Si 11 4 5 / 4 6 /47 P ROXIMITY / U V / A MBIENT L I G H T S E N S O R I C WITH I 2 C I NTE RFACE Features Pin Assignments Integrated infrared proximity detector Proximity detection adjustable from under 1 cm to over 50 cm Three independent LED drivers 15 current settings from 5.6 mA to 360 mA for each LED driver 25.6 µs LED driver pulse width 50 cm proximity range with single pulse (<3 klx) 15 cm proximity range with single pulse (>3 klx) Operates at up to 128 klx (direct sunlight) High reflectance sensitivity < 1 µW/cm2 High EMI immunity without shielded packaging Integrated ambient light sensor 100 mlx resolution possible, allowing operation under dark glass 1 to 128 klx dynamic range possible across two ADC range settings Accurate lux measurements with IR correction algorithm Integrated UV index sensor Industry's lowest power consumption 1.71 to 3.6 V supply voltage 9 µA average current (LED pulsed 25.6 µs every 800 ms at 180 mA plus 3 µA Si114x supply) < 500 nA standby current Internal and external wake support Built-in voltage supply monitor and power-on reset controller 25.6 µs LED “on” time keeps total power consumption duty cycle low without compromising performance or noise immunity I2C Serial communications Up to 3.4 Mbps data rate Slave mode hardware address decoding Small-outline 10-lead 2x2 mm QFN Temperature Range –40 to +85 °C DNC SDA 1 SCL 2 VDD 3 INT 4 10 QFN-10 5 9 LED1 8 GND 7 LED3/CVDD 6 LED2/CVDD DNC Applications Handsets E-book readers Notebooks/Netbooks Portable consumer electronics Audio products Security panels Tamper detection circuits Dispensers Valve controls Smoke detectors Touchless switches Touchless sliders Occupancy sensors Consumer electronics Industrial automation Display backlighting control Photo-interrupters Description The Si1145/46/47 is a low-power, reflectance-based, infrared proximity, ultraviolet (UV) index, and ambient light sensor with I2C digital interface and programmableevent interrupt output. This touchless sensor IC includes an analog-to-digital converter, integrated high-sensitivity visible and infrared photodiodes, digital signal processor, and one, two, or three integrated infrared LED drivers with fifteen selectable drive levels. The Si1145/46/47 offers excellent performance under a wide dynamic range and a variety of light sources including direct sunlight. The Si1145/46/ 47 can also work under dark glass covers. The photodiode response and associated digital conversion circuitry provide excellent immunity to artificial light flicker noise and natural light flutter noise. With two or more LEDs, the Si1146/47 is capable of supporting multiple-axis proximity motion detection. The Si1145/46/47 devices are provided in a 10-lead 2x2 mm QFN package and are capable of operation from 1.71 to 3.6 V over the –40 to +85 °C temperature range. Rev. 1.3 12/14 Copyright © 2014 by Silicon Laboratories Si1145/46/47 Si1145/46/47 Functional Block Diagram VDD Regulator Temp Visible A M U X LED2 1 LED3 2 Filter ADC Digital Sequencer & Control Logic Infrared INT LED1 LED Drivers SCL Registers I2C SDA Oscillator GND 1. Si1146 and Si1147 only. Must be tied to V DD with Si1145. 2. Si1147 only. Must be tied to V DD with Si1145 and Si1146. 3.3 V 30 ohm 5%, 1/16 W Host Si1145 SDA SDA SCL SCL GND VDD CVDD INT CVDD INT LED1 15 µF, 20%, >6 V 0.1 uF Figure 1. Si1145 Basic Application 3.3 V 4.3 V No Pop Host 30 ohm 5%, 1/16 W Si1147 SDA LED1 SCL GND VDD LED3 INT LED2 22 uF, 20%, >6V 0.1 uF Figure 2. Si1147 Application with Three LEDs and Separate LED Power Supply Note: For more application examples, refer to “AN498: irLED Selection Guide for Si114x Proximity Applications”. 2 Rev. 1.3 Si1145/46/47 TABLE O F C ONTENTS 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1. Performance Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.2. Typical Performance Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 2.2. Proximity Sensing (PS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.3. Ambient Light . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 2.4. Ultraviolet (UV) Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.5. Host Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3. Operational Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.1. Off Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.2. Initialization Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3. Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4. Forced Conversion Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 3.5. Autonomous Operation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 4. Programming Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.1. Command and Response Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.2. Command Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.3. Resource Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.4. Signal Path Software Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4.5. I2C Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.6. Parameter RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 7. Package Outline: 10-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 8. Suggested PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Rev. 1.3 3 Si1145/46/47 1. Electrical Specifications 1.1. Performance Tables Table 1. Recommended Operating Conditions Parameter VDD Supply Voltage VDD OFF Supply Voltage Symbol Test Condition VDD VDD_OFF Min Typ Max Unit 1.71 — 3.6 V 1.0 V OFF mode –0.3 VDD = 3.3 V 1 kHz–10 MHz — — 50 mVpp T –40 25 85 °C SCL, SDA, Input High Logic Voltage I2CVIH VDDx0.7 — VDD V SCL, SDA Input Low Logic Voltage I2CVIL 0 — VDDx0.3 V Edc — — 128 klx l 750 850 950 nm IrLED VF = 1.0 V nominal VDD — 4.3 V Applies if IrLEDs use separate supply rail 0–30 kHz 30 kHz–100 MHz — — — — 250 100 mVpp mVpp Start-Up Time VDD above 1.71 V 25 — — ms LED3 Voltage Start-up VDDx0.77 — — V VDD Supply Ripple Voltage Operating Temperature PS Operation under Direct Sunlight IrLED Emission Wavelength IrLED Supply Voltage IrLED Supply Ripple Voltage 4 VLED Rev. 1.3 Si1145/46/47 Table 2. Performance Characteristics1 Parameter Symbol Test Condition Min Typ Max Unit IDD OFF Mode Ioff VDD < VDD_OFF (leakage from SCL, SDA, and INT not included) — 240 1000 nA IDD Standby Mode Isb No ALS / PS Conversions No I2C Activity VDD = 1.8 V — 150 500 nA IDD Standby Mode Isb No ALS / PS Conversions No I2C Activity VDD =3.3 V — 1.4 — µA Iactive Without LED influence, VDD = 3.3 V — 4.3 5.5 mA VDD = 3.3 V — 8 — mA IDD Actively Measuring Peak IDD while LED1, LED2, or LED3 is Actively Driven LED Driver Saturation Voltage2,3 LED1, LED2, LED3 Pulse Width LED1, LED2, LED3, INT, SCL, SDA Leakage Current Vdd=1.71 to 3.6 V PS_LEDn=0001 PS_LEDn=0010 PS_LEDn=0011 PS_LEDn=0100 PS_LEDn=0101 PS_LEDn=0110 PS_LEDn=0111 PS_LEDn=1000 PS_LEDn=1010 PS_LEDn=1010 PS_LEDn=1011 PS_LEDn=1100 PS_LEDn=1101 PS_LEDn=1110 PS_LEDn=1111 tPS VDD = 3.3 V mV — — — — — — — — — — — — — — — 50 60 70 80 115 150 185 220 255 290 315 340 360 385 410 70 105 105 105 450 450 450 450 450 450 600 600 600 600 600 — 25.6 30 µs –1 — 1 µA Notes: 1. Unless specifically stated in "Conditions", electrical data assumes ambient light levels < 1 klx. 2. Proximity-detection performance may be degraded, especially when there is high optical crosstalk, if the LED supply and voltage drop allow the driver to saturate and current regulation is lost. 3. Guaranteed by design and characterization. 4. Represents the time during which the device is drawing a current equal to Iactive for power estimation purposes. Assumes default settings. Rev. 1.3 5 Si1145/46/47 Table 2. Performance Characteristics1 (Continued) Parameter Symbol Test Condition Min Typ Max ILEDx VDD = 3.3 V, single drive VLEDn = 1 V, PS_LEDn = 0001 VLEDn = 1 V, PS_LEDn = 0010 VLEDn = 1 V, PS_LEDn = 0011 VLEDn = 1 V, PS_LEDn = 0100 VLEDn = 1 V, PS_LEDn = 0101 VLEDn = 1 V, PS_LEDn = 0110 VLEDn = 1 V, PS_LEDn = 0111 VLEDn = 1 V, PS_LEDn = 1000 VLEDn = 1 V, PS_LEDn = 1001 VLEDn = 1 V, PS_LEDn = 1010 VLEDn = 1 V, PS_LEDn = 1011 VLEDn = 1 V, PS_LEDn = 1100 VLEDn = 1 V, PS_LEDn = 1101 VLEDn = 1 V, PS_LEDn = 1110 VLEDn = 1 V, PS_LEDn = 1111 3.5 — 13 — — — — — — — — — — — — 5.6 11.2 22.4 45 67 90 112 135 157 180 202 224 269 314 359 7 — 29 — — — — — — — — — — — — Actively Measuring Time4 Single PS UV or ALS VIS + ALS IR Two ALS plus three PS — — — 155 285 660 — — — µs µs µs Visible Photodiode Response Sunlight ALS_VIS_ADC_GAIN=0 VIS_RANGE=0 — 0.282 — ADC counts/ lux 2500K incandescent bulb ALS_VIS_ADC_GAIN=0 VIS_RANGE=0 — 0.319 — ADC counts/ lux “Cool white” fluorescent ALS_VIS_ADC_GAIN=0 VIS_RANGE=0 — 0.146 — ADC counts/ lux Infrared LED (875 nm) ALS_VIS_ADC_GAIN=0 VIS_RANGE=0 — 8.277 — ADC counts. m2/W LED1, LED2, LED3 Active Current Unit mA Notes: 1. Unless specifically stated in "Conditions", electrical data assumes ambient light levels < 1 klx. 2. Proximity-detection performance may be degraded, especially when there is high optical crosstalk, if the LED supply and voltage drop allow the driver to saturate and current regulation is lost. 3. Guaranteed by design and characterization. 4. Represents the time during which the device is drawing a current equal to Iactive for power estimation purposes. Assumes default settings. 6 Rev. 1.3 Si1145/46/47 Table 2. Performance Characteristics1 (Continued) Parameter Test Condition Min Typ Max Unit Sunlight ALS_IR_ADC_GAIN=0 IR_RANGE=0 — 2.44 — ADC counts/ lux 2500K incandescent bulb ALS_IR_ADC_GAIN=0 IR_RANGE=0 — 8.46 — ADC counts/ lux “Cool white” fluorescent ALS_IR_ADC_GAIN=0 IR_RANGE=0 — 0.71 — ADC counts/ lux Infrared LED (875 nm) ALS_IR_ADC_GAIN=0 IR_RANGE=0 — 452.38 — ADC counts. m2/W Sunlight PS_ADC_GAIN=0 PS_RANGE=0 PS_ADC_MODE=0 — 14.07 — ADC counts/ lux 2500K incandescent bulb PS_ADC_GAIN=0 PS_RANGE=0 PS_ADC_MODE=0 — 50.47 — ADC counts/ lux “Cool white” fluorescent PS_ADC_GAIN=0 PS_RANGE=0 PS_ADC_MODE=0 — 3.97 — ADC counts/ lux Infrared LED (875 nm) PS_ADC_GAIN=0 PS_RANGE=0 PS_ADC_MODE=0 — 2734 — ADC counts. m2/W Visible Photodiode Noise All gain settings — 7 — ADC counts RMS Small Infrared Photodiode Noise All gain settings — 1 — ADC counts RMS Small Infrared Photodiode Response Large Infrared Photodiode Response Symbol Notes: 1. Unless specifically stated in "Conditions", electrical data assumes ambient light levels < 1 klx. 2. Proximity-detection performance may be degraded, especially when there is high optical crosstalk, if the LED supply and voltage drop allow the driver to saturate and current regulation is lost. 3. Guaranteed by design and characterization. 4. Represents the time during which the device is drawing a current equal to Iactive for power estimation purposes. Assumes default settings. Rev. 1.3 7 Si1145/46/47 Table 2. Performance Characteristics1 (Continued) Parameter Symbol Test Condition Min Typ Max Unit All gain settings — 10 — ADC counts RMS Visible Photodiode Offset Drift VIS_RANGE=0 ALS_VIS_ADC_GAIN=0 ALS_VIS_ADC_GAIN=1 ALS_VIS_ADC_GAIN=2 ALS_VIS_ADC_GAIN=3 ALS_VIS_ADC_GAIN=4 ALS_VIS_ADC_GAIN=5 ALS_VIS_ADC_GAIN=6 ALS_VIS_ADC_GAIN=7 — — ADC counts/ °C Small Infrared Photodiode Offset Drift IR_RANGE=0 IR_GAIN=0 IR_GAIN=1 IR_GAIN=2 IR_GAIN=3 — — ADC counts/ °C I = 4 mA, VDD > 2.0 V I = 4 mA, VDD < 2.0 V — — — — VDDx0. 2 0.4 V V 25 °C — 11136 — ADC counts — 35 — ADC counts/ °C Large Infrared Photodiode Noise SCL, SDA, INT Output Low Voltage Temperature Sensor Offset VOL Temperature Sensor Gain –0.3 –0.11 –0.06 –0.03 –0.01 –0.008 –0.007 –0.008 –0.3 –0.06 –0.03 –0.01 Notes: 1. Unless specifically stated in "Conditions", electrical data assumes ambient light levels < 1 klx. 2. Proximity-detection performance may be degraded, especially when there is high optical crosstalk, if the LED supply and voltage drop allow the driver to saturate and current regulation is lost. 3. Guaranteed by design and characterization. 4. Represents the time during which the device is drawing a current equal to Iactive for power estimation purposes. Assumes default settings. 8 Rev. 1.3 Si1145/46/47 Table 3. I2C Timing Specifications Parameter Symbol Min Typ Max Unit Clock Frequency fSCL 95 — 3400 kHz Clock Pulse Width Low tLOW 160 — — ns Clock Pulse Width High tHIGH 60 — — ns Rise Time tR 10 — 40 ns Fall Time tF 10 — 40 ns Start Condition Hold Time tHD.STA 160 — — ns Start Condition Setup Time tSU.STA 160 — — ns Input Data Setup Time tSU.DAT 10 — — ns Input Data Hold Time tHD.DAT 0 — — ns Stop Condition Setup Time tSU.STO 160 — — ns Min Typ Max Unit VDD Supply Voltage –0.3 — 4 V Operating Temperature –40 — 85 °C Storage Temperature –65 — 85 °C Table 4. Absolute Maximum Limits Parameter Test Condition LED1, LED2, LED3 Voltage at VDD = 0 V, TA < 85 °C –0.5 — 3.6 V INT, SCL, SDA Voltage at VDD = 0 V, TA < 85 °C –0.5 — 3.6 V Maximum total current through LED1, LED2 and LED3 — — 500 mA Maximum total current through GND — — 600 mA — — — — — — 2 225 2 kV V kV ESD Rating Human Body Model Machine Model Charged-Device Model Rev. 1.3 9 Si1145/46/47 1.2. Typical Performance Graphs Figure 3. Proximity response using Kodak gray cards, PS_RANGE=0, PS_ADC_GAIN=0 (single 25.6s LED pulse), ± 22°LED view angle, 850 nm, 22.5 mW/sr, no overlay, 5 mm LED center to Si114x center Figure 4. ALS variability with different light sources 10 Rev. 1.3 Si1145/46/47 Figure 5. View angle, large photodiode rotated around the pin-5/pin-10 (“vertical”) axis Figure 6. View angle, large photodiode rotated around “horizontal”axis and small photodiode rotated around either axis Rev. 1.3 11 Si1145/46/47 2. Functional Description 2.1. Introduction The Si1145/46/47 is an active optical reflectance proximity detector, UV index, and ambient light sensor whose operational state is controlled through registers accessible through the I2C interface. The host can command the Si1145/46/47 to initiate on-demand proximity detection or ambient light sensing. The host can also place the Si1145/46/47 in an autonomous operational state where it performs measurements at set intervals and interrupts the host after each measurement is completed. This results in an overall system power saving allowing the host controller to operate longer in its sleep state instead of polling the Si1145/46/47. For more details, refer to “AN498: Designer's Guide for the Si114x”. 2.2. Proximity Sensing (PS) The Si1145/46/47 has been optimized for use as either a dual-port or single-port active reflection proximity detector. Over distances of less than 50 cm, the dual-port active reflection proximity detector has significant advantages over single-port, motion-based infrared systems, which are only good for triggered events. Motionbased infrared detectors identify objects within proximity, but only if they are moving. Single-port motion-based infrared systems are ambiguous about stationary objects even if they are within the proximity field. The Si1145/46/ 47 can reliably detect an object entering or exiting a specified proximity field, even if the object is not moving or is moving very slowly. However, beyond about 30–50 cm, even with good optical isolation, single-port signal processing may be required due to static reflections from nearby objects, such as table tops, walls, etc. If motion detection is acceptable, the Si1145/46/47 can achieve ranges of up to 50 cm, through a single product window. For small objects, the drop in reflectance is as much as the fourth power of the distance. This means that there is less range ambiguity than with passive motion-based devices. For example, a sixteenfold change in an object's reflectance means only a fifty-percent drop in detection range. The Si1147 can drive three separate infrared LEDs. When the three infrared LEDs are placed in an L-shaped configuration, it is possible to triangulate an object within the three-dimensional proximity field. Thus, a touchless user interface can be implemented with the aid of host software. The Si1145/46/47 can initiate proximity sense measurements when explicitly commanded by the host or periodically through an autonomous process. Refer to "3. Operational Modes" on page 19 for additional details of the Si1145/46/47's Operational Modes. Whenever it is time to make a PS measurement, the Si1145/46/47 makes up to three measurements, depending on what is enabled in the CHLIST parameter. Other ADC parameters for these measurements can also be modified to allow proper operation under different ambient light conditions. The LED choice is programmable for each of these three measurements. By default, each measurement turns on a single LED driver. However, the order of measurements can be easily reversed or even have all LEDs turned on at the same time. The Si1145/46/47 can generate an interrupt after a complete set of proximity measurements. To support different power usage cases dynamically, the infrared LED current of each output is independently programmable. The current can be programmed anywhere from a few to several hundred milliamps. Therefore, the host can optimize for proximity detection performance or for power saving dynamically. This feature can be useful since it allows the host to reduce the LED current once an object has entered a proximity sphere, and the object can still be tracked at a lower current setting. Finally, the flexible current settings make it possible to control the infrared LED currents with a controlled current sink, resulting in higher precision. The ADC properties are programmable. For indoor operation, the ADC should be configured for low signal range for best reflectance sensitivity. When under high ambient conditions, the ADC should be configured for high signal level range operation. 12 Rev. 1.3 Si1145/46/47 When operating in the lower signal range, it is possible to saturate the ADC when the ambient light level is high. Any overflow condition is reported in the RESPONSE register, and the corresponding data registers report a value of 0xFFFF. The host can then adjust the ADC sensitivity. Note however that the overflow condition is not sticky. If the light levels return to a range within the capabilities of the ADC, the corresponding data registers begin to operate normally. However, the RESPONSE register will continue to hold the overflow condition until a NOP command is received. Even if the RESPONSE register has an overflow condition, commands are still accepted and processed. Proximity detection ranges beyond 50 cm and up to several meters can be achieved without lensing by selecting a longer integration time. The detection range may be increased further, even with high ambient light, by averaging multiple measurements. Refer to “AN498: Designer's Guide for the Si114x” for more details. 2.3. Ambient Light The Si1145/46/47 has photodiodes capable of measuring both visible and infrared light. However, the visible photodiode is also influenced by infrared light. The measurement of illuminance requires the same spectral response as the human eye. If an accurate lux measurement is desired, the extra IR response of the visible-light photodiode must be compensated. Therefore, to allow the host to make corrections to the infrared light’s influence, the Si1145/46/47 reports the infrared light measurement on a separate channel. The separate visible and IR photodiodes lend themselves to a variety of algorithmic solutions. The host can then take these two measurements and run an algorithm to derive an equivalent lux level as perceived by a human eye. Having the IR correction algorithm running in the host allows for the most flexibility in adjusting for system-dependent variables. For example, if the glass used in the system blocks visible light more than infrared light, the IR correction needs to be adjusted. If the host is not making any infrared corrections, the infrared measurement can be turned off in the CHLIST parameter. By default, the measurement parameters are optimized for indoor ambient light levels where it is possible to detect light levels as low as 6 lx. For operation under direct sunlight, the ADC can be programmed to operate in a high signal operation so that it is possible to measure direct sunlight without overflowing the 16-bit result. For low-light applications, it is possible to increase the ADC integration time. Normally, the integration time is 25.6 µs. By increasing this integration time to 410 µs, the ADC can detect light levels as low as 1 lx. The ADC can be programmed with an integration time as high as 3.28 ms, allowing measurement to 100 mlx light levels. The ADC integration time for the Visible Light Ambient measurement can be programmed independently of the ADC integration time of the Infrared Light Ambient measurement. The independent ADC parameters allow operation under glass covers having a higher transmittance to Infrared Light than Visible Light. When operating in the lower signal range, or when the integration time is increased, it is possible to saturate the ADC when the ambient light suddenly increases. Any overflow condition is reported in the RESPONSE register, and the corresponding data registers report a value of 0xFFFF. Based on either of these two overflow indicators, the host can adjust the ADC sensitivity. However, the overflow condition is not sticky. If the light levels return to a range within the capabilities of the ADC, the corresponding data registers begin to operate normally. The RESPONSE register will continue to hold the overflow condition until a NOP command is received. Even if the RESPONSE register has an overflow condition, commands are still accepted and processed. The Si1145/46/47 can initiate ALS measurements either when explicitly commanded by the host or periodically through an autonomous process. Refer to "3. Operational Modes" on page 19 for additional details of the Si1145/ 46/47's Operational Modes. Rev. 1.3 13 Figure 7. Photodiode Spectral Response to Visible and Infrared Light (Indicative) Si1145/46/47 14 Rev. 1.3 Si1145/46/47 2.4. Ultraviolet (UV) Index The UV Index is a number linearly related to the intensity of sunlight reaching the earth and is weighted according to the CIE Erythemal Action Spectrum as shown in Figure 8. This weighting is a standardized measure of human skin's response to different wavelengths of sunlight from UVB to UVA. The UV Index has been standardized by the World Health Organization and includes a simplified consumer UV exposure level as shown in Figures 9 and 10. Figure 8. CIE Erythemal Action Spectrum Figure 9. UV Index Scale Figure 10. UV Levels Rev. 1.3 15 Si1145/46/47 To enable UV reading, set the EN_UV bit in CHLIST, and configure UCOEF [0:3] to the default values of 0x7B, 0x6B, 0x01, and 0x00. Also, set the VIS_RANGE and IR_RANGE bits. If the sensor will be under an overlay that is not 100% transmissive to sunlight, contact Silicon Labs for more information on adjusting these coefficients. Typically, after 285 µs, AUX_DATA will contain a 16-bit value representing 100 times the sunlight UV Index. Host software must divide the results from AUX_DATA by 100. The accuracy of UV readings can be improved by using calibration parameters that are programmed into the Si1132/Si114x at Silicon Labs' production facilities to adjust for normal part-to-part variation. The calibration parameters are recovered from the Si113x/Si114x by writing Command Register @ address 0x18 with the value 0x12. When the calibration parameters are recovered they show up at I2C registers 0x22 to 0x2D. These are the same registers used to report the VIS, IR, PS1, PS2, PS3, and AUX measurements. The use of calibration parameters is documented in the file, Si114x_functions.h, which is part of the Si114x Programmer's Toolkit example source code and is downloadable from Silabs.com. The host code is expected to allocate memory for the SI114X_CAL_S structure. The si114x_calibration routine will then fill it up with the appropriate values. Once the calibration parameters have been recovered the routine Si114x_set_ucoef is used to modify the default values that go into the UCOEF0 to UCOEF3 UV configuration registers to remove normal part-to-part variation. The typical calibrated UV sensor response vs. calculated ideal UV Index is shown in Figure 11 for a large database of sunlight spectra from cloudy to sunny days and at various angles of the sun/time of day. Figure 11. Calibrated UV Sensor Response vs. Calculated Ideal UV Index (AUX_DATA Measurement / 100) 16 Rev. 1.3 Si1145/46/47 2.5. Host Interface The host interface to the Si1145/46/47 consists of three pins: SCL SDA INT SCL and SDA are standard open-drain pins as required for I2C operation. The Si1145/46/47 asserts the INT pin to interrupt the host processor. The INT pin is an open-drain output. A pull-up resistor is needed for proper operation. As an open-drain output, it can be shared with other open-drain interrupt sources in the system. For proper operation, the Si1145/46/47 is expected to fully complete its Initialization Mode prior to any activity on the I2C. The INT, SCL, and SDA pins are designed so that it is possible for the Si1145/46/47 to enter the Off Mode by software command without interfering with normal operation of other I2C devices on the bus. The Si1145/46/47 I2C slave address is 0x60. The Si1145/46/47 also responds to the global address (0x00) and the global reset command (0x06). Only 7-bit I2C addressing is supported; 10-bit I2C addressing is not supported. Conceptually, the I2C interface allows access to the Si1145/46/47 internal registers. Table 14 on page 29 is a summary of these registers. An I2C write access always begins with a start (or restart) condition. The first byte after the start condition is the I2C address and a read-write bit. The second byte specifies the starting address of the Si1145/46/47 internal register. Subsequent bytes are written to the Si1145/46/47 internal register sequentially until a stop condition is encountered. An I2C write access with only two bytes is typically used to set up the Si1145/46/47 internal address in preparation for an I2C read. The I2C read access, like the I2C write access, begins with a start or restart condition. In an I2C read, the I2C master then continues to clock SCK to allow the Si1145/46/47 to drive the I2C with the internal register contents. The Si1145/46/47 also supports burst reads and burst writes. The burst read is useful in collecting contiguous, sequential registers. The Si1145/46/47 register map was designed to optimize for burst reads for interrupt handlers, and the burst writes are designed to facilitate rapid programming of commonly used fields. The internal register address is a six-bit (bit 5 to bit 0) plus an Autoincrement Disable (on bit 6). The Autoincrement Disable is turned off by default. Disabling the autoincrementing feature allows the host to poll any single internal register repeatedly without having to keep updating the Si1145/46/47 internal address every time the register is read. It is recommended that the host should read PS or ALS measurements (in the I2C Register Map) when the Si1145/ 46/47 asserts INT. Although the host can read any of the Si1145/46/47's I2C registers at any time, care must be taken when reading 2-byte measurements outside the context of an interrupt handler. The host could be reading part of the 2-byte measurement when the internal sequencer is updating that same measurement coincidentally. When this happens, the host could be reading a hybrid 2-byte quantity whose high byte and low byte are parts of different samples. If the host must read these 2-byte registers outside the context of an interrupt handler, the host should “double-check” a measurement if the measurement deviates significantly from a previous reading. I2C Broadcast Reset: The I2C Broadcast Reset should be sent prior to any I2C register access to the Si114x. If any I2C register or parameter has already been written to the Si114x when the I2C Broadcast Reset is issued, the host must send a reset command and reinitialize the Si114x completely. Rev. 1.3 17 Si1145/46/47 SCL SDA SLA6 START SLA5-0 R/W D7 Slave Address + R/W ACK D6-0 Data Byte Figure 12. I2C Bit Timing Diagram Figure 13. Host Interface Single Write Figure 14. Host Interface Single Read Figure 15. Host Interface Burst Write Figure 16. Host Interface Burst Read Figure 17. Si1145/46/47 REG ADDRESS Format Notes: Gray boxes are driven by the host to the Si1145/46/47 White boxes are driven by the Si1145/46/47 to the host A = ACK or “acknowledge” N = NACK or “no acknowledge” S = START condition Sr = repeat START condition P = STOP condition AI = Disable Auto Increment when set 18 Rev. 1.3 NACK STOP Si1145/46/47 3. Operational Modes The Si1145/46/47 can be in one of many operational modes at any one time. It is important to consider the operational mode since the mode has an impact on the overall power consumption of the Si1145/46/47. The various modes are: Off Mode Initialization Mode Standby Mode Forced Conversion Mode Autonomous Mode 3.1. Off Mode The Si1145/46/47 is in the Off Mode when VDD is either not connected to a power supply or if the VDD voltage is below the stated VDD_OFF voltage described in the electrical specifications. As long as the parameters stated in Table 4, “Absolute Maximum Limits,” on page 9 are not violated, no current will flow through the Si1145/46/47. In the Off Mode, the Si1145/46/47 SCL and SDA pins do not interfere with other I2C devices on the bus. The LED pins will not draw current through the infrared diodes. Keeping VDD less than VDD_OFF is not intended as a method of achieving lowest system current draw. The reason is that the ESD protection devices on the SCL, SDA and INT pins also from a current path through VDD. If VDD is grounded for example, then, current flow from system power to system ground through the SCL, SDA and INT pull-up resistors and the ESD protection devices. Allowing VDD to be less than VDD_OFF is intended to serve as a hardware method of resetting the Si1145/46/47 without a dedicated reset pin. The Si1145/46/47 can also reenter the Off Mode upon receipt of either a general I2C reset or if a software reset sequence is initiated. When one of these software methods is used to enter the Off Mode, the Si1145/46/47 typically proceeds directly from the Off Mode to the Initialization Mode. 3.2. Initialization Mode When power is applied to VDD and is greater than the minimum VDD Supply Voltage stated in Table 1, “Recommended Operating Conditions,” on page 4, the Si1145/46/47 enters its Initialization Mode. In the Initialization Mode, the Si1145/46/47 performs its initial startup sequence. Since the I2C may not yet be active, it is recommended that no I2C activity occur during this brief Initialization Mode period. The “Start-up time” specification in Table 1 is the minimum recommended time the host needs to wait before sending any I2C accesses following a power-up sequence. After Initialization Mode has completed, the Si1145/46/47 enters Standby Mode. The host must write 0x17 to the HW_KEY register for proper operation. 3.3. Standby Mode The Si1145/46/47 spends most of its time in Standby Mode. After the Si1145/46/47 completes the Initialization Mode sequence, it enters Standby mode. While in Standby Mode, the Si1145/46/47 does not perform any Ambient Light measurements or Proximity Detection functions. However, the I2C interface is active and ready to accept reads and writes to the Si1145/46/47 registers. The internal Digital Sequence Controller is in its sleep state and does not draw much power. In addition, the INT output retains its state until it is cleared by the host. I2C accesses do not necessarily cause the Si1145/46/47 to exit the Standby Mode. For example, reading Si1145/ 46/47 registers is accomplished without needing the Digital Sequence Controller to wake from its sleep state. 3.4. Forced Conversion Mode The Si1145/46/47 can operate in Forced Conversion Mode under the specific command of the host processor. The Forced Conversion Mode is entered if either the ALS_FORCE or the PS_FORCE command is sent. Upon completion of the conversion, the Si1145/46/47 can generate an interrupt to the host if the corresponding interrupt is enabled. It is possible to initiate both an ALS and multiple PS measurements with one command register write access by using the PSALS_FORCE command. Rev. 1.3 19 Si1145/46/47 3.5. Autonomous Operation Mode The Si1145/46/47 can be placed in the Autonomous Operation Mode where measurements are performed automatically without requiring an explicit host command for every measurement. The PS_AUTO, ALS_AUTO and PSALS_AUTO commands are used to place the Si1145/46/47 in the Autonomous Operation Mode. The Si1145/46/47 updates the I2C registers for PS and ALS automatically. Each measurement is allocated a 16-bit register in the I2C map. It is possible to operate the Si1145/46/47 without interrupts. When doing so, the host poll rate must be at least twice the frequency of the conversion rates for the host to always receive a new measurement. The host can also choose to be notified when these new measurements are available by enabling interrupts. The conversion frequencies for the PS and ALS measurements are set up by the host prior to the PS_AUTO, ALS_AUTO, or PSALS_AUTO commands. 20 Rev. 1.3 Si1145/46/47 4. Programming Guide 4.1. Command and Response Structure All Si1145/46/47 I2C registers (except writes to the COMMAND register) are read or written without waking up the internal sequencer. A complete list of the I2C registers can be found in "4.5. I2C Registers" on page 29. In addition to the I2C Registers, RAM parameters are memory locations maintained by the internal sequencer. These RAM Parameters are accessible through a Command Protocol (see "4.6. Parameter RAM" on page 45). A complete list of the RAM Parameters can be found in "4.6. Parameter RAM" on page 45. The Si1145/46/47 can operate either in Forced Measurement or Autonomous Mode. When in Forced Measurement mode, the Si1145/46/47 does not make any measurements unless the host specifically requests the Si1145/46/47 to do so via specific commands (refer to the Section 3.2). The CHLIST parameter needs to be written so that the Si1145/46/47 would know which measurements to make. The parameter MEAS_RATE, when zero, places the internal sequencer in Forced Measurement mode. When in Forced Measurement mode, the internal sequencer wakes up only when the host writes to the COMMAND register. The power consumption is lowest in Forced Measurement mode (MEAS_RATE = 0). The Si1145/46/47 operates in Autonomous Operation mode when MEAS_RATE is non-zero. The MEAS_RATE represents the time interval at which the Si1145/46/47 wakes up periodically. Once the internal sequencer has awoken, up to three proximity measurements are made (PS1, PS2 and PS3) depending on which measurements are enabled via the lower bits of the CHLIST Parameter. All three PS measurements are performed, in sequence, beginning with the PS1 measurement channel. Up to three measurements are made (ALS_VIS, ALS_IR and AUX) depending on which measurements are enabled via the upper bits of the CHLIST Parameter. All three measurements are made in the following sequence: ALS_VIS, ALS_IR and AUX. The operation of the Si1145/46/47 can be described as two measurement groups bound by some common factors. The PS Measurement group consists of the three PS measurements while the ALS Measurement group consists of the Visible Light Ambient Measurement (ALS_VIS), the Infrared Light Ambient Measurement (ALS_IR) and the Auxiliary measurement (AUX). Each measurement group has three measurements each. The Channel List (CHLIST) parameter enables the specific measurements for that measurement grouping. Each measurement (PS1, PS2, PS3, ALS_VIS, ALS_IR, AUX) are controlled through a combination of I2C Register or Parameter RAM. Tables 7 to 9 below summarize the properties and resources used for each measurement. Rev. 1.3 21 Si1145/46/47 4.2. Command Protocol The I2C map implements a bidirectional message box between the host and the Si1145/46/47 Sequencer. Hostwritable I2C registers facilitate host-to-Si1145/46/47 communication, while read-only I2C registers are used for Si1145/46/47-to-host communication. Unlike the other host-writable I2C registers, the COMMAND register causes the internal sequencer to wake up from Standby mode to process the host request. When a command is executed, the RESPONSE register is updated. Typically, when there is no error, the upper four bits are zeros. To allow command tracking, the lower four bits implement a 4-bit circular counter. In general, if the upper nibble of the RESPONSE register is non-zero, this indicates an error or the need for special processing. The PARAM_WR and PARAM_RD registers are additional mailbox registers. In addition to the registers in the I2C map, there are environmental parameters accessible through the Command/ Response interface. These parameters are stored in the internal ram space. These parameters generally take more I2C accesses to read and write. The Parameter RAM is described in "4.6. Parameter RAM" on page 45. For every write to the Command register, the following sequence is required: 1. Write 0x00 to Command register to clear the Response register. 2. Read Response register and verify contents are 0x00. 3. Write Command value from Table 5 into Command register. 4. Read the Response register and verify contents are now non-zero. If contents are still 0x00, repeat this step.* *Note: Step 4 is not applicable to the Reset Command because the device will reset itself and does not increment the Response register after reset. No Commands should be issued to the device for at least 1 ms after a Reset is issued. The Response register will be incremented upon the successful completion of a Command. If the Response register remains 0x00 for over 25 ms after the Command write, the entire Command process should be repeated starting with Step 1. Table 5. Command Register Summary COMMAND Register Name Encoding PARAM_QUERY 100 aaaaa PARAM_W R Register PARAM_RD Register Error Code in RESPONSE Register — nnnn nnnn Reads the parameter pointed to by bitfield [4:0] and writes value to PARAM_RD. See Table 15 for parameters. Description PARAM_SET 101 aaaaa dddd dddd nnnn nnnn Sets parameter pointed by bitfield [4:0] with value in PARAM_WR, and writes value out to PARAM_RD. See Table 15 for parameters. NOP 000 00000 — — Forces a zero into the RESPONSE register RESET 000 00001 — — Performs a software reset of the firmware BUSADDR 000 00010 — — — Modifies I2C address Reserved 000 00011 — — — — Reserved 000 00100 — — — — PS_FORCE 000 00101 — — GET_CAL 0001 0010 — — 22 Forces a single PS measurement Reports calibration data to I2C registers 0x22–0x2D Rev. 1.3 Si1145/46/47 Table 5. Command Register Summary (Continued) COMMAND Register Name Encoding PARAM_W R Register PARAM_RD Register Error Code in RESPONSE Register ALS_FORCE 000 00110 — — PSALS_FORCE 000 00111 — — Description Forces a single ALS measurement Forces a single PS and ALS measurement Reserved 000 01000 — — — — PS_PAUSE 000 01001 — — Pauses autonomous PS ALS_PAUSE 000 01010 — — PSALS_PAUSE 000 01011 — — Reserved 000 01100 — — PS_AUTO 000 01101 — — ALS_AUTO 000 01110 — — Starts/Restarts an autonomous ALS Loop PSALS_AUTO 000 01111 — — Starts/Restarts autonomous ALS and PS loop Reserved 000 1xxxx — — — Pauses autonomous ALS Pauses PS and ALS — Starts/Restarts an autonomous PS Loop — Table 6. Response Register Error Codes RESPONSE Register Description 0000 cccc NO_ERROR. The lower bit is a circular counter and is incremented every time a command has completed. This allows the host to keep track of commands sent to the Si1145/46/47. The circular counter may be cleared using the NOP command. 1000 0000 INVALID_SETTING. An invalid setting was encountered. Clear using the NOP command. 1000 1000 PS1_ADC_OVERFLOW. Indicates proximity channel one conversion overflow. 1000 1001 PS2_ADC_OVERFLOW. Indicates proximity channel two conversion overflow. 1000 1010 PS3_ADC_OVERFLOW. Indicates proximity channel three conversion overflow. 1000 1100 ALS_VIS_ADC_OVERFLOW. Indicates visible ambient light channel conversion overflow. 1000 1101 ALS_IR_ADC_OVERFLOW. Indicates infrared ambient light channel conversion overflow. 1000 1110 AUX_ADC_OVERFLOW. Indicates auxiliary channel conversion overflow. Rev. 1.3 23 Si1145/46/47 4.3. Resource Summary Table 7. Resource Summary for Interrupts Measurement Channel Channel Enable Interrupt Status Output Interrupt Enable Proximity Sense 1 EN_PS1 in CHLIST[0] PS1_INT in IRQ_STATUS[2] PS1_IE in IRQ_ENABLE[2] Proximity Sense 2 EN_PS2 in CHLIST[1] PS2_INT in IRQ_STATUS[3] PS2_IE in IRQ_ENABLE[3] Proximity Sense 3 EN_PS3 in CHLIST[2] PS3_INT in IRQ_STATUS[4] PS3_EN in IRQ_ENABLE[4] ALS Visible 24 EN_ALS_VIS in ALS_INT[1:0] in CHLIST[4] IRQ_STATUS[1:0] ALS IR EN_ALS_IR in CHLIST[5] Auxiliary Measurement EN_AUX in CHLIST[6] — Rev. 1.3 ALS_IE[1:0] in IRQ_ENABLE[1:0] — Autonomous Measurement Time Base MEAS_RATE[15:0] Si1145/46/47 Table 8. Resource Summary for LED Choice and ADC Parameters Measurement Channel LED Selection ADC Mode ADC Output ADC Input Source ADC Recovery Count ADC High Signal Mode ADC Clock Divider Proximity Sense 1 PS1_LED[2:0] in PSLED12_SELECT[2:0] PS_ADC_MODE in PS_ADC_MISC[2] PS1_DATA1[7:0] / PS1_DATA0[7:0] PS1_ADCMUX[7:0] PS_ADC_REC in PS_ADC_COUNTER [6:4] PS_RANGE in PS_ADC_MISC[5] PS_ADC_GAIN[3:0] Proximity Sense 2 PS2_LED[2:0] in PSLED12_SELECT[6:4] PS2_DATA1[7:0] / PS2_DATA0[7:0] PS2_ADCMUX[7:0] PS2_ALIGN in PS_ENCODING[5] Proximity Sense 3 PS3_LED[2:0] in PSLED3_SELECT[2:0] PS3_DATA1[7:0] / PS3_DATA0[7:0] PS3_ADCMUX[7:0] PS3_ALIGN in PS_ENCODING[6] ALS Visible — — ADC Alignment PS1_ALIGN in PS_ENCODING[4] ALS_VIS_DATA1 / ALS_VIS_DATA0 VIS_ADC_REC in ALS_VIS_ADC_COUNTER [6:4] VIS_RANGE in ALS_VIS_ADC_MISC[5] ALS_VIS_ADC_GAIN [3:0] ALS_VIS_ALIGN in ALS_ENCODING[4] ALS IR ALS_IR_DATA1[7:0] / ALS_IR_DATA0[7:0] IR_ADC_REC in ALS_IR_ADC_COUNTER [6:4] IR_RANGE in ALS_IR_ADC_MISC[5] ALS_IR_ADC_GAIN [3:0] ALS_IR_ALIGN in ALS_ENCODING[5] Auxiliary Measurement AUX_DATA1[7:0] / AUX_DATA0[7:0] — — — — AUX_ADCMUX[7:0] Rev. 1.3 25 Si1145/46/47 Table 9. Resource Summary for Hardware Pins Pin Name LED Current Drive LED1 LED1_I in PSLED12[3:0] LED2 LED2_I in PSLED12[7:4] HW_KEY[7:0] LED3 LED3_I in PSLED3[3:0] HW_KEY[7:0] INT Output Drive Disable Analog Voltage Input Enable ANA_IN_KEY[31:0] INT_OE in INT_CFG[0] ANA_IN_KEY[31:0] ANA_IN_KEY[31:0] The interrupts of the Si1145/46/47 are controlled through the INT_CFG, IRQ_ENABLE, IRQ_MODE1, IRQ_MODE2 and IRQ_STATUS registers. The INT hardware pin is enabled through the INT_OE bit in the INT_CFG register. The hardware essentially performs an AND function between the IRQ_ENABLE register and IRQ_STATUS register. After this AND function, if any bits are set, the INT pin is asserted. The host is responsible for clearing the interrupt by writing to the IRQ_STATUS register. When the specific bits of the IRQ_STATUS register is written with '1', that specific IRQ_STATUS bit is cleared. Typically, the host software is expected to read the IRQ_STATUS register, stores a local copy, and then writes the same value back to the IRQ_STATUS to clear the interrupt source. The INT_CFG register is normally written with '1'. The IRQ_MODE1, IRQ_MODE2 and IRQ_ENABLE registers work together to define how the internal sequencer sets bits in the IRQ_STATUS register (and as a consequence, asserting the INT pin). The PS1 interrupts are described in Table 10. The PS2 interrupts are described in Table 11. The PS3 interrupts are described in Table 12. The ALS interrupts are described in Table 13. 26 Rev. 1.3 Si1145/46/47 Table 10. PS1 Channel Interrupt Resources IRQ_ENABLE[2] Description PS1_IE 0 No PS1 Interrupts 1 PS1_INT set after every PS1 sample Table 11. PS2 Channel Interrupt Resources IRQ_ENABLE[3] Description PS2_IE 0 No PS2 Interrupts 1 PS2_INT set after every PS2 sample Table 12. PS3 Channel Interrupt Resources IRQ_ENABLE[4] Description PS3_IE 0 No PS3 Interrupts 1 PS3_INT set after every PS3 sample Table 13. Ambient Light Sensing Interrupt Resources IRQ_ENABLE[1:0] Description ALS_IE[1:0] 0 0 No ALS Interrupts 0 1 ALS_INT set after every ALS_VIS or UV sample Rev. 1.3 27 Si1145/46/47 4.4. Signal Path Software Model The following diagram gives an overview of the signal paths, along with the I2C register and RAM Parameter bit fields that control them. Sections with detailed descriptions of the I2C registers and Parameter RAM follow. PS1_ALIGN PS_RATE PS_ADC_REC PS_ADC_GAIN PS_RANGE PS1_ADCMUX Ref. Vdd Analog Range Gain Recov. time Rate Align Select 0 2 3 6 Out 0x25 0x65 0x75 Offset Sum Digital 16 PS1_DATA In Enable EN_PS1 GND PS2_ALIGN PS_RATE PS_ADC_REC PS_ADC_GAIN PS_RANGE PS2_ADCMUX Ref. Vdd Analog Range Gain Recov. time Rate Align Select 0 2 3 6 Out 0x25 0x65 0x75 Offset Sum Digital 16 PS2_DATA In Enable EN_PS2 GND PS3_ALIGN PS_RATE PS_ADC_REC PS_ADC_GAIN PS_RANGE PS3_ADCMUX Ref. Large IR Vdd Analog Range Gain Recov. time Rate Align Select 0 2 3 6 Out 0x25 0x65 0x75 Offset Sum Digital 16 PS3_DATA In Enable EN_PS3 GND ALS_VIS_ALIGN ALS_RATE ALS_VIS_ADC_REC ALS_VIS_ADC_GAIN VIS_RANGE GND Analog Range Gain Recov. time Rate Align Offset Sum Digital 16 ALS_VIS_DATA In Enable Small visible EN_ALS_VIS ALS_IR_ALIGN ALS_RATE ALS_IR_ADC_REC ALS_IR_ADC_GAIN IR_RANGE GND ALS_IR_ADCMUX 0 Out Analog 3 Range Gain Recov. time Rate Align Select Offset Sum Digital 16 ALS_IR_DATA In Enable EN_ALS_IR Small IR AUX_ADCMUX GND Offset Select Sum 0x65 Temperature sensor Out Vdd Analog Digital 16 In 0x75 Enable EN_AUX Figure 18. Signal Path Programming Model 28 Rev. 1.3 16 AUX_DATA Si1145/46/47 4.5. I2C Registers Table 14. I2C Register Summary I2C Register Name Address PART_ID 0x00 PART_ID REV_ID 0x01 REV_ID SEQ_ID 0x02 SEQ_ID INT_CFG 0x03 IRQ_ENABLE 0x04 HW_KEY 0x07 HW_KEY MEAS_RATE0 0x08 MEAS_RATE0 MEAS_RATE1 0x09 MEAS_RATE1 Reserved 0x0A Reserved 0x0B Reserved 0x0C Reserved 0x0D Reserved 0x0E PS_LED21 0x0F PS_LED3 0x10 Reserved 0x11 Reserved 0x12 UCOEF0 0x13 UCOEF0 UCOEF1 0x14 UCOEF1 UCOEF2 0x15 UCOEF2 UCOEF3 0x16 UCOEF3 PARAM_WR 0x17 PARAM_WR COMMAND 0x18 COMMAND RESPONSE 0x20 RESPONSE IRQ_STATUS 0x21 CMD_INT PS3_INT PS2_INT ALS_VIS_DATA0 0x22 7 6 5 4 3 2 1 0 INT_OE PS3_IE PS2_IE LED2_I PS1_IE ALS_IE LED1_I LED3_I PS1_INT ALS_INT ALS_VIS_DATA0 Rev. 1.3 29 Si1145/46/47 Table 14. I2C Register Summary (Continued) I2C Register Name Address ALS_VIS_DATA1 0x23 ALS_VIS_DATA1 ALS_IR_DATA0 0x24 ALS_IR_DATA0 ALS_IR_DATA1 0x25 ALS_IR_DATA1 PS1_DATA0 0x26 PS1_DATA0 PS1_DATA1 0x27 PS1_DATA1 PS2_DATA0 0x28 PS2_DATA0 PS2_DATA1 0x29 PS2_DATA1 PS3_DATA0 0x2A PS3_DATA0 PS3_DATA1 0x2B PS3_DATA1 AUX_DATA0/ UVINDEX0 0x2C AUX_DATA0/UVINDEX0 AUX_DATA1/ UVINDEX1 0x2D AUX_DATA1/UVINDEX1 PARAM_RD 0x2E PARAM_RD CHIP_STAT 0x30 ANA_IN_KEY 0x3B– 0x3E 30 7 6 5 4 3 2 1 RUNNING SUSPEND ANA_IN_KEY Rev. 1.3 0 SLEEP Si1145/46/47 PART_ID @ 0x00 Bit 7 6 5 4 Name PART_ID Type R 3 2 1 0 3 2 1 0 3 2 1 0 Reset value = 0100 0101 (Si1145) Reset value = 0100 0110 (Si1146) Reset value = 0100 0111 (Si1147) REV_ID @ 0x1 Bit 7 6 5 4 Name REV_ID Type R Reset value = 0000 0000 SEQ_ID @ 0x02 Bit 7 6 5 4 Name SEQ_ID Type R Reset value = 0000 1000 Bit Name 7:0 SEQ_ID Function Sequencer Revision. 0x08 Si114x-A10 (MAJOR_SEQ=1, MINOR_SEQ=0) Rev. 1.3 31 Si1145/46/47 INT_CFG @ 0x03 Bit 7 6 5 4 3 2 1 0 INT_OE Name RW Type RW Reset value = 0000 0000 Bit Name 7:2 Reserved 0 INT_OE Function Reserved. INT Output Enable. INT_OE controls the INT pin drive 0: INT pin is never driven 1: INT pin driven low whenever an IRQ_STATUS and its corresponding IRQ_ENABLE bits match 32 Rev. 1.3 Si1145/46/47 IRQ_ENABLE @ 0x04 Bit 7 6 5 Name RW Type 4 3 2 PS3_IE PS2_IE PS1_IE RW RW RW 1 0 ALS_IE RW Reset value = 0000 0000 Bit Name 7:5 Reserved 4 PS3_IE Function Reserved. PS3 Interrupt Enable. Enables interrupts based on PS3 Channel Activity. 0: INT never asserts due to PS3 Channel activity. 1: Assert INT pin whenever PS3_INT is set by the internal sequencer. 3 PS2_IE PS2 Interrupt Enable. Enables interrupts based on PS2 Channel Activity. 0: INT never asserts due to PS2 Channel activity. 1: Assert INT pin whenever PS2_INT is set by the internal sequencer. 2 PS1_IE PS1 Interrupt Enable. Enables interrupts based on PS1 Channel Activity. 0: INT never asserts due to PS1 Channel activity. 1: Assert INT pin whenever PS1_INT is set by the internal sequencer. 1 Reserved 0 ALS_IE Reserved. ALS Interrupt Enable. Enables interrupts when VIS bit or UV bit in CHLIST is enabled. 0: INT never asserts due to VIS or UV activity 1: Assert INT pin whenever VIS or UV measurements are ready Rev. 1.3 33 Si1145/46/47 HW_KEY @ 0x07 Bit 7 6 5 4 3 Name HW_KEY Type RW 2 1 0 Reset value = 0000 0000 Bit Name Function 7:0 HW_KEY The system must write the value 0x17 to this register for proper Si114x operation. MEAS_RATE0: MEAS_RATE Data Word Low Byte @ 0x08 Bit 7 6 5 4 3 Name MEAS_RATE[7:0] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function MEAS_RATE[7:0] MEAS_RATE1 and MEAS_RATE0 together form a 16-bit value: MEAS_RATE [15:0]. The 16-bit value, when multiplied by 31.25 us, represents the time duration between wake-up periods where measurements are made. Once the device wakes up, all measurements specified in CHLIST are made. Note that for the Si1145/6/7 with SEQ_ID=0x01, there is a code error that places MEAS_RATE0 at 0x0A with MEAS_RATE1 at 0x08 instead. This will be fixed in future revisions of the Si1145/6/7. 34 Rev. 1.3 Si1145/46/47 MEAS_RATE1: MEAS_RATE Data Word High Byte @ 0x09 Bit 7 6 5 4 3 Name MEAS_RATE[15:8] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function MEAS_RATE[15:8] MEAS_RATE1 and MEAS_RATE0 together form a 16-bit value: MEAS_RATE[15:0]. The 16-bit value, when multiplied by 31.25 ms, represents the time duration between wake-up periods where measurements are made. Once the device wakes up, all measurements specified in CHLIST are made. Note that for the Si1145/6/7 with SEQ_ID=0x01, there is a code error that places MEAS_RATE0 at 0x0A and MEAS_RATE1 at 0x08 instead. This will be fixed in future revisions of the Si1145/6/7. Rev. 1.3 35 Si1145/46/47 PS_LED21 @ 0x0F Bit 7 6 5 4 3 2 1 Name LED2_I LED1_I Type RW RW 0 Reset value = 0000 0000 Bit Name Function 7:4 LED2_I LED2_I Represents the irLED current sunk by the LED2 pin during a PS measurement. On the Si1145, these bits must be set to zero. 3:0 LED1_1 LED1_I Represents the irLED current sunk by the LED1 pin during a PS measurement. LED3_I, LED2_I, and LED1_I current encoded as follows: 0000: No current 0001: Minimum current 1111: Maximum current Refer to Table 2, “Performance Characteristics1,” on page 5 for LED current values. PS_LED3 @ 0x10 Bit 7 6 5 4 3 2 1 Name LED3_I Type RW 0 Reset value = 0000 0000 36 Bit Name 7:4 Reserved 3:0 LED3_I Function Reserved. LED3_I Represents the irLED current sunk by the LED3 pin during a PS measurement. See PS_LED21 Register for additional details. On the Si1145 and Si1146, these bits must be set to zero. Rev. 1.3 Si1145/46/47 PARAM_WR @ 0x17 Bit 7 6 5 4 3 Name PARAM_WR Type RW 2 1 0 Reset value = 0000 0000 Bit Name 7:0 Function PARAM_WR Mailbox register for passing parameters from the host to the sequencer. COMMAND @ 0x18 Bit 7 6 5 4 3 Name COMMAND Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function COMMAND COMMAND Register. The COMMAND Register is the primary mailbox register into the internal sequencer. Writing to the COMMAND register is the only I2C operation that wakes the device from standby mode. Rev. 1.3 37 Si1145/46/47 RESPONSE @ 0x20 Bit 7 6 5 4 3 Name RESPONSE Type RW 2 1 0 Reset value = 0000 0000 38 Bit Name Function 7:0 RESPONSE The Response register is used in conjunction with command processing. When an error is encountered, the response register will be loaded with an error code. All error codes will have the MSB is set. The error code is retained until a RESET or NOP command is received by the sequencer. Other commands other than RESET or NOP will be ignored. However, any autonomous operation in progress continues normal operation despite any error. 0x00–0x0F: No Error. Bits 3:0 form an incrementing roll-over counter. The roll over counter in bit 3:0 increments when a command has been executed by the Si114x. Once autonomous measurements have started, the execution timing of any command becomes non-deterministic since a measurement could be in progress when the COMMAND register is written. The host software must make use of the rollover counter to ensure that commands are processed. 0x80: Invalid Command Encountered during command processing 0x88: ADC Overflow encountered during PS1 measurement 0x89: ADC Overflow encountered during PS2 measurement 0x8A: ADC Overflow encountered during PS3 measurement 0x8C: ADC Overflow encountered during ALS-VIS measurement 0x8D: ADC Overflow encountered during ALS-IR measurement 0x8E: ADC Overflow encountered during AUX measurement Rev. 1.3 Si1145/46/47 IRQ_STATUS @ 0x21 Bit 7 6 5 4 3 2 Name CMD_INT PS3_INT PS2_INT PS1_INT Type RW RW RW RW 1 0 ALS_INT RW Reset value = 0000 0000 Bit Name Function 7:6 Reserved Reserved. 5 CMD_INT Command Interrupt Status. 4 PS3_INT PS3 Interrupt Status. 3 PS2_INT PS3 Interrupt Status. 2 PS1_INT PS1 Interrupt Status. 1:0 ALS_INT ALS Interrupt Status. (Refer to Table 13 for encoding.) Note: If the corresponding IRQ_ENABLE bit is also set when the IRQ_STATUS bit is set, the INT pin is asserted. ALS_VIS_DATA0: ALS_VIS_DATA Data Word Low Byte @ 0x22 Bit 7 6 5 4 3 2 Name ALS_VIS_DATA[7:0] Type RW 1 0 Reset value = 0000 0000 Bit 7:0 Name Function ALS_VIS_DATA[7:0] ALS VIS Data LSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. Rev. 1.3 39 Si1145/46/47 ALS_VIS_DATA1: ALS_VIS_DATA Data Word High Byte @ 0x23 Bit 7 6 5 4 3 Name ALS_VIS_DATA[15:8] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function ALS_VIS_DATA[15:8] ALS VIS Data MSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. ALS_IR_DATA0: ALS_IR_DATA Data Word Low Byte@ 0x24 Bit 7 6 5 4 3 Name ALS_IR_DATA[7:0] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function ALS_IR_DATA[7:0] ALS IR Data LSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. ALS_IR_DATA1: ALS_IR_DATA Data Word High Byte @ 0x25 Bit 7 6 5 4 3 Name ALS_IR_DATA[15:8] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 40 Name Function ALS_IR_DATA[15:8] ALS IR Data MSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. Rev. 1.3 Si1145/46/47 PS1_DATA0: PS1_DATA Data Word Low Byte @ 0x26 Bit 7 6 5 4 3 Name PS1_DATA[7:0] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function PS1_DATA[7:0] PS1 Data LSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. PS1_DATA1: PS1_DATA Data Word High Byte @ 0x27 Bit 7 6 5 4 3 Name PS1_DATA[15:8] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function PS1_DATA[15:8] PS1 Data MSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. PS2_DATA0: PS2_DATA Data Word Low Byte @ 0x28 Bit 7 6 5 4 3 Name PS2_DATA[7:0] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function PS2_DATA[7:0] PS2 Data LSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. Rev. 1.3 41 Si1145/46/47 PS2_DATA1: PS2_DATA Data Word High Byte @ 0x29 Bit 7 6 5 4 3 Name PS2_DATA[15:8] Type RW 2 1 0 Reset value = 0000 0000 Bit Name 7:0 Function PS2_DATA[15:8] PS2 Data MSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. PS3_DATA0: PS3_DATA Low Byte @ 0x2A Bit 7 6 5 4 3 Name PS3_DATA[7:0] Type RW 2 1 0 Reset value = 0000 0000 Bit Name 7:0 Function PS3_DATA[7:0] PS3 Data LSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. PS3_DATA1: PS3_DATA High Byte @ 0x2B Bit 7 6 5 4 3 Name PS3_DATA[15:8] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 42 Name Function PS3_DATA[15:8] PS3 Data MSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. Rev. 1.3 Si1145/46/47 AUX_DATA0/UVINDEX0: AUX_DATA Data Word Low Byte @ 0x2C Bit 7 6 5 4 3 Name AUX_DATA[7:0] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function AUX_DATA[7:0] AUX Data LSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. AUX_DATA1/UVINDEX1: AUX_DATA Data Word High Byte @ 0x2D Bit 7 6 5 4 3 Name AUX_DATA[15:8] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 Name Function AUX_DATA[15:8] AUX Data MSB. Once autonomous measurements have started, this register must be read after INT has asserted but before the next measurement is made. Refer to “AN498: Si114x Designer’s Guide”, section “5.6.2 Host Interrupt Latency”. PARAM_RD @ 0x2E Bit 7 6 5 4 3 Name PARAM_RD Type RW 2 1 0 Reset value = 0000 0000 Bit Name 7:0 PARAM_RD Function Mailbox register for passing parameters from the sequencer to the host. Rev. 1.3 43 Si1145/46/47 CHIP_STAT @ 0x30 Bit 7 6 5 4 3 2 1 0 Name RUNNING SUSPEND SLEEP Type R R R Reset value = 0000 0000 Bit Name Function 7:3 Reserved Reserved 2 RUNNING Device is awake. 1 SUSPEND Device is in a low-power state, waiting for a measurement to complete. 0 SLEEP Device is in its lowest power state. ANA_IN_KEY @ 0x3B to 0x3E Bit 7 6 5 4 3 2 0x3B ANA_IN_KEY[31:24] 0x3C ANA_IN_KEY[23:16] 0x3D ANA_IN_KEY[15:8] 0x3E ANA_IN_KEY[7:0] Type RW Reset value = 0000 0000 44 Bit Name 31:0 ANA_IN_KEY[31:0] Function Reserved. Rev. 1.3 1 0 Si1145/46/47 4.6. Parameter RAM Parameters are located in internal memory and are not directly addressable over I2C. They must be indirectly accessed using the PARAM_QUERY and PARAM_SET commands described in "4.2. Command Protocol" on page 22. Table 15. Parameter RAM Summary Table Parameter Name Offset Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 I2C_ADDR 0x00 CHLIST 0x01 EN_UV — EN_PS3 PSLED12_SELECT 0x02 — PSLED3_SELECT 0x03 Reserved 0x04 PS_ENCODING 0x05 ALS_ENCODING 0x06 PS1_ADCMUX 0x07 PS1 ADC Input Selection PS2_ADCMUX 0x08 PS2 ADC Input Selection PS3_ADCMUX 0x09 PS3 ADC Input Selection PS_ADC_COUNTER 0x0A PS_ADC_GAIN 0x0B PS_ADC_MISC 0x0C Reserved 0x0D Reserved (do not modify from default setting of 0x02) ALS_IR_ADCMUX 0x0E ALS_IR_ADCMUX AUX_ADCMUX 0x0F AUX ADC Input Selection ALS_VIS_ADC_COUNTER 0x10 ALS_VIS_ADC_GAIN 0x11 ALS_VIS_ADC_MISC 0x12 Reserved 0x13 Reserved (do not modify from default setting of 0x40) Reserved 0x14– 0x15 Reserved (do not modify from default setting of 0x00) Reserved 0x1B Reserved (do not modify from default setting of 0x00) LED_REC 0x1C LED recovery time ALS_IR_ADC_ COUNTER 0x1D ALS_IR_ADC_GAIN 0x1E ALS_IR_ADC_MISC 0x1F Bit 0 I2C Address EN_AUX EN_ALS_IR EN_ALS_VIS PS2_LED — EN_PS2 EN_PS1 PS1_LED — PS3_LED Reserved (always set to 0) — PS3_ALIGN PS2_ALIGN PS1_ALIGN Reserved (always set to 0) — ALS_IR_ALI GN ALS_VIS_ ALIGN Reserved (always set to 0) — PS_ADC_REC Reserved (always set to 0) — — — PS_ADC_GAIN PS_RANGE — PS_ADC_ MODE VIS_ADC_REC Reserved (always set to 0) — Reserved (always set to 0) — Reserved (always set to 0) ALS_VIS_ADC_GAIN VIS_RANGE Reserved (always set to 0) IR_ADC_REC — IR_RANGE Rev. 1.3 — Reserved (always set to 0) ALS_IR_ADC_GAIN Reserved (always set to 0) 45 Si1145/46/47 I2C @ 0x00 Bit 7 6 5 4 3 Name I2C Address[7:0] Type RW 2 1 0 Reset value = 0000 0000 Bit 7:0 46 Name 2 Function 2 I C Address[7:0] Specifies a new I C Address for the device to respond to. The new address takes effect when a BUSADDR command is received. Rev. 1.3 Si1145/46/47 CHLIST @ 0x01 Bit 7 6 Name EN_UV EN_AUX Type 5 4 3 EN_ALS_IR EN_ALS_VIS RW 2 1 0 EN_PS3 EN_PS2 EN_PS1 RW Reset value = 0000 0000 Bit Name 7 EN_UV 6 EN_AUX 5 EN_ALS_IR 4 Function Enables UV Index, data stored in AUX_DATA1[7:0] and AUX_DATA0[7:0] Enables Auxiliary Channel, data stored in AUX_DATA1[7:0] and AUX_DATA0[7:0]. Enables ALS IR Channel, data stored in ALS_IR_DATA1[7:0] and ALS_IR_DATA0[7:0]. EN_ALS_VIS Enables ALS Visible Channel, data stored in ALS_VIS_DATA1[7:0] and ALS_VIS_DATA0[7:0]. 3 Reserved 2 EN_PS3 Enables PS Channel 3, data stored in PS3_DATA1[7:0] and PS3_DATA0[7:0]. 1 EN_PS2 Enables PS Channel 2, data stored in PS2_DATA1[7:0] and PS2_DATA0[7:0]. 0 EN_PS1 Enables PS Channel 1, data stored in PS1_DATA1[7:0] and PS1_DATA0[7:0]. Note: For proper operation, CHLIST must be written with a non-zero value before forced measurements or autonomous operation is requested. Rev. 1.3 47 Si1145/46/47 PSLED12_SELECT @ 0x02 Bit 7 6 5 4 3 2 1 Name PS2_LED[2:0] PS1_LED[2:0] Type RW RW 0 Reset value = 0010 0001 48 Bit Name 7 Reserved 6:4 PS2_LED[2:0] 3 Reserved 2:0 PS1_LED[2:0] Function Specifies the LED pin driven during the PS2 Measurement. Note that any combination of irLEDs is possible. 000: NO LED DRIVE xx1: LED1 Drive Enabled x1x: LED2 Drive Enabled (Si1146 and Si1147 only. Clear for Si1145) 1xx: LED3 Drive Enabled (Si1147 only. Clear for Si1145 and Si1146) Specifies the LED pin driven during the PS1 Measurement. Note that any combination of irLEDs is possible. 000: NO LED DRIVE xx1: LED1 Drive Enabled x1x: LED2 Drive Enabled (Si1146 and Si1147 only. Clear for Si1145) 1xx: LED3 Drive Enabled (Si1147 only. Clear for Si1145 and Si1146) Rev. 1.3 Si1145/46/47 PSLED3_SELECT @ 0x03 Bit 7 6 5 4 3 2 1 Name PS3_LED[2:0] Type RW 0 Reset value = 0000 0100 Bit Name 7:3 Reserved 2:0 Function PS3_LED[2:0] Specifies the LED pin driven during the PS3 Measurement. Note that any combination of irLEDs is possible. 000: No LED drive. xx1: LED1 drive enabled. x1x: LED2 drive enabled (Si1146 and Si1147 only. Clear for Si1145). 1xx: LED3 drive enabled (Si1147 only. Clear for Si1145 and Si1146). PS_ENCODING @ 0x05 Bit 7 Name 6 5 4 3 2 1 0 PS3_ALIGN PS2_ALIGN PS1_ALIGN Type RW R/W R/W Reset value = 0000 0000 Bit Name 7 Reserved Function 6 PS3_ALIGN When set, the ADC reports the least significant 16 bits of the 17-bit ADC when performing PS3 Measurement. Reports the 16 MSBs when cleared. 5 PS2_ALIGN When set, the ADC reports the least significant 16 bits of the 17-bit ADC when performing PS2 Measurement. Reports the 16 MSBs when cleared. 4 PS1_ALIGN When set, the ADC reports the least significant 16 bits of the 17-bit ADC when performing PS1 Measurement. Reports the 16 MSBs when cleared. 3:0 Reserved Always set to 0. Rev. 1.3 49 Si1145/46/47 ALS_ENCODING @ 0x06 Bit 7 6 Name 5 4 3 2 1 0 ALS_IR_ALIGN ALS_VIS_ALIGN Type RW RW Reset value = 0000 0000 Bit Name 7:6 Reserved 5 ALS_IR_ALIGN 4 3:0 50 Function When set, the ADC reports the least significant 16 bits of the 17-bit ADC when performing ALS VIS Measurement. Reports the 16 MSBs when cleared. ALS_VIS_ALIGN When set, the ADC reports the least significant 16 bits of the 17-bit ADC when performing ALS IR Measurement. Reports the 16 MSBs when cleared. Reserved Always set to 0. Rev. 1.3 Si1145/46/47 PS1_ADCMUX @ 0x07 Bit 7 6 5 4 3 Name PS1_ADCMUX[7:0] Type RW 2 1 0 Reset value = 0000 0011 Bit 7:0 Name Function PS1_ADCMUX[7:0] Selects ADC Input for PS1 Measurement. The following selections are valid when PS_ADC_MODE = 1 (default). This setting is for normal Proximity Detection function. 0x03: Large IR Photodiode 0x00: Small IR Photodiode In addition, the following selections are valid for PS_ADC_MODE = 0. With this setting, irLED drives are disabled and the PS channels are no longer operating in normal Proximity Detection function. The results have no reference and the references needs to be measured in a separate measurement. 0x02: Visible Photodiode A separate 'No Photodiode' measurement should be subtracted from this reading. Note that the result is a negative value. The result should therefore be negated to arrive at the Ambient Visible Light reading. 0x03: Large IR Photodiode A separate “No Photodiode” measurement should be subtracted to arrive at Ambient IR reading. 0x00: Small IR Photodiode A separate “No Photodiode” measurement should be subtracted to arrive at Ambient IR reading. 0x06: No Photodiode This is typically used as reference for reading ambient IR or visible light. 0x25: GND voltage This is typically used as the reference for electrical measurements. 0x65: Temperature (Should be used only for relative temperature measurement. Absolute Temperature not guaranteed) A separate GND measurement should be subtracted from this reading. 0x75: VDD voltage A separate GND measurement is needed to make the measurement meaningful. Rev. 1.3 51 Si1145/46/47 PS2_ADCMUX @ 0x08 Bit 7 6 5 4 3 Name PS2_ADCMUX[7:0] Type R/W 2 1 0 Reset value = 0000 0011 Bit 7:0 Name Function PS2_ADCMUX[7:0] Selects input for PS2 measurement. See PS1_ADCMUX register description for details. PS3_ADCMUX @ 0x09 Bit 7 6 5 4 3 Name PS3_ADCMUX[7:0] Type R/W 2 1 0 Reset value = 0000 0011 Bit 7:0 52 Name Function PS3_ADCMUX[7:0] Selects input for PS3 measurement. See PS1_ADCMUX register description for details. Rev. 1.3 Si1145/46/47 PS_ADC_COUNTER @ 0x0A Bit 7 6 Name 5 4 3 2 1 0 PS_ADC_REC[2:0] Type RW R/W R/W Reset value = 0111 0000 Bit Name 7 Reserved 6:4 3:0 Function PS_ADC_REC[2:0] Recovery period the ADC takes before making a PS measurement. 000: 1 ADC Clock (50 ns times 2PS_ADC_GAIN) 001: 7 ADC Clock (350 ns times 2PS_ADC_GAIN) 010: 15 ADC Clock (750 ns times 2PS_ADC_GAIN) 011: 31 ADC Clock (1.55 µs times 2PS_ADC_GAIN) 100: 63 ADC Clock (3.15 µs times 2PS_ADC_GAIN) 101: 127 ADC Clock (6.35 µs times 2PS_ADC_GAIN) 110: 255 ADC Clock (12.75 µs times 2PS_ADC_GAIN) 111: 511 ADC Clock (25.55 µs times 2PS_ADC_GAIN) The recommended PS_ADC_REC value is the one’s complement of PS_ADC_GAIN. Reserved Always set to 0. Rev. 1.3 53 Si1145/46/47 PS_ADC_GAIN @ 0x0B Bit 7 6 5 4 3 2 Name 1 0 PS_ADC_GAIN[2:0] Type R/W R/W R/W Reset value = 0000 0000 54 Bit Name 7:3 Reserved 2:0 PS_ADC_GAIN[2:0] Function Increases the irLED pulse width and ADC integration time by a factor of (2 ^ PS_ADC_GAIN) for all PS measurements. Care must be taken when using this feature. At an extreme case, each of the three PS measurements can be configured to drive three separate irLEDs, each of which, are configured for 359 mA. The internal sequencer does not protect the device from such an error. To prevent permanent damage to the device, do not enter any value greater than 5 without consulting with Silicon Labs. For Example: 0x0: ADC Clock is divided by 1 0x4: ADC Clock is divided by 16 0x5: ADC Clock is divided by 32 Rev. 1.3 Si1145/46/47 PS_ADC_MISC @ 0x0C Bit 7 6 5 4 3 2 Name PS_RANGE PS_ADC_MODE Type RW RW 1 0 Reset value = 0000 0100 Bit Name 7:6 Reserved 5 PS_RANGE 4:3 Reserved 2 1:0 Function When performing PS measurements, the ADC can be programmed to operate in high sensitivity operation or high signal range. The high signal range is useful in operation under direct sunlight. 0: Normal Signal Range 1: High Signal Range (Gain divided by 14.5) PS_ADC_MODE PS Channels can either operate normally as PS channels, or it can be used to perform raw ADC measurements: 0: Raw ADC Measurement Mode 1: Normal Proximity Measurement Mode Reserved ALS_IR_ADCMUX @ 0x0E Bit 7 6 5 4 3 Name ALS_IR_ADCMUX Type RW 2 1 0 Reset value = 0000 0000 Bit Name 7:0 ALS_IR_ADCMUX Function Selects ADC Input for ALS_IR Measurement. 0x00: Small IR photodiode 0x03: Large IR photodiode Rev. 1.3 55 Si1145/46/47 AUX_ADCMUX @ 0x0F Bit 7 6 5 4 3 Name AUX_ADCMUX[7:0] Type RW 2 1 0 Reset value = 0110 0101 Bit 7:0 Name Function AUX_ADCMUX[7:0] Selects input for AUX Measurement. These measurements are referenced to GND. 0x65: Temperature (Should be used only for relative temperature measurement. Absolute Temperature not guaranteed) 0x75: VDD voltage ALS_VIS_ADC_COUNTER @ 0x10 Bit 7 6 5 Name 4 3 2 1 0 VIS_ADC_REC[2:0] Type RW R/W R/W Reset value = 0111 0000 56 Bit Name 7 Reserved 6:4 VIS_ADC_REC[2:0] 3:0 Reserved Function Recovery period the ADC takes before making a ALS-VIS measurement. 000: 1 ADC Clock (50 ns times 2ALS_VIS_ADC_GAIN) 001: 7 ADC Clock (350 ns times 2ALS_VIS_ADC_GAIN) 010: 15 ADC Clock (750 ns times 2ALS_VIS_ADC_GAIN) 011: 31 ADC Clock (1.55 µs times 2ALS_VIS_ADC_GAIN) 100: 63 ADC Clock (3.15 µs times 2ALS_VIS_ADC_GAIN) 101: 127 ADC Clock (6.35 µs times 2ALS_VIS_ADC_GAIN) 110: 255 ADC Clock (12.75 µs times 2ALS_VIS_ADC_GAIN) 111: 511 ADC Clock (25.55 µs times 2ALS_VIS_ADC_GAIN) The recommended VIS_ADC_REC value is the one’s complement of ALS_VIS_ADC_GAIN. Always set to 0. Rev. 1.3 Si1145/46/47 ALS_VIS_ADC_GAIN @ 0x11 Bit 7 6 5 4 3 2 Name 1 0 ALS_VIS_ADC_GAIN[2:0] Type RW R/W RW Reset value = 0000 0000 Bit Name 7:3 Reserved 2:0 Function ALS_VIS_ADC_GAIN[2:0] Increases the ADC integration time for ALS Visible measurements by a factor of (2 ^ ALS_VIS_ADC_GAIN). This allows visible light measurement under dark glass. The maximum gain is 128 (0x7). For Example: 0x0: ADC Clock is divided by 1 0x4: ADC Clock is divided by 16 0x6: ADC Clock is divided by 64 ALS_VIS_ADC_MISC @ 0x12 Bit 7 6 5 Name VIS_RANGE Type RW 4 3 2 1 0 Reset value = 0000 0000 Bit Name 7:6 Reserved 5 4:0 Function VIS_RANGE When performing ALS-VIS measurements, the ADC can be programmed to operate in high sensitivity operation or high signal range. The high signal range is useful in operation under direct sunlight. 0: Normal Signal Range 1: High Signal Range (Gain divided by 14.5) Reserved Rev. 1.3 57 Si1145/46/47 LED_REC @ 0x1C Bit 7 6 5 4 3 Name LED_REC[7:0] Type RW Bit Name 7:0 2 1 0 2 1 0 Function LED_REC[7:0] Reserved. ALS_IR_ADC_COUNTER @ 0x1D Bit 7 6 5 4 Name IR_ADC_REC[2:0] Type RW 3 Reset value = 0111 0000 58 Bit Name 7 Reserved 6:4 IR_ADC_REC[2:0] 3:0 Reserved Function Recovery period the ADC takes before making a ALS-IR measurement. 000: 1 ADC Clock (50 ns times 2ALS_IR_ADC_GAIN) 001: 7 ADC Clock (350 ns times 2ALS_IR_ADC_GAIN) 010: 15 ADC Clock (750 ns times 2ALS_IR_ADC_GAIN) 011: 31 ADC Clock (1.55 µs times 2ALS_IR_ADC_GAIN) 100: 63 ADC Clock (3.15 µs times 2ALS_IR_ADC_GAIN) 101: 127 ADC Clock (6.35 µs times 2ALS_IR_ADC_GAIN) 110: 255 ADC Clock (12.75 µs times 2ALS_IR_ADC_GAIN) 111: 511 ADC Clock (25.55 µs times 2ALS_IR_ADC_GAIN) The recommended IR_ADC_REC value is the one’s complement of ALS_IR_ADC_GAIN. Always set to 0. Rev. 1.3 Si1145/46/47 ALS_IR_ADC_GAIN @ 0x1E Bit 7 6 5 4 3 2 Name 1 0 ALS_IR_ADC_GAIN[2:0] Type R/W R/W R/W Reset value = 0000 0000 Bit Name 7:3 Reserved 2:0 Function ALS_IR_ADC_GAIN[2:0] Increases the ADC integration time for IR Ambient measurements by a factor of (2 ^ ALS_IR_ADC_GAIN). The maximum gain is 128 (0x7). For Example: 0x0: ADC Clock is divided by 1 0x4: ADC Clock is divided by 16 0x6: ADC Clock is divided by 64 ALS_IR_ADC_MISC @ 0x1F Bit 7 6 5 Name IR_RANGE Type RW 4 3 2 1 0 Reset value = 0000 0000 Bit Name 7:6 Reserved 5 4:0 Function IR_RANGE When performing ALS-IR measurements, the ADC can be programmed to operate in high sensitivity operation or high signal range. The high signal range is useful in operation under direct sunlight. 0: Normal Signal Range 1: High Signal Range (Gain divided by 14.5) Reserved Write operations to this RAM parameter must preserve this bit-field value using read-modify-write. Rev. 1.3 59 Si1145/46/47 5. Pin Descriptions DNC SDA 1 SCL 2 VDD 3 INT 4 10 QFN-10 5 9 LED1 8 GND 7 LED3/CVDD 6 LED2/CVDD DNC Table 16. Pin Descriptions Pin Name Type Description 1 SDA 2 SCL Input 3 VDD Power 4 INT 5 DNC 6 LED2/CVDD1 Output LED2 Output/Connect to VDD.1 Programmable constant current sink normally connected to an infrared LED cathode. Connect directly to VDD when not in use. 7 LED3/CVDD2 Output LED3 Output/Connect to VDD.2 Programmable constant current sink normally connected to an infrared LED cathode. If VLED < (VDD + 0.5 V), a 47 k pull-up resistor from LED3 to VDD is needed for proper operation. Connect directly to VDD when not in use. 8 GND Power Ground. Reference voltage. 9 LED1 Output LED1 Output. Programmable constant current sink normally connected to an infrared LED cathode. 10 DNC Bidirectional I2C Data. I2C Clock. Power Supply. Voltage source. Bidirectional Interrupt Output. Open-drain interrupt output pin. Must be at logic level high during powerup sequence to enable low power operation. Do Not Connect. This pin is electrically connected to an internal Si1145/46/47 node. It should remain unconnected. Do Not Connect. This pin is electrically connected to an internal Si1145/46/47 node. It should remain unconnected. Notes: 1. Si1146 and Si1147 only. Connect to VDD in Si1145. 2. Si1147 only. Connect to VDD in Si1145 and Si1146. 60 Rev. 1.3 Si1145/46/47 6. Ordering Guide Part Number Package LED Drivers Si1145-A10-GMR QFN-10 1 Si1146-A10-GMR QFN-10 2 Si1147-A10-GMR QFN-10 3 Rev. 1.3 61 Si1145/46/47 7. Package Outline: 10-Pin QFN Figure 19 illustrates the package details for the Si1145/46/47 QFN package. Table 17 lists the values for the dimensions shown in the illustration. Top View Pin 1 Indication Figure 19. QFN Package Diagram Dimensions 62 Rev. 1.3 Si1145/46/47 Table 17. Package Diagram Dimensions Dimension Min Nom Max A 0.55 0.65 0.75 b 0.20 0.25 0.30 D 2.00 BSC. e 0.50 BSC. E 2.00 BSC. L 0.30 0.35 aaa 0.10 bbb 0.10 ccc 0.08 ddd 0.10 0.40 Notes: 1. All dimensions shown are in millimeters (mm). 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. Pin 1 0.115 die offset to package 0.66 0.12 0.65 0.16 Small IR photodiode and visible photodiode (stacked) 0.415 Large IR photodiode 0.14 Figure 20. Photodiode Centers Rev. 1.3 63 Si1145/46/47 8. Suggested PCB Land Pattern Figure 21 illustrates the PCB land pattern details for the Si1145/46/47. Table 18 lists the values for the dimensions shown in the illustration. Figure 21. PCB Land Pattern 64 Rev. 1.3 Si1145/46/47 Table 18. PCB Land Pattern Dimensions Dimension mm C1 1.90 C2 1.90 E 0.50 X 0.30 Y 0.80 Notes: General 1. All dimensions shown are in millimeters (mm). 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm minimum, all the way around the pad. Stencil Design 5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 6. The stencil thickness should be 0.125 mm (5 mils). 7. The ratio of stencil aperture to land pad size should be 1:1 for all pads. Card Assembly 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components. 65 Rev. 1.3 Si1145/46/47 DOCUMENT CHANGE LIST Revision 0.1 to Revision 1.0 Updated UV functional description in "2.4. Ultraviolet (UV) Index" on page 15. I2C slave address changed from 0x5A to 0x60 in "2.5. Host Interface" on page 17. Added calibration command in "4.2. Command Protocol" on page 22. Added order numbers in "6. Ordering Guide" on page 61. Revision 1.0 to Revision 1.1 Removed threshold settings. Revision 1.1 to Revision 1.2 Updated recommended UV coefficients. Updated photodiode spectral response. Revision 1.2 to Revision 1.3 Clarified how to enable UV reading. Clarified usage of Command Register and Parameter RAM. Clarified LED2 and LED3 connection when using Si1145 and Si1146. 66 Rev. 1.3 Smart. Connected. Energy-Friendly. Products Quality Support and Community www.silabs.com/products www.silabs.com/quality community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. 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