BCP160T

BCP160T
HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP (.25µm x 1600µm)
The BeRex BCP160T is a GaAs Power pHEMT with a nominal 0.25 micron gate length and 1600 micron gate width
making the product ideally suited for amplifier applications where high-gain and medium power from DC to 26
GHz. The product may be used in either wideband or narrow-band applications. The BCP160T is produced using
state of the art metallization with SI3N4 passivation and is screened to assure reliability.
PRODUCT FEATURES
•
•
•
•
33 dBm Typical Output Power
10.5 dB Typical Gain @ 12 GHz
60% PAE Typical @12 GHz
0.25 X 1600 µm Recessed Gate
APPLICATIONS
•
•
•
Commercial
Military / Hi-Rel.
Test & Measurement
DC CHARACTERISTICS Ta = 25° C
SYMBOL
PARAMETER/TEST CONDITIONS
Idss
Gm
Vp
BVgd
Saturated Drain Current (Vgs = 0V, Vds = 1.0V)
Transconductance (Vds = 3V, Vgs = 50% Idss)
Pinch-off Voltage (Ids = 1.6 mA, Vds = 2V)
Drain Breakdown Voltage (Igd = 1.6 mA, source open)
BVgs
Rth
Source Breakdown Voltage (Ig = 1.6 mA, drain open)
Thermal Resistance (Au-Sn Eutectic Attach)
MIN.
TYPICAL
MAX.
UNIT
320
480
640
-1.1
-15
640
mA
mS
V
V
-2.5
-0.5
-12
-13
33
V
° C/W
ELECTRICAL CHARACTERISTICS (TUNED FOR POWER) Ta = 25° C
SYMBOL
PARAMETER/TEST CONDITIONS
P1dB
Output Power @ P1dB (Vds = 8V, Ids = 50% Idss)
G1dB
Gain @ P1dB (Vds = 8V, Ids = 50% Idss)
PAE
PAE @ P1dB (Vds = 8V, Ids = 50% Idss)
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TEST
FREQ.
12 GHz
18 GHz
12 GHz
18 GHz
12 GHz
18 GHz
MIN.
TYPICAL
32.0
33.2
33.0
10.4
6.7
63
47
9.5
BeRex, Inc. 3350 Scot Blvd. #61-01 Santa Clara, CA 95054 tel. (408) 452-5595
Specifications are subject to change without notice. ©BeRex 2015
Rev. 1.7
MAX.
UNIT
dBm
dB
%
January 2015
BCP160T
ELECTRICAL CHARACTERISTICS (TUNED FOR GAIN) Ta = 25° C
SYMBOL
PARAMETER/TEST CONDITIONS
P1dB
Output Power @ P1dB (Vds = 8V, Ids = 50% Idss)
G1dB
Gain @ P1dB (Vds = 8V, Ids = 50% Idss)
PAE
PAE @ P1dB (Vds = 8V, Ids = 50% Idss)
TEST
FREQ.
12 GHz
18 GHz
12 GHz
18 GHz
12 GHz
18 GHz
MIN.
TYPICAL
29.5
30.7
30.1
10.8
6.4
41.0
26.5
10.0
MAX.
UNIT
dBm
dB
%
MAXIMUM RATINGS (Ta = 25° C)
SYMBOL
Vds
Vgs
Ids
Igsf
Pin
Tch
Tstg
Pt
PARAMETERS
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Forward Gate Current
Input Power
Channel Temperature
Storage Temperature
Total Power Dissipation
ABSOLUTE
12 V
-6 V
Idss
80 mA
30 dBm
175° C
-60° C - 150° C
6.0 W
CONTINUOUS
8V
-3 V
Idss
14 mA
@ 3 dB Compression
150° C
-60° C - 150° C
5.0 W
Exceeding any of the above Maximum Ratings will result in reduced MTTF and may cause permanent damage to the device.
PIN_POUT/Gain, PAE (12 GHz)
Frequency = 12GHz
Vds = 8 V, Ids = 50% Idss (Tuned for Power)
www.berex.com
Frequency = 12GHz
Vds = 8 V, Ids = 50% Idss (Tuned for Gain)
BeRex, Inc. 3350 Scot Blvd. #61-01 Santa Clara, CA 95054 tel. (408) 452-5595
Specifications are subject to change without notice. ©BeRex 2015
Rev. 1.7
January 2015
BCP160T
S-PARAMETERS (Vds = 8V, Ids = 50% Idss)
FREQ.
[GHZ]
S11
[MAG]
S11
[ANG.]
S21
[MAG]
S21
[ANG.]
S12
[MAG]
S12
[ANG.]
S22
[MAG]
S22
[ANG.]
1
0.87
-125.38
13.67
111.02
0.029
37.07
0.34
-144.18
2
0.85
-156.37
7.50
92.04
0.034
32.44
0.36
-161.51
3
0.86
-171.07
5.11
80.78
0.036
33.73
0.37
-168.21
4
0.86
-179.89
3.86
72.20
0.040
34.70
0.38
-172.01
5
0.87
173.17
3.08
64.03
0.043
38.64
0.40
-174.55
6
0.87
167.14
2.55
56.79
0.047
40.81
0.42
-177.15
7
0.88
162.28
2.14
50.07
0.048
40.71
0.44
-179.70
8
0.88
157.56
1.88
43.01
0.050
45.15
0.45
178.62
9
0.89
152.94
1.65
37.28
0.055
45.37
0.47
175.28
10
0.89
148.80
1.48
31.07
0.060
44.07
0.49
172.74
11
0.89
143.76
1.33
24.59
0.062
42.96
0.51
169.96
12
0.90
138.90
1.20
18.21
0.066
41.21
0.53
167.35
13
0.91
134.97
1.09
12.85
0.070
39.95
0.55
163.90
14
0.91
129.80
0.99
6.58
0.071
38.03
0.58
161.41
15
0.92
125.36
0.89
0.82
0.073
35.59
0.61
158.02
16
0.93
121.84
0.81
-4.31
0.075
32.10
0.64
154.68
17
0.93
117.69
0.72
-10.60
0.073
29.92
0.66
151.79
18
0.95
115.85
0.63
-14.17
0.076
28.56
0.68
149.05
19
0.94
113.69
0.57
-18.70
0.076
27.06
0.71
145.91
20
0.94
110.54
0.52
-22.86
0.077
24.13
0.73
143.57
21
0.95
109.76
0.46
-26.30
0.077
24.61
0.75
141.51
22
0.94
110.02
0.41
-28.17
0.079
22.75
0.76
139.28
23
0.94
108.99
0.36
-31.53
0.080
22.44
0.77
136.86
24
0.94
110.06
0.33
-33.06
0.082
19.77
0.79
135.47
25
0.95
110.74
0.30
-34.59
0.077
20.11
0.80
133.59
26
0.95
110.24
0.27
-33.68
0.079
23.85
0.81
133.29
Note: S-parameters include bond wires. Reference planes are at edge of substrates shown on “Wire Bonding Information” figure below.
www.berex.com
BeRex, Inc. 3350 Scot Blvd. #61-01 Santa Clara, CA 95054 tel. (408) 452-5595
Specifications are subject to change without notice. ©BeRex 2015
Rev. 1.7
January 2015
BCP160T
WIRE BONDING INFORMATION
Follow the wire bonding diagrams recommended by BeRex below to achieve optimum device performance. BeRex
recommends thermo-compression wedge bonding. As a general rule, bonding temperature should be kept to a
maximum of 280°C for no longer than 2 minutes for all bonding wires. Ultrasonic bonding is not recommended.
Using 1 mil. diameter, Au bonding wires.
1. Gate to input transmission line
- Length and Height : 600 µm x 250 µm
- Number of wire(s): 2
2. Drain to output transmission line
- Length and Height : 400 µm x 250 µm
- Number of wire(s) : 2
3. Source to ground plate
- Length and Height : 250 µm x 300 µm
- Number of wire(s) : 6
DIE ATTACH RECOMMENDATIONS:
BeRex recommends the “Eutectic” die attach using Au-Sn (80%-20%) pre-forms. The die attach station must have
accurate temperature control, and the operation should be performed with parts no hotter than 300°C for less
than 10 seconds. An inert forming gas (90% N2-10% H2) or clean, dry N2 should be used.
HANDLING PRECAUTIONS:
GaAs FETs are very sensitive to and may be damaged by Electrostatic Discharge (ESD). Therefore, proper ESD
precautions must be taken whenever you are handling these devices. It is critically important that all work
surfaces, and assembly equipment, as well as the operator be properly grounded when handling these devices to
prevent ESD damage.
STORAGE & SHIPPING:
BeRex’s standard chip device shipping package consists of an antistatic “Gel-Pak”, holding the chips, placed inside a
sealed antistatic and moisture barrier bag. This packaging is designed to provide a reasonable measure of
protection from both mechanical and ESD damage.
Chip devices should be stored in a clean, dry Nitrogen gas environment at room temperature until they are
required for assembly. Only open the shipping package or perform die assembly in a work area with a class 10,000
or better clean room environment to prevent contamination of the exposed devices.
www.berex.com
BeRex, Inc. 3350 Scot Blvd. #61-01 Santa Clara, CA 95054 tel. (408) 452-5595
Specifications are subject to change without notice. ©BeRex 2015
Rev. 1.7
January 2015
BCP160T
CAUTION:
THIS PRODUCT CONTAINS GALLIUM ARSENIDE (GaAs) WHICH CAN BE HAZARDOUS TO THE HUMAN BODY AND THE
ENVIRONMENT. THEREFORE, IT MUST BE HANDLED WITH CARE AND IN ACCORDANCE WITH ALL GOVERNMENTAL
AND COMPANY REGULATIONS FOR THE SAFE HANDLING AND DISPOSAL OF HAZARDOUS WASTE. DO NOT BURN,
DESTROY, CUT, CRUSH OR CHEMICALLY DISSOLVE THE PRODUCT. DO NOT LICK THE PRODUCT OR IN ANY WAY
ALLOW IT TO ENTER THE MOUTH. EXCLUDE THE PRODUCT FROM GENERAL INDUSTRIAL WASTE OR GARBAGE AND
DISPOSE OF ONLY IN ACCORDANCE TO APPLICABLE LAWS AND/OR ORDINANCES.
DISCLAIMER
BEREX RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE RELIABILITY, FUNCTION OR DESIGN. BEREX DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN.
LIFE SUPPORT POLICY
BEREX PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES WITHOUT
THE EXPRESS WRITTEN APPROVAL OF BEREX.
1. Life support devices or systems are devices or systems which (a) are intended for surgical implant into the
body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with
instructions for use provided in labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
RoHS COMPLIANT
For complete specifications, S-parameters and information on bonding and handling, visited our
website; www.berex.com
www.berex.com
BeRex, Inc. 3350 Scot Blvd. #61-01 Santa Clara, CA 95054 tel. (408) 452-5595
Specifications are subject to change without notice. ©BeRex 2015
Rev. 1.7
January 2015
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