
S34
15
BP3
S35
16
BP4/S43
S36
17
BP5/S42
S37
18
BP6/S41
S38
19
BP7/S40
S39
32
S32
BP7/S40
33
S33
BP6/S41
34
S34
BP5/S42
35
S35
BP4/S43
36
S36
BP3
37
S37
BP2
38
S38
BP1
39
S39
BP0
output
LCD backplane/LCD segment
Pin layout depending on product and bus type
PCF8545ATT PCF8545BTT
40
A0
CE
41
SCL
SCL
42
SDA
SDI
PCF8545
Product data sheet
input
I2C-bus slave address selection
input
SPI-bus chip enable - active LOW
input
I2C-bus serial clock
input
SPI-bus serial clock
input/output
I2C-bus serial data
input
SPI-bus data input
[1]
VLCD must be equal to or greater than VDD.
[2]
Effect of backplane swapping is illustrated in Figure 5 on page 9.
[3]
Bit BPS is explained in Section 8.1.3 on page 8.
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6 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
8. Functional description
The PCF8545 is a versatile peripheral device designed to interface any microcontroller to
a wide variety of LCDs. It can directly drive any multiplexed LCD containing up to eight
backplanes and up to 44 segments.
8.1 Commands of PCF8545
The PCF8545 is controlled by 9 commands, which are defined in Table 5. Any other
combinations of operation code bits that are not mentioned in this document may lead to
undesired operation modes of PCF8545.
Table 5.
Commands of PCF8545
Command name
Register
selection
RS[1:0][1]
Bits
Reference
7
6
5
4
3
2
1
0
initialize
0
0
0
0
0
1
0
1
1
0
Section 8.1.1
OTP-refresh
0
0
1
1
1
1
0
0
0
0
Section 8.1.2
mode-settings
0
0
0
1
0
1
BPS
INV
PD
E
Section 8.1.3
oscillator-control
0
0
0
0
0
1
1
EFR
COE
OSC
Section 8.1.4
set-MUX-mode
0
0
0
0
0
0
0
0
M[1:0]
Section 8.1.5
set-bias-mode
0
0
0
0
0
0
0
1
B[1:0]
Section 8.1.6
frame-frequency
0
0
0
0
1
FD[4:0]
load-data-pointer
0
0
1
0
DP[5:0]
write-RAM-data
0
1
D[7:0]
[1]
Section 8.1.7
Section 8.1.8
Section 8.1.9
Information about control byte and register selection see Section 9.1 on page 36.
8.1.1 Command: initialize
This command generates a chip-wide reset. It has the same function as the RESET pin.
Reset takes 1 ms to complete.
Table 6.
Initialize - initialize command bit description
Bit
Symbol
Value
Description
7 to 0
-
00010110
fixed value
8.1.2 Command: OTP-refresh
During production of the device, each IC is calibrated to achieve the specified accuracy of
the frame frequency. This calibration is performed on EPROM cells called One Time
Programmable (OTP) cells. The device reads these cells every time the OTP-refresh
command is sent. The OTP-refresh command has to be sent after a reset has been made
and before the display is enabled.
This command will be completed after a maximum of 30 ms and requires either the
internal or external clock to run. If the internal oscillator is not used, then a clock must be
supplied to the OSCCLK pin. If the OTP-refresh instruction is sent and no clock is present,
then the request is stored until a clock is available.
Remark: It is recommended not to enter power-down mode during the OTP refresh cycle.
PCF8545
Product data sheet
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
Table 7.
OTP-refresh - OTP-refresh command bit description
Bit
Symbol
Value
Description
7 to 0
-
11110000
fixed value
8.1.3 Command: mode-settings
Table 8.
Bit
Symbol
Value
Description
7 to 4
-
0101
fixed value
3
BPS
2
1
0
8.1.3.1
Mode-settings - mode settings command bit description
backplane swapping
0[1]
backplane configuration 0
1
backplane configuration 1
INV
set inversion mode
0[1][2]
Driving scheme A: LCD line inversion mode
1
Driving scheme B: LCD frame inversion mode
PD
set power mode
1
power-down mode; backplane and segment
outputs are connected to VSS and the internal
oscillator is switched off
0[1]
power-up mode
E
display switch
[1]
Default value.
[2]
See Section 8.1.3.2.
0[1]
display disabled; backplane and segment
outputs are connected to VSS
1
display enabled
Backplane swapping
Backplane swapping can be configured with the BPS bit (see Table 8). It moves the
location of the backplane and the associated segment outputs from one side of the
PCF8545 to the other. Backplane swapping is sometimes desirable to aid with the routing
of PCBs that do not use multiple layers.
The BPS bit has to be set to the required value before enabling the display. Failure to do
so does not damage the PCF8545 or the display, however unexpected display content
may appear.
PCF8545
Product data sheet
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8 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Effect of backplane swapping
8.1.3.2
Line inversion (driving scheme A) and frame inversion (driving scheme B)
The DC offset of the voltage across the LCD is compensated over a certain period:
line-wise in line inversion mode (driving scheme A) or frame-wise in frame inversion mode
(driving scheme B). With the INV bit (see Table 8), the compensation mode can be
switched.
In frame inversion mode, the DC value is compensated across two frames and not within
one frame. Changing the inversion mode to frame inversion reduces the power
consumption; therefore it is useful when power consumption is a key point in the
application.
Frame inversion may not be suitable for all applications. The RMS voltage across a
segment is better defined; however, since the switching frequency is reduced, there is
possibility for flicker to occur.
The waveforms of Figure 14 on page 24 to Figure 17 on page 27 are showing line
inversion mode. Figure 18 on page 28 shows an example of frame inversion.
8.1.3.3
Power-down mode
The power-down bit (PD) allows the PCF8545 to be put in a minimum power
configuration. To avoid display artifacts, enter power-down only after the display has been
switched off by setting bit E to logic 0. During power-down, the internal oscillator is
switched off.
PCF8545
Product data sheet
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
Table 9.
Effect of the power-down bit (PD)
Effect on function
Mode settings
Effect of setting PD
0
1
backplane output
E=1
normal function
VSS
segment output
E=1
normal function
VSS
internal oscillator
OSC = 0, COE = 1
on
off
OSCCLK pin
OSC = 0, COE = 1
output of internal
oscillator frequency
VDD
OSCCLK pin
OSC = 1
input clock
clock input, can be
logic 0, logic 1, or left
floating
With the following sequence, the PCF8545 can be set to a state of minimum power
consumption, called power-down mode.
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Fig 6.
Recommended power-down sequence
Remarks:
• It is necessary to run the power-down sequence before removing the supplies.
Depending on the application, care must be taken that no other signals are present at
the chip input or output pins when removing the supplies (see Section 10). Otherwise
it may cause unwanted display artifacts. If an uncontrolled removal of the supply
happens, the PCF8545 does not get damaged.
• Static voltages across the liquid crystal display can build up when the external LCD
supply voltage (VLCD) is on while the IC supply voltage is off, or the other way around.
This may cause unwanted display artifacts. To avoid such artifacts, VLCD and VDD
must be applied or removed together.
PCF8545
Product data sheet
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
• A clock signal must always be supplied to the device when the display is active.
Removing the clock may freeze the LCD in a DC state, which is not suitable for the
liquid crystal. First disable the display and afterwards remove the clock signal.
8.1.3.4
Display enable
The display enable bit (E) is used to enable and disable the display. When the display is
disabled, all LCD outputs go to VSS. This function is implemented to ensure that no
voltage can be induced on the LCD outputs as it may lead to unwanted displays of
segments.
Recommended start-up sequences are found in Section 8.2.3
Remark: Display enable is not synchronized to an LCD frame boundary. Therefore using
this function to flash a display for prolonged periods is not recommended due to the
possible build-up of DC voltages on the display.
8.1.4 Command: oscillator-control
The oscillator-control command switches between internal and external oscillator and
enables or disables the pin OSCCLK. It is also defines the external frequency.
Table 10.
Oscillator-control - oscillator control command bit description
Bit
Symbol
Value
7 to 3
-
00011
2
EFR
1
0
[1]
Description
fixed value
external clock frequency applied on pin
OSCCLK
0[1]
9.6 kHz
1
230 kHz
COE
clock output enable for pin OSCCLK
0[1]
clock signal not available on pin OSCCLK;
pin OSCCLK is in 3-state
1
clock signal available on pin OSCCLK
OSC
oscillator source
0[1]
internal oscillator running
1
external oscillator used;
pin OSCCLK becomes an input;
used in combination with EFR to determine
input frequency
Default value.
The bits OSC, COE, and EFR control the source and frequency of the clock used to
generate the LCD signals (see Figure 7). Valid combinations are shown in Table 11.
PCF8545
Product data sheet
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11 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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(1) Can only be used with the internal oscillator (OSC = 0).
(2) Can only be used with an external oscillator (OSC = 1).
(3) Nominal value for divide factor q is 24; source clock is 230 kHz (see Section 8.1.7).
Fig 7.
Oscillator selection
Table 11.
OSC
COE
EFR
OSCCLK pin
Clock source
0
0
not used
inactive;
may be left floating
internal oscillator used
0
1
not used
output of internal oscillator
frequency (prescaler)
internal oscillator used
1
not used
0
9.6 kHz input
OSCCLK pin
1
not used
1
230 kHz input
OSCCLK pin
Table 12.
8.1.4.1
Valid combinations of bits OSC, EFR, and COE
Typical use of bits OSC, EFR, and COE
Usage
OSC
COE
EFR
LCD with internal oscillator
0
0
not used
LCD with external oscillator (230 kHz)
1
not used
1
LCD with external oscillator (9.6 kHz)
1
not used
0
Oscillator
The system is designed to operate from a 9.6 kHz or a 230 kHz clock. This clock can be
sourced internally or externally. The internal logic and LCD drive signals of the PCF8545
are timed either by the internal oscillator or from the clock externally supplied.
Internal clock: When the internal oscillator is used, all LCD signals are generated from it.
The oscillator runs at nominal 230 kHz. The relationship between this frequency and the
LCD frame frequency is detailed in Section 8.1.7. Control over the internal oscillator is
made with the OSC bit (see Section 8.1.4).
It is possible to make the internal oscillator signal available on pin OSCCLK by using the
oscillator-control command (see Table 10) and configuring the clock output enable (COE)
bit. If not required, the pin OSCCLK should be left open or connected to VSS. At power-on
the signal at pin OSCCLK is disabled and pin OSCCLK is in 3-state.
Clock output is only valid when using the internal oscillator. The signal appears on the
OSCCLK pin.
An intermediate clock frequency is available at the OSCCLK pin. The duty cycle of this
clock varies with the chosen divide ratio.
PCF8545
Product data sheet
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
Table 13.
OSCCLK pin state depending on configuration
PD
OSC
COE
EFR
OSCCLK pin[1]
power-down
n.a.
off
n.a.
3-state[2]
power-down
n.a.
on
n.a.
VDD
power-up
internal oscillator
off
n.a.
3-state
on
n.a.
9.6 kHz output[3]
n.a.
9.6 kHz
9.6 kHz input
230 kHz
230 kHz input
external oscillator
[1]
When RESET is active, the pin OSCCLK is in 3-state.
[2]
In this state, an external clock may be applied, but it is not a requirement.
[3]
9.6 kHz is the nominal frequency with q = 24, see Table 14.
External clock: In applications where an external clock must be applied to the PCF8545,
bit OSC (see Table 10) has to be set logic 1. In this case pin OSCCLK becomes an input.
The OSCCLK signal must switch between the VSS and the VDD voltage supplied to the
chip.
The EFR bit determines the external clock frequency (230 kHz or 9.6 kHz). The clock
frequency (fclk(ext)) in turn determines the LCD frame frequency, see Table 14.
Remark: If an external clock is used, then this clock signal must always be supplied to the
device when the display is on. Removing the clock may freeze the LCD in a DC state
which damages the LCD material.
8.1.4.2
Timing and frame frequency
The timing of the PCF8545 organizes the internal data flow of the device. This includes
the transfer of display data from the display RAM to the display segment outputs. The
timing also generates the LCD frame frequency which it derives as an integer division of
the clock frequency (see Table 14). The frame frequency is a fixed division of the internal
clock or of the frequency applied to pin OSCCLK when an external clock is used.
Table 14.
LCD frame frequencies
Frame frequency
Typical external Nominal frame
frequency (Hz)
frequency (Hz)
EFR bit
Value of q[1]
f clk  ext  9600
f fr  LCD  = ----------------48
200
0
-
f clk  ext  230000
f fr  LCD  = ----------------48  q
200
1
24
[1]
Other values of the frame frequency prescaler see Table 18.
When the internal clock is used, or an external clock with EFR = 1, the LCD frame
frequency can be programmed by software in steps of approximately 10 Hz in the range of
60 Hz to 300 Hz (see Table 18). Furthermore the internal oscillator is factory calibrated,
see Table 34 on page 50.
PCF8545
Product data sheet
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
8.1.5 Command: set-MUX-mode
The multiplex drive mode is configured with the bits described in Table 15.
Table 15.
Set-MUX-mode - set multiplex drive mode command bit description
Bit
Symbol
Value
Description
7 to 2
-
000000
fixed value
M[1:0]
00[1],
1:8 multiplex drive mode; eight backplanes
1 to 0
[1]
01
10
1:6 multiplex drive mode; 6 backplanes
11
1:4 multiplex drive mode; 4 backplanes
Default value.
8.1.6 Command: set-bias-mode
The set-bias-mode command allows setting the bias level.
Table 16.
Set-bias-mode - set bias mode command bit description
Bit
Symbol
Value
7 to 2
-
000001
fixed value
B[1:0]
00[1].
1⁄
4
bias
11
1⁄
3
bias
10
1⁄
2
bias
1 to 0
[1]
01
Description
Default value.
8.1.7 Command: frame-frequency
With the frame-frequency command, the frame frequency for the display can be
configured. The clock frequency determines the frame frequency.
Table 17.
Frame-frequency - frame frequency and output clock frequency command bit
description
Bit
Symbol
Value
Description
7 to 5
-
001
fixed value
4 to 0
FD[4:0]
see Table 18
frequency prescaler
When using an external clock it can be either a 230 kHz or a 9.6 kHz clock signal. The
EFR bit (see Table 10) has to be set according to the external clock frequency.
When EFR is set to 9.6 kHz, then the LCD frame frequency is calculated with Equation 1:
f clk  ext 
f fr  LCD  = ----------------48
(1)
When EFR is set to 230 kHz, then the LCD frame frequency is calculated with Equation 2:
f clk  ext 
f fr  LCD  = ----------------48  q
(2)
where q is the frequency divide factor (see Table 18).
Remark: fclk(ext) is the external input clock frequency to pin OSCCLK.
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Universal LCD driver for multiplex rates up to 1:8
When the internal oscillator is used, the intermediate frequency may be output on the
OSCCLK pin. Its frequency is given in Table 18.
Table 18.
Frame frequency prescaler values for 230 kHz clock operation
FD[4:0]
Nominal LCD frame
frequency (Hz)[1]
Divide factor, q
Intermediate clock
frequency (Hz)
00000
59.9
80
2875
00001
70.5
68
3382
00010
79.9
60
3833
00011
90.4
53
4340
00100
99.8
48
4792
00101
108.9
44
5227
00110
119.8
40
5750
00111
129.5
37
6216
01000
140.9
34
6765
01001
149.7
32
7188
01010
159.7
30
7667
01011
171.1
28
8214
01100
177.5
27
8519
01101
191.7
25
9200
01110[2]
199.7
24
9583
01111
208.3
23
10000
10000
217.8
22
10455
10001
228.3
21
10952
10010
239.6
20
11500
10011
252.2
19
12105
10100
266.2
18
12778
10101
281.9
17
13529
10110
299.5
16
14375
10111 to 11111
not used
[1]
Nominal frame frequency calculated for the default clock frequency of 230 kHz.
[2]
Default value.
8.1.8 Command: load-data-pointer
The load-data-pointer command defines the start address of the display RAM. The data
pointer is auto incremented after each RAM write. The size of the display RAM is
dependent on the current multiplex drive mode setting, see Table 19.
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Universal LCD driver for multiplex rates up to 1:8
Table 19.
Load-data-pointer - load data pointer command bit description
Bit
Symbol
Value
Description
7 to 6
-
10
fixed value
000000[1] to
100111
6-bit binary value of 0 to 39
000000[1] to
101001
6-bit binary value of 0 to 41
000000[1] to
101011
6-bit binary value of 0 to 43
Multiplex drive mode 1:8
5 to 0
DP[5:0]
Multiplex drive mode 1:6
5 to 0
DP[5:0]
Multiplex drive mode 1:4
5 to 0
[1]
DP[5:0]
Default value.
Remark: Data pointer values outside of the valid range are ignored and no RAM content
is transferred until a valid data pointer value is set.
Filling of the display RAM is described in Section 8.9.
8.1.9 Command: write-RAM-data
This command initiates the transfer of data to the display RAM. Data is written into the
address defined by the load-data-pointer command. RAM filling is described in
Section 8.9.
Table 20.
Write-RAM-data - write RAM data command bit description[1]
Bit
Symbol
Value
Description
7 to 0
D[7:0]
00000000 to
11111111
writing data byte-wise to RAM
[1]
For this command to be effective bit RS[1:0] of the control byte has to be set logic 01, see Table 25 on
page 36.
8.2 Start-up and shut-down
8.2.1 Reset and Power-On Reset (POR)
After a reset and at power-on the PCF8545 resets to starting conditions as follows:
1. The display is disabled.
2. All backplane outputs are set to VSS.
3. All segment outputs are set to VSS.
4. Selected drive mode is: 1:8 with 1⁄4 bias.
5. The data pointers are cleared (set logic 0).
6. RAM data is not initialized. Its content can be considered to be random.
7. The internal oscillator is running; no clock signal is available on pin OSCCLK; pin
OSCCLK is in 3-state.
The reset state is as shown in Table 21.
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Universal LCD driver for multiplex rates up to 1:8
Table 21. Reset state
Reset state of configurable bits shown in the command table format for clarity.
Associated command
Bits
7
6
5
4
3
2
1
0
mode-settings
-
-
-
-
BPS = 0
INV = 0
PD = 0
E=0
oscillator-control
-
-
-
-
-
EFR = 0
COE = 0
OSC = 0
set-MUX-mode
-
-
-
-
-
-
M[1:0] = 00
-
-
B[1:0] = 00
set-bias-mode
-
-
-
-
frame-frequency
-
-
-
FD[4:0] = 01110
load-data-pointer
-
-
DP[5:0] = 000000
The first command sent to the device after the power-on event must be the initialize
command (see Section 8.1.1).
After Power-On Reset (POR) and before enabling the display, the RAM content should be
brought to a defined state by writing meaningful content (for example, a graphic)
otherwise unwanted display artifacts may appear on the display.
8.2.2 RESET pin function
The RESET pin of the PCF8545 sets all the registers to their default state. The reset state
is given in Table 21. The RAM contents remains unchanged. After the reset signal is
removed, the PCF8545 will behave in the same manner as after Power-On Reset (POR).
See Section 8.2.1 for details.
8.2.3 Recommended start-up sequences
This chapter describes how to proceed with the initialization of the chip in different
application modes.
In general, the sequence should always be:
1. Power-on the device,
2. set the display and functional modes,
3. fill the display memory and then
4. turn on the display.
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Universal LCD driver for multiplex rates up to 1:8
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Fig 8.
PCF8545
Product data sheet
Recommended start-up sequence when using the internal oscillator
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 9.
PCF8545
Product data sheet
Recommended start-up sequence when using an external clock signal
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8.3 Possible display configurations
The PCF8545 is a versatile peripheral device designed to interface between any
microcontroller to a wide variety of LCD segment or dot matrix displays (see Figure 10). It
can drive multiplexed LCD with 4, 6, or 8 backplanes and up to 44 segments.
The display configurations possible with the PCF8545 depend on the required number of
active backplane outputs. A selection of possible display configurations is given in
Table 22.
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Fig 10. Example of displays suitable for PCF8545
Table 22.
Selection of display configurations
Number of
Backplanes
Digits/Characters
Segments
Icons
7
segment[1]
14
segment[2]
Dot matrix/
Elements
8
40
320
40
20
320
6
42
252
31
15
252
4
44
176
22
11
176
[1]
7 segment display has 8 elements including the decimal point.
[2]
14 segment display has 16 elements including decimal point and accent dot.
All of the display configurations in Table 22 can be implemented in the typical systems
shown in Figure 11 and Figure 12.
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 12. Typical system configuration for the SPI-bus
The host microcontroller maintains the two line I2C-bus or a three line SPI-bus
communication channel with the PCF8545. The appropriate biasing voltages for the
multiplexed LCD waveforms are generated internally. The only other connections required
to complete the system are the power supplies (VDD, VSS, VLCD) and the LCD panel
selected for the application.
The minimum recommended values for external capacitors on VDD and VLCD are 100 nF
respectively. Decoupling of VLCD helps to reduce display artifacts. The decoupling
capacitors should be placed close to the IC with short connections to the respective
supply pin and VSS.
8.4 LCD voltage selector
The LCD voltage selector coordinates the multiplexing of the LCD in accordance with the
selected LCD drive configuration. The operation of the voltage selector is controlled by the
set-bias-mode command (see Table 16) and the set-MUX-mode command (see
Table 15).
Fractional LCD biasing voltages are obtained from an internal voltage divider. The biasing
configurations that apply to the preferred modes of operation, together with the biasing
characteristics as functions of VLCD and the resulting discrimination ratios (D), are given in
Table 23.
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Universal LCD driver for multiplex rates up to 1:8
Discrimination is a term which is defined as the ratio of the on and off RMS voltage across
a segment. It can be thought of as a measurement of contrast.
Table 23.
Preferred LCD drive modes: summary of characteristics
LCD bias
configuration
V off  RMS 
----------------------V LCD
V on  RMS 
---------------------V LCD
VLCD[2]
V on  RMS 
D = ----------------------- [1]
V off  RMS 
3
1⁄
2
0.433
0.661
1.527
2.309Voff(RMS)
4
1⁄
3
0.333
0.577
1.732
3.0Voff(RMS)
5
1⁄
4
0.331
0.545
1.646
3.024Voff(RMS)
3
1⁄
2
0.456
0.612
1.341
2.191Voff(RMS)
LCD multiplex
drive mode
Number of:
Backplanes
Levels
1:4 [3]
4
1:4
4
1:4
[3]
1:6
[3]
4
6
1:6
6
4
1⁄
3
0.333
0.509
1.527
3.0Voff(RMS)
1:6
6
5
1⁄
4
0.306
0.467
1.527
3.266Voff(RMS)
1:8 [3]
8
3
1⁄
2
0.467
0.586
1.254
2.138Voff(RMS)
4
1⁄
3
0.333
0.471
1.414
3.0Voff(RMS)
5
1⁄
4
0.293
0.424
1.447
3.411Voff(RMS)
1:8
[3]
1:8
8
8
[1]
Determined from Equation 5.
[2]
Determined from Equation 4.
[3]
In these examples, the discrimination factor and hence the contrast ratios are smaller. The advantage of
these LCD drive modes is a reduction of the LCD voltage VLCD.
A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD
threshold voltage (Vth(off)), typically when the LCD exhibits approximately 10 % contrast.
1
Bias is calculated by ------------- , where the values for a are
1+a
a = 1 for 1⁄2 bias
a = 2 for 1⁄3 bias
a = 3 for 1⁄4 bias
The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 3
V on  RMS  =
V LCD
a 2 + 2a + n
-----------------------------2
n  1 + a
(3)
where VLCD is the resultant voltage at the LCD segment and where the values for n are
n = 4 for 1:4 multiplex drive
n = 6 for 1:6 multiplex drive
n = 8 for 1:8 multiplex drive
The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 4:
V off  RMS  =
V LCD
a 2 – 2a + n
-----------------------------2
n  1 + a
(4)
Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 5:
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PCF8545
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Universal LCD driver for multiplex rates up to 1:8
V on  RMS 
D = ----------------------- =
V off  RMS 
2
a + 2a + n
--------------------------2
a – 2a + n
(5)
VLCD is sometimes referred to as the LCD operating voltage.
8.4.1 Electro-optical performance
Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The
RMS voltage, at which a pixel gets switched on or off, determine the transmissibility of the
pixel.
For any given liquid, there are two threshold values defined. One point is at 10 % relative
transmission (at Vth(off)) and the other at 90 % relative transmission (at Vth(on)), see
Figure 13. For a good contrast performance, the following rules should be followed:
V on  RMS   V th  on 
(6)
V off  RMS   V th  off 
(7)
Von(RMS) and Voff(RMS) are properties of the display driver and are affected by the selection
of a, n (see Equation 3 to Equation 5) and the VLCD voltage.
Vth(off) and Vth(on) are properties of the LCD liquid and can be provided by the module
manufacturer. Vth(off) is sometimes named Vth. Vth(on) is sometimes named saturation
voltage Vsat.
It is important to match the module properties to those of the driver in order to achieve
optimum performance.
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PCF8545
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Universal LCD driver for multiplex rates up to 1:8
8.5 LCD drive mode waveforms
8.5.1 1:4 Multiplex drive mode
When four backplanes are provided in the LCD, the 1:4 multiplex drive mode applies, as
shown in Figure 14. This drawing is also showing the case of line inversion (see
Section 8.1.3.2).
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Vstate1(t) = VSn(t)  VBP0(t). Vstate2(t) = VSn(t)  VBP1(t).
Von(RMS)(t) = 0.577VLCD. Voff(RMS)(t) = 0.333VLCD.
Fig 14. Waveforms for the 1:4 multiplex drive mode with 1⁄3 bias and line inversion
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Universal LCD driver for multiplex rates up to 1:8
8.5.2 1:6 Multiplex drive mode
When six backplanes are provided in the LCD, the 1:6 multiplex drive mode applies. The
PCF8545 allows use of 1⁄3 bias or 1⁄4 bias in this mode as shown in Figure 15 and
Figure 16. These waveforms are drawn for the case of line inversion (see
Section 8.1.3.2).
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Vstate1(t) = VSn(t)  VBP0(t). Vstate2(t) = VSn +1 (t)  VBP0(t). Von(RMS)(t) = 0.509VLCD. Voff(RMS)(t) = 0.333VLCD.
Fig 15. Waveforms for 1:6 multiplex drive mode with bias 1⁄3 and line inversion
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Vstate1(t) = VSn(t)  VBP0(t). Vstate2(t) = VSn + 1(t)  VBP0(t).
Von(RMS)(t) = 0.467VLCD. Voff(RMS)(t) = 0.306VLCD.
Fig 16. Waveforms for 1:6 multiplex drive mode with bias 1⁄4 and line inversion
PCF8545
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
8.5.3 1:8 Multiplex drive mode
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Vstate1(t) = VSn(t)  VBP0(t). Vstate2(t) = VSn + 1(t)  VBP0(t). Von(RMS)(t) = 0.424VLCD. Voff(RMS)(t) = 0.293VLCD.
Fig 17. Waveforms for 1:8 multiplex drive mode with bias 1⁄4 and line inversion
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Vstate1(t) = VSn(t)  VBP0(t). Vstate2(t) = VSn + 1(t)  VBP0(t). Von(RMS)(t) = 0.424VLCD. Voff(RMS)(t) = 0.293VLCD.
Fig 18. Waveforms for 1:8 multiplex drive mode with bias 1⁄4 and frame inversion
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Universal LCD driver for multiplex rates up to 1:8
8.6 Display register
The display register holds the display data while the corresponding multiplex signals are
generated.
8.7 Backplane outputs
The LCD drive section includes eight backplane outputs: BP0 to BP7. The backplane
output signals are generated based on the selected LCD multiplex drive mode.
• In 1:8 multiplex drive mode: BP0 to BP7 must be connected directly to the LCD.
• In 1:6 multiplex drive mode: BP0 to BP5 must be connected directly to the LCD.
• In 1:4 multiplex drive mode: BP0 to BP3 must be connected directly to the LCD.
8.8 Segment outputs
The LCD drive section includes up to 44 segment outputs (S0 to S43) which must be
connected directly to the LCD. The segment output signals are generated based on the
multiplexed backplane signals and with data resident in the display register. When less
segment outputs are required, the unused segment outputs must be left open-circuit. The
number of available segments depends on the multiplex drive mode selected.
Table 24.
Backplane and active segment combinations
Multiplex
drive mode
Active BPs
Active segments
1:8
BP0 to BP7
S0 to S39
1:6
BP0 to BP5
S0 to S41
1:4
BP0 to BP3
S0 to S43
8.9 Display RAM
The display RAM stores the LCD data. Depending on the multiplex drive mode, the
arrangement of the RAM is changed.
• multiplex drive 1:8: RAM is 40  8 bit
• multiplex drive 1:6: RAM is 42  6 bit
• multiplex drive 1:4: RAM is 44  4 bit
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NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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The display RAM bitmap shows the direct relationship between the display RAM column and the
segment outputs and between the bits in a RAM row and the backplane outputs.
Fig 19. Display RAM bitmap
Logic 1 in the RAM bit map indicates the on-state (Von(RMS)) of the corresponding LCD
element; similarly, logic 0 indicates the off-state (Voff(RMS)). For more information on
Von(RMS) and Voff(RMS), see Section 8.4.
There is a one-to-one correspondence between
• the bits in the RAM bitmap and the LCD elements,
• the RAM columns and the segment outputs,
• the RAM rows and the backplane outputs.
The display RAM bit map, Figure 19, shows row 0 to row 7 and column 0 to column 43.
Row 0 to row 7 correspond with the backplane outputs BP0 to BP7. Column 0 to column
43 correspond with the segment outputs S0 to S43. In multiplexed LCD applications, the
data of each row of the display RAM is time-multiplexed with the corresponding backplane
(row 0 with BP0, row 1 with BP1, and so on).
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Universal LCD driver for multiplex rates up to 1:8
When display data is transmitted to the PCF8545, the display bytes received are stored in
the display RAM in accordance with the selected LCD multiplex drive mode. The data is
stored as it arrives and depending on the current multiplex drive mode, data is stored in
quadruples, sextuples or bytes.
8.9.1 Data pointer
The addressing mechanism for the display RAM is realized using the data pointer. This
allows the loading of an individual display data byte, or a series of display data bytes, into
any location of the display RAM. The sequence commences with the initialization of the
data pointer by the load-data-pointer command (see Table 19).
Following this command, an arriving data byte is stored starting at the display RAM
address indicated by the data pointer.
The data pointer is automatically incremented in accordance with the chosen LCD
multiplex drive mode configuration. That is, after each byte is stored, the contents of the
data pointer are incremented
• by two (1:4 multiplex drive mode),
• by one or two (1:6 multiplex drive mode),
• by one (1:8 multiplex drive mode).
Multiplex drive 1:6 is a special case and is described later on.
When the address counter reaches the end of the RAM, it stops incrementing after the last
byte is transmitted. Redundant bits of the last byte and subsequent bytes transmitted are
discarded until the pointer is reset. To send new RAM data, the data pointer must be reset.
If an I2C-bus or SPI-bus data access is terminated early, then the state of the data pointer
is unknown. The data pointer must then be rewritten before further RAM accesses.
8.9.2 RAM filling in 1:4 multiplex drive mode
In the 1:4 multiplex drive mode the RAM is organized in four rows and 44 columns. The
eight transmitted data bits are placed in two successive display RAM columns of four rows
(see Figure 20). In order to fill the whole four RAM rows, 22 bytes need to be sent to the
PCF8545. After the last byte sent, the data pointer must be reset before the next RAM
content update. Additional data bytes sent and any data bits that spill over the RAM are
discarded.
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 20. Display RAM filling order in 1:4 multiplex drive mode
Depending on the start address of the data pointer, there is the possibility for a boundary
condition. This occurs when more data bits are sent than fit into the remaining RAM. The
additional data bits are discarded. See Figure 21.
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Fig 21. Boundary condition in 1:4 multiplex drive mode
8.9.3 RAM filling in 1:6 multiplex drive mode
In the 1:6 multiplex drive mode the RAM is organized in six rows and 42 columns. The
eight transmitted data bits are placed in such a way, that a column is filled up (see
Figure 22).
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 22. Display RAM filling order in 1:6 multiplex drive mode
The remaining bits are wrapped over into the next column. In order to fill the whole RAM,
31 and a half bytes need to be sent to the PCF8545. After the last byte sent, the data
pointer must be reset before the next RAM content update. Additional data bytes sent and
any data bits that spill over the RAM are discarded. Depending on the start address of the
data pointer, there are three possible boundary conditions. See Figure 23.
PCF8545
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33 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 23. Boundary condition in 1:6 multiplex drive mode
8.9.4 RAM filling in 1:8 multiplex drive mode
In the 1:8 multiplex drive mode the RAM is organized in eight rows and 40 columns. The
eight transmitted data bits are placed into eight rows of one display RAM column (see
Figure 24). In order to fill the whole RAM, 40 bytes need to be sent to the PCF8545. After
the last byte sent, the data pointer must be reset before the next RAM content update.
Additional data bytes sent are discarded.
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34 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
&ROXPQV
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Fig 24. Display RAM filling order in 1:8 multiplex drive mode
There are no boundary conditions in 1:8 multiplex drive mode.
PCF8545
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Universal LCD driver for multiplex rates up to 1:8
9. Bus interfaces
9.1 Control byte and register selection
After initiating the communication over the bus and sending the slave address (I2C-bus,
see Section 9.2) or subaddress (SPI-bus, see Section 9.3), a control byte follows. The
purpose of this byte is to indicate both, the content for the following data bytes (RAM, or
command) and to indicate that more control bytes will follow.
Typical sequences could be:
• Slave address/subaddress - control byte - command byte - command byte - command
byte - end
• Slave address/subaddress - control byte - RAM byte - RAM byte - RAM byte - end
• Slave address/subaddress - control byte - command byte - control byte - RAM byte end
In this way, it is possible to send a mixture of RAM and command data in one access or
alternatively, to send just one type of data in one access.
Table 25.
Control byte description
Bit
Symbol
7
CO
6 to 5
4 to 0
Value
Description
continue bit
0
last control byte
1
control bytes continue
RS[1:0]
register selection
-
00
command register
01
RAM data
10, 11
unused
-
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Fig 25. Control byte format
PCF8545
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
9.2 I2C-bus interface
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines must
be connected to a positive supply via a pull-up resistor when connected to the output
stages of a device. Data transfer may be initiated only when the bus is not busy.
9.2.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time is
interpreted as a control signal (see Figure 26).
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Fig 26. Bit transfer
9.2.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy.
A HIGH-to-LOW change of the data line, while the clock is HIGH, is defined as the START
condition (S).
A LOW-to-HIGH change of the data line, while the clock is HIGH, is defined as the STOP
condition (P).
The START and STOP conditions are shown in Figure 27.
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Fig 27. Definition of START and STOP conditions
9.2.3 System configuration
A device generating a message is a transmitter, a device receiving a message is the
receiver. The device that controls the message is the master and the devices which are
controlled by the master are the slaves. The system configuration is shown in Figure 28.
PCF8545
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 28. System configuration
9.2.4 Acknowledge
The number of data bytes transferred between the START and STOP conditions from
transmitter to receiver is unlimited. Each byte of 8 bits is followed by an acknowledge
cycle.
• A slave receiver which is addressed must generate an acknowledge after the
reception of each byte.
• Also a master receiver must generate an acknowledge after the reception of each
byte that has been clocked out of the slave transmitter.
• The device that acknowledges must pull-down the SDA line during the acknowledge
clock pulse, so that the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times must be considered).
• A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
Acknowledgement on the I2C-bus is shown in Figure 29.
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Fig 29. Acknowledgement on the I2C-bus
9.2.5 I2C-bus controller
The PCF8545 acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or
transmit data to an I2C-bus master receiver. Device selection depends on the I2C-bus
slave address.
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Universal LCD driver for multiplex rates up to 1:8
9.2.6 Input filters
To enhance noise immunity in electrically adverse environments, RC low-pass filters are
provided on the SDA and SCL lines.
9.2.7 I2C-bus slave address
Device selection depends on the I2C-bus slave address. Two different I2C-bus slave
addresses can be used to address the PCF8545 (see Table 26).
Table 26.
I2C slave address byte
Slave address
Bit
7
6
5
4
3
2
1
0
1
1
1
0
0
A0
R/W
MSB
0
LSB
The least significant bit of the slave address byte is bit R/W (see Table 27).
Table 27.
R/W-bit description
R/W
Description
0
write data
1
read data
Bit 1 of the slave address is defined by connecting the input A0 to either VSS (logic 0) or
VDD (logic 1). Therefore, two instances of PCF8545 can be distinguished on the same
I2C-bus.
9.2.8 I2C-bus protocol
The I2C-bus protocol is shown in Figure 30. The sequence is initiated with a START
condition (S) from the I2C-bus master which is followed by one of the two PCF8545 slave
addresses available. All PCF8545 with the corresponding A0 level acknowledge in
parallel to the slave address. But any PCF8545 with the alternative A0 level ignore the
whole I2C-bus transfer.
After acknowledgement, a control byte follows (see Section 9.1 on page 36).
The display bytes are stored in the display RAM at the address specified by the RAM data
pointer.
The acknowledgement after each byte is made only by the addressed PCF8545. After the
last data byte, the I2C-bus master issues a STOP condition (P). Alternatively a START
may be issued to RESTART an I2C-bus access.
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39 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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9.2.8.1
Status read out
Status read out for I2C-bus operation only. This command initiates the read-out of a fixed
value plus the slave address bit A0 from the PCF8545. The read-out function allows the
I2C master to confirm the existence of the device on the I2C-bus.
Table 28.
Status read out value
Bit
Symbol
Value
Description
7 to 1
-
0101010
fixed value
0
A0
0
read back value is 01010100
1
read back value is 01010101
If a readout is made, the R/W bit must be logic 1 and then the next data byte following is
provided by the PCF8545 as shown in Figure 31.
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Fig 31. I2C-bus protocol read mode
In the unlikely case that the chip has entered the internal test mode, detection of this state
is possible by using the modified status read-out detailed in Table 29. The read out value
is modified to indicate that the chip has entered an internal test mode.
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PCF8545
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Universal LCD driver for multiplex rates up to 1:8
Table 29.
Modified status read out value
Bit
Symbol
Value
Description
7 to 1
-
1111000
fixed value
0
A0
0
read back value is 1111 0000
1
read back value is 1111 0001
EMC detection: The PCF8545 is ruggedized against EMC susceptibility; however it is not
possible to cover all cases. To detect if a severe EMC event has occurred, it is possible to
check the responsiveness of the device by reading its register.
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PCF8545
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Universal LCD driver for multiplex rates up to 1:8
9.3 SPI-bus interface
Data transfer to the device is made via a 3 line SPI-bus (see Table 30). There is no output
data line. The SPI-bus is initialized whenever the chip enable line pin CE is inactive.
Table 30.
Serial interface
Symbol
Function
Description
input[1];
CE
chip enable
SCL
serial clock input
input may be higher than VDD
SDI
serial data input
input may be higher than VDD; input data is
sampled on the rising edge of SCL
[1]
active LOW
when HIGH, the interface is reset
The chip enable must not be wired permanently LOW.
9.3.1 Data transmission
The chip enable signal is used to identify the transmitted data. Each data transfer is a byte
with the Most Significant Bit (MSB) sent first.
The transmission is controlled by the active LOW chip enable signal CE. The first byte
transmitted is the subaddress byte.
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Fig 32. Data transfer overview
The subaddress byte opens the communication with a read/write bit and a subaddress.
The subaddress is used to identify multiple devices on one SPI-bus.
Table 31.
Subaddress byte definition
Bit
Symbol
7
R/W
6 to 5
SA[1:0]
4 to 0
-
Value
Description
data read or write selection
0
write data
1
read data
01
subaddress; other codes cause the device to
ignore data transfer
unused
After the subaddress byte, a control byte follows (see Section 9.1 on page 36).
PCF8545
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42 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Data transfers are terminated by de-asserting CE (set CE to logic 1).
Fig 33. SPI-bus write example
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In this example, the bias system is set to 1⁄3. The transfer is terminated by CE returning to logic 1. After the last bit is
transmitted, the state of the SDI line is not important.
Fig 34. SPI-bus example
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PCF8545
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Universal LCD driver for multiplex rates up to 1:8
10. Internal circuitry
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Fig 36. Device protection diagram for PCF8545B
11. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
CAUTION
Static voltages across the liquid crystal display can build up when the LCD supply voltage
(VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted
display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together.
PCF8545
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PCF8545
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Universal LCD driver for multiplex rates up to 1:8
12. Limiting values
Table 32. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
Conditions
Min
Max
Unit
supply voltage
0.5
+6.5
V
IDD
supply current
50
+50
mA
VLCD
LCD supply voltage
0.5
+6.5
V
IDD(LCD)
LCD supply current
50
+50
mA
VI
input voltage
0.5
+6.5
V
0.5
+6.5
V
10
+10
mA
on pins S0 to S39,
BP0 to BP7
0.5
+6.5
V
on pin SDA
0.5
+6.5
V
10
+10
mA
PCF8545ATT
on pins SDA,
OSCCLK, SCL, A0,
RESET
PCF8545BTT
on pins CE,
OSCCLK, SCL,
SDI, RESET
II
input current
VO
output voltage
IO
output current
ISS
ground supply current
50
+50
mA
Ptot
total power dissipation
-
400
mW
P/out
power dissipation per output
VESD
electrostatic discharge voltage
-
100
mW
HBM
[1]
-
3500
V
CDM
[2]
-
1250
V
Ilu
latch-up current
[3]
-
200
mA
Tstg
storage temperature
[4]
65
+150
C
Tamb
ambient temperature
40
+85
C
operating device
[1]
Pass level; Human Body Model (HBM), according to Ref. 6 “JESD22-A114”.
[2]
Pass level; Charge Device Model (CDM), according to Ref. 7 “JESD22-C101”.
[3]
Pass level; latch-up testing according to Ref. 8 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the store and transport requirements (see Ref. 12 “UM10569”) the devices have to be stored at a temperature of +8 C to
+45 C and a humidity of 25 % to 75 %.
PCF8545
Product data sheet
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45 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
13. Static characteristics
Table 33. Static characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 5.5 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
1.8
2.5
-
5.5
V
-
5.5
[1]
V
-
0.5
2
A
external 9.6 kHz clock
[2]
-
10
25
A
internal oscillator
[2]
-
30
60
A
power-down, see
Figure 38
[1][3]
-
7
15
A
[4]
-
55
140
A
VSS  0.5
-
VDD + 0.5
V
Supplies
VDD
supply voltage
VLCD
LCD supply voltage
VLCD  VDD
IDD(pd)
power-down mode supply current
IDD
supply current
IDD(LCD)
see Figure 37
LCD supply current
display active, see
Figure 39
Logic
VI
input voltage
VIL
LOW-level input voltage
on pins OSCCLK,
A0 and RESET
-
-
0.3VDD
V
VIH
HIGH-level input voltage
on pins OSCCLK,
A0 and RESET
0.7VDD
-
-
V
VO
output voltage
0.5
-
VDD + 0.5
V
VOH
HIGH-level output voltage
driving load of 50 A
on pins OSCCLK
0.8VDD
-
-
V
VOL
LOW-level output voltage
driving load of 50 A
on pins OSCCLK
-
-
0.2VDD
V
IOH
HIGH-level output current
output source current;
VOH = VDD  0.4 V
VDD = 1.8 V
0.7
1.6
-
mA
VDD  3.3 V
1.5
4.0
-
mA
VDD = 1.8 V
3
4
-
mA
VDD  3.3 V
5
10
-
mA
1
-
+1
A
on pin OSCCLK
IOL
LOW-level output current
output sink current;
VOL = 0.4 V
on pin OSCCLK
IL
leakage current
PCF8545
Product data sheet
Vi = VDD or VSS; on
pin OSCCLK
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
Table 33. Static characteristics …continued
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 5.5 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
I2C-bus[5]
On pins SCL and SDA
VI
input voltage
VSS  0.5
-
5.5
V
VIL
LOW-level input voltage
-
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
-
V
VO
output voltage
0.5
-
+5.5
V
IL
leakage current
VI = VDD or VSS
1
-
+1
A
LOW-level output current
output sink current
VDD = 1.8 V
3
5.5
-
mA
VDD = 3.3 V
5
9
-
mA
on pin SCL
VSS  0.5
-
5.5
V
on pins CE and SDI
VSS  0.5
-
VDD + 0.5
V
On pin SDA
IOL
SPI-bus
input voltage
VI
On pins SCL, CE and SDI
VIL
LOW-level input voltage
-
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
-
V
IL
leakage current
1
-
+1
A
VI = VDD or VSS
LCD outputs
VO
output voltage variation
on pins BP0 to BP7
[6]
-
2.5
+10
mV
on pins S0 to S43
[7]
-
2.5
+10
mV
VLCD = 5.5 V;
on pins BP0 to BP7
[8]
-
0.9
5.0
k
VLCD = 5.5 V;
on pins S0 to S43
[8]
-
1.5
6.0
k
output resistance
RO
[1]
Power-down mode is enabled; I2C-bus or SPI-bus inactive.
[2]
1:8 multiplex drive mode; 1⁄4 bias; display enabled; LCD outputs are open circuit; RAM is all written with logic 1; inputs at VSS or VDD;
default display prescale factor; I2C-bus or SPI-bus inactive.
[3]
Strongly linked to VLCD voltage. See Figure 38.
[4]
1:8 multiplex drive mode; 1⁄4 bias; display enabled; LCD outputs are open circuit; RAM is all written with logic 1; default display prescale
factor.
[5]
The I2C-bus interface of PCF8545 is 5 V tolerant.
[6]
Variation between any two backplanes on a given voltage level; static measured.
[7]
Variation between any two segments on a given voltage level; static measured.
[8]
Outputs measured one at a time.
PCF8545
Product data sheet
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47 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
DDD
,''
—$
7DPEž&
1:8 multiplex drive mode; 1⁄4 bias; internal oscillator; display enabled; LCD outputs are open circuit;
RAM is all written with logic 1; inputs at VSS or VDD; default display prescale factor; I2C-bus or
SPI-bus inactive. Typical is defined at VDD = 3.3 V, 25 C.
Fig 37. Typical IDD with respect to temperature
DDD
,''/&'
—$
9/&' 9
7DPEž&
Power-down mode is enabled; I2C-bus or SPI-bus inactive. Typical is defined at 25 C.
Fig 38. Typical IDD(LCD) in power-down mode with respect to temperature
PCF8545
Product data sheet
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48 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
DDD
,''/&'
—$
9/&' 9
7DPEž&
1:8 multiplex drive mode; 1⁄4 bias; display enabled; LCD outputs are open circuit; RAM is all written
with logic 1; default display prescale factor. Typical is defined at 25 C.
Fig 39. Typical IDD(LCD) when display is active with respect to temperature
PCF8545
Product data sheet
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49 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
14. Dynamic characteristics
Table 34. Dynamic characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 5.5 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
[1]
Min
Typ
Max
Unit
7800
9600
11040
Hz
fclk
clock frequency
output on pin
OSCCLK; VDD = 3.3 V
fclk(ext)
external clock frequency
EFR = 0
-
-
250000
Hz
t(RESET_N)
RESET_N pulse width
LOW time
400
-
-
ns
External clock source used on pin OSCCLK
tclk(H)
clock HIGH time
33
-
-
s
tclk(L)
clock LOW time
33
-
-
s
[1]
Frequency present on OSCCLK with default display frequency division factor.
DDD
IFON
N+]
9''9
(1) 40 C.
(2) 25 C.
(3) 85 C.
Fig 40. Typical clock frequency with respect to VDD and temperature
WFON+
IFONH[W
WFON/
9''
26&&/.
9''
DDD
External clock source used on pin OSCCLK.
Fig 41. Driver timing waveforms
PCF8545
Product data sheet
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50 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
W5(6(7/
5(6(7
9''
DDD
Fig 42. RESET timing
Table 35. Timing characteristics: I2C-bus
VDD = 1.8 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. All timing values are valid within the
operating supply voltage and temperature range and referenced to VIL and VIH with an input voltage swing of VSS to VDD.
Timing waveforms see Figure 43.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
400
kHz
Pin SCL
[1]
fSCL
SCL clock frequency
tLOW
LOW period of the SCL clock
1.3
-
-
s
tHIGH
HIGH period of the SCL clock
0.6
-
-
s
tSU;DAT
data set-up time
100
-
-
ns
tHD;DAT
data hold time
0
-
-
ns
Pin SDA
Pins SCL and SDA
tBUF
bus free time between a STOP
and START condition
1.3
-
-
s
tSU;STO
set-up time for STOP condition
0.6
-
-
s
tHD;STA
hold time (repeated) START
condition
0.6
-
-
s
tSU;STA
set-up time for a repeated START
condition
0.6
-
-
s
tr
rise time of both SDA and SCL
signals
fSCL = 400 kHz
-
-
0.3
s
fSCL = 100 kHz
-
-
1.0
s
-
-
0.3
s
tf
fall time of both SDA and SCL
signals
tVD;ACK
data valid acknowledge time
[2]
0.6
-
-
s
tVD;DAT
data valid time
[3]
0.6
-
-
s
Cb
capacitive load for each bus line
-
-
400
pF
-
-
50
ns
[4]
pulse width of spikes that must be
suppressed by the input filter
tSP
[1]
The minimum SCL clock frequency is limited by the bus time-out feature, which resets the serial bus interface if either the SDA or SCL
is held LOW for a minimum of 25 ms. The bus time-out feature must be disabled for DC operation.
[2]
tVD;ACK = time for acknowledgement signal from SCL LOW to SDA output LOW.
[3]
tVD;DAT = minimum time for valid SDA output following SCL LOW.
[4]
Input filters on the SDA and SCL inputs suppress noise spikes of less than 50 ns.
PCF8545
Product data sheet
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© NXP B.V. 2013. All rights reserved.
51 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
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Fig 43. I2C-bus timing waveforms
Table 36. Timing characteristics: SPI-bus
VDD = 1.8 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C. All timing values are valid within the operating supply voltage and
temperature range and referenced to VIL and VIH with an input voltage swing of VSS to VDD. Timing waveforms see Figure 44.
Symbol
Parameter
Conditions
VDD < 2.7 V
VDD  2.7 V
Min
Max
Min
Max
Unit
fclk(SCL)
SCL clock frequency
-
2
-
5
MHz
tSCL
SCL time
500
-
200
-
ns
tclk(H)
clock HIGH time
200
-
80
-
ns
tclk(L)
clock LOW time
200
-
80
-
ns
tr
rise time
for SCL signal
-
100
-
100
ns
tf
fall time
for SCL signal
-
100
-
100
ns
tsu(CE_N)
CE_N set-up time
150
-
80
-
ns
th(CE_N)
CE_N hold time
0
-
0
-
ns
trec(CE_N)
CE_N recovery time
100
-
100
-
ns
tsu
set-up time
set-up time for
SDI data
10
-
5
-
ns
th
hold time
hold time for SDI
data
25
-
10
-
ns
PCF8545
Product data sheet
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
52 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
&(
WVX&(B1
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W6&/
WFON+
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WUHF&(B1
WK&(B1
6&/
WFON/
WVX
WK
6',
E
E
E
DDD
Fig 44. SPI-bus timing
PCF8545
Product data sheet
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
53 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
15. Package outline
76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP
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Fig 45. Package outline SOT364-1 (TSSOP56)
PCF8545
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
54 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
PCF8545
Product data sheet
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Rev. 1 — 13 November 2013
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55 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
17. Packing information
17.1 Tape and reel information
7239,(:
‘'
3
:
SLQ
%
\
3
$
‘'
.
[
GLUHFWLRQRIIHHG
2ULJLQDOGLPHQVLRQVDUHLQPP
)LJXUHQRWGUDZQWRVFDOH
DDD
Fig 46. Tape and reel details for PCF8545ATT and PCF8545BTT
Table 37.
Carrier tape dimensions of PCF8545ATT and PCF8545BTT
Symbol
Description
Value
Unit
Compartments
A0
pocket width in x direction
8.65 to 8.9
mm
B0
pocket width in y direction
14.4 to 15.8
mm
K0
pocket depth
1.5 to 1.8
mm
P1
pocket hole pitch
12
mm
D1
pocket hole diameter
1.5 to 2.05
mm
Overall dimensions
PCF8545
Product data sheet
W
tape width
24
mm
D0
sprocket hole diameter
1.5 to 1.55
mm
P0
sprocket hole pitch
4
mm
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56 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
18.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCF8545
Product data sheet
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57 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
18.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 47) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 38 and 39
Table 38.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 39.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 47.
PCF8545
Product data sheet
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 47. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PCF8545
Product data sheet
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59 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
19. Footprint information for reflow soldering
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627
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+\
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Fig 48. Footprint information for reflow soldering of SOT364-1 (TSSOP56) package
PCF8545
Product data sheet
All information provided in this document is subject to legal disclaimers.
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60 of 72
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NXP Semiconductors
Product data sheet
PCF8545
20. Appendix
20.1 LCD segment driver selection
Table 40.
Selection of LCD segment drivers
Type name
Number of elements at MUX
VDD (V)
VLCD (V)
ffr (Hz)
1:1 1:2 1:3 1:4 1:6 1:8 1:9
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
Interface
Package
AECQ100
PCA8561AHN[5]
18
36
54
72
-
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 I2C
HVQFN32 Y
PCA8561BHN[5]
18
36
54
72
-
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 SPI
HVQFN32 Y
PCF8566TS
24
48
72
96
-
-
-
2.5 to 6
N
N
40 to 85
I2C
VSO40
N
40 to 85
I2C
TSSOP48 N
I2C
TSSOP48 Y
PCF85162T
32
64
96
128 -
-
-
2.5 to 6
69
1.8 to 5.5 2.5 to 6.5 82
N
N
32
64
96
128 -
-
-
1.8 to 5.5 2.5 to 8
110
N
N
40 to 95
PCA85262ATT
32
64
96
128 -
-
-
1.8 to 5.5 2.5 to 8
200
N
N
40 to 105 I2C
TSSOP48 Y
TSSOP48 N
TSSOP48 N
PCF8551ATT[5]
PCF8551BTT[5]
36
36
72
72
108 144 108 144 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to
128[1]
N
N
40 to 85
I2C
1.8 to 5.5 1.8 to 5.5 32 to
128[1]
N
N
40 to 85
SPI
256[1]
I2C
TSSOP48 Y
PCA8551ATT[5]
36
72
108 144 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to
N
N
40 to 105
PCA8551BTT[5]
36
72
108 144 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 SPI
TSSOP48 Y
PCF85176T
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 82
N
N
40 to 85
I2C
TSSOP56 N
N
40 to 95
I2C
TSSOP56 Y
N
N
40 to 105
I2C
TSSOP56 Y
N
N
40 to 85
I2C
TQFP64
N
N
40 to 95
I2C
TQFP64
Y
TSSOP56 N
PCA85176T
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 8
110
PCA85276ATT
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 8
PCF85176H
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 82
PCA85176H
PCF8553ATT[5]
40
40
80
80
120 160 120 160 -
-
-
1.8 to 5.5 2.5 to 8
N
200
82
N
1.8 to 5.5 1.8 to 5.5 32 to
128[1]
N
N
40 to 85
I2C
128[1]
40
80
120 160 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to
N
N
40 to 85
SPI
TSSOP56 N
PCA8553ATT[5]
40
80
120 160 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 I2C
TSSOP56 Y
-
1.8 to 5.5 1.8 to 5.5 32 to
256[1]
N
N
40 to 105 SPI
TSSOP56 Y
1.8 to 5.5 2.5 to 9
60 to
300[1]
N
N
40 to 95
I2C
TSSOP56 Y
300[1]
N
N
40 to 95
SPI
TSSOP56 Y
Y
Y[3]
40 to 95
I2C
TQFP64
Y
Y
Y[3]
40 to 95
SPI
TQFP64
Y
N
40 to 85
I2C
LQFP80
N
N
40 to 95
I2C
LQFP80
Y
PCA8553BTT[5]
PCA8546ATT[5]
40
-
80
-
120 160 -
176 -
-
-
61 of 72
© NXP B.V. 2013. All rights reserved.
PCA8546BTT[5]
-
-
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to
PCA8547AHT[5]
44
88
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to 300[1]
1.8 to 5.5 2.5 to 9
300[1]
PCA8547BHT[5]
PCF85134HL
PCA85134H
44
60
60
88
-
176 -
120 180 240 120 180 240 -
-
-
60 to
1.8 to 5.5 2.5 to 6.5 82
1.8 to 5.5 2.5 to 8
82
N
N
PCF8545
PCF8553BTT[5]
Universal LCD driver for multiplex rates up to 1:8
Rev. 1 — 13 November 2013
All information provided in this document is subject to legal disclaimers.
PCA85162T
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Selection of LCD segment drivers …continued
Type name
Number of elements at MUX
VDD (V)
VLCD (V)
ffr (Hz)
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
60 to 300[1]
Y
Y
1:1 1:2 1:3 1:4 1:6 1:8 1:9
40 to 105 I2C
LQFP80
Y
120 -
240 -
PCF8545ATT[5]
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to 300[1]
N
N
40 to 85
I2C
TSSOP56 N
PCF8545BTT[5]
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to 300[1]
N
N
40 to 85
SPI
TSSOP56 N
176 252 320 -
60 to
300[1]
N
N
40 to 85
I2C
TSSOP56 N
300[1]
-
-
2.5 to 5.5 2.5 to 9
AECQ100
60
-
-
Package
PCA8543AHL
PCF8536AT[4]
-
Interface
1.8 to 5.5 2.5 to 9
PCF8536BT[4]
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to
N
N
40 to 85
SPI
TSSOP56 N
PCA8536AT[4]
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
I2C
TSSOP56 Y
1.8 to 5.5 2.5 to 9
60 to
300[1]
N
N
40 to 95
SPI
TSSOP56 Y
60 to
300[1]
Y
Y[3]
40 to 85
I2C
TQFP64
300[1]
PCA8536BT[4]
PCF8537AH
44
88
-
176 252 320 176 276 352 -
1.8 to 5.5 2.5 to 9
N
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to
Y
40 to 85
SPI
TQFP64
N
PCA8537AH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y[3]
40 to 95
I2C
TQFP64
Y
PCA8537BH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y[3]
40 to 95
SPI
TQFP64
Y
2.5 to 5.5 2.5 to 9
60 to
300[1]
Y
Y[3]
40 to 105
I2C
LQFP80
Y
60 to
300[1]
Y
Y[3]
40 to 105
I2C
bare die
Y
-
1.8 to 5.5 1.8 to 5.5 32 to 128[1]
N
N
40 to 85
I2C, SPI
bare die
N
-
256[1]
N
40 to 105
I2C,
bare die
Y
N
40 to 85
I2C
bare die
N
I2C
60
120 -
PCA9620U
60
120 -
PCF8552DUG[5]
36
72
PCA8552DUG[5]
PCF8576DU
36
40
72
80
240 320 480 240 320 480 -
108 144 108 144 120 160 -
-
-
2.5 to 5.5 2.5 to 9
1.8 to 5.5 1.8 to 5.5 32 to
1.8 to 5.5 2.5 to 6.5 77
N
N
SPI
PCF8576EUG
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 77
N
N
40 to 85
bare die
N
PCA8576FUG[5]
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 8
N
N
40 to 105 I2C
bare die
Y
N
40 to 85
I2C
bare die
N
N
40 to 95
I2C
bare die
Y
I2C
PCF85133U
PCA85133U
80
80
160 240 320 160 240 320 -
PCA85233U
80
PCA8530DUG[5]
102 204 -
PCF85132U
PCA85132U
160 240 320 408 -
160 320 480 640 160 320 480 640 160 320 480 640 -
PCF8538UG[5]
102 204 -
PCA8538UG
102 204 -
-
-
1.8 to 5.5 2.5 to 6.5 82,
110[2]
1.8 to 5.5 2.5 to 8
110[2]
82,
N
N
40 to 105
bare die
Y
Y
Y[3]
40 to 105 I2C, SPI
bare die
Y
N
40 to 85
I2C
bare die
N
N
40 to 95
I2C
bare die
Y
N
N
40 to 95
I2C
bare die
Y
Y
Y[3]
40 to 85
I2C, SPI[2] bare die
N
Y
Y[3]
40 to 105
I2C,
Y
-
1.8 to 5.5 2.5 to 8
150,
-
-
2.5 to 5.5 4 to 12
45 to 300[1]
-
-
1.8 to 5.5 1.8 to 8
1.8 to 5.5 1.8 to 8
1.8 to 5.5 1.8 to 8
60 to
90[1]
60 to
90[1]
117 to
176[1]
408 612 816 918 2.5 to 5.5 4 to 12
45 to 300[1]
408 612 816 918 2.5 to 5.5 4 to 12
300[1]
[1]
Can be selected by command.
[2]
Can be selected by pin configuration.
45 to
N
220[2]
-
N
N
N
SPI[2]
bare die
PCF8545
62 of 72
© NXP B.V. 2013. All rights reserved.
PCA85232U
-
200
Universal LCD driver for multiplex rates up to 1:8
Rev. 1 — 13 November 2013
All information provided in this document is subject to legal disclaimers.
PCF8537BH
Y[3]
PCA9620H
NXP Semiconductors
Product data sheet
PCF8545
Table 40.
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Extra feature: Temperature sensor.
[4]
Extra feature: 6 PWM channels.
[5]
In development.
NXP Semiconductors
Product data sheet
PCF8545
[3]
PCF8545
63 of 72
© NXP B.V. 2013. All rights reserved.
Universal LCD driver for multiplex rates up to 1:8
Rev. 1 — 13 November 2013
All information provided in this document is subject to legal disclaimers.
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
21. Abbreviations
Table 41.
Acronym
PCF8545
Product data sheet
Abbreviations
Description
CDM
Charged-Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DC
Direct Current
EMC
ElectroMagnetic Compatibility
EPROM
Erasable Programmable Read-Only Memory
ESD
ElectroStatic Discharge
HBM
Human Body Model
I2C
Inter-Integrated Circuit bus
IC
Integrated Circuit
LCD
Liquid Crystal Display
LSB
Least Significant Bit
MSB
Most Significant Bit
MSL
Moisture Sensitivity Level
MUX
Multiplexer
OTP
One Time Programmable
PCB
Printed-Circuit Board
POR
Power-On Reset
RC
Resistance-Capacitance
RAM
Random Access Memory
RGB
Red Green Blue
RMS
Root Mean Square
SCL
Serial CLock line
SDA
Serial DAta line
SPI
Serial Peripheral Interface
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
64 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
22. References
[1]
AN10365 — Surface mount reflow soldering description
[2]
AN11267 — EMC and system level ESD design guidelines for LCD drivers
[3]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[4]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[5]
IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface-Mount Devices
[6]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[7]
JESD22-C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[8]
JESD78 — IC Latch-Up Test
[9]
JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[10] SNV-FA-01-02 — Marking Formats Integrated Circuits
[11] UM10204 — I2C-bus specification and user manual
[12] UM10569 — Store and transport requirements
PCF8545
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
65 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
23. Revision history
Table 42.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF8545 v.1
20131113
Product data sheet
-
-
PCF8545
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
66 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
24. Legal information
24.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
24.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
24.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCF8545
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
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PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
24.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
25. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCF8545
Product data sheet
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
68 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
26. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description of PCF8545ATT and
PCF8545BTT . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Commands of PCF8545 . . . . . . . . . . . . . . . . . .7
Initialize - initialize command bit description . . .7
OTP-refresh - OTP-refresh command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Mode-settings - mode settings command
bit description . . . . . . . . . . . . . . . . . . . . . . . . . .8
Effect of the power-down bit (PD). . . . . . . . . . .10
Oscillator-control - oscillator control
command bit description . . . . . . . . . . . . . . . . . 11
Valid combinations of bits OSC, EFR,
and COE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Typical use of bits OSC, EFR, and COE . . . . .12
OSCCLK pin state depending on configuration 13
LCD frame frequencies. . . . . . . . . . . . . . . . . . .13
Set-MUX-mode - set multiplex drive mode
command bit description . . . . . . . . . . . . . . . . .14
Set-bias-mode - set bias mode command
bit description . . . . . . . . . . . . . . . . . . . . . . . . .14
Frame-frequency - frame frequency and output
clock frequency command bit description . . . .14
Frame frequency prescaler values for 230 kHz
clock operation . . . . . . . . . . . . . . . . . . . . . . . .15
Load-data-pointer - load data pointer
command bit description. . . . . . . . . . . . . . . . . .16
Write-RAM-data - write RAM data
command bit description[1] . . . . . . . . . . . . . . . .16
Reset state . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Selection of display configurations . . . . . . . . . .20
Preferred LCD drive modes: summary of
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .22
Backplane and active segment combinations. .29
Control byte description . . . . . . . . . . . . . . . . . .36
I2C slave address byte . . . . . . . . . . . . . . . . . . .39
R/W-bit description . . . . . . . . . . . . . . . . . . . . . .39
Status read out value . . . . . . . . . . . . . . . . . . . .40
Modified status read out value . . . . . . . . . . . . .41
Serial interface . . . . . . . . . . . . . . . . . . . . . . . . .42
Subaddress byte definition . . . . . . . . . . . . . . . .42
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .45
Static characteristics . . . . . . . . . . . . . . . . . . . .46
Dynamic characteristics . . . . . . . . . . . . . . . . . .50
Timing characteristics: I2C-bus . . . . . . . . . . . .51
Timing characteristics: SPI-bus . . . . . . . . . . . .52
Carrier tape dimensions of PCF8545ATT
and PCF8545BTT . . . . . . . . . . . . . . . . . . . . . .56
SnPb eutectic process (from J-STD-020D) . . .58
Lead-free process (from J-STD-020D) . . . . . .58
Selection of LCD segment drivers . . . . . . . . . .61
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .64
Revision history . . . . . . . . . . . . . . . . . . . . . . . .66
PCF8545
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
69 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
27. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Fig 24.
Fig 25.
Fig 26.
Fig 27.
Fig 28.
Fig 29.
Fig 30.
Fig 31.
Fig 32.
Fig 33.
Fig 34.
Fig 35.
Fig 36.
Fig 37.
Fig 38.
Fig 39.
Fig 40.
Fig 41.
Fig 42.
Block diagram of PCF8545A . . . . . . . . . . . . . . . . .3
Block diagram of PCF8545B . . . . . . . . . . . . . . . . .4
Pin configuration for TSSOP56 (PCF8545ATT). . .5
Pin configuration for TSSOP56 (PCF8545BTT) . .5
Effect of backplane swapping . . . . . . . . . . . . . . . .9
Recommended power-down sequence . . . . . . . .10
Oscillator selection. . . . . . . . . . . . . . . . . . . . . . . .12
Recommended start-up sequence when
using the internal oscillator . . . . . . . . . . . . . . . . .18
Recommended start-up sequence when
using an external clock signal . . . . . . . . . . . . . . .19
Example of displays suitable for PCF8545 . . . . .20
Typical system configuration for the I2C-bus . . . .21
Typical system configuration for the SPI-bus. . . .21
Electro-optical characteristic: relative
transmission curve of the liquid . . . . . . . . . . . . . .23
Waveforms for the 1:4 multiplex drive mode
with 1⁄3 bias and line inversion . . . . . . . . . . . . . . .24
Waveforms for 1:6 multiplex drive mode with
bias 1⁄3 and line inversion. . . . . . . . . . . . . . . . . . .25
Waveforms for 1:6 multiplex drive mode with
bias 1⁄4 and line inversion. . . . . . . . . . . . . . . . . . .26
Waveforms for 1:8 multiplex drive mode with
bias 1⁄4 and line inversion. . . . . . . . . . . . . . . . . . .27
Waveforms for 1:8 multiplex drive mode with
bias 1⁄4 and frame inversion . . . . . . . . . . . . . . . . .28
Display RAM bitmap . . . . . . . . . . . . . . . . . . . . . .30
Display RAM filling order in 1:4 multiplex
drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Boundary condition in 1:4 multiplex drive mode .32
Display RAM filling order in 1:6 multiplex
drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Boundary condition in 1:6 multiplex drive mode .34
Display RAM filling order in 1:8 multiplex
drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Control byte format . . . . . . . . . . . . . . . . . . . . . . .36
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Definition of START and STOP conditions. . . . . .37
System configuration . . . . . . . . . . . . . . . . . . . . . .38
Acknowledgement on the I2C-bus . . . . . . . . . . . .38
I2C-bus protocol write mode . . . . . . . . . . . . . . . .40
I2C-bus protocol read mode. . . . . . . . . . . . . . . . .40
Data transfer overview . . . . . . . . . . . . . . . . . . . . .42
SPI-bus write example . . . . . . . . . . . . . . . . . . . . .43
SPI-bus example . . . . . . . . . . . . . . . . . . . . . . . . .43
Device protection diagram for PCF8545A . . . . . .44
Device protection diagram for PCF8545B . . . . . .44
Typical IDD with respect to temperature . . . . . . . .48
Typical IDD(LCD) in power-down mode with
respect to temperature. . . . . . . . . . . . . . . . . . . . .48
Typical IDD(LCD) when display is active with
respect to temperature. . . . . . . . . . . . . . . . . . . . .49
Typical clock frequency with respect to VDD
and temperature . . . . . . . . . . . . . . . . . . . . . . . . .50
Driver timing waveforms . . . . . . . . . . . . . . . . . . .50
RESET timing . . . . . . . . . . . . . . . . . . . . . . . . . . .51
PCF8545
Product data sheet
I2C-bus timing waveforms . . . . . . . . . . . . . . . . . . 52
SPI-bus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Package outline SOT364-1 (TSSOP56) . . . . . . . 54
Tape and reel details for PCF8545ATT and
PCF8545BTT . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Fig 47. Temperature profiles for large and small
components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Fig 48. Footprint information for reflow soldering of
SOT364-1 (TSSOP56) package . . . . . . . . . . . . . 60
Fig 43.
Fig 44.
Fig 45.
Fig 46.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
70 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
28. Contents
1
2
3
4
4.1
5
6
7
7.1
7.2
8
8.1
8.1.1
8.1.2
8.1.3
8.1.3.1
8.1.3.2
8.1.3.3
8.1.3.4
8.1.4
8.1.4.1
8.1.4.2
8.1.5
8.1.6
8.1.7
8.1.8
8.1.9
8.2
8.2.1
8.2.2
8.2.3
8.3
8.4
8.4.1
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 7
Commands of PCF8545 . . . . . . . . . . . . . . . . . . 7
Command: initialize . . . . . . . . . . . . . . . . . . . . . 7
Command: OTP-refresh . . . . . . . . . . . . . . . . . . 7
Command: mode-settings . . . . . . . . . . . . . . . . 8
Backplane swapping. . . . . . . . . . . . . . . . . . . . . 8
Line inversion
(driving scheme A)
and frame inversion
(driving scheme B) . . . . . . . . . . . . . . . . . . . . . . 9
Power-down mode . . . . . . . . . . . . . . . . . . . . . . 9
Display enable . . . . . . . . . . . . . . . . . . . . . . . . 11
Command: oscillator-control . . . . . . . . . . . . . 11
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Timing and frame frequency . . . . . . . . . . . . . . 13
Command: set-MUX-mode . . . . . . . . . . . . . . . 14
Command: set-bias-mode . . . . . . . . . . . . . . . 14
Command: frame-frequency . . . . . . . . . . . . . . 14
Command: load-data-pointer . . . . . . . . . . . . . 15
Command: write-RAM-data . . . . . . . . . . . . . . 16
Start-up and shut-down. . . . . . . . . . . . . . . . . . 16
Reset and Power-On Reset
(POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
RESET pin function . . . . . . . . . . . . . . . . . . . . 17
Recommended start-up sequences . . . . . . . . 17
Possible display configurations . . . . . . . . . . . 20
LCD voltage selector . . . . . . . . . . . . . . . . . . . 21
Electro-optical performance . . . . . . . . . . . . . . 23
LCD drive mode waveforms . . . . . . . . . . . . . . 24
1:4 Multiplex drive mode. . . . . . . . . . . . . . . . . 24
1:6 Multiplex drive mode. . . . . . . . . . . . . . . . . 25
1:8 Multiplex drive mode. . . . . . . . . . . . . . . . . 27
Display register . . . . . . . . . . . . . . . . . . . . . . . . 29
Backplane outputs . . . . . . . . . . . . . . . . . . . . . 29
Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 29
Display RAM . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.9.1
8.9.2
Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . .
RAM filling in 1:4 multiplex
drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.9.3
RAM filling in 1:6 multiplex
drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.9.4
RAM filling in 1:8 multiplex
drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . .
9
Bus interfaces . . . . . . . . . . . . . . . . . . . . . . . . .
9.1
Control byte and register selection . . . . . . . .
9.2
I2C-bus interface . . . . . . . . . . . . . . . . . . . . . .
9.2.1
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.2.2
START and STOP conditions. . . . . . . . . . . . .
9.2.3
System configuration . . . . . . . . . . . . . . . . . . .
9.2.4
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . .
9.2.5
I2C-bus controller . . . . . . . . . . . . . . . . . . . . . .
9.2.6
Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.2.7
I2C-bus slave address . . . . . . . . . . . . . . . . . .
9.2.8
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . .
9.2.8.1
Status read out. . . . . . . . . . . . . . . . . . . . . . . .
9.3
SPI-bus interface . . . . . . . . . . . . . . . . . . . . . .
9.3.1
Data transmission . . . . . . . . . . . . . . . . . . . . .
10
Internal circuitry . . . . . . . . . . . . . . . . . . . . . . .
11
Safety notes. . . . . . . . . . . . . . . . . . . . . . . . . . .
12
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
13
Static characteristics . . . . . . . . . . . . . . . . . . .
14
Dynamic characteristics. . . . . . . . . . . . . . . . .
15
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
16
Handling information . . . . . . . . . . . . . . . . . . .
17
Packing information . . . . . . . . . . . . . . . . . . . .
17.1
Tape and reel information . . . . . . . . . . . . . . .
18
Soldering of SMD packages . . . . . . . . . . . . . .
18.1
Introduction to soldering. . . . . . . . . . . . . . . . .
18.2
Wave and reflow soldering. . . . . . . . . . . . . . .
18.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
18.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
19
Footprint information
for reflow soldering. . . . . . . . . . . . . . . . . . . . .
20
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.1
LCD segment driver selection . . . . . . . . . . . .
21
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
22
References. . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
Revision history . . . . . . . . . . . . . . . . . . . . . . .
24
Legal information . . . . . . . . . . . . . . . . . . . . . .
24.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
24.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
31
32
34
36
36
37
37
37
37
38
38
39
39
39
40
42
42
44
44
45
46
50
54
55
56
56
57
57
57
57
58
60
61
61
64
65
66
67
67
67
continued >>
PCF8545
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
71 of 72
PCF8545
NXP Semiconductors
Universal LCD driver for multiplex rates up to 1:8
24.3
24.4
25
26
27
28
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
67
68
68
69
70
71
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 13 November 2013
Document identifier: PCF8545
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