523AS

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN8, 1.4x1.2, 0.4P
CASE 523AS
ISSUE A
DATE 20 JAN 2012
SCALE 4:1
2X
2X
0.10 C
0.10 C
DETAIL A
E
ALTERNATE
CONSTRUCTIONS
EXPOSED Cu
(A3)
A
MOLD CMPD
DETAIL B
0.05 C
ALTERNATE
CONSTRUCTION
0.05 C
A1
SIDE VIEW
L2
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
L2
ÏÏ
ÎÎ
TOP VIEW
DETAIL B
8X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
L
L1
ÏÏ
ÏÏ
PIN ONE
REFERENCE
L
A
B
D
2
C
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
L
4
XM
1
1
e
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.40 BSC
1.20 BSC
0.40 BSC
0.20
0.40
−−−
0.15
0.30
0.50
8
X
M
6
6X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
NOTE 3
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
1.61
0.55
1.40
8X
1
0.25
7X
0.45
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON58906E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UQFN8, 1.4X1.2, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON58906E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA.
23 AUG 2011
A
CORRECTED PIN ONE REFERENCE LOCATION TO BOTTOM LEFT OF TOP
VIEW. REQ. BY I. CAMBALIZA.
20 JAN 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. A
Case Outline Number:
523AS