Freescale Semiconductor Advance Information Document Number: MC12311 Rev. 1.0 11/2011 MC12311 Package Information Case nnnn-xx LGA-60 [8x8 mm] MC12311 Highly-integrated, cost-effective single-package solution for the sub-1 GHz, Wireless MBUS Standard 1 Introduction The MC12311 is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless node solution with an FSK, GFSK, MSK, or OOK modulation-capable transceiver and low-power HCS08 8-bit microcontroller. The highly integrated RF transceiver operates over a wide frequency range including 315 MHz, 433 MHz, 470 MHz, 868 MHz, 915 MHz, 928 MHz, and 955 MHz in the license-free Industrial, Scientific and Medical (ISM) frequency bands. This configuration allows users to minimize the use of external components. Ordering Information Device Device Marking Package MC12311 MC12311 LGA-60 Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Software Solutions . . . . . . . . . . . . . . . . . . . . . 4 4 System-in-Package Sub-1 GHz Wireless Node 5 5 MC12311 Pin Assignments and Connections 8 6 System and Power Management . . . . . . . . 12 7 Development Environment . . . . . . . . . . . . . 14 8 System Electrical Specification . . . . . . . . . 14 9 Typical Applications Circuit . . . . . . . . . . . . 34 10 Mechanical Drawings . . . . . . . . . . . . . . . . . 37 The MC12311 is targeted for the following low-power wireless applications: • Automated Meter Reading • Wireless Sensor Networks • Home and Building Automation • Wireless Alarm and Security Systems • Industrial Monitoring and Control • Wireless MBUS Standard (EN13757-4:2005) This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. © Freescale Semiconductor, Inc., 2006, 2007, 2008, 2009, 2010, 2011. All rights reserved. Freescale supplements the MC12311 with tools and software that include hardware evaluation and development boards, software development IDE and applications, drivers, custom PHY usable with Freescale’s IEEE 802.15.4 compatible MAC, SMAC and an available wireless MBUS solution. 2 Features This section provides a simplified block diagram and highlights MC12311 features. 2.1 Block Diagram Figure 1 shows a simplified block diagram of the MC12311. Figure 1. MC12311 Simplified Block Diagram 2.2 • Features Summary RF Transceiver Features — High Sensitivity: down to -120 dBm at 1.2 kbps — High Selectivity: 16-tap FIR Channel Filter — Bullet-proof front end: IIP3 = -18 dBm, IIP2 = +35 dBm, 80 dB Blocking Immunity, no Image Frequency response — Low current: Rx = 16mA, 100nA register retention — Programmable Pout : -18 to +17 dBm in 1 dB steps — Constant RF performance over voltage range of chip MC12311 Advance Information, Rev. 1.0 2 Freescale Semiconductor • — FSK bit rates up to 300 kbps — Fully integrated synthesizer with a resolution of 61 Hz — FSK, GFSK, MSK, GMSK and OOK modulations — Built-in Bit Synchronizer performing Clock recovery — Incoming Sync Word Recognition — Automatic RF Sense with ultra-fast AFC — Packet engine with CRC, AES-128 encryption and 66-byte FIFO — Built-in temperature sensor and Low battery indicator — 32 MHz crystal oscillator clock source 9S08QE32 MCU Features — 8-Bit HCS08 Central Processor Unit (CPU) with CPU clock rate up to: – 50.33 MHz at 3.6 V to 2.4V – 40 MHz at 2.4V to 2.1V – 20 MHz at 2.1V to 1.8V — HC08 instruction set with added BGND instruction — Support for up to 32 interrupt/reset sources — 32 KB Flash and 2 KB RAM — Low power modes (Wait plus Stop2 and Stop3 modes) — Dedicated serial peripheral interface (SPI) connected internally to sub-1 GHz transceiver — Multiple clock source options – Internal clock generator (ICG) with 243 kHz oscillator that has +/-0.2% trimming resolution and +/-0.5% deviation across voltage. – Startup oscillator of approximately 8 MHz – External crystal or resonator – External source from modem clock for very high accuracy source or system low-cost option — In-circuit debug and FLASH programming available via on-chip background debug module (BDM) — System protection features – Programmable low voltage interrupt (LVI) – Optional watchdog timer (COP) – Illegal opcode detection — Peripherals – ADC — 10-channel, 12-bit resolution; 2.5 ms conversion time; automatic compare function; 1.7 mV/°C temperature sensor; internal bandgap reference channel; operation in stop3; fully functional from 3.6 V to 1.8 V – ACMPx — Two analog comparators with selectable interrupt on rising, falling, or either edge of comparator output; compare option to fixed internal bandgap reference voltage; outputs can be optionally routed to TPM module; operation in stop3 MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 3 • • • 3 – SCIx — Two serial communications interface modules with optional 13-bit break. Full duplex non-return to zero (NRZ); LIN master extended break generation; LIN slave extended break detection; wake on active edge – IIC — One IIC; up to 100 kbps with maximum bus loading; multi-master operation; programmable slave address; interrupt driven byte-by-byte data transfer; supports broadcast mode and 10-bit addressing – TPMx — One 6-channel (TPM3) and two 3-channel (TPM1 and TPM2); selectable input capture, output compare, or buffered edge- or center-aligned PWM on each channel; – RTC — (Real-time counter) 8-bit modulus counter with binary or decimal based prescaler; external clock source for precise time base, time-of-day, calendar or task scheduling functions; free running on-chip low power oscillator (1 kHz) for cyclic wake-up without external components; runs in all MCU modes — KBI — Two 8-bit port keyboard interrupt modules — Input/Output – Up to 33 GPIO including dedicated GPIO supporting transceiver – 13 KBI interrupts with selectable polarity – Hysteresis and configurable pullup device on all input pins; Configurable slew rate and drive strength on all output pins. 1.8 V to 3.6 V operating voltage with on-chip voltage regulators Temperature range of –40 °C to 85 °C 60-pin LGA (8x8 mm) Package Software Solutions Freescale will support the MC12311 platform with several software solutions: • SMAC (Simple Media Access Controller) - This codebase provides simple communication and test apps based on drivers/PHY utilities available as source code. This environment is useful for hardware and RF debug, hardware standards certification, and developing proprietary applications. • IEEE 802.15.4 MAC with custom PHY layer - The Freescale MAC is a robust, mature codebase useful for developing networking solutions. Freescale is implementing an IEEE 802.15.4 MAC-compatible custom sub-1 GHz PHY template that can be used across different frequency bands. This capability allows users to build powerful networking solutions on a known, stable codebase. • Wireless MBUS stack - Freescale is porting an existing wireless MBUS codebase to the MC12311 platform which will be available through an external partner. The Freescale MC12311 solutions are provided through a powerful software environment called the Freescale BeeKit Wireless Connectivity Toolkit. BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and sample applications. The BeeKit Graphical User Interface (GUI), part of the BeeKit Wireless Connectivity Toolkit, allows users to create, modify, and update various wireless networking implementations. The MC12311 products are available as codebases within BeeKit; for the wireless MBUS stack, BeeKit will have simple demo apps only. MC12311 Advance Information, Rev. 1.0 4 Freescale Semiconductor 4 System-in-Package Sub-1 GHz Wireless Node The MC12311 brings together a transceiver chip and an MCU chip on a single substrate to provide a small footprint, cost-effective sub-1 GHz wireless node. The transceiver is controlled by the MCU through a dedicated SPI interface. The SPI bus interface and some status signals are connected onboard the substrate to eliminate the need for external connections. 4.1 RF Transceiver The transceiver (see Figure 2) is a single-chip integrated circuit ideally suited for today's high performance ISM band RF applications. Its advanced features set, including state of the art packet engine, greatly simplifies system design while the high level of integration reduces the external RF component bill of material (BOM) to a handful of passive de-coupling and matching components. It is intended for use as a high-performance, low-cost FSK and OOK RF transceiver for robust, frequency agile, half-duplex bi-directional RF links. The MC12311 is intended for applications over a wide frequency range, including the 433 MHz and 868 MHz European and the 902-928 MHz North American ISM bands. Coupled with a link budget in excess of 135 dB, the transceiver advanced system features include a 66 byte TX/RX FIFO, configurable automatic packet handler, listen mode, temperature sensor and configurable DIOs which greatly enhance system flexibility while at the same time significantly reducing MCU requirements. The transceiver complies with both ETSI and FCC regulatory requirements. Figure 2. MC12311 Transceiver Block Diagram The major RF communication parameters of the MC12311 transceiver are programmable and most can be dynamically set. This feature offers the unique advantage of programmable narrow-band and wide-band communication modes without the need to modify external components. The transceiver is also optimized for low power consumption while offering high RF output power and channelized operation. MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 5 4.2 9S08QE32 MCU The onboard 9S08QE32 MCU integrated circuit features an HC08 8-bit CPU, 2 KB RAM, 32 KB Flash memory, and a rich set of peripherals (see Section 2.2, “Features Summary”). The RF transceiver is controlled through the MCU SPI port which is dedicated to the RF device interface. Two of the transceiver status IO lines are also directly connected to the MCU GPIO to monitor the transceiver operation. In addition, the transceiver reset and additional status can be connected to the MCU through external connections. BKGD/MS HCS08 CORE BDC REAL-TIME COUNTER (RTC) SCL LVD 32768 BYTES SERIAL PERIPHERAL INTERFACE MODULE(SPI) USER RAM 3-CHANNEL TIMER/PWM MODULE (TPM1) 2048 BYTES LOW-POWER OSCILLATOR 31.25 kHz to 38.4 kHz 1 MHz to 16 MHz (XOSCVLP) VSS VDD VOLTAGE REGULATOR RxD1 TxD1 SERIAL COMMUNICATIONS INTERFACE MODULE(SCI2) USER FLASH 50.33 MHz INTERNAL CLOCK SOURCE (ICS) SERIAL COMMUNICATIONS INTERFACE MODULE(SCI1) 3-CHANNEL TIMER/PWM MODULE (TPM2) 6-CHANNEL TIMER/PWM MODULE (TPM3) VSSAD ANALOG COMPARATOR VDDAD (ACMP1) VSSAD ANALOG COMPARATOR VDDAD (ACMP2) VSSAD/VREFL VDDAD/VREFH VREFL VREFH SS MISO MOSI SPSCK PTB6/SDA/XTAL PTB5/TPM1CH1/SS PTB2/KBI1P6/SPSCK/ADP6 PTB0/KBI1P4/RxD1/ADP4 PTC7/TxD2/ACMP2– PTC6/RxD2/ACMP2+ TPM1CH2–TPM1CH0 TPM2CH2–TPM2CH0 PTB3/KBI1P7/MOSI/ADP7 PTB1/KBI1P5/TxD1/ADP5 TPM1CLK TPM2CLK PTB4/TPM2CH1/MISO PTC5/TPM3CH5/ACMP2O PTC4/TPM3CH4 PTC3/TPM3CH3 PTC2/TPM3CH2 EXTAL XTAL RxD2 TxD2 PTA7/TPM2CH2/ADP9 PTA6/TPM1CH2/ADP8 PTA5/IRQ/TPM1CLK/RESET PTA4/ACMP1O/BKGD/MS PTA3/KBI1P3/SCL/ADP3 PTA2/KBI1P2/SDA/ADP2 PTA1/KBI1P1/TPM2CH0/ADP1/ACMP1– PTA0/KBI1P0/TPM1CH0/ADP0/ACMP1+ PTB7/SCL/EXTAL PORT B IRQ COP SDA 10-CHANNEL, 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC12) KEYBOARD INTERRUPT MODULE (KBI1) KEYBOARD INTERRUPT MODULE (KBI2) TPM3CLK PTC1/TPM3CH1 TPM3CH5–TPM3CH0 PTC0/TPM3CH0 ACMP1O ACMP1– ACMP1+ ACMP2O ACMP2– ACMP2+ PTD7/KBI2P7 Not Bonded Out PTD6/KBI2P6 PORT D IRQ RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT IIC MODULE (IIC) PORT C HCS08 SYSTEM CONTROL PTD5/KBI2P5 PTD4/KBI2P4 PTD3/KBI2P3 PTD2/KBI2P2 PTD1/KBI2P1 ADP9–ADP0 PTD0/KBI2P0 PTE7/TPM3CLK PTE6 KBI1P7–KBI1P0 KBI2P7–KBI2P0 PORT E CPU PORT A DEBUG MODULE (DBG) Notes: 1. When PTA5 is configured as RESET, pin becomes bi-directional with output being open-drain drive containing an internal pullup device. 2. When PTA4 is configured as BKGD, pin becomes bi-directional. 3. Pins PTD7-PTD5 and PTE7-PTE4 not bonded out. PTE5 Not Bonded Out PTE4 PTE3/SS PTE2/MISO PTE1/MOSI PTE0/TPM2CLK/SPSCK Figure 3. MC12311 MCU Block Diagram MC12311 Advance Information, Rev. 1.0 6 Freescale Semiconductor Operational modes of the MC12311 are determined by the software running on the MCU. The 9S08QE32 itself has its normal run mode as well as two low power modes (Stop2 and Stop3). The MCU in turn sets the operational mode of the transceiver which include sleep, standby, and radio operational modes. Two common application scenarios are: • Low power, battery-operated standalone wireless node - a common example of this configuration would be a remote sensor monitor. The wireless node programmed for standalone operation, typically has a low active-mode duty cycle, and is designed for long battery life, i.e., lowest power. • Communication channel to a higher level controller - in this example, the wireless node implements the lower levels of a communications stack and is subordinate to the primary controller. Typically the MC12311 is connected to the controller through a command channel implemented via a UART/SCI port or other serial communication port. 4.3 System Clock Configuration The MC12311 device allows for a wide array of system clock configurations: • Pins are provided for a separate external clock source for the MCU. The external clock source can by derived from a crystal oscillator or from an external clock source • Pins are provided for a 32 MHz crystal for the transceiver reference clock source (required) • The transceiver can be programmed to provide a ClkOut programmable frequency clock output that can be used as an external source to the CPU. As a result, a single crystal system clock solution is possible (see Figure 4). • The MCU provides a trimmable internal reference clock and also supports an external clock source. An optional onboard frequency locked loop (FLL) can be used with either clock source to support a CPU clock as high as 50 Mhz at 3.6 V to 2.4 V VDD. MC12311 XTA Sub-1 GHz Transceiver XTB 46 9S08QE32 MCU EXTAL XTAL 5 47 6 32MHz CL CL Figure 4. MC12311 Single Crystal System Clock Connection MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 7 5 MC12311 Pin Assignments and Connections DIO5/CLKOUT DIO4 DIO3 DIO2 DIO1/PTD0/KBI2P0 DIO0/PTD1/ KBI2P1 RESET XTB XTA VR_DIG VR_ANA VBAT1 (RF) 54 53 52 51 50 47 46 45 44 43 48 VDD1 55 49 VDDAD 56 Figure 5 shows the MC12311 pinout. VREFH 1 42 VR_PA (RF) VREFL 2 41 PA_BOOST VSSAD 3 40 GND_PA1 (RF) VSS 4 39 RFIO (RF) EXTAL/PTB7 5 38 GND_PA2 (RF) XTAL/PTB6 6 37 RXTX (RF) PTB5 7 36 GND PTB4 8 35 VBAT2 PTC3 9 34 PTA4/BKGD/MS PTC2 10 33 PTA5/IRQ/RESETB PTC1 11 32 PTC4 PTC0 12 31 PTC5 PTB3 13 30 NC PTB2 14 29 PTC6 MC12311 Flag Opening Flag Opening 57 58 15 16 17 18 19 20 21 22 23 24 25 26 27 28 PTB0 PTA7 PTA6 VDD VSS PTD4 PTD3 PTD2 PTA3 PTA2 PTA1 PTA0 PTC7 60 PTB1 59 Pads 57-60 Located on Bottom Pad 57 – SPSCK Pad 58 – MOSI Pad 59 – NSS Pad 60 – MISO Figure 5. MC12311 Pinout (Top View) 5.1 Pin Definitions Table 1 details the MC12311 pinout and functionality. Table 1. Pin Function Description Pin # Pin Name Type Description Functionality 1 VREFH Input MCU high reference voltage for ATD 2 VREFL Input MCU low reference voltage for ATD 3 VSSAD Power Input MCU ADC Ground Connect to ground 4 VSS Power Input MCU Ground Connect to ground • Normally used as MCU clock source • Driven from transceiver ClkOut (DIO5) 1 5 EXTAL/SCL/PTB7 Input / Digital Input/Output MCU Crystal Oscillator input / IIC bus clock / Port B Bit 7 6 XTAL/SDA/PTB61 Output / Digital Input/Output MCU Crystal Oscillator output / IIC bus data / Port B Bit 6 MC12311 Advance Information, Rev. 1.0 8 Freescale Semiconductor Table 1. Pin Function Description (continued) Pin # Pin Name Type Description Functionality 7 PTB5/TPM1CH12 Digital Input/Output MCU Port B Bit 5 / TPM1 Channel 1 8 PTB4/TPM2CH12 Digital Input/Output MCU Port B Bit 4 / TPM2 Channel 1 9 PTC3/TPM3CH3 Digital Input/Output MCU Port C Bit 3 / TPM3 Channel 3 10 PTC2/TPM3CH2 Digital Input/Output MCU Port C Bit 2/ TPM3 Channel 2 11 PTC1/TPM3CH1 Digital Input/Output MCU Port C Bit 1 / TPM3 Channel 1 12 PTC0/TPM3CH0 Digital Input/Output MCU Port C Bit 0 / TPM3 Channel 0 13 PTB3/KBI1P7/ ADP72 Digital Input/Output / Analog Input MCU Port B Bit 3 / KBI1 Input Bit 7 / ADC Analog Channel 7 14 PTB2/KBI1P6/ ADP62 Digital Input/Output / Analog Input MCU Port B Bit 2 / KBI1 Input Bit 6 / ADC Analog Channel 6 15 PTB1/KBI1P5/TxD1 Digital /ADP5 Input/Output / Analog Input MCU Port B Bit 1 / KBI1 Input Bit 5 / SCI1 TxD / ADC Analog Channel 5 16 PTB0/KBI1P4/ RXD1/ADP4 Digital Input/Output / Analog Input MCU Port B Bit 0 / KBI1 Input Bit 4 / SCI1 RXD / ADC Analog Channel 4 17 PTA7/TPM2CH2/ ADP9 Digital Input/Output / Analog Input MCU Port A Bit 7 / TPM2 Channel 2 / ADC Analog Channel 9 18 PTA6/TPM1CH2/ ADP8 Digital Input/Output / Analog Input MCU Port A Bit 6 / TPM1 Channel 2 / ADC Analog Channel 8 19 VDD Power Input MCU VDD Connect to MC12311 VDD supply 20 VSS Power Input MCU Ground Connect to ground 21 PTD4/KBI2P4 Digital Input/Output MCU Port D Bit 4 / KBI2 Input Bit 4 22 PTD3/KBI2P3 Digital Input/Output MCU Port D Bit 3 / KBI2 Input Bit 3 23 PTD2/KBI2P2 Digital Input/Output MCU Port D Bit 2 / KBI2 Input Bit 2 24 PTA3/KBI1P3/ SCL/ADP31 Digital Input/Output / Analog Input MCU Port A Bit 3 / KBI1 Input Bit 3 / IIC bus clock / ADC Analog Channel 3 MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 9 Table 1. Pin Function Description (continued) Pin # Pin Name Type Description Functionality 25 PTA2/KBI1P2/ SDA/ADP22 Digital Input/Output / Analog Input MCU Port A Bit 2 / KBI1 Input Bit 2 / IIC bus data / ADC Analog Channel 2 26 PTA1/KBI1P1/ TPM2CH0/ADP1/ ACMP1-3 Digital Input/Output / Analog Input MCU Port A Bit 1 / KBI1 Input Bit 1 / TPM2 Channel 0 / ADC Analog Channel 1 / ACMP1 Analog Input Minus 27 PTA0/KBI1P0/ TPM1CH0/ADP0/ ACMP1+3 Digital Input/Output / Analog Input MCU Port A Bit 0 / KBI1 Input Bit 0 / TPM1 Channel 0 / ADC Analog Channel 0 / ACMP1 Analog Input Plus 28 PTC7/TXD2/ ACMP2- Digital Input/Output / Analog Input MCU Port C Bit 7 / SCI2 TXD / ACMP2 Analog Input Minus 29 PTC6/RXD2/ ACMP2+ Digital Input/Output MCU Port C Bit 6 / SCI2 RXD / ACMP2 Analog Input Plus 30 NC 31 PTC5/TPM3CH5/ ACMP2O Digital Input/Output MCU Port C Bit 5 / TPM3 Channel 5 / ACMP2 Output 32 PTC4/TPM3CH4 Digital Input/Output MCU Port C Bit 5 / TPM3 Channel 5 / ACMP2 Output 33 PTA5/IRQ/ Digital TPM1CLK/RESETB Input/Output MCU Port A Bit 5 / MCU IRQ / TPM1 Clock / MCU RESET 34 PTA4/ACMP1O/ BKGD/MS Digital Input/Output MCU Port A Bit 4 / ACMP1 Output / Background Debug Port / Mode Select 35 VBAT2 Power Input Transceiver VDD Connect to MC12311 VDD supply 36 GND Power Input Transceiver Ground Connect to ground 37 RXTX (RF) Digital Output Transceiver Rx/Tx RF Switch Control Output; high when in TX 38 GND_PA2 (RF) Power Input Transceiver RF Ground 39 RFIO (RF) RF Input/Output Transceiver RF Input/Output 40 GND_PA1 (RF) Power Input Transceiver RF Ground 41 PA_BOOST RF Output Transceiver Optional High-Power PA Output 42 VR_PA Power Output Transceiver regulated output voltage for VR_PA use. 43 VBAT1 (RF) Power Input Transceiver VDD for RF circuitry 44 VR_ANA Power Output Transceiver regulated output voltage for Decouple to ground with 100 nF analog circuitry. capacitor No Connect Connect to ground Connect to ground Connect to MC12311 VDD supply MC12311 Advance Information, Rev. 1.0 10 Freescale Semiconductor Table 1. Pin Function Description (continued) Pin # Pin Name Type Description Functionality 45 VR_DIG Power Output Transceiver regulated output voltage for Decouple to ground with 100 nF digital circuitry. capacitor 46 XTA Xtal Osc Transceiver crystal reference oscillator Connect to 32 MHz crystal and load capacitor 47 XTB Xtal Osc Transceiver crystal reference oscillator Connect to 32 MHz crystal and load capacitor 48 RESET Digital Input Transceiver hardware reset input Typically driven from MCU GPIO 49 DIO0/PTD1/KBI2P1 Digital Input/Output Transceiver GPIO Bit 0 / MCU Port D Bit 1 / MCU KBI2 Bit 1 MCU IO and Transceiver IO connected onboard MC12311 50 DIO1/PTD0/KBI2P0 Digital Input/Output Transceiver GPIO Bit 1 / MCU Port D Bit 0 / MCU KBI2 Bit 0 MCU IO and Transceiver IO connected onboard MC12311 51 DIO2 Digital Input/Output Transceiver GPIO Bit 2 52 DIO3 Digital Input/Output Transceiver GPIO Bit 3 53 DIO4 Digital Input/Output Transceiver GPIO Bit 4 54 DIO5/CLKOUT Digital Input/Output Transceiver GPIO Bit 5 / ClkOut Commonly programmed as ClkOut to supply MCU clock; connect to Pin 5 55 VDD1 Power Input MCU VDD supply Connect to MC12311 VDD supply 56 VDDAD Power Input MCU ADC VDD Connect to MC12311 VDD supply 57 SPSCK2 Digital Input/Output SPI Port Clock driven from MCU Port E Bit 0 • MCU IO and Transceiver IO connected onboard MC12311 • MCU IO must be configured for this connection 58 MOSI2 Digital Input/Output SPI Port MOSI signal connected to MCU Port E Bit 1 • MCU IO and Transceiver IO connected onboard MC12311 • MCU IO must be configured for this connection 59 NSS2 Digital Input/Output SPI Port SS signal connected to MCU Port E Bit 3 • MCU IO and Transceiver IO connected onboard MC12311 • MCU IO must be configured for this connection 60 MISO2 Digital Input/Output SPI Port MISO signal connected to MCU Port E Bit 2 • MCU IO and Transceiver IO connected onboard MC12311 • MCU IO must be configured for this connection Power input External package flag. Common VSS Connect to ground. FLAG VSS 1 IIC pins, SCL and SDA can be repositioned using the IICPS bit in SOPT2; default locations are PTA3 and PTA2. The SPI Port pin selection must be configured by software by writing the SPIPS Bit in Register SOPT2 3 If ADC and ACMP1 are both enabled, both modules have access to the pin. 2 MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 11 5.2 Internal Functional Interconnects The MCU provides control to the transceiver through the SPI Port and receives status from the transceiver from the DIOx pins. Certain interconnects between the devices are routed onboard the SiP. In addition, the signals are brought out to external pads. Table 2. MC12311 Internal Functional Interconnects Pin # MCU Signal Transceiver Signal 49 PTD1/KBI2P1 DIO0 Transceiver DIO0 can be programmed to provide status to the MCU 50 PTD0/KBI2P0 DIO1 Transceiver DIO1 can be programmed to provide status to the MCU 57 PTE0/SPSCK SCK MCU SPI connection must be initiated, not default 58 PTE1/MOSI MOSI MCU SPI connection must be initiated, not default 59 PTE3/SS NSS MCU SPI connection must be initiated, not default 60 PTE2/MISO MISO MCU SPI connection must be initiated, not default • • 5.3 Description NOTE As shown in Table 2, the MCU SPI Port pin selection must be configured by software by writing the SPIPS bit in Register SOPT2 The transceiver DIO pins must be programmed to provide desired status External Functional Interconnects In addition to the onboard device interconnection, other external connections between the MCU and the transceiver are common: 1. Freescale recommends programming the transceiver DIO5 signal as ClkOut - for lowest system cost, a single crystal configuration can be used where ClkOut can be used to supply the MCU clock by connection to EXTAL Pin 5. With a 32 MHz transceiver reference oscillator crystal, ClkOut can be programmed for frequencies of 32 MHz, 16 MHz, 8 MHz, 4 MHz, 2 MHz, and 1 MHz. 2. Freesacle recommends driving/controlling the transceiver reset from an MCU GPIO - This allows over-riding control of the transceiver from the system application. 3. The other DIO2-DIO4 status and RXTX signals can prove useful for monitoring the transceiver operation - the DIO4-DIO2 signals must be programmed to provide operational status. All signals must be connected externally to appropriate MCU GPIO for this function. 6 System and Power Management The MC12311 consists of an independent transceiver and MCU. The MCU controls the transceiver through programming of the SPI Port, and sets its operational mode through this control channel. Total current draw for the MC12311 is dependent on the operation mode of both devices. MC12311 Advance Information, Rev. 1.0 12 Freescale Semiconductor 6.1 Modes of Operation The MCU is the host controller and has the following primary modes of operation: • Stop2 - provides lowest standby power consumption and maintains the contents of RAM and the current state of all of the I/O pins, but the main oscillator and most other digital circuitry are off. Wake-up is treated as a system recovery from reset. • Stop3 - provides very low standby power consumption and maintains the contents of RAM, registers, and the current state of all of the I/O pins, but the main oscillator can be enabled or not. Wake-up is treated as an interrupt request, and this provides faster recovery time • Wait - entered by executing a WAIT command, the CPU enters a low power state. This state can be used to save power over a normal RUN condition, but is not a true low power state such as Stop2 or Stop3 • Run - normal run condition for the CPU. Current draw is very dependent on the CPU clock frequency. Additional current can be saved but running at a lower clock rate if the software performance. The transceiver has the following modes of operation: • Sleep - provides lowest power consumption and is the full power down state • Idle - provides very low standby power consumption and has the main voltage regulator and the RC oscillator enabled • Standby - similar to Idle with low standby power consumption but has the main voltage regulator and the crystal oscillator enabled • FS (Frequency synthesizer) - the frequency synthesizer is alive to shorten startup time to transmit or receive states • Transmit - transmitter is active • Receive - receiver is active 6.2 Power Management The MC12311 power management is controlled through programming of the modes of operation. Different modes allow for different levels of power-down. Additional features include: • Transceiver Sleep with MCU Stop2 is the lowest power state • The transceiver mode is independent of the MCU • The transceiver uses/powers-up the transmitter or receiver only as required • MCU peripheral control clock gating can be disabled on a module-by-module basis to provide lowest power • RTC can be used as wake-up timer • Wake-up available through KBI asynchronous interrupts and UART activity • Wake-up available with RTC MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 13 6.3 System Protection The MC12311 provides several vehicles to maintain security or a high level of system robustness: • Watchdog computer operating properly (COP) reset with option to run from dedicated 1 kHz internal clock source or bus clock • Low-voltage detection with reset or interrupt; selectable trip points • Illegal opcode detection with reset • Illegal address detection with reset • Flash block protection 7 Development Environment Development support for the HCS08 on the MC12311 includes the background debug controller (BDC) and the on-chip debug module (DBG). The BDC provides a single-wire debug interface to the MCU that provides a convenient interface for programming the on-chip FLASH and other storage. The BDC is also the primary debug interface for development and allows non-intrusive access to memory data and traditional debug features such as CPU register modify, breakpoints, and single instruction trace commands. Address and data bus signals are not available on external pins. Debug is done through commands fed into the MCU via the single-wire background debug interface. The debug module provides a means to selectively trigger and capture bus information so an external development system can reconstruct what happened inside the MCU on a cycle-by-cycle basis without having external access to the address and data signals. Features include: • Single-wire background debug interface • Breakpoint capability to allow single breakpoint setting during in-circuit debugging (plus two more breakpoints) • On-chip in-circuit emulator (ICE) debug module containing two comparators and nine trigger modes 8 System Electrical Specification This section details maximum ratings for the 60 pin LGA package and recommended operating conditions, DC characteristics, and AC characteristics for the modem, and the MCU. 8.1 SiP LGA Package Maximum Ratings Absolute maximum ratings are stress ratings only, and functional operation at the maximum rating is not guaranteed. Stress beyond the limits specified in Table 3 may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this section. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused MC12311 Advance Information, Rev. 1.0 14 Freescale Semiconductor inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD) or the programmable pull-up resistor associated with the pin is enabled. Table 3 shows the maximum ratings for the 60 Pin LGA package. Table 3. LGA Package Maximum Ratings Rating Symbol Value Unit Maximum Junction Temperature TJ 95 °C Storage Temperature Range Tstg -55 to 115 °C VBATT, VDDINT -0.3 to 3.8 Vdc Vin -0.3 to (VDDINT + 0.3) Pmax 6 Power Supply Voltage Digital Input Voltage RF Input Power dBm Note: Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics or Recommended Operating Conditions tables. Note: Meets Human Body Model (HBM) = 2 kV. RF input/output pins have no ESD protection. 8.2 ESD Protection and Latch-Up Immunity Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM). All latchup testing is in conformity with the JESD78 IC Latch-Up Test. A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Table 4. ESD and Latch-up Test Conditions Model Description Symbol Value Unit R1 1500 Ω C 100 pF — 1 Series resistance R1 0 Ω Storage capacitance C 200 pF Number of pulses per pin1 — 1 Series resistance Human Body Storage capacitance Number of pulses per Machine Latch-up 1 pin1 Minimum input voltage limit – 1.8 V Maximum input voltage limit 4.32 V This number represents a minimum number for both positive pulse(s) and negative pulse(s) MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 15 Table 5. ESD and Latch-Up Protection Characteristics Rating1 No. 1 8.3 Symbol Min Max Unit 1 Human body model (HBM) VHBM ± 2000 — V 2 Machine model (MM) VMM ± 200 — V 3 Charge device model (CDM) VCDM ± 750 — V 4 Latch-up current at TA = 85°C ILAT ± 100 — mA Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. Transceiver Electrical Characteristics The tables below give the electrical specifications of the transceiver under the following conditions: Supply voltage VBAT1= VBAT2=VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF = 915 MHz, Pout = +13dBm, 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, unless otherwise specified. NOTE Unless otherwise specified, the performances in the other frequency bands are similar or better. 8.3.1 Transceiver Recommended Operating Conditions Table 6. Recommended Operating Conditions Characteristic Symbol Min Power Supply Voltage (VBATT) Typ 1.8 Max Unit 3.6 Vdc Operating Temperature Range TA -40 25 85 °C Logic Input Voltage Low VIL 0 - 20% VBATT V Logic Input Voltage High VIH 80% VBATT - VBATT V Logic Output Voltage Low (Imax = -1 mA) VOL 0 - 10% VBATT V Logic Output Voltage High (Imax = 1 mA) VOH 90% VBATT - VBATT V 25 pF Load capacitance on digital ports CL SPI Clock Rate fSPI - - 8.0 MHz RF Input Power Pmax - - 0 dBm Crystal Reference Oscillator Frequency fref 32 MHz Only MC12311 Advance Information, Rev. 1.0 16 Freescale Semiconductor 8.3.2 Transceiver Power Consumption Table 7. Power Supply Current Characteristic Conditions Symbol Min Typ Max Unit IDDSL - 0.1 1 µA IDDIDLE - 1.2 - µA IDDST - 1.25 1.5 mA Supply current in Synthesizer mode IDDFS - 9 - mA Supply current in Receive mode IDDR - 16 - mA Supply current in Transmit mode with RFOP = +17 dBm, on PA_BOOST appropriate matching, stable across RFOP = +13 dBm, on RFIO pin VDD range RFOP = +10 dBm, on RFIO pin RFOP = 0 dBm, on RFIO pin RFOP = -1 dBm, on RFIO pin IDDT - 95 45 33 20 16 - mA mA mA mA mA Symbol Min Typ Max Unit FR 290 424 862 - 340 510 1020 MHz MHz MHz Crystal oscillator frequency FXOSC - 32 - MHz Crystal oscillator wake-up time TS_OSC - 250 500 µs TS_FS - 80 150 µs - 20 20 50 50 80 80 80 - µs µs µs µs µs µs µs FSTEP - 61.0 - Hz Supply current in Sleep mode Supply current in Idle mode RC oscillator enabled Supply current in Standby mode Crystal oscillator enabled 8.3.3 Transceiver Frequency Synthesis Table 8. Frequency Synthesizer Specification Characteristic Synthesizer Frequency Range Conditions Programmable Frequency synthesizer wake-up time From Standby mode to PllLock signal Frequency synthesizer hop time at most 10 kHz away from the target 200 kHz step TS_HOP 1 MHz step 5 MHz step 7 MHz step 12 MHz step 20 MHz step 25 MHz step Frequency synthesizer step FSTEP = FXOSC/219 RC Oscillator frequency After calibration FRC - 62.5 - kHz Bit rate, FSK Programmable BRF 1.2 - 300 kbps Bit rate, OOK Programmable BRO 1.2 - 32.768 kbps Frequency deviation, FSK Programmable FDA + BRF/2 =< 500 kHz FDA 0.6 - 300 kHz MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 17 8.3.4 Receiver All receiver tests are performed with RxBw = 10 kHz (Single Side Bandwidth) as programmed in RegRxBw, receiving a PN15 sequence with a BER of 0.1% (Bit Synchronizer is enabled), unless otherwise specified. The LNA impedance is set to 200 Ohms, by setting bit LnaZin in RegLna to 1. Blocking tests are performed with an unmodulated interferer. The wanted signal power for the Blocking Immunity, ACR, IIP2, IIP3 and AMR tests is set 3 dB above the nominal sensitivity level. Table 9. Receiver Specification Characteristic FSK sensitivity, highest LNA gain Conditions FDA = 5 kHz, BR = 1.2 kb/s FDA = 5 kHz, BR = 4.8 kb/s FDA = 40 kHz, BR = 38.4 kb/s Symbol Min Typ Max Unit RFS_F - -118 -114 -105 - dBm dBm dBm - -120 - dBm RFS_O - -112 -109 dBm CCR -13 -10 - dB FDA = 5 kHz, BR = 1.2 kb/s 1 OOK sensitivity, highest LNA gain BR = 4.8 kb/s Co-Channel Rejection Adjacent Channel Rejection Offset = +/- 25 kHz Offset = +/- 50 kHz ACR 37 42 42 - dB dB Blocking Immunity Offset = +/- 1 MHz Offset = +/- 2 MHz Offset = +/- 10 MHz BI - -45 -40 -32 - dBm dBm dBm Blocking Immunity Wanted signal at sensitivity +16dB Offset = +/- 1 MHz Offset = +/- 2 MHz Offset = +/- 10 MHz - -36 -33 -25 - dBm dBm dBm AM Rejection , AM modulated interferer with 100% modulation depth, fm = 1 kHz, square Offset = +/- 1 MHz Offset = +/- 2 MHz Offset = +/- 10 MHz AMR - -45 -40 -32 - dBm dBm dBm 2nd order Input Intercept Point Unwanted tones are 20 MHz above the LO Lowest LNA gain Highest LNA gain IIP2 - +75 +35 - dBm dBm 3rd order Input Intercept point Unwanted tones are 1MHz and 1.995 MHz above the LO Lowest LNA gain Highest LNA gain IIP3 -23 +20 -18 - dBm dBm BW_SSB 2.6 - 500 kHz Single Side channel filter BW Programmable Image rejection in OOK mode Wanted signal level = -106 dBm IMR_ OOK 27 30 - dB Receiver wake-up time, from PLL locked state to RxReady RxBw = 10 kHz, BR = 4.8 kb/s RxBw = 200 kHz, BR = 100 kb/s TS_RE - 1.7 96 - ms µs Receiver wake-up time, from PLL locked state, AGC enabled RxBw= 10 kHz, BR = 4.8 kb/s RxBw = 200 kHz, BR = 100 kb/s TS_RE_ AGC - 3.0 163 ms µs 4.8 265 ms µs Receiver wake-up time, from PLL lock RxBw= 10 kHz, BR = 4.8 kb/s RxBw = 200 kHz, BR = 100 kb/s state, AGC and AFC enabled TS_RE_ AGC&AFC FEI sampling time Receiver is ready TS_FEI - 4.Tbit - - AFC Response Time Receiver is ready TS_AFC - 4.Tbit - - MC12311 Advance Information, Rev. 1.0 18 Freescale Semiconductor Table 9. Receiver Specification Characteristic Conditions RSSI Response Time Receiver is ready RSSI Dynamic Range AGC enabled 1 Min Max Symbol Min Typ Max Unit TS_RSSI - 2.Tbit - - DR_RSSI - -115 0 - dBm dBm Set SensitivityBoost in RegTestLna to 0x2D to reduce the noise floor in the receiver 8.3.5 Transmitter Table 10. Transmitter Specidication Characteristic Conditions Symbol Min Typ Max Unit RF_OP - +13 -18 - dBm dBm Max RF output power, on PA_BOOST With external match to 50 ohms pin RF_OPH - +17 - dBm RF output power stability From VDD=1.8V to 3.6V ΔRF_OP - +/-0.3 - dB Transmitter Phase Noise 50 kHz Offset from carrier 868 / 915 MHz bands 434 / 315 MHz bands PHN - -95 -99 - dBc/Hz ACP - - -37 dBm TS_TR - 120 - µs RF output power in 50 ohms On RFIO pin Programmable with 1dB steps Max Min Transmitter adjacent channel power (measured at 25 kHz offset) BT=0.5 . Measurement conditions as defined by EN 300 220-1 V2.1.1 Transmitter wake up time, to the first rising edge of DCLK Frequency Synthesizer enabled, PaRamp = 10 µs, BR = 4.8 kb/s. 8.4 MCU Electrical Characteristics The following sections describe the electrical characteristics of the MC12311 MCU. 8.4.1 MCU DC Characteristics This section includes information about power supply requirements and I/O pin characteristics. Table 11. DC Characteristics Num C 1 Symbol Condition Output high voltage P T C Min Typ1 1.82 Operating Voltage C 2 Characteristic All I/O pins, low-drive strength All I/O pins, high-drive strength 1.8 V, ILoad = –2 mA VOH Max Unit 3.6 V VDD – 0.5 — — 2.7 V, ILoad = –10 mA VDD – 0.5 — — 2.3 V, ILoad = –6 mA VDD – 0.5 — — 1.8V, ILoad = –3 mA VDD – 0.5 — — V MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 19 Table 11. DC Characteristics (continued) Num C 3 4 Characteristic D Output high current C Output low voltage Symbol Max total IOH for all ports All I/O pins, high-drive strength T VOL C Output low current Max total IOL for all ports 5 D 6 P Input high voltage C all digital inputs P Input low voltage all digital inputs 7 C 8 C Input hysteresis 9 P Input leakage current 10 P Typ1 Max Unit — — 100 mA 1.8 V, ILoad = 2 mA — — 0.5 2.7 V, ILoad = 10 mA — — 0.5 2.3 V, ILoad = 6 mA — — 0.5 1.8 V, ILoad = 3 mA — — 0.5 — — 100 VDD > 2.7 V 0.70 x VDD — — VDD > 1.8 V 0.85 x VDD — — VDD > 2.7 V — — 0.35 x VDD VDD >1.8 V — — 0.30 x VDD 0.06 x VDD — — mV IOHT All I/O pins, low-drive strength P Min Condition IOLT VIH VIL V mA V all digital inputs Vhys all input only pins (Per pin) |IIn| VIn = VDD or VSS — — 1 μA Hi-Z (off-state) leakage current all input/output (per pin) |IOZ| VIn = VDD or VSS — — 1 μA All input only and I/O 11 Total leakage combined for all P inputs and Hi-Z pins |IOZTOT| VIn = VDD or VSS — — 2 μA 12 P Pull-up resistors all digital inputs, when enabled 17.5 — 52.5 kΩ DC injection 3, 4, 5 D current –0.2 — 0.2 mA 13 –5 — 5 mA 14 C Input Capacitance, all pins CIn — — 8 pF 15 C RAM retention voltage VRAM — 0.6 1.0 V 16 C POR re-arm voltage6 VPOR 0.9 1.4 1.79 V RPU Single pin limit Total MCU limit, includes sum of all stressed pins IIC VIN < VSS, VIN > VDD MC12311 Advance Information, Rev. 1.0 20 Freescale Semiconductor NOTES Table 11. DC Characteristics (continued) Num C Characteristic Symbol Condition Typ1 Max Unit 10 — — μs 17 D POR re-arm time 18 P Low-voltage detection threshold — high range7 VLVDH8 VDD falling VDD rising 2.11 2.16 2.16 2.21 2.22 2.27 V 19 P Low-voltage detection threshold — low range7 VLVDL VDD falling VDD rising 1.80 1.86 1.82 1.90 1.91 1.99 V 20 P Low-voltage warning threshold — high range7 VLVWH VDD falling VDD rising 2.36 2.36 2.46 2.46 2.56 2.56 V 21 P Low-voltage warning threshold — low range7 VLVWL VDD falling VDD rising 2.11 2.16 2.16 2.21 2.22 2.27 V 22 C Low-voltage inhibit reset/recover hysteresis7 Vhys — 50 — mV 23 P Bandgap Voltage Reference9 VBG 1.15 1.17 1.18 V 1 2 3 4 5 6 tPOR Min Typical values are measured at 25°C. Characterized, not tested As the supply voltage rises, the LVD circuit will hold the MCU in reset until the supply has risen above VLVDL. All functional non-supply pins are internally clamped to VSS and VDD. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the larger of the two values. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if clock rate is very low (which would reduce overall power consumption). Maximum is highest voltage that POR is guaranteed. Low voltage detection and warning limits measured at 1 MHz bus frequency. 8 Run at 1 MHz bus frequency Factory trimmed at VDD = 3.0 V, Temp = 25°C 9 PULL-UP RESISTOR TYPICALS 85°C 25°C –40°C PULL-UP RESISTOR (kΩ) 40 35 30 25 20 1.8 2 2.2 2.4 2.6 2.8 VDD (V) 3 3.2 3.4 3.6 PULL-DOWN RESISTANCE (kΩ) 7 40 35 PULL-DOWN RESISTOR TYPICALS 85°C 25°C –40°C 30 25 20 1.8 2.3 2.8 VDD (V) 3.3 3.6 Figure 6. Pull-up and Pull-down Typical Resistor Values MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 21 TYPICAL VOL VS IOL AT VDD = 3.0 V 1.2 85°C 25°C –40°C 1 0.15 VOL (V) 0.8 VOL (V) TYPICAL VOL VS VDD 0.2 0.6 0.4 0.2 0.1 85°C, IOL = 2 mA 25°C, IOL = 2 mA –40°C, IOL = 2 mA 0.05 0 0 0 5 10 IOL (mA) 15 1 20 2 3 VDD (V) 4 Figure 7. Typical Low-Side Driver (Sink) Characteristics — Low Drive (PTxDSn = 0) 0.4 85°C 25°C –40°C 0.8 0.4 0.2 0.2 0.1 0 0 0 85°C 25°C –40°C 0.3 0.6 VOL (V) VOL (V) TYPICAL VOL VS VDD TYPICAL VOL VS IOL AT VDD = 3.0 V 1 10 20 30 IOL = 10 mA IOL = 6 mA IOL = 3 mA 1 2 3 4 VDD (V) IOL (mA) Figure 8. Typical Low-Side Driver (Sink) Characteristics — High Drive (PTxDSn = 1) TYPICAL VDD – VOH VS IOH AT VDD = 3.0 V 0.25 85°C 25°C –40°C 1 VDD – VOH (V) VDD – VOH (V) 1.2 0.8 0.6 0.4 TYPICAL VDD – VOH VS VDD AT SPEC IOH 85°C, IOH = 2 mA 25°C, IOH = 2 mA –40°C, IOH = 2 mA 0.2 0.15 0.1 0.05 0.2 0 0 0 –5 –10 IOH (mA)) –15 –20 1 2 VDD (V) 3 4 Figure 9. Typical High-Side (Source) Characteristics — Low Drive (PTxDSn = 0) MC12311 Advance Information, Rev. 1.0 22 Freescale Semiconductor TYPICAL VDD – VOH VS VDD AT SPEC IOH TYPICAL VDD – VOH VS IOH AT VDD = 3.0 V 0.8 VDD – VOH (V) VDD – VOH (V) 0.4 85°C 25°C –40°C 0.6 0.4 0.2 0 0 –5 –10 –15 –20 IOH (mA) –25 –30 85°C 25°C –40°C 0.3 0.2 IOH = –10 mA IOH = –6 mA 0.1 IOH = –3 mA 0 1 2 3 4 VDD (V) Figure 10. Typical High-Side (Source) Characteristics — High Drive (PTxDSn = 1) 8.4.2 MCU Supply Current Characteristics This section includes information about power supply current in various operating modes. Table 12. Supply Current Characteristics Num C P P 1 Symbol Run supply current FEI mode, all modules on RIDD VDD (V) 20 MHz 3 Max 13 184 –40 to 25 14 15 85 13.75 — 8 MHz 5.59 — T 1 MHz 1.03 — 25.165 MHz 11.5 12.3 9.5 — 4.6 — 1.0 — 152 — T Run supply current FEI mode, all modules off RIDD T T 3 4 T C T 8 MHz 3 1 MHz Run supply current LPS=0, all modules off RIDD T T 20 MHz Run supply current LPS=1, all modules off, running from Flash Run supply current LPS=1, all modules off, running from RAM T 16 kHz FBELP 3 115 Unit mA –40 to 85 mA –40 to 85 μA –40 to 85 — — 21.9 RIDD 16 kHz FBELP 3 25.165 MHz WIDD 20 MHz 8 MHz 3 1 MHz 0 to 70 — — 7.3 Wait mode supply current FEI mode, all modules off T 16 kHz FBILP Temp (°C) Typ1 T T 5 Bus Freq 25.165 MHz T C 2 Parameter –40 to 85 μA — 5.74 6 4.57 — 2 — 0.73 — 0 to 70 –40 to 85 mA –-40 to 85 MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 23 Table 12. Supply Current Characteristics (continued) Num C P Parameter Symbol Bus Freq VDD (V) Stop2 mode supply current C 3 P 6 S2IDD C n/a C 2 C P C Stop3 mode supply current No clocks active 3 P 7 S3IDD C n/a C 2 C 1 Max 0.35 0.65 -40 to 25 0.8 1.0 70 2.0 4.5 0.25 0.5 0.65 0.85 70 1.5 3.5 85 0.45 1.0 -40 to 25 1.5 2.3 70 4 8 0.35 0.7 1 2 70 3.5 6.0 85 Unit μA μA 8 T EREFSTEN=1 32 kHz 500 nA 9 T IREFSTEN=1 32 kHz 70 μA 10 T TPM PWM 100 Hz 12 nA 11 T SCI, SPI, or IIC 300 bps 15 μA 12 T RTC using LPO 1 kHz 200 μA 13 T RTC using ICSERCLK 32 kHz 1 μA 14 T LVD n/a 100 μA 15 T ACMP n/a 20 μA Low power mode adders: 3 Temp (°C) Typ1 85 -40 to 25 85 -40 to 25 -40 to 85 Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value. Table 13. Stop Mode Adders Temperature (°C) Num C Parameter 1 T LPO 2 T ERREFSTEN 3 T IREFSTEN1 4 T RTC T LVD1 5 1 Condition Units -40 25 70 85 50 75 100 150 nA 1000 1000 1100 1500 nA 63 70 77 81 uA does not include clock source current 50 75 100 150 nA LVDSE = 1 90 100 110 115 uA RANGE = HGO = 0 6 T ACMP not using the bandgap (BGBE = 0) 18 20 22 23 uA 7 T ADC1 ADLPC = ADLSMP = 1 not using the bandgap (BGBE = 0) 95 106 114 120 uA MC12311 Advance Information, Rev. 1.0 24 Freescale Semiconductor 1 Not available in stop2 mode. 8.4.3 External Oscillator (XOSCVLP) Characteristics Reference Figure 11 and Figure 12 for crystal or resonator circuits. Table 14. XOSC and ICS Specifications (Temperature Range = –40 to 85°C Ambient) Num C Characteristic 1 Oscillator crystal or resonator (EREFS = 1, ERCLKEN = 1) Low range (RANGE = 0) C High range (RANGE = 1), high gain (HGO = 1) High range (RANGE = 1), low power (HGO = 0) 2 D 3 Feedback resistor Low range, low power (RANGE=0, HGO=0)2 D Low range, High Gain (RANGE=0, HGO=1) High range (RANGE=1, HGO=X) 4 Series resistor — Low range, low power (RANGE = 0, HGO = 0)2 Low range, high gain (RANGE = 0, HGO = 1) High range, low power (RANGE = 1, HGO = 0) D High range, high gain (RANGE = 1, HGO = 1) ≥ 8 MHz 4 MHz 1 MHz Load capacitors Low range (RANGE=0), low power (HGO=0) Other oscillator settings 5 Crystal start-up time 4 Low range, low power Low range, high power C High range, low power High range, high power 6 D Symbol Min Typ1 Max Unit flo fhi fhi 32 1 1 — — — 38.4 16 8 kHz MHz MHz RF RS t CSTL t CSTH Square wave input clock frequency (EREFS = 0, ERCLKEN = 1) FEE or FBE mode FBELP mode See Note2 See Note3 C1,C2 fextal — — — — 10 1 — — — — — — — 0 100 — — — — — — 0 0 0 0 10 20 — — — — 200 400 5 15 — — — — ms 0.03125 0 — — 40.0 50.33 MHz MHz MΩ kΩ 1 Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value. Load capacitors (C1,C2), feedback resistor (RF) and series resistor (RS) are incorporated internally when RANGE=HGO=0. 3 See crystal or resonator manufacturer’s recommendation. 4 Proper PC board layout procedures must be followed to achieve specifications. 2 MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 25 XOSC EXTAL XTAL RF RS Crystal or Resonator C1 C2 Figure 11. Typical Crystal or Resonator Circuit: High Range and Low Range/High Gain XOSC EXTAL XTAL Crystal or Resonator Figure 12. Typical Crystal or Resonator Circuit: Low Range/Low Gain 8.4.4 Internal Clock Source (ICS) Characteristics Table 15. ICS Frequency Specifications (Temperature Range = –40 to 85°C Ambient) Symbol Min Typ1 Max Unit Average internal reference frequency — factory trimmed at VDD = 3.6 V and temperature = 25°C fint_ft — 32.768 — kHz P Internal reference frequency — user trimmed fint_ut 31.25 — 39.06 kHz T Internal reference start-up time tIRST — 5 10 μs 16 — 20 32 — 40 High range (DRS=10) 48 — 60 Low range (DRS=00) — 19.92 — — 39.85 — — 59.77 — Num C 1 P 2 3 Characteristic P 4 P Low range (DRS=00) DCO output frequency range — trimmed 2 P P 5 P P DCO output frequency 2 Reference = 32768 Hz and DMX32 = 1 Mid range (DRS=01) Mid range (DRS=01) fdco_u fdco_DMX32 High range (DRS=10) MHz MHz 6 C Resolution of trimmed DCO output frequency at fixed voltage and temperature (using FTRIM) Δfdco_res_t — ± 0.1 ± 0.2 %fdco 7 C Resolution of trimmed DCO output frequency at fixed voltage and temperature (not using FTRIM) Δfdco_res_t — ± 0.2 ± 0.4 %fdco MC12311 Advance Information, Rev. 1.0 26 Freescale Semiconductor Table 15. ICS Frequency Specifications (Temperature Range = –40 to 85°C Ambient) (continued) Symbol Min Typ1 Max Unit Total deviation of trimmed DCO output frequency over voltage and temperature Δfdco_t — + 0.5 -1.0 ±2 %fdco Total deviation of trimmed DCO output frequency over fixed voltage and temperature range of 0°C to 70 °C Δfdco_t — ± 0.5 ±1 %fdco tAcquire — — 1 ms CJitter — 0.02 0.2 %fdco Num C Characteristic 8 C 9 C 10 C FLL acquisition time 3 11 C Long term jitter of DCO output clock (averaged over 2-ms interval) 4 1 Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value. The resulting bus clock frequency should not exceed the maximum specified bus clock frequency of the device. 3 This specification applies to any time the FLL reference source or reference divider is changed, trim value changed or changing from FLL disabled (FBELP, FBILP) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 4 Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f Bus. Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected into the FLL circuitry via VDD and VSS and variation in crystal oscillator frequency increase the CJitter percentage for a given interval. 2 8.4.5 MCU AC Characteristics This section describes timing characteristics for each peripheral system. 8.4.5.1 Control Timing Table 16. Control Timing Num C Rating 1 D Bus frequency (tcyc = 1/fBus) VDD ≥ 1.8V VDD > 2.1V VDD > 2.4V 2 D Internal low power oscillator period width2 Typ1 Max — — — 10 20 25.165 700 — 1300 μs textrst 100 — — ns Symbol Min fBus dc tLPO Unit MHz 3 D External reset pulse 4 D Reset low drive trstdrv 34 x tcyc — — ns 5 D BKGD/MS setup time after issuing background debug force reset to enter user or BDM modes tMSSU 500 — — ns 6 D BKGD/MS hold time after issuing background debug force reset to enter user or BDM modes 3 tMSH 100 — — μs 7 D IRQ pulse width Asynchronous path2 Synchronous path4 tILIH, tIHIL 100 1.5 x tcyc — — — — ns MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 27 Table 16. Control Timing (continued) Num C 8 D 9 10 C Symbol Min Typ1 Max Unit Keyboard interrupt pulse width Asynchronous path2 Synchronous path4 tILIH, tIHIL 100 1.5 x tcyc — — — — ns Port rise and fall time — Low output drive (PTxDS = 0) (load = 50 pF)5 Slew rate control disabled (PTxSE = 0) Slew rate control enabled (PTxSE = 1) tRise, tFall — — 8 31 — — Port rise and fall time — High output drive (PTxDS = 1) (load = 50 pF) Slew rate control disabled (PTxSE = 0) Slew rate control enabled (PTxSE = 1) tRise, tFall — — 7 24 — — — 4 — Rating Voltage regulator recovery time tVRR ns ns μs 1 Typical values are based on characterization data at VDD = 3.0V, 25°C unless otherwise stated. This is the shortest pulse that is guaranteed to be recognized as a reset or interrupt pin request. Shorter pulses are not guaranteed to override reset requests from internal sources. 3 To enter BDM mode following a POR, BKGD/MS should be held low during the power-up and for a hold time of t MSH after VDD rises above VLVD. 4 This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case. 5 Timing is shown with respect to 20% V DD and 80% VDD levels. Temperature range –40°C to 85°C. 2 textrst RESET PIN Figure 13. Reset Timing tIHIL KBIPx IRQ/KBIPx tILIH Figure 14. IRQ/KBIPx Timing 8.4.6 TPM Module Timing Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current bus rate clock. MC12311 Advance Information, Rev. 1.0 28 Freescale Semiconductor Table 17. TPM Input Timing No. C Function Symbol Min Max Unit 1 D External clock frequency fTCLK 0 fBus/4 Hz 2 D External clock period tTCLK 4 — tcyc 3 D External clock high time tclkh 1.5 — tcyc 4 D External clock low time tclkl 1.5 — tcyc 5 D Input capture pulse width tICPW 1.5 — tcyc Comment tTCLK tclkh TCLK tclkl Figure 15. Timer External Clock tICPW TPMCHn TPMCHn tICPW Figure 16. Timer Input Capture Pulse 8.4.7 ADC Characteristics Table 18. 12-bit ADC Operating Conditions C D Characteristic Supply voltage Conditions Absolute Delta to VDD (VDD-VDDA )2 Delta to VSS (VSS-VSSA)2 Symb Min Typ1 Max Unit VDDA 1.8 — 3.6 V ΔVDDA -100 0 +100 mV ΔVSSA -100 0 +100 mV D Ground voltage D Ref Voltage High VREFH 1.8 VDDA VDDA V D Ref Voltage Low VREFL VSSA VSSA VSSA V D Input Voltage VADIN VREFL — VREFH V C Input Capacitance CADIN — 4.5 5.5 C Input Resistance RADIN — 5 7 pF kΩ MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 29 Table 18. 12-bit ADC Operating Conditions (continued) C Analog Source Resistance C D Min Typ1 Max — — — — 2 5 10 bit mode fADCK > 4MHz fADCK < 4MHz — — — — 5 10 8 bit mode (all valid fADCK) — — 10 0.4 — 8.0 0.4 — 4.0 Characteristic Conditions Symb RAS 12 bit mode fADCK > 4MHz fADCK < 4MHz Unit Comment External to MCU kΩ ADC Conversion High Speed (ADLPC=0) Clock Freq. Low Power (ADLPC=1) fADCK MHz 1 Typical values assume VDDA = 3.0V, Temp = 25°C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2 DC potential difference. SIMPLIFIED INPUT PIN EQUIVALENT ZADIN CIRCUIT Pad leakage due to input protection ZAS RAS SIMPLIFIED CHANNEL SELECT CIRCUIT RADIN ADC SAR ENGINE + VADIN VAS + – CAS – RADIN INPUT PIN INPUT PIN RADIN RADIN INPUT PIN CADIN Figure 17. ADC Input Impedance Equivalency Diagram MC12311 Advance Information, Rev. 1.0 30 Freescale Semiconductor Table 19. 12-bit ADC Characteristics (VREFH = VDDASSA, VREFL = VSSA) C Symb Min Typ1 Max Supply Current ADLPC=1 ADLSMP=1 ADCO=1 T IDDA — 120 — Supply Current ADLPC=1 ADLSMP=0 ADCO=1 T Supply Current ADLPC=0 ADLSMP=1 ADCO=1 T Supply Current ADLPC=0 ADLSMP=0 ADCO=1 D Characteristic Conditions IDDA — 202 — μA IDDA — 288 — μA IDDA — 0.532 1 mA Stop, Reset, Module Off P IDDA — 0.007 0.8 ADC Asynchronous Clock Source High Speed (ADLPC=0) P fADACK 2 3.3 5 Low Power (ADLPC=1) Conversion Time Short Sample (ADLSMP=0) (Including Long Sample (ADLSMP=1) sample time) P P Short Sample (ADLSMP=0) P Long Sample (ADLSMP=1) C tADS ETUE 1.25 2 3.3 — 20 — — 40 — — 3.5 — — 23.5 — — –1 to 3 –2.5 to 5.5 — –1 to 3 –3.0 to 6.5 10 bit mode P — ±1 ±2.5 8 bit mode T — ±0.5 ±1.0 12 bit mode T — ±1.0 –1.5 to 2.0 10 bit mode3 DNL P — ±0.5 ±1.0 3 T — ±0.3 ±0.5 12 bit mode T — ±1.5 –2.5 to 2.75 10 bit mode T — ±0.5 ±1.0 8 bit mode T — ±0.3 ±0.5 — ±1.5 ±2.5 8 bit mode Integral Non-Linearity tADC C Total Unadjusted 12-bit mode, 3.6> VDDA > 2.7 T Error 12-bit mode, 2.7> VDDA > 1.8V T Differential Non-Linearity Comment μA Supply Current Sample Time Unit INL Zero-Scale Error 12 bit mode T EZS 10 bit mode P — ±0.5 ±1.5 8 bit mode T — ±0.5 ±0.5 μA MHz ADCK cycles ADCK cycles LSB2 tADACK = 1/fADACK See the ADC chapter in the MC9S08QE128 Reference Manual for conversion time variances Includes Quantization LSB2 LSB2 LSB2 VADIN = VSSA MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 31 Table 19. 12-bit ADC Characteristics (VREFH = VDDASSA, VREFL = VSSA) (continued) C Symb Min Typ1 Max Unit Comment 12 bit mode T EFS — ±1.0 –3.5 to 1.0 LSB2 VADIN = VDDA 10 bit mode P — ±0.5 ±1 8 bit mode T — ±0.5 ±0.5 12 bit mode D — -1 to 0 — 10 bit mode — — ±0.5 8 bit mode — — ±0.5 — ±2 — 10 bit mode — ±0.2 ±4 8 bit mode — ±0.1 ±1.2 — 1.646 — — 1.769 — — 701.2 — Characteristic Full-Scale Error Quantization Error Input Leakage Error Temp Sensor Slope Temp Sensor Voltage Conditions 12 bit mode D -40°C to 25°C D EQ EIL m 25°C to 85°C 25°C D VTEMP25 LSB2 LSB2 Pad leakage4 * RAS mV/°C mV 1 Typical values assume VDDA = 3.0V, Temp = 25°C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2 1 LSB = (V N REFH - VREFL)/2 3 Monotonicity and No-Missing-Codes guaranteed in 10 bit and 8 bit modes 4 Based on input pad leakage current. Refer to pad electricals. 8.5 Flash Specifications This section provides details about program/erase times and program-erase endurance for the flash memory. Program and erase operations do not require any special power sources other than the normal VDD supply. For more detailed information about program/erase operations, see the Memory section of the MC9S08QE128 Reference Manual. Table 20. Flash Characteristics C Characteristic Symbol Min Typical Max Unit D Supply voltage for program/erase -40°C to 85°C Vprog/erase 1.8 3.6 V D Supply voltage for read operation VRead 1.8 3.6 V fFCLK 150 200 kHz tFcyc 5 6.67 μs 1 D Internal FCLK frequency D Internal FCLK period (1/FCLK) P P Byte program time (random location) Byte program time (burst time2 P Page erase P Mass erase time(2) mode)(2) (2) tprog 9 tFcyc tBurst 4 tFcyc tPage 4000 tFcyc tMass 20,000 tFcyc MC12311 Advance Information, Rev. 1.0 32 Freescale Semiconductor Table 20. Flash Characteristics (continued) C Characteristic Byte program current3 Page erase current 3 Symbol Min Typical Max Unit RIDDBP — 4 — mA RIDDPE — 6 — mA 10,000 — — 100,000 — — cycles 15 100 — years endurance4 C Program/erase TL to TH = –40°C to + 85°C T = 25°C C Data retention5 tD_ret 1 The frequency of this clock is controlled by a software setting. These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for calculating approximate time to program and erase. 3 The program and erase currents are additional to the standard run IDD. These values are measured at room temperatures with VDD = 3.0 V, bus frequency = 4.0 MHz. 4 Typical endurance for flash was evaluated for this product family on the HC9S12Dx64. For additional information on how Freescale defines typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile Memory. 5 Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale defines typical data retention, please refer to Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory. 2 8.5.1 Onboard System SPI Timing Table 21. SPI Timing No. Function Symbol Operating frequency Master 1 2 3 4 5 6 7 8 9 fop SCK period Master tSCK Enable lead time Master tLead Enable lag time Master tLag Clock (SCK) high or low time Master tWSCK Data setup time (inputs) Master tSU Data hold time (inputs) Master tHI Data valid (after SCK edge) Master tv Data hold time to transceiver tHO Slave Select high time between accesses tnhigh Min Max Unit fBus/2048 10 2 2048 tcyc 1/2 — tSCK 1/2 — tSCK 62.5 1024 tcyc ns 15 — ns 0 — ns — 25 ns 250 — ns MHz 20 ns MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 33 SS1 (OUTPUT) 1 SCK (CPOL = 0) (OUTPUT) 4 10 SCK (CPOL = 1) (OUTPUT) 5 MISO (INPUT) 6 MSB IN2 BIT 6 . . . 1 2 MOSI (OUTPUT) 3 9 4 LSB IN 7 MSB OUT2 BIT 6 . . . 1 8 LSB OUT Figure 18. Onboard SPI Timing 9 Typical Applications Circuit Figure 19 show a MC12311 typical applications circuit with and without use of an external power amplifier (PA) (driven by the RF power boost feature). Note a number of circuit features: 1. The two metal flags on the package bottom are independent (unconnected), and as a result, both must be connected to ground. 2. The topology of the external RF matching components is consistent across various frequency bandwidths. Only the component values differ as determined by the desired frequency range. 3. Freescale recommends using a single crystal design (as shown) to minimize systems costs - the circuit must connect transceiver signal DIO5/CLKOUT to the MCU EXTAL input to supply the MCU with a crystal accurate clock source. Also, the MCU initialization must enable the DIO5 pin as the ClkOut function. 4. Freescale also recommends that the transceiver RESET is driven by an MCU GPIO to provide total hardware control of the transceiver. Figure 19 shows GPIO PTC0 (preferred), but any GPIO can be used. 5. The MC12311 provides onboard connection for the DIO1-DIO0 status to the MCU. External connection of DIO4-DIO2 status to MCU GPIO may be useful or required to implement a wireless node communication algorithm. 6. The transceiver reference oscillator uses the specified 32 MHz crystal (pins XTA and XTB). 7. A debug port connector is provided for programming the 9S08QE32 MCU FLASH and debugging code. 8. A simple UART interface (without flow control) is shown that is useful for a command/ communication channel interface or for system debug. Two common RF wiring options are shown in Figure 19: 1. Bi-directional single port operation - this mode uses the bi-directional RF port pin of the MC12311 designated as RFIO. The device transmits and receives through this single port. MC12311 Advance Information, Rev. 1.0 34 Freescale Semiconductor — Typical +13 dBm TX output power — Inductor L6 acts to provide DC power to the onboard transmitter while also acting as an AC signal block. — The circuit topology defined by inductors L7, L4 and L2 as well as capacitors C15, C13, C11, C7, C9, and C4 can provide: – Impedance matching between the RFIO port and the antenna – Low pass filtering for the onboard transmitter - when fully populated can implement an elliptic-function low pass filter. NOTE • The topology for the RF matching network can be used over the various bands of interest with changes in component values • Not all indicated components are used at all frequencies • Refer to MC12311Sub 1 GHz Low Power Transceiver plus Microcontroller Reference Manual (MC12311RM.pdf) for additional information 2. Dual port operation with external amplification - this mode uses the RFIO port pin of the MC12311 typically as the RX input and the auxiliary port PA_BOOST as the TX output. An external PA can optionally be inserted into the transmit path and an external antenna switch is also required. — The PA_BOOST has typical +17 dBm output power - this is +4 dBm higher than the RFIO and helps achieve higher power at the PA output — The PA_BOOST transmit path has a similar filter matching network discussed in the single-port to do low pass filtering and impedance match. The above note about components values also applies. — With separate transmit and receive paths, an antenna switch is required - the RXTX signal or another programmed GPIO can be used to switch paths depending on radio operation. — The receive side matching network can be simplified as no low pass filtering or harmonic trapping is required as with the transmit and single port networks MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 35 2 4 Freescale Semiconductor 32 Mhz 1 3 Y3 C50 C51 CL TRANS_RESET V_Batt CL TP3 CLK OUT Connection for Dual Port Mode and Optional External Power Amplifier BKGD BDM RESET C54 100nF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 57 58 59 60 VREFH VREFL VSSAD VSS EXTAL/PTB7 XTAL/PTB6 PTB5 PTB4 PTC3 PTC2 PTC1 PTC0 PTB3 PTB2 VR_PA PA_BOOST GND_PA1 RFIO GND_PA2 RXTX GND VBAT2 PTA4/BKGD/MS PTA5/IRQ/RESETB PTC4 PTC5 NC PTC6 1 VR_PA C61 C50 220PF 0.01UF 42 41 40 39 38 37 36 35 34 33 32 31 30 29 Optional External PA C8 V_Batt MC12311 J6 C1 VDD PA_BOOST R3 0 C72 47PF 1 2 1 2 L3 RFIO L1 3 1 2 C12 RXTX C3 C2 V_Batt BKGD RESET OUT2 VDD OUT1 IN GND VCONT C58 C57 220PF 0.1UF C11 ANT ANT A5 C7 C13 L7 1 2 1 2 1 2 L4 RFIO_EXT RFIO RFIO ANT L2 MCU_TXD ANT C4 Standard Connection for Bi-Directional Single Port MCU_RXD V_Batt CON4 + 5 4 RXTX L6 33nH C15 1 2 3 4 6 Ant SW C9 C55 100nF OPTIONAL UART PORT FOR DEBUG / COMM NOTES: 1) 2) 3) 3) PA_BOOST_EXT RFIO C56 100nF SPSCK MOSI NSS MISO L5 33nH 2 R4 47k 100nF C52 2 1 3 5 FLAG FLAG PTB1 PTB0 PTA7 PTA6 VDD VSS PTD4 PTD3 PTD2 PTA3 PTA2 PTA1 PTA0 PTC7 2 4 6 VDDAD VDD1 DIO5/CLKOUT DIO4 DIO3 DIO2 DIO1/PTD0/KBI2P0 DIO0/PTD1/KBi2P1 RESET XTB XTA VR_DIG VR_ANA VBAT1 61 62 1 56 55 54 53 52 51 50 49 48 47 46 45 44 43 U5 J5 C53 100nF 15 16 17 18 19 20 21 22 23 24 25 26 27 28 MC12311 Advance Information, Rev. 1.0 DEBUG PORT RF components determined by desired frequency range. Recommend that ClkOut drive the MCU EXTAL input. Recommend that transceiver RESET be driven from MCU GPIO (PTC0 shown). Transceiver status DIO4-DIO2 may be monitored via external connection to MCU GPIO Figure 19. MC12311 Typical Application Circuit Options 36 10 Mechanical Drawings Figure 20. Mechanical Drawing (1 of 2) MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 37 Figure 21. Mechanical Drawing (2 of 2) MC12311 Advance Information, Rev. 1.0 38 Freescale Semiconductor NOTES MC12311 Advance Information, Rev. 1.0 Freescale Semiconductor 39 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 [email protected] Document Number: MC12311 Rev. 1.0 11/2011 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2010, 2011. All rights reserved.