7WBD383 Translating Bus Exchange Switch The 7WBD383 is an advanced high−speed low−power translating bus exchange switch in ultra−small footprints. Features • • • • • • • http://onsemi.com High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V 3 W Switch Connection Between 2 Ports Power Down Protection Provided on Inputs Zero Bounce TTL−Compatible Control Inputs Ultra−Small Pb−Free Packages These are Pb−Free Devices MARKING DIAGRAMS 8 1 UDFN8 MU SUFFIX CASE 517AJ UDFN8 1.95 x 1.0 CASE 517CA ALM G XM 1 8 Micro8] DM SUFFIX CASE 846A D383 AYWG G 1 1 8 UQFN8 MU SUFFIX CASE 523AN 1 AJ M*G G 8 US8 US SUFFIX CASE 493 AG M*G G 1 A = Assembly Location Y = Year W = Work Week M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. © Semiconductor Components Industries, LLC, 2014 October, 2014 − Rev. 2 1 Publication Order Number: 7WBD383/D 7WBD383 OE A 1 8 2 7 VCC GND 3 6 4 5 A B 7 6 5 OE 1 8 VCC A 2 7 C B 3 6 D GND 4 5 EX C VCC B OE 8 4 GND D EX 1 2 3 C D EX Figure 3. US8/Micro8 Figure 2. UQFN8 Figure 1. UDFN8 (Top View) (Top Thru−View) (Top Thru−View) A C B D EX OE Figure 4. Logic Diagram FUNCTION TABLE Input OE Input EX Function L L A = C; B = D L H A = D; B = C H X Disconnect http://onsemi.com 2 7WBD383 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter −0.5 to +7.0 V VIN Control Pin Input Voltage −0.5 to +7.0 V VI/O Switch Input / Output Voltage −0.5 to +7.0 V IIK Control Pin DC Input Diode Current VIN < GND −50 mA IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA IO ON−State Switch Current $128 mA Continuous Current Through VCC or GND $150 mA ICC DC Supply Current Per Supply Pin $150 mA IGND DC Ground Current per Ground Pin $150 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP ESD Withstand Voltage 150 °C US8 (Note 1) UDFN8 UQFN8 Micro8 251 111 208 392 °C/W US8 UDFN8 UQFN8 Micro8 498 1127 601 319 mW Level 1 Oxygen Index: 28 to 34 Human Body Mode (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125 °C (Note 5) UL 94 V−0 @ 0.125 in > 2000 > 200 N/A V $200 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.0 5.5 V VCC Positive DC Supply Voltage VIN Control Pin Input Voltage 0 5.5 V VI/O Switch Input / Output Voltage 0 5.5 V −55 +125 °C 0 0 5 DC nS/V TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Control Input Switch I/O Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 3 7WBD383 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Conditions Min Typ 4.5 Max Min Unit −1.2 V Clamp Diode Voltage VIH High−Level Input Voltage (Control) 4.0 to 5.5 VIL Low−Level Input Voltage (Control) 4.0 to 5.5 0.8 0.8 V VOH Output Voltage High See Figure 5 Input Leakage Current 0 v VIN v 5.5 V 5.5 ±0.1 ±1.0 mA IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0 ±0.1 ±1.0 mA ICC Quiescent Supply Current IO = 0, VIN = VCC or 0 V OE = GND OE = VCC 5.5 ±1.0 ±0.1 ±1.0 ±1.0 mA mA 2.5 mA DICC Increase in Supply Current (Control Pin) One input at 3.4 V; Other inputs at VCC or GND 5.5 RON Switch ON Resistance VI/O = 0, II/O = 64 mA II/O = 30 mA 4.5 −1.2 Max VIK IIN II/O = −18 mA TA = −555C to +1255C TA = 255C 2.0 V W VI/O = 2.4, II/O = 15 mA VI/O = 2.4, II/O = 15 mA 2.0 3 3 7 7 7 7 15 50 50 50 70 70 4.0 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS VCC (V) Min Typ Max Max Unit 0.25 0.25 ns 4.5 4.5 ns 0.8 4.2 ns 4.6 0.8 4.6 3.0 4.8 0.8 4.8 2.9 4.4 0.8 4.4 Symbol Parameter tPD Propagation Delay, Bus to Bus See Figure 6 4.0 to 5.5 tPD−EX Propagation Delay, EX to Bus See Figure 6 and Figure 7 4.0 to 5.5 Output Enable Time See Figure 6 4.5 to 5.5 0.8 2.5 4.2 4.0 0.8 3.0 4.5 to 5.5 0.8 4.0 0.8 tEN tDIS CIN Test Condition TA = −555C to +1255C TA = 25 5C Output Disable Time Min ns Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF http://onsemi.com 4 7WBD383 TYPICAL DC CHARACTERISTICS VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 IOH = −0.1 mA 3.50 −6 mA −12 mA −24 mA 3.25 3.00 2.75 2.50 TA = +85°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 3.50 IOH = −0.1 mA 3.25 −6 mA −12 mA −24 mA 3.00 2.75 2.50 TA = +25°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 3.50 IOH = −0.1 mA 3.25 −6 mA −12 mA −24 mA 3.00 2.75 2.50 TA = −40°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) Figure 5. Output Voltage High vs Supply Voltage http://onsemi.com 5 7WBD383 AC LOADING AND WAVEFORMS From Output Under Test 500 W 7V S1 Open GND CL = 50 pF* 500 W Test S1 tPD Open tPLZ/tPZL 7V tPHZ/tPZH Open *CL includes probes and jig capacitance. 1.5 V 1.5 V Output Control tPZL Output Waveform 1 S1 at 7 V (Note 6) 3V Input 0V tPLH tPHL VOH 1.5 V 1.5 V Output Waveform 2 S1 at Open (Note 6) VOL Voltage Waveforms Propagation Delay Times 1.5 V 3V 0V tPLZ tPZH 1.5 V Output 1.5 V 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ VOH VOH − 0.3 V 0V Voltage Waveforms Enable and Disable Times 6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control 7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns. 8. The outputs are measured one at a time, with one transition per measurement. 9. tPLZ and tPHZ are the same as tDIS. 10. tPZL and tPZH are the same as tEN. 11. tPHL and tPLH are the same as tPD. Figure 6. tPD, tEN, tDIS Loading and Waveforms tr 2.5 ns tf 2.5 ns 3V Exchange (EX) 90% 1.5 V 10% tPLH GND tPHL Output (A, B, C, D) 1.5 V VOH Output (A, B, C, D) VOL 1.5 V tPHL tPLH Figure 7. tPD−EX Waveforms http://onsemi.com 6 7WBD383 ORDERING INFORMATION Package Shipping† 7WBD383USG US8 (Pb−Free) 3000 / Tape & Reel 7WBD383MUTAG UDFN8 (Pb−Free) 3000 / Tape & Reel 7WBD383AMUTCG UQFN8 (Pb−Free) 3000 / Tape & Reel 7WBD383DMR2G Micro8 (Pb−Free) 4000 / Tape & Reel (In Development) UDFN8, 1.95 x 1.0, 0.5 mm Pitch (Pb−Free) 3000 / Tape & Reel Device 7WBD383DMUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 7WBD383 PACKAGE DIMENSIONS UDFN8 1.8 x 1.2, 0.4P CASE 517AJ ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C PIN ONE REFERENCE ÉÉ ÉÉ L1 E DETAIL A NOTE 5 0.10 C TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW A1 e/2 e (b2) C DETAIL A 8X 1 SEATING PLANE L 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF MOUNTING FOOTPRINT* SOLDERMASK DEFINED (L2) 8 5 BOTTOM VIEW 8X 8X b 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 7WBD383 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 1 PKG OUTLINE 7WBD383 PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN ISSUE O A B D ÉÉ ÉÉ ÉÉ PIN ONE REFERENCE 2X 0.10 C 2X EXPOSED Cu E A1 ÇÇ ÉÉ MOLD CMPD A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C (0.15) (0.10) SIDE VIEW C A1 SEATING PLANE DETAIL A SOLDERING FOOTPRINT* OPTIONAL CONSTRUCTION 1.70 8X L3 8X L 0.50 PITCH 1 e 5 3 1 DETAIL A MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 0.35 7 8 8X b 0.10 C A B BOTTOM VIEW 1.70 0.05 C 7X NOTE 3 0.25 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 7WBD383 PACKAGE DIMENSIONS US8 CASE 493 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M DIM A B C D F G H J K L M N P R S U V F DETAIL E SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC 7WBD383 PACKAGE DIMENSIONS Micro8t CASE 846A ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. D HE PIN 1 ID E e b 8 PL 0.08 (0.003) −T− M T B S A MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 DIM A A1 b c D E e L HE S SEATING PLANE MIN −− 0.05 0.25 0.13 2.90 2.90 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 A 0.038 (0.0015) A1 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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