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SPBT2632C1A
Bluetooth® technology class-1 module
Datasheet - production data
Features
 Bluetooth radio
– Fully embedded Bluetooth® v3.0 with
profiles
– Class 1 module
– Complete RF ready module
– 128-bit encryption security
– Range up to 60 m LOS
– Integrated antenna
– Multipoint capability
 ST Micro Cortex-M3 microprocessor up to
72 MHz (256 kb Flash, 48 kb RAM)
 Modem transmitter speed
– With SPP service active: 560 kbps
transmission speed
 General I/O
– 16 general purpose I/Os
 User interface
– AT2 command set (abSerial)
– Firmware upgrade over UART
 FCC and Bluetooth® qualified
 Single voltage supply: 2.5 V typical
 Small form factor: 15 x 27 x 2.9 mm
 Operating temperature range: -40 °C to 85 °C
June 2016
This is information on a product in full production.
DocID022930 Rev 7
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www.st.com
Contents
SPBT2632C1A
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
4.1
Lower layer stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.2
Upper layer stack: Amp’ed UP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3
AT command set: abSerial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.4
Bluetooth firmware implantation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3
High speed mode CPU current consumption . . . . . . . . . . . . . . . . . . . . . . . 8
5.4
Standard CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.5
I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.6
Selected RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.7
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.8
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6
Hardware block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7
Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2/27
7.1
Module reflow installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2
GPIO interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.3
GPIO configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.4
UART interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.5
PCB layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.6
Reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.6.1
External reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.6.2
Internal reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
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SPBT2632C1A
7.7
8
Contents
Apple iOS CP reference design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.1
FCC and IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.2
Bluetooth certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.3
CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9
Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
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Description
1
SPBT2632C1A
Description
The SPBT2632C1A.AT2 is an easy to use Bluetooth module, compliant with Bluetooth v3.0.
The module provides complete RF platform in a small form factor.
The SPBT2632C1A.AT2 enables electronic devices with wireless connectivity, not requiring
any RF experience or expertise for integration into the final product. The
SPBT2632C1A.AT2 module, being a certified solution, optimizes the time to market of the
final application.
The module is designed for maximum performance in a minimal space including fast speed
UART and 16 general purpose I/O lines, several serial interface options, and up to 560 kbps
transmission speed with SPP service active, 250 kbps with iAP1 service active.
An optimized design allows the integration of a complete working Bluetooth modem,
including antenna and LPO (low power oscillator), enabling low power mode capability in
the minimum possible size.
The SPBT2632C1A.AT2 is a surface mount PCB module that provides fully embedded,
ready-to-use Bluetooth wireless technology. The reprogrammable Flash memory contains
embedded firmware for serial cable replacement using the Bluetooth SPP profile.
Embedded Bluetooth AT2 command firmware is a friendly interface, which realizes a simple
control for cable replacement, enabling communication with most Bluetooth enabled
devices, provided that the devices support SPP profile. The SPBT2532C1A.AT2, supporting
iAP1 profile, provides communication with Android, smartphone and Apple® iOS Bluetooth
enabled devices. An Apple authentication IC is required to exchange data with an Apple
device or access an Apple device application. The AT2 FW includes the Bluetooth SPP
profile capable of recognizing the Apple authentication chip.
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2
RoHS compliance
RoHS compliance
ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance. The Material
Declaration file is available from the ST website at the following URL:
http://www.st.com/web/catalog/sense_power/FM1968/CL1976/SC1324/PF253471#.
3
Applications

Serial cable replacement

M2M industrial control

Service diagnostics

Data acquisition equipment

Machine controls

Sensor monitoring

Security systems

Mobile health
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Software architecture
SPBT2632C1A
4
Software architecture
4.1
Lower layer stack
4.2
4.3

Bluetooth v3.0

Device power active, sleep and deep sleep

Wake on Bluetooth feature optimized power consumption of host CPU

Authentication and encryption

Encryption key length from 8 bits to 128 bits

Persistent Flash memory for BD address and radio parameter storage

All ACL (asynchronous connection less) packet types

Multipoint capability

Sniff mode: fully supported to maximum allowed intervals

Master slave switch supported during connection and post connection

Dedicated inquiry access code for improved inquiry scan performance

Dynamic packet selection channel quality driven data rate to optimize link performance

Dynamic power control

Bluetooth radio natively supports 802.11b coexistence AFH
Upper layer stack: Amp’ed UP

SPP, IAP1, SDAP and GAP protocols

RFComm, SDP and L2CAP supported

Multipoint with simultaneous slaves
AT command set: abSerial

6/27
The complete command list including the iAP1 commands is reported in user manual
UM1547
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SPBT2632C1A
4.4
Software architecture
Bluetooth firmware implantation
Figure 1. FW architecture
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Hardware specifications
5
SPBT2632C1A
Hardware specifications
General conditions (VIN= 2.5 V and 25 °C).
5.1
Recommended operating conditions
Table 1. Recommended operating conditions
5.2
Rating
Min.
Typ.
Max.
Unit
Operating temperature range
-40
-
85
°C
Supply voltage VIN
2.0
2.5
3.6
V
Signal pin voltage
-
2.1
-
V
RF frequency
2400
-
2483.5
MHz
Absolute maximum ratings
Table 2. Absolute maximum ratings
5.3
Rating
Min.
Typ.
Max.
Unit
Storage temperature range
-55
-
+105
°C
Supply voltage, VIN
-0.3
-
+ 5.0
V
I/O pin voltage, VIO
-0.3
-
+ 5.5
V
RF input power
-
-
-5
dBm
Modes (typical power consumption)
Avg
Unit
ACL data 115 K Baud UART at max. throughput (master)
23
mA
ACL data 115 K Baud UART at max. throughput (slave)
27.5
mA
Connection, no data traffic, master
9.1
mA
Connection, no data traffic, slave
11.2
mA
Connection in sniff (Tsniff=375 ms), no data traffic, master
490
µA
High speed mode CPU current consumption

High speed CPU mode current consumption
–
CPU 32 MHz
–
UART supports up to 921 Kbps
–
Max data throughput
–
Shallow sleep enabled
Table 3. Current consumption
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SPBT2632C1A
Hardware specifications
Table 3. Current consumption (continued)
5.4
Modes (typical power consumption)
Avg
Unit
Standby, without deep sleep
8.6
mA
Standby, with deep sleep
60
µA
Page/inquiry scan, deep sleep
520
µA
Standard CPU mode current consumption

High speed CPU mode
–
CPU 8 MHz
–
UART supports up to 115 Kbps
–
Data throughput up to 200 Kbps
–
Shallow sleep enabled
Table 4. Standard CPU mode current consumption
5.5
Modes (typical power consumption)
Avg.
Unit
ACL data 115 K Baud UART at max. throughput (master)
16.7
mA
ACL data 115 K Baud UART at max. throughput (slave)
18
mA
Connection, no data traffic, master
4.9
mA
Connection, no data traffic, slave
7.0
mA
Connection in sniff (Tsniff=375 ms), no data traffic, master
490
µA
Standby, without deep sleep
4.2
mA
Standby, with deep sleep
60
µA
Page/Inquiry scan, deep sleep
520
µA
I/O operating characteristics
Table 5. I/O operating characteristics
Symbol
Parameter
Min.
Max.
Unit
Conditions
VIL
Low level input voltage
-
0.6
V
VIN, 2.1 V
VIH
High level input voltage
1.4
-
V
VIN, 2.1 V
VOL
Low level output voltage
-
0.4
V
VIN, 2.1 V
VOH
High level output voltage
1.8
-
V
VIN, 2.1 V
IOL
Low level output current
-
4.0
mA
VOL = 0.4 V
IOH
High level output current
-
4.0
mA
VOH = 1.8 V
RPU
Pull-up resistor
80
120
kW
Resistor turned on
RPD
Pull-down resistor
80
120
kW
Resistor turned on
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Hardware specifications
5.6
SPBT2632C1A
Selected RF characteristics
Table 6. Selected RF characteristics
Parameters
Conditions
Antenna load
Typical(1)
Unit
50
ohm
Radio receiver
Sensitivity level
BER < .001 with DH5
-90
dBm
Maximum usable level
BER < .001 with DH1
0
dBm
Input VSWR
2.5:1
Radio transmitter
Maximum output power
50 W load
+10
dBm
Initial carrier frequency tolerance
0
kHz
20 dB bandwidth for modulated carrier
935
kHz
1. RF characteristics can be influenced by physical characteristics of final application
5.7
Pin assignment
Figure 2. Pin connection diagram
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Hardware specifications
Table 7. Pin assignment
Name
Type
Pin #
Description
ALT function(1)
5 V tolerant
UART interface
RXD
I
8
Receive data
Y
TXD
O
6
Transmit data
Y
CTS
I
9
Clear to send (active low)
Y
RTS
O
10
Request to send (active
low)
Y
Boot loader
Boot 0
I
2
Reserved
Power and ground
VDD
24
VDD
GND
23
GND
Reset
RESETN
I
3
Reset input (active low for
5 ms)
2.5 Vmax
GPIO - general purpose input/output
GPIO [0]
I/O
16
General purpose
input/output
Y
GPIO [1]
I/O
17
General purpose
input/output
Y
GPIO [2]
I/O
19
General purpose
input/output
Y
GPIO [3]
I/O
1
General purpose
input/output
Y
GPIO [4]
I/O
18
General purpose
input/output
UART 2 RXD
Y
GPIO [5]
I/O
20
General purpose
input/output
UART 2 TXD
Y
GPIO [6]
I/O
22
General purpose
input/output
ADC 0
2.5 Vmax
GPIO [7]
I/O
13
General purpose
input/output
ADC 1
2.5 Vmax
GPIO [8]
I/O
4
General purpose
input/output
ADC 2
2.5 Vmax
GPIO [9]
I/O
7
General purpose
input/output
ADC 3
2.5 Vmax
GPIO [10]
I/O
5
General purpose
input/output
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Hardware specifications
SPBT2632C1A
Table 7. Pin assignment (continued)
Name
Type
Pin #
Description
ALT function(1)
5 V tolerant
GPIO [11]
I/O
11
General purpose
input/output
I2C SCL
Y
GPIO [12]
I/O
12
General purpose
input/output
I2C SDA
Y
GPIO [13]
I/O
15
General purpose
input/output
Y
GPIO [14]
I/O
14
General purpose
input/output
Y
GPIO [15]
I/O
21
General purpose
input/output
DAC
2.5 Vmax
1. Please note that the usage of ALT function is dependent upon the firmware that is loaded into the module,
and is beyond the scope of this document. The AT command interface uses the main UART by default.
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5.8
Hardware specifications
Mechanical dimensions
Figure 3. Mechanical dimensions
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Hardware specifications
SPBT2632C1A
Figure 4. Recommend land pattern top view
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SPBT2632C1A
6
Hardware block diagram
Hardware block diagram
Figure 5. SPBT2632C1A.AT2 module block diagram
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Hardware design
7
SPBT2632C1A
Hardware design
The SPBT2632C1A module without AT2 command embedded FW, supports UART, I2C and
GPIO hardware interfaces. Note that the use of these interfaces is dependent upon the
firmware that is loaded into the module, and is beyond the scope of this document. The AT2
command interface uses the main UART by default.
Note:
7.1
1
All unused pins should be left floating; do not ground.
2
All GND pins must be well grounded.
3
The area around the module should be free of any ground planes, power planes, trace
routings, or metal for 6 mm from the antenna in all directions.
4
Traces should not be routed underneath the module.
Module reflow installation
The SPB2632C1A is a high temperature-strength surface-mount Bluetooth module supplied
on a 24-pin, 6-layer PCB. The final assembly recommended reflow profiles are indicated
below.
The soldering phase must be executed with care. In order to avoid an undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
Table 8 contains some suggestions for the temperature profile based on IPC/JEDEC J-STD020C, July 2004 recommendations.
Table 8.
Soldering
Profile feature
Average ramp-up rate (TSMAX to TP)
3 °C/sec max.
Preheat:
– Temperature min. (TS min.)
– Temperature max. (TS max.)
– Time (ts min. to ts max.)(ts)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature TL
– Temperature TL
217 °C
60-70 sec
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
16/27
PB-free assembly
DocID022930 Rev 7
8 minutes max.
SPBT2632C1A
Hardware design
Figure 6. Soldering profile
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7.2
GPIO interface
All GPIOs are capable of sinking and sourcing 8 mA of I/O current. GPIO [0] to GPIO [7] are
internally pulled down with 100 k (nominal) resistors, GPIO [8] to GPIO [15] are internally
pulled up with 100 k (nominal) resistors.
7.3
GPIO configuration
Module GPIO configuration depends on the FW embedded.
For example, the following table summarizes the GPIO configuration set by the standard
FW version, the .AT2
GPIO1
SPBT2632C1A.AT2
GPIO2
Output/
Input/
connection pulled-down
status probe
BOOT
GPIO3
GPIO4
GPIO5-7
Output/
Input/
Input/
active status
pulled-down
pulled-down
probe
GPIO8-16
Input/
pulled-up
GPIO4: active status probe (MCU RUN): always on when the radio is in active mode;
Blinking when the radio is in deep sleep mode
GPIO1: connection status probe: always on when the module is connected
GPIO can be reconfigured using the following commands:

At+ab gpioconfig [GPIO pin] [I/O]

At+ab gpioRead [GPIO pin]

At+ab gpioWrite [GPIO pin] [1/0]
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Hardware design
SPBT2632C1A
For additional details, refer to user manual UM1547.
7.4
UART interface
The UART is compatible with the 16550 industry standard. Four signals are provided with
the UART interface. The TXD and RXD pins are used for data while the CTS and RTS pins
are used for flow control.
Figure 7. Connection to host device
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Figure 8. Typical RS232 circuit
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7.5
Hardware design
PCB layout guidelines
Figure 9. PCB layout guidelines
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7.6
Reset circuit
Two types of system reset circuits are detailed below. The maximum voltage that can be
supplied to the RESET pin is 2.5 V. As shown in Figure 9 and Figure 10 the RESET is active
low, in the absence of a reset circuit the pin is internally pulled up and therefore inactive.
7.6.1
External reset circuit
Figure 10. External reset circuit
5(6(7
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Hardware design
SPBT2632C1A
Note:
RPU ranges from 30 k to 50 k internally.
7.6.2
Internal reset circuit
Figure 11. Internal reset circuit
5(6(7
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Note:
7.7
1
RPU ranges from 30 k to 50 k internally.
2
RRST should be from 1 kto 10 k.
Apple iOS CP reference design
The figures below give an indicative overview of what the hardware concept looks like. A
specific MFI co-processor layout is available for licensed MFI developers from the MFI
program.
Figure 12. BT module
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5
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SPBT2632C1A
Hardware design
Figure 13. Co-processor
1.8V
Apple MFI
CO-Processor 2.0c
R?
10k
U?
1
2
3
4
1.8V
VSS
I2C_SDA
NC
NC
VCC
RST
I2C_SCL
NC
8
7
6
5
C?
100n
C?
100n
1.8V
R?
10k
SDA
R?
10k
SCL
datasheet_x_ipod.DSN
Figure 14. Power switch
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Regulatory compliance
SPBT2632C1A
8
Regulatory compliance
8.1
FCC and IC
–
This module has been tested and found to comply with the FCC part 15 and IC
RSS-210 rules. These limits are designed to provide reasonable protection
against harmful interference in approved installations. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference may not occur
in a particular installation. This device complies with part 15 of the FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause
harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Modifications or changes to this equipment not expressly approved by the part
responsible for compliance may render void the user’s authority to operate this
equipment.
–
Modular Approval, FCC and IC
FCC ID: X3ZBTMOD3
IC: 8828A-MOD3
In accordance with FCC part 15, the SPT2632C1A.AT2 is listed above as a
modular transmitter device.
–
Label instructions:
When integrating the SPBT2632C1A.AT2 into the final product, it must be
ensured that the FCC labeling requirements, as specified below, are satisfied.
Based on the public notice from FCC, the product into which the ST transmitter
module is installed must display a label referring to the enclosed module.
The label should use wording such as the following:
Contains transmitter module
FCC ID: X3ZBTMOD3
IC: 8828A-MOD3
Any similar wording that expresses the same meaning may be used.
8.2
Bluetooth certification
Module with embedded stack and profile has been qualified according to SIG qualification
rules:
– Bluetooth SIG qualified design, QD ID: B019224
– Product type: end product
– TGP version: Core 3.0
– Core spec version: 3.0
– Product descriptions: Bluetooth module, spec V3.0
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8.3
Regulatory compliance
CE certification
Module has been certified according to following certification rules:
– CE Expert opinion: 0447-ARSO00093-r
– Measurements have been performed in accordance with (report available on
request):
– EN 300 328 V 1.8.1 (2012:06) (a)
– EN 301 489-17 V 2.2.1 (2012:09) (b)
–
EN 301 489-1 V1.9.2 (2011:09) (c)
– EN60950-1:2006 +A12:2011 (d)

CE certified:
a. EN 300 328 V 1.8.1 (2012:06): “electromagnetic compatibility and radio spectrum Matters (ERM); Wideband
transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband
modulation techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE
directive”.
b. EN 301 489-17 V 2.2.1 (2012:09): “electromagnetic compatibility and radio spectrum Matters (ERM);
electromagnetic compatibility (EMC) standard for radio equipment and services; part 17: specific condition for
2.4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment”.
c.
EN301 489-1 V 1.9.2 (2011 09): “electromagnetic compatibility and radio spectrum Matters (ERM);
electromagnetic compatibility (EMC) standard for radio equipment and services; part 1: Common technical
requirements”.
d. EN60950-1:2006 +A12:20011: “Information technology equipment - safety”.
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Traceability
9
SPBT2632C1A
Traceability
Each module is unambiguously identified by serial number stored in a 2D data matrix laser
mark on the bottom side of the module itself.
The serial number has the following format:
WW YY D FF NNN
where
WW = week
YY = year
D = product ID family
FF = production panel coordinate identification.
NNN = progressive serial number.
Each module bulk is identified by a bulk ID.
Bulk ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
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10
Ordering information
Ordering information
Table 9.
Ordering information
Order code
Description
Packing
MOQ
SPBT2632C1A.AT2
Class 1 OEM Bluetooth antenna module
JEDEC tray
1020 pcs
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Revision history
11
SPBT2632C1A
Revision history
Table 10.
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Document revision history
Date
Revision
Changes
23-Apr-2012
1
Initial release.
12-Jun-2012
2
– Document status promoted from preliminary data to production
data
– Modified: Figure 1
07-Aug-2012
3
– Added: notes in Table 6 and 7
– Modified: Section 7
29-Oct-2013
4
Added new section: Section 5.8, Section 7.3 and Section 9
12-Jun-2014
5
Updated: Features
01-Apr-2015
6
Corrected typo (W in Ω): 7.6.2: Internal reset circuit on page 20
08-Jun-2016
7
– Replaced “iAP” with “iAP1” throughout the document.
– Removed last three paragraphs from Section 1: Description.
– Minor text edits.
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