SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection HF RoHS Pb GREEN SP6002 Lead-Free/Green Series Description The Littelfuse SP6002 SPA series integrates 4 and 6 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Pinout Features 1 t&.*mMUFSJOHPG frequencies from 800MHz to 3GHz 4 GND UDFN-08 8 t(SFBUFSUIBOE# attenuation (TYP) at 1GHz 5 t&4%*&$ ±30kV contact, ±30kV air t4NBMMMPXQSPmMF6%'/ package (TYP 0.5mm height) SP6002-04UTG-1 1 6 7 12 SP6002-06UTG-1 Functional Block Diagram Applications SP6002-04UTG-1 1 8 1 Cd Cd Cd Cd 2 7 2 Cd Cd Cd Cd 3 6 t.PCJMFQIPOF 12 t-$%BOEDBNFSBEJTQMBZ interfaces for handsets t1PSUBCMFOBWJHBUJPO device 11 t$POOFDUPSJOUFSGBDFTGPS portable electronics t4NBSUQIPOF 10 3 Cd Cd Cd Cd 4 t,FZQBEJOUFSGBDFGPS portable electronics SP6002-06UTG-1 5 9 4 Cd Cd Cd Cd 8 5 Cd Cd 6 7 Cd Cd ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 95 Revised: March 25, 2010 SP6002 Lead-Free/Green Series Lead-Free/Green SP6002 GND UDFN-12 SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Absolute Maximum Ratings Value Units TOP Symbol Operating Temperature Parameter -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Storage Temperature Range Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Breakdown Voltage VBR IR=1mA Reverse Leakage Current I-&", VRWM=5V Min 7.0 Typ Max Units 6.0 V 7.8 8.5 V 0.1 1.0 μA 100 115 Resistance RA IR=10mA Diode Capacitance1,2 CD VR=2.5V,f=1MHz Line Capacitance1,2 CL VR=2.5V,f=1MHz 24 IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 Cutoff Frequency3 VESD F-3dB 85 15 Above this frequency, appreciable attenutation occurs 30 100 Ω pF 36 pF MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 3 Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination SP6002 Lead-Free/Green Series 96 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Insertion Loss (S21) CH1 S 21 log MAG Analog Crosstalk (S41) 5 dB/ REF 0 dB 1 _:-613 dB CH1 S Cor Cor Del Smo Smo log MAG 10 dB/ REF 0 dB 1 x2 Start x2 START 3.000 000 MHz Stop 6 000.000.000MHz 3.000 000MHz STOP 6 000.000 000 MHz Line Capacitance vs. DC Bias 60 Capacitance (pF) 50 40 30 20 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Lead-Free/Green SP6002 0 5.0 DC Bias (V) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 97 Revised: March 25, 2010 SP6002 Lead-Free/Green Series SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Application Example Dx: SP6002-04 Silicon Protection Array LCD Module Controller Input 4 5 Outside World GND D1 D2 D3 D4 1 8 SP6002-04UTG (μDFN) Signal Ground Soldering Parameters Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow Pb – Free assembly 3°C/second max 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP6002 Lead-Free/Green Series 98 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Package Dimensions - UDFN-08 D UDFN-08 Symbol Max Min Max 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 A1 A3 E A Min 0.450 K L e 0.127 REF 0.005 REF b 0.150 0.250 0.006 0.010 D 1.600 1.800 0.063 0.071 D2 1.100 1.300 0.043 0.051 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e b Inches A A3 E2 D2 Millimeters 0.400 BSC K 0.200 L 0.150 0.016 BSC 0.350 0.008 0.000 0.006 0.014 Package Dimensions - UDFN-12 UDFN-12 Symbol A 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 A1 A3 E A Max E2 K L e ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 99 Revised: March 25, 2010 0.127 REF Min Max 0.005 REF b 0.150 0.250 0.006 D 2.400 2.600 0.094 0.102 D2 1.900 2.100 0.075 0.083 0.010 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e b Inches Min A3 D2 Millimeters 0.400 BSC K 0.200 L 0.150 0.350 0.016 BSC 0.008 0.000 0.006 0.014 SP6002 Lead-Free/Green Series Lead-Free/Green SP6002 D SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Product Characteristics Part Numbering System SP 6002 – 0x U T G - 1 Silicon Protection Array G= Green T= Tape & Reel Series Package Number of Channels UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. J H x KH4 KH6 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 4 = UDFN-08 6 = UDFN-12 Product Series K = SP6002 6. Package surface matte finish VDI 11-13. Assembly Site Ordering Information Part Number Package Size Marking Min. Order Qty. SP6002-04UTG-1 uDFN-08 1.7x1.35mm ,) 3000 SP6002-06UTG-1 uDFN-12 2.5x1.35mm ,) 3000 Embossed Carrier Tape & Reel Specification – UDFN-08 D P2 t Symbol Max Min Max 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 1.00 - 0.040 - W E Min D F 10P BO P AO Inches E P D1 Millimetres 1.50 min 3.90 0.059 min 4.10 40.0 +/- 0.20 0.154 0.161 1.575 +/- 0.008 W 7.70 8.30 0.303 0.327 P2 1.95 2.05 0.077 0.081 A0 1.55 1.75 0.061 0.069 B0 1.90 2.1 0.075 0.083 K0 0.95 1.15 0.037 0.045 0.30 max 0.012 max KO t SP6002 Lead-Free/Green Series 100 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 15pF EMI Filter Array with ESD Protection Embossed Carrier Tape & Reel Specification – UDFN-12 o/ D Symbol Max Min Max 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.55 0.65 0.021 0.025 BO W D P 10P P Inches Min F oD / Millimetres E t E P2 1.50 min 3.90 0.059 min 4.10 40.0 +/- 0.20 0.154 0.161 1.575 +/- 0.008 W 7.90 8.30 0.311 0.327 P2 1.95 2.05 0.077 0.081 0.060 A0 1.33 1.53 0.052 B0 2.63 2.83 0.103 0.111 K0 0.58 0.78 0.023 0.031 A0 0.22 max 0.009 max Lead-Free/Green SP6002 K0 t ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 101 Revised: March 25, 2010 SP6002 Lead-Free/Green Series