SPA™ Silicon Protection Array Products Surface Mount TVS Avalanche Diode Array HF Pb GREEN RoHS SP050xBA Lead-Free/Green Series Description The surface mount family of arrays are designed to suppress ESD and other transient overvoltage events. These arrays are used to meet the International Electrotechnical Compatibility (IEC transient immunity standards IEC 61000-4-2 for Electrostatic Discharge Requirements). The series are used to help protect sensitive digital or analog input circuits on data, signal, or control lines with voltage levels up to 5VDC. The monolithic silicon arrays are comprised of specially designed structures for transient voltage suppression(TVS). The size and shape of these structures have be tailored for transient protection. The low capacitance and clamp voltage are ideal for high speed signal line protection. Pinout SP0502BAHTG SP0502BAJTG SP0503BAHTG 1 4 1 3 SP0504BAHTG SP0504BAJTG 1 Features 5 t "O"SSBZPGPS574"WBMBODIF%JPEFTJOBVMUSB small SC70, SOT-23, SOT-143, MSOP or TSSOP packages t &4%$BQBCJMJUZ4UBOEBSET 2 - IEC 61000-4-2, Direct Discharge ........ 20kV (Level 4) - IEC 61000-4-2, Air Discharge .............. 30kV (Level 4) 2 2 3 4 3 - MIL STD 883 3015.7 ..........................................30kV t *OQVU1SPUFDUJPOGPS"QQMJDBUJPOT6QUP7%$ SP0505BAHTG SP0505BAJTG 1 6 2 5 3 4 SP0504BAATG 8 7 6 5 t 'BTU3FTQPOTF5JNF ..................................................<1ns SP0506BAATG 8 7 6 5 t -PX*OQVU$BQBDJUBODF...................................30pF Typical t 0QFSBUJOH5FNQFSBUVSF3BOHF..................... -40ºC to 85ºC Applications t .PCJMFQIPOFIBOETFUT 1 2 3 4 1 2 3 t 1FSTPOBM%JHJUBM Assistants (PDA) 4 t %JHJUBMTUJMMDBNFSBT t 1PSUBCMFIBOEIFME equipment (Laptop, Palmtop computers) SP050xBA Lead-Free/Green Series 72 t $PNQVUFSQPSULFZCPBSE (USB1.1) t %JHJUBMWJEFPDBNFSBT t .1QMBZFST ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Surface Mount TVS Avalanche Diode Array Absolute Maximum Ratings Parameter Storage Temperature Range Package Power Dissipation SC70 SOT23-3, SOT23-5, SOT23-6, SOT143 TSSOP, MSOP Electrical Characteristics Rating -65 to + 150 Units ºC 0.2 0.225 0.5 W W W TA = +25ºC, Unless Otherwise Specified Parameter Reverse Standoff Voltage Reverse Standoff Leakage Current Test Conditions Min Typ Max Units IR < = 1μA - - 5.5 V 1 100 nA V = 5.0V Signal Clamp Voltage Positive I = 10mA 5.6 6.8 8 V Negative I = 10mA -1.2 -0.8 -0.4 V Clamp Voltage during ESD MIL-STD-883 Method 3015 (HBM) test + 8kV 12 V - 8kV -8 V IEC-61000-2, Contact discharge 20 kV MIL-STD-883 Method 3015 (HBM) 30 kV Capacitance 2.5V @ 1Mhz Turn on/off Time 30 pF <1 ns Temperature Range Operating -40 85 ºC Storage -65 150 ºC Diode Dynamic Resistance Forward Conduction 1.0 Ω Reverse Conduction 1.4 Ω Note: (1) ESD voltage applied between channel pins and ground, one pin at a time; all other channel pins are open; all ground pins are grounded. ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 73 SP050xBA Lead-Free/Green Series Lead-Free/Green SP050xBA ESD Test Level (1) SPA™ Silicon Protection Array Products Surface Mount TVS Avalanche Diode Array Typical Input VI Characteristics Typical Diode Capacitance vs. Reverse Voltage (Pulse-mode measurements, pulse width = 0.7 mS nominal) 60 1.6 1.4 1.2 Diode Capacitance (pF) 1.0 Input Current (A) 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 40 20 -0.8 -1.0 -1.2 -1.4 -1.6 0 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 0 Input Voltage (V) 1 2 3 4 5 Diode Reverse Voltage (V) Soldering Parameters - Wave Soldering Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow Pb – Free assembly 5°C/second max 5°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP050xBA Lead-Free/Green Series 74 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Surface Mount TVS Avalanche Diode Array Package Dimensions - SC70 B Package Pins JEDEC 3 502 1 SP0502BAJTG - SC70-3 HE E 2 e A A1 A2 B c D E e HE L e D A2 A A1 C SC70-3 3 MO-203 Issue A Millimeters Inches Min Max Min Max 0.80 1.10 0.031 0.043 0.00 0.10 0.00 0.004 0.70 1.00 0.028 0.039 0.15 0.30 0.006 0.012 0.08 0.25 0.003 0.010 1.85 2.25 0.073 0.089 1.15 1.35 0.045 0.053 0.66 BSC 0.026 BSC 2.00 2.40 0.079 0.094 0.26 0.46 0.010 0.018 5 4 SP0504BAJTG - SC70-5 504 1 Package Pins JEDEC e e E HE A A1 A2 B c D E e HE L 3 2 B D A2 A A1 c SC70-5 5 MO-203 Issue A Millimeters Inches Min Max Min Max 0.80 1.10 0.031 0.043 0.00 0.10 0.00 0.004 0.70 1.00 0.028 0.039 0.15 0.30 0.006 0.012 0.08 0.25 0.003 0.010 1.85 2.25 0.073 0.089 1.15 1.35 0.045 0.053 0.65 BSC 0.026 BSC 2.00 2.40 0.079 0.094 0.26 0.46 0.010 0.018 L 6 Package Pins JEDEC e e 5 SP0505BAJTG - SC70-6 4 505 E Recommended Pad Layout HE A A1 A2 B c D E e HE L M N O P R S T O (REF) 1 2 3 R B + + + D T A2 A + P S (REF) A1 c + + M (REF) + N (REF) L ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 75 SC70-6 6 MO-203 Issue A Millimeters Inches Min Max Min Max 0.80 1.10 0.031 0.043 0.00 0.10 0.00 0.004 0.70 1.00 0.028 0.039 0.15 0.30 0.006 0.012 0.08 0.25 0.003 0.010 1.85 2.25 0.073 0.089 1.15 1.35 0.045 0.053 0.65 BSC 0.026 BSC 2.00 2.40 0.079 0.094 0.26 0.46 0.010 0.018 1.60 0.063 1.30 0.051 0.65 0.026 0.70 0.028 0.35 0.014 0.90 0.035 2.50 0.098 SP050xBA Lead-Free/Green Series Lead-Free/Green SP050xBA L SPA™ Silicon Protection Array Products Surface Mount TVS Avalanche Diode Array Package Dimensions - SOT23 Package Pins JEDEC b 3 SP0502BAHT - SOT23-3 502B 1 E1 E Recommended Pad Layout A A1 b c D E E1 e e1 L1 M N O P 2 e e1 M D P A A1 N 0 C L1 e1 5 4 504B 1 Recommended Pad Layout E1 E A A1 b c D E E1 e e1 L1 M N O P 3 2 B M D A P A1 N c O L1 e 5 505B 1 2 SP0505BAHTG - SOT23-6 4 E1 E Recommended Pad Layout A A1 b c D E E1 e e1 L1 M N O P 3 b M D A P A1 N O c L1 SP050xBA Lead-Free/Green Series 76 Inches Min Max 0.035 0.044 0.0004 0.004 0.012 0.020 0.003 0.008 0.110 0.120 0.083 0.104 0.047 0.055 0.038 BSC 0.075 BSC 0.021 REF .090 0.038 .030TYP .030TYP SOT23-5 5 MO-178 Millimeters Min Max 1.45 0 0.15 0.3 0.5 0.08 0.22 2.75 3.05 2.6 3.0 1.45 1.75 0.95 BSC 1.90 BSC 0.60 REF 2.59 0.95 0.69 0.99 Package Pins JEDEC e1 6 Millimeters Min Max 0.89 1.12 0.01 0.1 0.3 0.5 0.08 0.2 2.8 3.04 2.1 2.64 1.2 1.4 0.95 BSC 1.90 BSC 0.54 REF 2.29 0.95 0.78 0.78 Package Pins JEDEC SP0504BAHTG - SOT23-5 e SOT23-3 3 TO-236 Inches Min Max 0.057 0 0.006 0.012 0.020 0.003 0.009 0.108 0.120 0.102 0.118 0.057 0.069 0.038 BSC 0.075 BSC 0.024 REF .102 .038 .027TYP .039TYP SOT23-6 6 MO-178 Millimeters Min Max 1.45 0 0.15 0.3 0.5 0.08 0.22 2.75 3.05 2.6 3.0 1.45 1.75 0.95 BSC 1.90 BSC 0.60 REF 2.59 0.95 0.69 0.99 Inches Min Max 0.057 0 0.006 0.012 0.020 0.003 0.009 0.108 0.120 0.102 0.118 0.057 0.069 0.038 BSC 0.075 BSC 0.024 REF .102 0.038 .027TYP .039TYP ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Surface Mount TVS Avalanche Diode Array Package Dimensions - SOT143 e Package Pins JEDEC SP0503BAHTG - SOT143-4 3 4 Recommended Pad Layout 503B E1 E A A1 b b2 c D E E1 e e1 L L1 0.80 (.032") 1.00 (.040") 2 1 e1 1.40 (.055") MAX 2.20 3.40 (.134") (.087") 3.60 (.140") REF D 1.90 (.075") 1.70 (.067") A BSC b2 A1 b 1.00 (.040") 1.20 (.048") c 0.80 (.032") 1.00 (.040") L SOT143-4 4 TO-253 Millimeters Min Max 0.08 1.22 0.05 0.15 0.30 0.50 0.76 0.89 0.08 0.20 2.80 3.04 2.10 2.64 1.20 1.40 1.92 BSC 0.20 BSC 0.4 0.6 0.550 REF Inches Min Max 0.003 0.048 0.002 0.006 0.012 0.020 0.030 0.035 0.003 0.008 0.110 0.120 0.082 0.104 0.047 0.055 0.076 BSC 0.008 BSC 0.016 0.024 0.022 REF L1 Package Dimensions - TSSOP SP0504BAATG - TSSOP-8 LF 504 BA E D E E1 A A1 B C L1 L2 E1 A A1 C TSSOP-8 8 Millimeters Min Max 2.90 3.10 6.40 REF 4.29 4.50 1.194 REF 0.051 0.152 0.30 0.66 0.51 0.76 0.102 0.203 Inches Min Max 0.114 .122 .252 REF .17 .18 .047 REF .002 0.006 0.012TYP TYP .020 .030 .004 .008 B L2 L1 Package Dimensions - MSOP Package Pins D SP0506BAATG - MSOP-8 LF E 506 B Recommended Pad Layout E1 H G F1 F A A1 D E E1 A A1 B C L1 L2 F F1 G H I I B L1 C L2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 77 MSOP-8 8 Millimeters Min Max 2.90 3.10 4.78 4.98 2.90 3.10 0.87 1.17 0.05 0.25 0.30TYP 0.65TYP 0.52 0.54 0.18TYP 5.28 4.24 0.65 0.38 1.04 Inches Min 0.114 .188 .114 .034 .002 0.020 - Max .122 .196 .122 .046 0.010 0.012TYP 0.026TYP 0.021 .007TYP .208 .167 0.026 .015 .041 SP050xBA Lead-Free/Green Series Lead-Free/Green SP050xBA Package Pins D SPA™ Silicon Protection Array Products Surface Mount TVS Avalanche Diode Array Part Numbering System Product Characteristics SP0502 BAHT G Blank = NOT Green/RoHS/Lead Free* G= Green/RoHS/Lead Free Product Silicon Protection Array Series T= Tape & Reel Package BAA = MSOP-8 or TSSOP-8, 2500 qty BAH = SOT23-3, -5, -6 or SOT143-4, 3000 qty BAJ = SC70-3, -5 or -6, 3000 qty Number of Channels 02 = 2 channel (SC70-3, SOT23 packages) 03 = 3 channel (SOT143 package) 04 = 4 channel (SC70-5, SOT23-5, TSSOP-8 packages) 05 = 5 channel (SC70-6, SOT23-6 packages) 06 = 6 channel (MSOP-8 package) Lead Plating “G” Green version - Matte Tin (Sn); *Non-Green version - Tin Lead Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes: 1. All dimensions are in millimeters. 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 ISSUE A. 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information *NOTE: To order NON-Green/RoHS/Lead Free version of product, remove “G” at the end of part number. Part Number CH Package Type Quantity Per Reel SP0502BAHTG 2 SOT23-3 3000 SP0503BAHTG 3 SOT143-4 3000 SP0504BAHTG 4 SOT23-5 3000 SP0505BAHTG 5 SOT23-6 3000 SP0504BAATG 4 TSSOP-8 3000 SP0506BAATG 6 MSOP-8 4000 SP0502BAJTG 2 SC70-3 3000 SP0504BAJTG 4 SC70-5 3000 SP0505BAJTG 5 SC70-6 3000 SP050xBA Lead-Free/Green Series 78 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.