CP2400-C-GDI Tested 128 Segment LCD Driver Die in Wafer Form

CP2400-C-GDI
Tested 128 Segment LCD Driver Die in Wafer Form
LCD Driver
- Controls up to 128 segments
- Supports static, 2-mux, 3-mux, and 4-mux displays
- On-chip bias generation with internal charge pump
- Low power blink capability
GPIO Expander
- Expands GPIO count by up to 36 pins
- GPIO pins may be configured to push-pull or open-
drain outputs with two drive levels. GPIO may also
be used as digital inputs
Port Match Capability can wake up host controller
using interrupt pin
5 V Tolerant I/O
Real Time Clock, SmaRTClock
- Precision time keeping with 32.768 kHz watch crystal; self-oscillate mode requires no external crystal;
accepts external 32 kHz CMOS clock
36-hour programmable counter with wake up alarm
Can wake up the host controller using interrupt pin
Low power (<1.5 µA)
256 Bytes RAM
- General purpose RAM expands the memory available to host controller.
16-bit Timers
l Two
general purpose 16-bit timers
Digital Bus Interface
- 4-wire SPI Interface (SPI device only) operates up
-
to 2.5 Mbps with synchronous external clock or up
to 1 Mbps with internal clock
Dedicated RST and INT pins
Optional CLK pin can be used as a CMOS clock
input.
2-wire SMBus/I2C interface (SMBus/I2C device
only) operates up to 400 kHz with internal clock
Optional PWR pin (SMBus/I2C device only) places
the device in a low-power mode. SPI devices use
the NSS pin to place device in a low-power mode
Low Power
- 1.8–3.6 V operation with integrated LDO
- Ultra Low Power Mode w/ LCD (<3 µA typical)
- Shutdown current (0.05 µA typical)
Example Applications
- Handheld Equipment
- Utility Meters
- Thermostat Display
- Home Security Systems
Temperature Range: –40 to +85 °C
Full Technical Data Sheet
- CP2400/1/2/3
Clock Sources
- 20 MHz Internal oscillator
- Can be clocked from an external CMOS clock
CP2400/1
Optional
Host
Interface
Host
Controller
SPI
(CP2400)
20 MHz
Internal
Oscillator
smaRTClock
2 x 16-bit
Timers
GPIO Expander
Digital I/O
256 Byte
SRAM
LCD Controller
LCD
32.768 kHz
OR
SMBus/I2C
(CP2401)
Rev. 1.1 4/12
Copyright © 2012 by Silicon Laboratories
CP2400-C-GDI
CP2400-C-GDI
1. Ordering Information
MIPS (Peak)
RAM (Bytes)
SmaRTClock Real Time Clock
SMBus/I2C
Enhanced SPI
Timers (16-bit)
Digital Port I/Os
CP2400-GDI1,2
20
256



2
36
Notes:
1. See “SPI Bonding Information” on page 7.
2. See “SMBus/I2C Bonding Information” on page 10.
2
Rev. 1.1
Package
Ordering Part Number
Table 1.1. Product Selection Guide
Tested Die in
Wafer Form
CP2400-C-GDI
2. Pin Definitions
Table 2.1 lists the pin definitions for the CP2400-C-GDI.
Table 2.1. Pin Definitions for the CP2400-C-GDI
Name
Physical Pad
Number
Type
Description
Crystal Input. This pin is the return for the external oscillator
driver. This pin can be overdriven by an external CMOS clock.
SPI
SMBus/
I 2C
XTAL1
2
2
A In
XTAL2
3
3
A Out
VDD
4
4
GND
5, 6, 43
5, 6,
43, 53
Ground
Ground
CAP
1
1
Power
Out
LCD Power Supply Voltage Output. This pin requires a 10 µF
decoupling capacitor.
CLK
57
57
D In
CMOS clock input. This pin should not be left floating.
RST
56
56
D In
Device Reset. An external source can initiate a system reset
by driving this pin low for at least 15 µs. This pin has an
internal weak pullup.
INT
55
55
D Out
Interrupt Service Request. This pin provides notification to the
host. This pin is a push-pull output.
NSS
52
—
D In
Slave select signal for SPI interface. This pin should not be
left floating.
MOSI
51
—
D In
Master Out/Slave In data signal for SPI interface. This pin
should not be left floating.
MISO
50
—
D Out
SCK
49
—
D In
Clock signal for SPI interface. This pin should not be left
floating.
PWR
—
54
D In
Allows SMBus device to enter the Ultra Low Power mode.
This pin should not be left floating.
SCL
—
52
D I/O
Clock signal for SMBus interface. This pin should not be left
floating.
SDA
—
51
D I/O
Data signal for SMBus interface. This pin should not be left
floating.
Crystal Output. This pin is the excitation driver for a quartz
crystal.
Power In 1.8–3.6 V Power Supply Voltage Input.
Master In/Slave Out data signal for SPI interface
Rev. 1.1
3
CP2400-C-GDI
Table 2.1. Pin Definitions for the CP2400-C-GDI (Continued)
Name
4
Physical Pad
Number
Type
Description
SPI
SMBus/
I 2C
SMBA0
—
50
D In
P0.0
LCD0
48
48
D I/O
A Out
Bit 0, Port 0
P0.1
LCD1
47
47
D I/O
A Out
Bit 1, Port 0
P0.2
LCD2
46
46
D I/O
A Out
Bit 2, Port 0
P0.3
LCD3
45
45
D I/O
A Out
Bit 3, Port 0
P0.4
LCD4
42
42
D I/O
A Out
Bit 4, Port 0
P0.5
LCD5
41
41
D I/O
A Out
Bit 5, Port 0
P0.6
LCD6
40
40
D I/O
A Out
Bit 6, Port 0
P0.7
LCD7
39
39
D I/O
A Out
Bit 7, Port 0
P1.0
LCD8
38
38
D I/O
A Out
Bit 0, Port 1
P1.1
LCD9
37
37
D I/O
A Out
Bit 1, Port 1
P1.2
LCD10
36
36
D I/O
A Out
Bit 2, Port 1
P1.3
LCD11
35
35
D I/O
A Out
Bit 3, Port 1
P1.4
LCD12
34
34
D I/O
A Out
Bit 4, Port 1
P1.5
LCD13
33
33
D I/O
A Out
Bit 5, Port 1
P1.6
LCD14
32
32
D I/O
A Out
Bit 6, Port 1
Bit 0, SMBus Slave Address. This pin should not be left
floating.
Rev. 1.1
CP2400-C-GDI
Table 2.1. Pin Definitions for the CP2400-C-GDI (Continued)
Name
Physical Pad
Number
Type
Description
SPI
SMBus/
I 2C
P1.7
LCD15
31
31
D I/O
A Out
Bit 7, Port 1
P2.0
LCD16
26
26
D I/O
A Out
Bit 0, Port 2
P2.1
LCD17
25
25
D I/O
A Out
Bit 1, Port 2
P2.2
LCD18
24
24
D I/O
A Out
Bit 2, Port 2
P2.3
LCD19
23
23
D I/O
A Out
Bit 3, Port 2
P2.4
LCD20
22
22
D I/O
A Out
Bit 4, Port 2
P2.5
LCD21
21
21
D I/O
A Out
Bit 5, Port 2
P2.6
LCD22
20
20
D I/O
A Out
Bit 6, Port 2
P2.7
LCD23
19
19
D I/O
A Out
Bit 7, Port 2
P3.0
LCD24
18
18
D I/O
A Out
Bit 0, Port 3
P3.1
LCD25
17
17
D I/O
A Out
Bit 1, Port 3
P3.2
LCD26
16
16
D I/O
A Out
Bit 2, Port 3
P3.3
LCD27
15
15
D I/O
A Out
Bit 3, Port 3
P3.4
LCD28
14
14
D I/O
A Out
Bit 4, Port 3
P3.5
LCD29
13
13
D I/O
A Out
Bit 5, Port 3
P3.6
LCD30
12
12
D I/O
A Out
Bit 6, Port 3
Rev. 1.1
5
CP2400-C-GDI
Table 2.1. Pin Definitions for the CP2400-C-GDI (Continued)
Name
6
Physical Pad
Number
Type
Description
SPI
SMBus/
I 2C
P3.7
LCD31
11
11
D I/O
A Out
Bit 7, Port 3
P4.0
COM0
10
10
D I/O
A Out
Bit 0, Port 4
P4.1
COM1
9
9
D I/O
A Out
Bit 1, Port 4
P4.2
COM2
8
8
D I/O
A Out
Bit 2, Port 4
P4.3
COM3
7
7
D I/O
A Out
Bit 3, Port 4
Rev. 1.1
CP2400-C-GDI
3. Bonding Information
3.1. SPI Bonding Information
Table 3.1. SPI Bonding Pad Coordinates (Relative to Center of Die)
Physical Pad
Number
Example Package
Pin Number
(QFN-48)
Package Pin Name
Physical Pad X
(µm)
Physical Pad Y
(µm)
1
48
CAP
–858.75
545.41
2
1
XTAL1
–858.75
470.41
3
2
XTAL2
–858.75
395.41
4
3
VDD
–858.75
320.41
5
4
GND
–858.75
245.41
6
4
GND
–858.75
170.41
7
5
P4.3/COM3
–858.75
50.41
8
6
P4.2/COM2
–858.75
–24.59
9
7
P4.1/COM1
–858.75
–99.59
10
8
P4.0/COM0
–858.75
–174.59
11
9
P3.7/LCD31
–858.75
–249.59
12
10
P3.6/LCD30
–858.75
–324.59
13
11
P3.5/LCD29
–858.75
–399.59
14
12
P3.4/LCD28
–858.75
–474.59
15
13
P3.3/LCD27
–858.75
–549.59
16
14
P3.2/LCD26
–508.49
–739.5
17
15
P3.1/LCD25
–433.49
–739.5
18
16
P3.0/LCD24
–358.49
–739.5
19
17
P2.7/LCD23
–283.49
–739.5
20
18
P2.6/LCD22
–208.49
–739.5
21
19
P2.5/LCD21
–133.49
–739.5
22
20
P2.4/LCD20
–58.49
–739.5
23
21
P2.3/LCD19
61.51
–739.5
24
22
P2.2/LCD18
136.51
–739.5
25
23
P2.1/LCD17
211.51
–739.5
26
24
P2.0/LCD16
286.51
–739.5
27
Reserved*
—
361.51
–739.5
28
Reserved*
—
436.51
–739.5
29
Reserved*
—
511.51
–739.5
*Note: Pins marked “Reserved” should not be connected.
Rev. 1.1
7
CP2400-C-GDI
Table 3.1. SPI Bonding Pad Coordinates (Relative to Center of Die) (Continued)
Physical Pad
Number
Example Package
Pin Number
(QFN-48)
Package Pin Name
Physical Pad X
(µm)
Physical Pad Y
(µm)
30
Reserved*
—
858.75
–515.09
31
25
P1.7/LCD15
858.75
–440.09
32
26
P1.6/LCD14
858.75
–365.09
33
27
P1.5/LCD13
858.75
–290.09
34
28
P1.4/LCD12
858.75
–215.09
35
29
P1.3/LCD11
858.75
–140.09
36
30
P1.2/LCD10
858.75
–65.09
37
31
P1.1/LCD9
858.75
54.91
38
32
P1.0/LCD8
858.75
129.91
39
33
P0.7/LCD7
858.75
204.91
40
34
P0.6/LCD6
858.75
279.91
41
35
P0.5/LCD5
858.75
354.91
42
36
P0.4/LCD4
858.75
429.91
43
GND
GND
858.75
504.91
44
Reserved*
—
509.87
739.5
45
37
P0.3/LCD3
434.87
739.5
46
38
P0.2/LCD2
359.87
739.5
47
39
P0.1/LCD1
284.87
739.5
48
40
P0.0/LCD0
209.87
739.5
49
41
SCK
134.87
739.5
50
42
MISO
14.87
739.5
51
43
MOSI
–60.13
739.5
52
44
NSS
–135.13
739.5
53
Reserved*
—
–210.13
739.5
54
Reserved*
—
–285.13
739.5
55
45
INT
–360.13
739.5
56
46
RST
–435.13
739.5
57
47
CLK
–510.12
739.5
*Note: Pins marked “Reserved” should not be connected.
8
Rev. 1.1
CP2400-C-GDI
48
1
25
13
Figure 3.1. Example Die Bonding (QFN-48) for SPI
Rev. 1.1
9
CP2400-C-GDI
3.2. SMBus/I2C Bonding Information
Table 3.2. SMBus/I2C Bonding Pad Coordinates (Relative to Center of Die)
Physical Pad
Number
Example
Package Pin
Number
(QFP-48)
Package Pin Name
Physical Pad X (µm)
Physical Pad Y (µm)
1
48
CAP
–858.75
545.41
2
1
XTAL1
–858.75
470.41
3
2
XTAL2
–858.75
395.41
4
3
VDD
–858.75
320.41
5
4
GND
–858.75
245.41
6
4
GND
–858.75
170.41
7
5
P4.3/COM3
–858.75
50.41
8
6
P4.2/COM2
–858.75
–24.59
9
7
P4.1/COM1
–858.75
–99.59
10
8
P4.0/COM0
–858.75
–174.59
11
9
P3.7/LCD31
–858.75
–249.59
12
10
P3.6/LCD30
–858.75
–324.59
13
11
P3.5/LCD29
–858.75
–399.59
14
12
P3.4/LCD28
–858.75
–474.59
15
13
P3.3/LCD27
–858.75
–549.59
16
14
P3.2/LCD26
–508.49
–739.5
17
15
P3.1/LCD25
–433.49
–739.5
18
16
P3.0/LCD24
–358.49
–739.5
19
17
P2.7/LCD23
–283.49
–739.5
20
18
P2.6/LCD22
–208.49
–739.5
21
19
P2.5/LCD21
–133.49
–739.5
22
20
P2.4/LCD20
–58.49
–739.5
23
21
P2.3/LCD19
61.51
–739.5
24
22
P2.2/LCD18
136.51
–739.5
25
23
P2.1/LCD17
211.51
–739.5
26
24
P2.0/LCD16
286.51
–739.5
27
Reserved*
—
361.51
–739.5
28
Reserved*
—
436.51
–739.5
29
Reserved*
—
511.51
–739.5
*Note: Pins marked “Reserved” should not be connected.
10
Rev. 1.1
CP2400-C-GDI
Table 3.2. SMBus/I2C Bonding Pad Coordinates (Relative to Center of Die)
Physical Pad
Number
Example
Package Pin
Number
(QFP-48)
Package Pin Name
Physical Pad X (µm)
Physical Pad Y (µm)
30
Reserved*
—
858.75
–515.09
31
25
P1.7/LCD15
858.75
–440.09
32
26
P1.6/LCD14
858.75
–365.09
33
27
P1.5/LCD13
858.75
–290.09
34
28
P1.4/LCD12
858.75
–215.09
35
29
P1.3/LCD11
858.75
–140.09
36
30
P1.2/LCD10
858.75
–65.09
37
31
P1.1/LCD9
858.75
54.91
38
32
P1.0/LCD8
858.75
129.91
39
33
P0.7/LCD7
858.75
204.91
40
34
P0.6/LCD6
858.75
279.91
41
35
P0.5/LCD5
858.75
354.91
42
36
P0.4/LCD4
858.75
429.91
43
GND
GND
858.75
504.91
44
Reserved*
—
509.87
739.5
45
37
P0.3/LCD3
434.87
739.5
46
38
P0.2/LCD2
359.87
739.5
47
39
P0.1/LCD1
284.87
739.5
48
40
P0.0/LCD0
209.87
739.5
49
Reserved*
—
134.87
739.5
50
41
SMBA0
14.87
739.5
51
42
SDA
–60.13
739.5
52
43
SCL
–135.13
739.5
53
GND
GND
–210.13
739.5
54
44
/PWR
–285.13
739.5
55
45
/INT
–360.13
739.5
56
46
/RST
–435.13
739.5
57
47
/CLK
–510.12
739.5
*Note: Pins marked “Reserved” should not be connected.
Rev. 1.1
11
CP2400-C-GDI
Figure 3.2. Example Die Bonding (QFP-48) for SMBus/I2C
12
Rev. 1.1
CP2400-C-GDI
Table 3.3. Wafer and Die Information
CP2401C
Wafer ID
8 in
Wafer Dimensions
Die Dimensions
1.88 mm x 1.64 mm
Wafer Thickness
12 mil ±1 mil
Wafer Identification
Notch
Scribe Line Width
80 µm
Contact Sales for info
Die Per Wafer*
Passivation
Standard
Wafer Packaging Detail
Wafer Jar
Bond Pad Dimensions
60 µm x 60 µm
Maximum Processing Temperature
250 °C
Electronic Die Map Format
.txt
Bond Pad Pitch Minimum
65 µm
*Note: This is the Expected Known Good Die yielded per wafer and
represents the batch order quantity (one wafer).
Rev. 1.1
13
CP2400-C-GDI
4. Wafer Storage Guidelines
It is necessary to conform to appropriate wafer storage practices to avoid product degradation or contamination.

Wafers may be stored for up to 18 months in the original packaging supplied by Silicon Labs.
Wafers must be stored at a temperature of 18–24 °C.
 Wafers must be stored in a humidity-controlled environment with a relative humidity of <30%.
 Wafers should be stored in a clean, dry, inert atmosphere (e.g. nitrogen or clean, dry air).

14
Rev. 1.1
CP2400-C-GDI
DOCUMENT CHANGE LIST
Revision 1.0 to Revision 1.1

Changed Wafer Packaging Detail to “Wafer Jar” 
in Table 3.3 on page 13.
Rev. 1.1
15
CP2400-C-GDI
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Please visit the Silicon Labs Technical Support web page:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for
the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further
notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other
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Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
16
Rev. 1.1
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