Data Sheet

Data Sheet: JN5168-001-Myy
JenNet-IP, ZigBee PRO and IEEE802.15.4 Module
Overview
The JN5168-001-Myy family is a range of ultra low power, high performance surface mount
modules targeted at IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy and
RF4CE networking applications, enabling users to realise products with minimum time to
market and at the lowest cost. They remove the need for expensive and lengthy development
of custom RF board designs and test suites. The modules use NXP’s JN5168 wireless
microcontroller to provide a comprehensive solution with large memory, high CPU and radio
performance and all RF components included. All that is required to develop and manufacture
wireless control or sensing products is to connect a power supply and peripherals such as
switches, actuators and sensors, considerably simplifying product development.
Features: Module
•
2.4GHz IEEE 802.15.4, JenNet-IP,
ZigBee Light Link, ZigBee Smart Energy
and RF4CE compatible
•
JN5168-001-M00/03
up to 1km range (Ext antenna)
M00: integral antenna 16x30mm
M03: uFl connector 16x21mm
o
o
o
o
o
Four module variants are available: JN5168-001-M00 with an integrated antenna, JN5168-001M03 with an antenna connector and the JN5168-001-M05 and M06 with an antenna connector,
power amplifier and LNA for extended range. The JN5168-001-M05 output power has been
optimised for use in Europe and Asia.
•
Module Block Diagram
Integrated Antenna
Watchdog
Timer
Matching
M00 Option
uFl
Connector
2.4GHz
Radio
Including
Diversity
Matching
O-QPSK
Modem
uFl
Connector
PA / LNA
IEEE802.15.4
MAC
Accelerator
Matching
M05/M06 Option
Flash
64/160/256K
SPI Master & Slave
2-Wire Serial
(Master/Slave)
32 -Bit
RISC CPU
•
4xPWM + Timers
2x UART
M03 Option
External
Antenna
RAM
8/32K
Voltage
Brownout
Power
Management
4kB
EEPROM
Sleep Counter
Battery and Temp
Sensor
Power
9.5 dBm TX Power
Receiver sensitivity -96dBm
uFl connector
TX current 35mA
RX current 22mA
16x30mm
2.0-3.6V operation
JN5168-001-M06
up to 6km range (Ext 2 dBi Antenna)
o
o
o
o
o
o
o
20 DIO
4 Chan 10-bit ADC
128-bit AES
Encryption
Accelerator
JN5168-001-M05
up to 2km range (Ext 2dBi Antenna)
o
o
o
o
o
o
o
XTAL
TX power +2.5dBm
Receiver sensitivity –95dBm
TX current 15.3mA
RX current 17mA
2.0-3.6V operation
22dBm TX Power
Receiver sensitivity -100dBm
uFl connector
TX current 175mA
RX current 22mA
16x30mm
2.0-3.6V operation
Features: Microcontroller
Benefits
Applications
•
Microminiature module solutions
•
•
Ready to use in products
Robust and secure low power wireless
applications
•
Minimises product development
time
•
ZigBee and JenNet-IP networks
•
•
Home and commercial building
automation
No RF test required for systems
•
•
Utilities metering (e.g. AMR)
Compliant with
o FCC 47CFR Part 15C
o IC Canada RSS 210 Issue 8 Annex 8,
o ETSI EN 300-328 V1.7.1
o EN 301-489-17 V2.1.1
o EN60950-1-2006 +A1, A11, A12
•
Location Aware services (e.g. Asset
Tracking)
•
32-bit RISC CPU, up to 32MIPs with low
power
•
Data EEPROM with guaranteed 100k
write operations
•
RF4CE, JenNet-IP, ZigBee Smart
Energy stacks
•
JTAG debug interface
•
4-input 10-bit ADC, 1 comparator
•
5 x PWM (4 x timer, 1 x timer/counter)
•
2 UARTs
•
SPI Master & Slave port with 3 selects
•
2-wire serial interface
•
Toys and gaming peripherals
•
Battery and Temperature Sensor
•
Industrial systems
•
Watchdog timer and BOR
•
•
Telemetry
Remote Control
•
Up to 20 DIO
Industrial temp (-40°C to +85°C)
Lead-free and RoHS compliant
JN-DS-JN5168-001-Myy
© NXP Laboratories UK 2013
Contents
1. Introduction
3
1.1.
1.2.
3
3
Variants
Regulatory Approvals
2. Specifications
4
2.1.
5
JN5168 Single Chip Wireless Microcontroller
3. Pin Configurations
6
3.1.
3.2.
3.2.1
7
8
8
Pin Assignment
Pin Descriptions
Power Supplies
4. Electrical Characteristics
9
4.1.
4.2.
9
9
Maximum Ratings
Operating Conditions
Appendix A Additional Information
10
A.1
A.2
A.3
A.4
A.5
A.5.1
A.5.2
A.6
A.6.1
A.6.2
A.6.3
A.6.4
A.7
A.8
A.9
A.9.1
A.9.2
A.9.3
A.10
A.10.1
A.11
A.12
10
13
14
15
19
19
20
20
20
21
22
22
22
23
24
25
25
25
26
26
26
27
Outline Drawing
Module PCB Footprint
Optimal PCB placement of the JN5168-001-M00 Module
JN5168-001-M00 Antenna Radiation Pattern
Manufacturing
Reflow Profile
Soldering Paste and Cleaning
Tape and Reel Information
Tape Orientation and dimensions
Reel Dimensions
Cover tape details
Leader and Trailer
Related Documents
Ordering Information
Federal Communication Commission Interference Statement
Antennas approved by FCC for use with JN5168 modules
High Power Module usage limitation
FCC End Product Labelling
Industry Canada Statement
Industry Canada End Product Labelling
European R & TTE Directive 1999/5/EC Statement
RoHS Compliance
Status Information
Disclaimers
Trademarks
Version Control
Contact Details
ii
27
28
28
28
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
1. Introduction
The JN5168-001-Myy module family provides designers with a ready-made component that provides a fully
integrated solution for applications, using the IEEE802.15.4 standard in the 2.4-2.5GHz ISM frequency band [1],
including JenNet-IP and ZigBee Smart Energy, and can be quickly and easily included in product designs. The
modules integrate all of the RF components required, removing the need to perform expensive RF design and test.
Products can be designed by simply connecting sensors and switches to the module IO pins. The modules use
NXP’s single chip IEEE802.15.4 Wireless Microcontroller, allowing designers to make use of the extensive chip
development support material. Hence, this range of modules allows designers to bring wireless applications to
market in the minimum time with significantly reduced development effort and cost.
Four variants are available: JN5168-001-M00, JN5168-001-M03, JN5168-001-M05 and JN5168-001-M06. All
modules have FCC and Industry Canada modular approvals. All modules other than the JN5168-001-M06 are also
CE compliant and subject to a Notified Body Opinion.
The variants available are described below.
1.1.
Variants
Variant
Description
FCCID
Industry Canada ID
JN5168-001-M00
Standard Power, integrated antenna
TYOJN5168M0
7438A-CYO5168M0
JN5168-001-M03
Standard Power, uFL connector
TYOJN5168M3
7438A-CYO5168M3
JN5168-001-M05
Medium Power, uFL connector
TYOJN5168M5
7438A-CYO5168M5
JN5168-001-M06
High Power, uFL connector
TYOJN5168M6
7438A-CYO5168M6
1.2.
Regulatory Approvals
The JN5168-001-M00, M03 and M05 have been tested against the requirements of the following European
standards.
•
Radio EN 300 328 v1.7.1.
•
EMC, EN 301 489-17 v2.1.1
•
Basic Safety Assessment (BSA) EN 60950-1:2006
A Notified Body statement of opinion for this standard is available on request.
The High Power module with M06 suffix is not approved for use in Europe, instead the JN5168-001-M05 module may
be used with an antenna with up to 2.2dBi; 10mW/MHz power spectral density e.i.r.p is the maximum permitted in
Europe.
Additionally, all module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15
regulations and in accordance to FCC Public notice DA00-1407. Appendix 0 contains details on the conditions
applying to this modular approval. The modules are approved for use with a range of different antennas; further
details of which can be found in section Appendix A.9.1. The modular approvals notice and test reports are available
on request.
All modules are compliant with Industry Canada RSS210 (Issue 8, Annex 8) and have Industry Canada modular
approval.
The JN5168-001-M06 module is subject to user proximity restrictions under FCC and Industry Canada regulations;
more specific information is available in A.9.2.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
3
2. Specifications
Most specification parameters for the modules are specified in the chip datasheet – JN-DS-JN5168 Wireless
Microcontroller Datasheet [2]. Where there are differences, the parameters are defined here.
VDD=3.0V @ +25°C
Typical DC Characteristics
Notes
JN5168-001M00/03
JN5168-001M06
JN5168-001M05
Deep sleep current
100nA
100nA
100nA
Sleep current
0.70uA
0.70uA
0.70uA
With active sleep timer
Radio transmit
current
15.3mA
175mA
35mA
CPU in doze, radio transmitting
Radio receive
current
17mA
22mA
22mA
CPU in doze, radio receiving
+/-25ppm
+/-25ppm
+/-25ppm
Centre frequency
accuracy
Additional +/-15ppm allowance for
temperature and ageing
Typical RF Characteristics
Notes
Receive sensitivity
-95dBm
-100dBm
-96dBm
Nominal for 1% PER, as per 802.15.4
section 6.5.3.3 (Note 1)
Transmit power
2.5dBm
22dBm
9.5 dBm
Nominal
Maximum input
signal
10dBm
5dBm
10dBm
For 1% PER, measured as sensitivity
RSSI range
-95 to
-10dBm
-105 to
-20dBm
-102 to
-17dBm
RF Port impedance
– uFL connector
50 ohm
50 ohm
50 ohm
2.4 - 2.5GHz
Rx Spurious
Emissions
-61dBm
-69dBm
-69dBm
Measured conducted into 50ohms
Tx Spurious
Emissions
-40dBm
-49dBm
-45dBm
Measured conducted into 50ohms
VSWR (max)
2:1
2:1
2:1
Peripherals
2.4 - 2.5GHz
Notes
Master SPI port
3 selects
3 selects
3 selects
250kHz - 16MHz
Slave SPI port



250kHz - 4MHz
Two UARTs



16550 compatible
Two-wire serial I/F
(compatible with
2
SMbus & I C)



Up to 400kHz
5 x PWM (4 x timer,
1 x timer/counter)



16MHz clock
Two programmable
Sleep Timers



32kHz clock
Digital IO lines
(multiplexed with
UARTs, timers and
20
18
18
DIO2 & DIO3 not available on JN5168-001M05 and JN5168-001-M06 modules
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
SPI selects)
Four channel
Analogue-to-Digital
converter



10-bit, up to 100ks/s
Programmable
analogue
comparators



Ultra low power mode for sleep
Internal
temperature sensor
and battery monitor



The performance of all peripherals is defined in the JN-DS-JN5168 Wireless Microcontroller Datasheet [2].
Note 1: Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated
antenna have approximately 1.5 dB less e.i.r.p and reciprocal receive sensitivity.
NXP supplies all the development tools and networking stacks needed to enable end-product development to occur
quickly and efficiently. These are all freely available from the NXP Wireless Connectivity TechZone:
www.nxp.com/techzones/wireless-connectivity. A range of evaluation/developer kits is also available, allowing
products to be quickly bread boarded. Efficient development of software applications is enabled by the provision of a
complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and the
JenNet-IP and ZigBee PRO network stacks, this package provides everything required to develop application code
and to trial it with hardware representative of the final module.
The modules can be user programmed both in development and in production using software supplied by NXP.
Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This
information is available on the NXP support website, together with many example applications, user guides, reference
manuals and application notes.
2.1.
JN5168 Single Chip Wireless Microcontroller
The JN5168-001-Myy series is constructed around the JN5168-001 single chip wireless microcontroller, which
includes the radio system, a 32-bit RISC CPU, Flash, RAM & EEPROM memory and a range of analogue and digital
peripherals.
The chip is described fully in JN-DS-JN5168 Wireless Microcontroller Datasheet [2].
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
5
3. Pin Configurations
ADC1
DO0
DO1
DIO18
DIO19
DIO0
DIO1
DIO2
DIO3
1
27
2
26
3
25
4
24
5
23
6
22
7
21
8
20
9
19
VREF/ADC2
DIO17
DIO16
DIO15
DIO14
RESETN
DIO13
DIO12
DIO11
GND
DIO10
VDD
DIO4
DIO5
DIO6
DIO7
DIO8
DIO9
10 11 12 13 14 15 16 17 18
Figure 1: Pin Configuration (top view)
Note that the same basic pin configuration applies for all module designs. However, DIO3 (pin 9) and DIO2 (pin 8)
are not available on the JN5168-001-M05 and JN5168-001-M06.
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
3.1. Pin Assignment
Pin
No
Pin Functions
Primary
Signal
Type
Alternate Functions
3.3V
Description
1
ADC1
2
DO0
SPICLK
PWM2
CMOS
SPI Master Clock Output or
PWM2 Output
3
DO1
SPIMISO
PWM3
CMOS
SPI Master In Slave Out Input or
PWM3 Output
4
DIO18
SPIMOSI
CMOS
SPI Master Out Slave In Output
5
DIO19
SPISEL0
CMSO
SPI Master Select Output 0
6
DIO0
SPISEL1
ADC3
CMOS
DIO0, SPI Master Select Output 1
or ADC input 3
7
DIO1
SPISEL2
ADC4
PC0
CMOS
DIO1, SPI Master Select Output
2, ADC input 4 or Pulse Counter
0 Input
8
DIO2*
RFRX
TIM0CK_GT
CMOS
DIO2, Radio Receive Control
Output or Timer0 Clock/Gate
Input
9
DIO3*
RFTX
TIM0CAP
CMOS
DIO3, Radio Transmit Control
Output or Timer0 Capture Input
10
DIO4
CTS0
JTAG_TCK
TIM0OUT
PC0
CMOS
DIO4, UART 0 Clear To Send
Input, JTAG CLK Input, Timer0
PWM Output, or Pulse Counter 0
input
11
DIO5
RTS0
JTAG_TMS
PWM1
PC1
CMOS
DIO5, UART 0 Request To Send
Output, JTAG Mode Select Input,
PWM1 Output or Pulse Counter 1
Input
12
DIO6
TXD0
JTAG_TDO
PWM2
CMOS
DIO6, UART 0 Transmit Data
Output, JTAG Data Output or
PWM2 Output
13
DIO7
RXD0
JTAG_TDI
PWM3
CMOS
DIO7, UART 0 Receive Data
Input, JTAG Data Input or PWM 3
Output
14
DIO8
TIM0CK_GT
PC1
PWM4
CMOS
DIO8, Timer0 Clock/Gate Input,
Pulse Counter1 Input or PWM 4
Output
15
DIO9
TIM0CAP
32KXTALIN
RXD1
CMOS
DIO9, Timer0 Capture Input, 32K
External Crystal Input, UART 1
Receive Data Input or 32K
external clock Input
16
DIO10
TIM0OUT
32KXTALOUT
CMOS
DIO10, Timer0 PWM Output or
32K External Crystal Output
32KIN
Analogue to Digital Input
17
VDD
3.3V
Supply Voltage
18
GND
0V
Digital Ground
19
DIO11
PWM1
20
DIO12
PWM2
CTS0
JTAG_TCK
21
DIO13
PWM3
RTS0
22
RESETN
23
DIO14
SIF_CLK
TXD0 TXD1
© NXP Laboratories UK 2013
CMOS
DIO11, PWM1 Output or UART 1
Transmit Data Output
ADO or
SPISMOSI
CMOS
DIO12, PWM2 Output, UART 0
Clear To Send Input, JTAG CLK
Input, Antenna Diversity Odd
Output or SPI Slave Master Out
Slave In Input
JTAG_TMS
ADE or
SPISMISO
CMOS
DIO13, PWM3 Output, UART 0
Request To Send Output, JTAG
Mode Select Input, Antenna
Diversity Even output or SPI
Slave Master In Slave Out Output
CMOS
Reset input
JTAG_TDO
SPISEL1 or
CMOS
DIO14, Serial Interface Clock,
TXD1
JN-DS-JN5168-001-Myy 1v4
7
SPISSEL
24
DIO15
SIF_D
RXD0 RXD1
JTAG_TDI
25
DIO16
COMP1P
SIF_CLK
SPISMOSI
26
DIO17
COMP1M
PWM4
I2C DATA
27
VREF/ADC2
SPISEL2
SPISIMO
UART 0 Transmit Data Output,
UART 1 Transmit Data Output,
JTAG Data Output, SPI Master
Select Output 1 or SPI Slave
Select Input
CMOS
DIO15, Serial Interface Data or
Intelligent Peripheral Data Out
CMOS
DIO16, Comparator Positive
Input, Serial Interface clock or
SPI Slave Master Out Slave In
Input
DIO17, Comparator Negative
Input, Serial Interface Data or SPI
Slave Master In Slave Out Output
CMOS
3.3V
Analogue peripheral reference
voltage or ADC input 2
* These two pins are not connected for JN5168-001-M05 & JN5168-001-M06 modules.
3.2. Pin Descriptions
All pins behave as described in the JN-DS-JN5168 Wireless Microcontroller Datasheet [2], with the exception of the
following:
3.2.1 Power Supplies
A single power supply pin, VDD is provided.
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
4. Electrical Characteristics
In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in
the chip datasheet. Where there are differences, they are detailed below.
4.1. Maximum Ratings
Exceeding these conditions will result in damage to the device.
Parameter
Min
Max
Device supply voltage VDD
-0.3V
3.6V
All Pins
-0.3V
VDD + 0.3V
Storage temperature
-40ºC
150ºC
4.2.
Operating Conditions
Supply
Min
Max
VDD
2.0V
3.6V
Ambient temperature range
-40ºC
85ºC
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
9
Appendix A Additional Information
A.1 Outline Drawing
16mm
30.0mm
1.27
mm
2.54
mm
2.54
mm
3.30
mm
Thickness: 3.5mm
Figure 2: JN5168-001-M00 Outline Drawing
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
16mm
9.72mm
2.59
mm
1.27
mm
21mm
2.54
mm
2.54
mm
3.30
mm
Thickness: 3.5mm
Figure 3: JN5168-001-M03 Outline Drawing
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
11
16mm
8.0mm
2.81mm
30mm
1.27
mm
2.54
mm
.
2.54
mm
3.30
mm
Thickness: 3.5mm
Figure 4: JN5168-001-M05 and JN5168-001-M06 Outline Drawing
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.2 Module PCB Footprint
All dimensions are in mm.
16.00
1.27
Ø1
2.54
1.5
2.54
3.30
1
Note: All modules have the same footprint
Figure 5: Module PCB footprint
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
13
A.3 Optimal PCB placement of the JN5168-001-M00 Module
The JN5168-001-M00 module features an optimised, low cost, integrated, inverted F, printed PCB antenna. The
antenna has a vertically polarised near omnidirectional radiation pattern and up to 1.6 dBi of peak gain. The PCB
design has been elongated in order to increase the ground plane area which increases the antenna efficiency. This
allows stand alone operation without any additional ground plane however care must be taken when mounting this
module onto another PCB. The area around the antenna must be kept clear of conductors or other metal objects for
an absolute minimum of 20 mm. This is true for all layers of the PCB and not just the top layer. Any conductive
objects close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and high directivity in
some directions.
The diagrams below show various possible scenarios. The top 3 scenarios are correct; groundplane may be placed
beneath JN5168-001-M00 module as long as it does not protrude beyond the edge of the top layer ground plane on
the module PCB.
The bottom 3 scenarios are incorrect; the left hand side example because there is groundplane underneath the
antenna, the middle example because there is insufficient clearance around the antenna (it is best to have no
conductors anywhere near the antenna), finally the right hand example has a battery’s metal casing in the
recommended keep out area.
Figure 6: PCB placement of the JN5168-001-M00 Module
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© NXP Laboratories UK 2013
A.4 JN5168-001-M00 Antenna Radiation Pattern
Figure 7, Figure 8 & Figure 9 are simulated 3D radiation plots of the JN5168-001-M00. They are provided here to
help the user orientate the module in end equipment in an optimal way. These visualisations are an accurate
representation of the antenna radiation pattern in the 3D space.
The 2D XZ plots for each channel are shown in
JN5168-001-M00 Radiation Plots @ 3 meters (XZ Orientation)
dBuV CH11 CH18 CH26
104
94
2
84
3
1
74
64
54
44
34
24
14
4
14
24
34
44
54
64
74
84
94
104
Mkr Trace
X-Axis
Value
1
CH11
40.0 deg
101.04 dBuV
2
CH18
40.0 deg
100.67 dBuV
3
CH26
40.0 deg
101.26 dBuV
Figure 10. These are actual measurements in an anechoic chamber with the JN5168-001-M00 mounted on a
DR1174 carrier board from the JN516x-EK001 Evaluation kit. The device under test and the antenna height was 1m
and the values are in dBuV/m at a distance of 3m.
Figure 11 is a plot of the peak field strengths for a JN5168-001-M00, JN5148-001-M00 and JN5168-001-M03. The
M03 is used with a λ/2 vertical antenna. Figure 11 shows that the new integrated antenna is 1.5-3dB better than the
JN5148-001-M00 and is within 1.5 dB of a JN5168-001-M03 λ/2 vertical.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
15
Figure 7: 3D radiation plot JN5168-001-M00 XY Orientation (simulation)
Figure 8: 3D radiation plot JN5168-001-M00 XZ Orientation (simulation)
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© NXP Laboratories UK 2013
Figure 9: 3D radiation plot JN5168-001-M00 YZ Orientation (simulation)
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
17
JN5168-001-M00 Radiation Plots @ 3 meters (XZ Orientation)
dBuV CH11 CH18 CH26
104
94
84
74
64
54
44
34
24
14
4
14
24
34
44
54
64
74
84
94
104
Mkr Trace
CH11
1
CH18
2
CH26
3
2
3
X-Axis
40.0 deg
40.0 deg
40.0 deg
1
Value
101.04 dBuV
100.67 dBuV
101.26 dBuV
Figure 10: Actual radiation plot of JN5168-001-M00 Mounted on a carrier PCB – XZ orientation
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© NXP Laboratories UK 2013
dBuV/m @ 3m
Module Peak Field Strengths
104.0
103.5
103.0
102.5
102.0
101.5
101.0
100.5
100.0
99.5
99.0
98.5
98.0
JN5168-001-M03 with
vertical
JN5168-001-M00
JN5148-001-M00
11
18
26
Channel
Figure 11: Peak Field Strengths for various modules optimised for height and azimuth
A.5 Manufacturing
A.5.1 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste
manufacturer’s guidelines on peak flow temperature, soak times, time above liquid and ramp rates.
Temperature
Target Time (s)
25~160 ºC
160~190 ºC
> 220º C
230~Pk.
Pk. Temp
(235ºC)
90~130
30~60
20~50
10~15
150~270
Figure 12: Recommended solder reflow profile
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
19
A.5.2 Soldering Paste and Cleaning
NXP does not recommend use of a solder paste that requires the module and PCB assembly to be cleaned (rinsed in
water) for the following reasons:
Solder flux residues and water can be trapped by the PCB, can or components and result in short circuits.
The module label could be damaged or removed.
NXP recommends use of a 'no clean' solder paste for all its module products.
A.6 Tape and Reel Information
A.6.1 Tape Orientation and dimensions
All dimensions are in mm.
Module type
A
B
W
F
E
P0
P1
P2
T
Cover Tape
width (W)
JN5168-001-M00
16.6
30.6
44
20.2
1.75
4.0
24.0
2.0
3.7
44.0
JN5168-001-M03
16.6
21.6
44
20.2
1.75
4.0
24.0
2.0
3.7
44.0
JN5168-001-M05
16.6
30.6
44
20.2
1.75
4.0
24.0
2.0
3.7
44.0
JN5168-001-M06
16.6
30.6
44
20.2
1.75
4.0
24.0
2.0
3.7
44.0
Tolerance
±0.1
±0.1
±0.3
±0.15
+0.1
±0.1
±0.1
±0.15
±0.1
±0.3
20
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.6.2 Reel Dimensions
All dimensions are in mm.
Module
A
B
N
W1
W2 (Max)
JN5168-001-MYY
330 ±2.0
2.0±0.5
181.3±0.2
45.0 +1.4/-0.6
50.4
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
21
A.6.3 Cover tape details
Thickness (T)
0.06 ± 0.005mm
Width (W)
37.5 ± 0.1mm
Surface resistivity (component side)
10 to 10
Surface resistivity (component side)
Non-conductive
Backing type:
Polyester
Adhesive type:
PSA
Sealing:
Room ambient
5
11
Ohms/sq
A.6.4 Leader and Trailer
Vacant
Quantity/400PCS
>500mm
Vacant
>500 MM
A.7 Related Documents
[1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2] JN-DS-JN5168 Wireless Microcontroller Datasheet
22
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.8 Ordering Information
Ordering Code Format:
JN5168-001-MYY
Module Type (YY)
00
Standard Power, Integral antenna
03
Standard Power, uFl connector
05
Medium Power, uFL connector
06
High Power, uFl connector
Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or
Prototypes.
Part Number
Description
JN5168-001-M00
Shipped in tape mounted 400 piece reel
JN5168-001-M03
JN5168-001-M05
JN5168-001-M06
Line Content Format
1
NXP Logo
B&W outline logo
1
2D
Coding
2D Matrix
2
Part ID
JN5168-001-M0x
3
Serial No.
NNNNN
Options
4
5
FCC ID
FCCID:TYOJN5168Mx
6
IC ID
IC:7438ACYO5168Mx
Symbology, square
data matrix ECC-200
with 0.5mm cell size
x is module type, 0,
3, 5 or 6
Serial number from
test
Z
SSMC
S
APK
D
RoHs
Compliant
Y
Year
WW
Week
x is module type
0,3,5 or 6
x is module type
0,3,5 or 6
Sample
JN5168-001-M00
NNNNN
ZSDYWW
FCC ID:TYOJN5168M0
IC:7438A-CYO5168M0
Figure 13: Example module labelling
Note :- The 2-D barcode in line 1 is used only for production purposes.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
23
A.9 Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
WARNING!
FCC Radiation Exposure Statement:
This portable equipment with its antenna complies with FCC’s RF radiation exposure limits set forth for an
uncontrolled environment. To maintain compliance follow the instructions below;
1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment.
This transmitter module is authorized to be used in other devices only by OEM integrators under the
following condition:
The transmitter module must not be co-located with any other antenna or transmitter.
As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is
still responsible for testing their end product for any additional compliance requirements required with this module
installed (for example, digital device emissions, PC peripheral requirements, etc.).
This applies to the JN5168-001-M00, JN5168-001-M03 and JN5168-001-M05 devices, the JN5168-001-M06 is a
mobile device (see section A.9.2)
24
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.9.1 Antennas approved by FCC for use with JN5168 modules
Brand
Model Number
Description
Gain (dBi) Connector type
1
Antenna Factor
ANT-2.4-CW-RCT-RP
Vertical - knuckle antenna
2.2
RP-SMA
2
Antennova
2010B6090-01
Vertical - knuckle antenna
2.2
RP-SMA
3
Hyperlink Technology
HG2402RD-RSF
Vertical - knuckle antenna
2.2
RP-SMA
4
Aveslink Technology, Inc
E-0005-AC
Vertical- flying lead
2
RP-SMA
5
Aveslink Technology, Inc
E-2411-GC
Vertical - swivel
2
RP-SMA
6
Aveslink Technology, Inc
E-2410-CA
Vertical - bulkhead- flying lead
2
uFL
7
Aveslink Technology, Inc
E-2410-GC
Vertical - swivel
2
RP-SMA
8
Aveslink Technology, Inc
E-2820-CA
Vertical - bulkhead- flying lead
2
uFL
9
Aveslink Technology, Inc
E-2820-GC
Vertical - swivel
2
RP-SMA
10 Embedded Antenna Design
FBKR35068-RS-KR
Vertical - knuckle antenna
2
RP-SMA
11
Nearson
S131CL-L-PX-2450S
Vertical - knuckle-flying lead
2
uFL
12
Laird Technologies
WRR2400-IP04
Vertical - knuckle-flying lead
1.5
uFL
13
Laird Technologies
WRR2400-RPSMA
Vertical - knuckle-flying lead
1.3
RP-SMA
14
Aveslink Technology, Inc
E-6170-DA
Vertical - right angle
1
uFL
15
Laird Technologies
WCR2400-SMRP
Vertical - knuckle antenna
1
RP-SMA
This device has been designed to operate with the antennas listed above, and having a maximum gain of 2.2 dBi.
Alternative vertical antennas may be used provided that the gain does not exceed 2.2 dBi. Antennas having a gain
greater than 2.2 dBi are strictly prohibited for use with this device.
The required antenna impedance is 50 ohms.
A.9.2 High Power Module usage limitation
The high power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used
at a distance of < 20 cm (8”) from any people. This applies to the JN5168-001-M06 module type (TYOJN5168M6).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the
final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization.
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user manual of the end product.
The user manual for the end product must include the following information in a prominent location;
“To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this transmitter must not be colocated or operating in conjunction with any other antenna or transmitter.”
A.9.3 FCC End Product Labelling
The final ‘end product’ should be labelled in a visible area with the following:
“Contains TX FCC ID: TYOJN5168M0, TYOJN5168M3, TYOJN5168M5 or TYOJN5168M6” to reflect the version of
the module being used inside the product.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
25
A.10 Industry Canada Statement
This device complies with Industry Canada licenceexempt RSS standard(s). Operation is subject
to the following two conditions: (1) this device may
not cause interference, and (2) this device must
accept any interference, including interference that
may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie
Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux
deux conditions suivantes : (1) l'appareil ne
doit pas produire de brouillage, et (2) l'utilisateur de
l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropic radiated power (e.i.r.p.) is not more than that permitted for successful communication.
These modules have been designed to operate with antennas having a maximum gain of 2.2 dBi. Antennas having a
gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.
As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is
still responsible for testing their end-product for any additional compliance requirements required with this module
installed (for example, digital device emissions, PC peripheral requirements, etc).
A.10.1 Industry Canada End Product Labelling
For Industry Canada purposes the following should be used.
“Contains Industry Canada ID IC: 7438A-CYO5168M0, IC: 7438A-CYO5168M3, IC: 7438A-CYO5168M5 or IC:
7438A-CYO5168M6” to reflect the version of the module being used inside the product.
A.11 European R & TTE Directive 1999/5/EC Statement
All modules listed in this datasheet with the exception of the JN5168-001-M06 are compliant with ETSI EN 300 328
V1.7.1 (2006-10), EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006
(2006-06) and are subject to a Notified Body Opinion.
The modules are approved for use with the antennas listed in the following table. The JN5168-001-M06 module is not
approved for use in Europe, instead use the JN5168-001-M05 which produces the maximum permitted power.
Alternative vertical antennas may be used provided that the gain does not exceed 2.2 dBi.
1
Brand
Model Number
Description
Gain (dBi) Connector type
Antenna Factor
ANT-2.4-CW-RCT-SMA
Vertical - knuckle antenna
2.2
SMA
2
Antennova
B6090
Vertical - knuckle antenna
2.2
RP-SMA
3
Hyperlink Technology
HG2402RD-RSF
Vertical - knuckle antenna
2.2
RP-SMA
4
Aveslink Technology, Inc
E-0005-AC
Vertical- flying lead
2
RP-SMA
5
Aveslink Technology, Inc
E-2411-GC
Vertical - swivel
2
RP-SMA
6
Aveslink Technology, Inc
E-2410-CA
Vertical - bulkhead- flying lead
2
uFL
7
Aveslink Technology, Inc
E-2410-GC
Vertical - swivel
2
RP-SMA
8
Aveslink Technology, Inc
E-2820-CA
Vertical - bulkhead- flying lead
2
uFL
9
Aveslink Technology, Inc
E-2820-GC
Vertical - swivel
2
RP-SMA
10 Embedded Antenna Design
FBKR35068-RS-KR
Vertical - knuckle antenna
2
RP-SMA
11
Nearson
S131CL-L-PX-2450S
Vertical - knuckle-flying lead
2
uFL
12
Laird Technologies
WRR2400-IP04
Vertical - knuckle-flying lead
1.5
uFL
13
Laird Technologies
WRR2400-RPSMA
Vertical - knuckle-flying lead
1.3
RP-SMA
14
Aveslink Technology, Inc
E-6170-DA
Vertical - right angle
1
uFL
15
Laird Technologies
WCR2400-SMRP
Vertical - knuckle antenna
1
RP-SMA
26
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.12 RoHS Compliance
JN5168-001-Myy modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the
Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006
st
which came into force on 1 March 2007.
Status Information
The status of this Data Sheet is Production.
NXP products progress according to the following format:
Advanced
The Data Sheet shows the specification of a product in planning or in development.
The functionality and electrical performance specifications are target values and may be used as a guide to the final
specification.
NXP reserves the right to make changes to the product specification at anytime without notice.
Preliminary
The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified.
The functionality of the product is final. The electrical performance specifications are target values and may be used
as a guide to the final specification. NXP reserves the right to make changes to the product specification at anytime
without notice.
Production
This is the production Data Sheet for the product.
All functional and electrical performance specifications, where included, including min and max values are derived
from detailed product characterization.
This Data Sheet supersedes all previous document versions.
NXP reserves the right to make changes to the product specification at anytime.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
27
Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion
and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the
products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause
permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above
those given in the Operating Conditions section or the Electrical Characteristics sections of this document is not warranted. Constant or repeated
exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
AEC unqualified products — This product has not been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101
and should not be used in automotive applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the
customer’s own risk.
Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the
Product data sheet
All products are sold subject to NXP Semiconductors’ terms and conditions of sale, supplied at the time of order acknowledgment and published at
http://www.nxp.com/profile/terms.
Trademarks
All trademarks are the property of their respective owners.
“JenNet” and “JenNet-IP” are trademarks of NXP B.V..
Version Control
Version
28
Notes
1.0
Initial release
1.1
Additional clarification of RF exposure conditions added to FCC Section A8 and minor corrections made
1.2
Revision of key parameters. Module footprint dimension updated
1.3
Tape and reel information added
1.4
Updated pin configuration and assignments. Module labelling and reel dimensions updated.
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
Contact Details
NXP Laboratories UK Ltd
Furnival Street
Sheffield
S1 4QT
United Kingdom
Tel: +44 (0)114 281 2655
Fax: +44 (0) 114 281 2951
For the contact details of your local NXP office or distributor, refer to the NXP web site:
www.nxp.com
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
29
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