SPT02-236DDB Automation sensor transient and overvoltage protection Datasheet − production data Applications • Factory automation sensor application • Proximity sensor interface protection • Transient and surge voltage protection • Compliant with sensor standard, EN 60947-5-2 µQFN-2L SPT02-236DDB Description Features • 6 V to 36 V supply voltage range The SPT02 is specifically designed for the protection of 24 V proximity sensors. It implements the reverse polarity and the overvoltage protection of the sensor power supply and the power switch overvoltage protection. • Minimum breakdown voltage VBR: 38 V It provides a very compact and flexible solution. • 8/20 µs 2 A maximum clamping voltage: 46 V Thanks to high performance ST technology, the SPT02 protects the proximity sensor to the highest level compliant with IEC 61000-4-2, IEC 61000-4-4 and IEC 61000-4-5 standards. • Double diode array for switch protection and reverse blocking protection • Blocking diode drop forward voltage VF: 1.1 V at 300 mA • Blocking diode maximum 10 ms square pulse current IFSM: 3 A • Ambient temperature: -40 °C to +100 °C Figure 1. Functional diagram (top view) • µQFN 2L 0.8 mm flat package K D1 Complies with following standards D2 A1 A2 • Voltage surge: IEC 61000-4-5, R CC = 500 Ω, ±1 kV • Electrostatic discharge, IEC 61000-4-2: – ±8 kV contact discharge – ±15 kV air discharge Figure 2. Bottom view • Electrical transient immunity: IEC 61000-4-4: ±2 kV Benefits • Compliant for interface with logic input type 1, 2 and 3 IEC 61131-2 standard • Highly compact with integrated power solution in SMD version March 2014 This is information on a product in full production. DocID024333 Rev2 1/12 www.st.com 12 Basic application 1 SPT02-236DDB Basic application Figure 3. STP02 configuration Sensor Process control VCC Detector LS P.supply D2 D1 GND HS Load Load Detector LS D2 VCC D1 HS GND Sensor 2/12 DocID024333 Rev2 P.supply Process control SPT02-236DDB 2 Characteristics Characteristics Table 1. Pinout connections(1) Symbol Description K D1 power bus protection diode cathode and D2 reverse blocking protection cathode A1 D1 power bus protection diode anode A2 D2 reverse blocking protection anode 1. See Figure 1 Table 2. Absolute ratings (Tamb = 25 °C) Symbol Diode Parameter Value Unit VPP All 30 kV 30 kV VPP All Peak Surge Voltage, IEC 61000-4-5, per diode, RCC = 500 Ω, (1) 1 kV PPP All Peak pulse current, TJ = Tamb = 85 °C, tP = 8/20 µs 1400 W IPP All Peak pulse power dissipation, TJ = Tamb = 85 °C, tP = 8/20 µs 25 A IFSM All Maximum forward surge current, tP = 10 ms square 3 A EAR D1 Maximum repetitive avalanche energy L= 1 H, IRAS= 0.3A, RS = 100 Ω, VCC = 30 V, Tamb = 85 °C, (1) 66 mJ TJ All Storage junction temperature range - 40 to 150 °C ESD protection, IEC 61000-4-2, per diode, in air (1) ESD protection, IEC 61000-4-2, per diode, in contact (1) 1. See system oriented test circuits in Figure 5 (ESD) and Figure 4 (Surge as also described in IEC 60947-5-2). Table 3. Recommended operating conditions Symbol VCC IF Tamb TJ Parameter Value Unit Operating power bus supply voltage -30 to 35 V Pulse repetitive voltage tP = 0.5 s, RCC = 500 Ω -30 to 37 V 300 mA -40 to 100 °C -40 to 150 °C D2 forward peak current Tj = 150 °C duty cycle = 50% Operating ambient temperature range Operating junction temperature range(1) 1. Extended from DC operating at 150 °C up to peak repetitive value during the inductive load demagnetization DocID024333 Rev2 3/12 Characteristics SPT02-236DDB Table 4. Thermal resistance Symbol Parameter Value Unit Rth(j-a) SMD thermal resistance junction to ambient, per diode FR4 board, copper thickness = 35 µm, recommended footprint 230 °C/W Zth(j-a) SMD thermal transient impedance junction to ambient, per diode tp = 15 ms, Tamb = 85 °C, recommended footprint 6.5 °C/W Table 5. Electrical characteristics (TJ = 25 °C, unless otherwise specified) Symbol Diode VRM ALL IRM ALL VBR ALL VCL ALL RD ALL Name Reverse stand off voltage Leakage reverse current Reverse breakdown voltage Peak clamping voltage Value Unit IR = 200 nA MIN 33 IR = 1 µA MIN 36 VRM = 36 V(1) MAX 1 µA VRM = 36 V, TJ = 150 °C MAX 5 µA MIN 38 V TYP 41.4 V MAX 46 V TYP 44 V TYP 0.5 Ω MAX 17 10-4 /°C IR = 1 mA IPP = 2 A, tP = 8 /20 µs 8/20µs dynamic resistance sensitivity(2) V αT ALL VBR Temperature VCL D1 Peak clamping voltage IR = 0.3 A, L = 1 H, VCC = 30 V MAX 46 V VF D2 Forward drop voltage IF = 300 mA MAX 1.1 V 1. Voltage applied at the nodes of each diode 2. VBR @ TJ = VBR @25 °C x (1+ αT x (TJ - 25)) 4/12 Test conditions DocID024333 Rev2 SPT02-236DDB 3 System related electromagnetic compatibility ratings System related electromagnetic compatibility ratings Figure 4. Surge Voltage test circuit according to IEC 61000-4-5 with 500 Ω serial resistor C = 18 µF R=2Ω High voltage surge generator Diode under test PE Figure 5. ESD test circuit according to IE 61000-4-2 R = 300 Ω ESD voltage source Diode under test C = 150 pF ESD generator Figure 6. EOS test circuit according to IE 61000-4-5 Sensor C = 18 µF R=2Ω Detector LS D2 D1 HS 4 High voltage surge generator PE Evaluation of the clamping voltage VBR (TJ) = VBR (25) x (1+ αT (TJ – 25)) VCL MAX (8/20 µs) = VBR MAX + RD x IPP DocID024333 Rev2 5/12 Application considerations SPT02-236DDB 5 Application considerations 5.1 Demagnetization of an inductive load driven by the switch protection diode. The turn off energy EOFF that could be dissipated in the D1 diode is calculated as shown in AN587 and AN1351 application notes: EOFF = VBR x L / / (RS)² x [VCC + (VCC - VBR) x ln (VBR / (VBR - VCC))] tOFF = L x ln (VBR / (VBR - VCC)) / RS POFF = EOFF / tOFF With L = 1 H; I = 0.3 A; VBR = 39 V; VCC = 30 V, R S = 100 Ω the stress withstood by D1 becomes: EOFF = 65 mJ; tOFF = 15 ms; POFF = 4.3 W In a single pulse mode operation, the junction temperature can be fairly estimated: TJ = Tamb + [ZTH (tOFF) x POFF] In a repetitive operation with an F repetitive rate, PAV = EOFF x F TJ_AV = Tamb + PAV x RTH_JA And during the demagnetization tOFF, TJ_PK < TJ_AV + POFF x ZTH (tOFF) ZTH is the transient thermal impedance of each diode for a pulse having a duration tOFF. Figure 7. Electrical diagram for inductive load demagnetization D D2 VBR Switch D1 VCC RS Load 5.2 L Life time considerations Life time of the product is calculated to exceed 10 years. The key parameters to consider are the ambient temperature (Tamb < 100 °C), the power supply voltage (VCC < 30 V), and the current in the reverse blocking diode (IF = 0.1 A switching at 0.5 Hz with 50% duty cycle, the stand-by current being less than 1.5 mA). For higher current or higher switching frequency operation, the life time should be calculated considering the peak and average junction temperature. 6/12 DocID024333 Rev2 SPT02-236DDB 6 Package information Package information • Epoxy meets UL94,V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. µQFN-2L dimensions (definitions) D2 b L E2 e A A1 D E Table 6. µQFN-2L dimensions (values) Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.70 0.75 0.80 0.027 0.029 0.031 A1 0.00 0.02 0.05 0.00 0.001 0.002 b 0.25 0.30 0.35 0.010 0.011 0.014 D - 3.30 - - 0.13 - D2 1.85 2.00 2.10 0.073 0.079 0.082 E - 1.50 - - 0.06 - E2 0.90 1.05 1.16 0.035 0.041 0.046 e - 2.8 - - 0.110 - L 0.97 1.07 1.18 0.038 0.042 0.046 DocID024333 Rev2 7/12 Package information SPT02-236DDB Figure 9. Footprint (dimensions in mm) 2.00 0.50 0.50 1.07 1.05 0.25 8/12 DocID024333 Rev2 SPT02-236DDB Recommendation on PCB assembly 7 Recommendation on PCB assembly 7.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 10. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1,5 T L×W Aspect Area = ---------------------------- ≥ 0,66 2T ( L + W ) 2. 7.2 Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c) Stencil opening for leads: Opening to footprint ratio is 90%. Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. DocID024333 Rev2 9/12 Recommendation on PCB assembly 7.3 7.4 7.5 SPT02-236DDB Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 11. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Compliant with J-STD-020D soldering profile 10/12 180 DocID024333 Rev2 SPT02-236DDB 8 Ordering information Ordering information Figure 12. Ordering information scheme SPT 02 - 2 36 DDB Sensor protection termination Generation 02 = 2nde génération Channels number 2 = 2 channels Stand-off voltage 36 = 36 V Package D = Dual D = 3 x 2 mm package size B = 3 pins Table 7. Ordering information 9 Order code Marking Package Weight Packing SPT02-236DDB S2 µQFN-2L with exposed pad 15.55 mg Tape and reel Revision history Table 8. Document revision history Date Revision Changes 06-May-2013 1 First issue 21-Mar-2014 2 Updated Table 2, Table 6 and Figure 9. 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