BD19B

BD19B
Dual Band 2-Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD-SCDMA
Device Features




Typical Isolation = 23 dB
Typical Insertion Loss = 0.4 dB
MSL 3 moisture rating
Lead-free/RoHS-compliant SOIC-8 Plastic Package
With exposed back side ground pad
Product Description
Typical Performance1
BeRex’s Divider BD19B is designed for PCS,
WCDMA & TD-SCDMA band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHS-compliant with
SOIC-8 surface mount package.
It can be used without back side ground soldering. (This may degrade the performance
at the high frequency edge.)
Parameter
Min
Frequency Range
Insertion Loss
Typical
1700
0.4
Isolation
15
Max
Unit
2300
0.8
MHz
dB
23
dB
IRL(S11)
-20
-15
dBm
ORL(S22/S33)
Amplitude Balance
Phase Balance
-23
0.05
0.5
-15
0.2
1.0
dBm
dB
deg
*All specifications apply to the following test conditions,
1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system.
2. Insertion Loss: Above 3.0dB.
3. Back side ground _ soldered.
Applications
Absolute Maximum Ratings
 Base station Infrastructure
 Commercial/Industrial/Military wireless system
Parameter
Input Power
Storage Temperature
Operating Temperature
Rating
1W CW dBm
-55 to +155°C
-40 to +85°C
Operation of this device above any of these parameters may result in permanent damage.
Evaluation Board Drawing
Function Block Diagram
Pins 1,3,4,6 and 7 must be DC and RF grounded.
BeRex
●website: www.berex.com
●email: [email protected]
1
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
Rev. D
BD19B
Dual Band 2-Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD-SCDMA
Typical Test Data
With Back Side Ground Soldering
Parameters
Unit
PCS, WCDMA & TD-SCDMA
Frequency Range
MHz
1700
1800
1900
1900
2075
2250
Insertion Loss
dB
0.35
0.37
0.38
0.38
0.47
0.64
Isolation
dB
20.4
22.1
24.4
24.4
30.1
20.6
IRL(S11)
dB
-22.3
-24.4
-24.1
-24.1
-19.3
-15.1
ORL(S22,S33)
dB
-27.1
-36.4
-34.1
-34.1
-27.4
-26.4
Phase Diff.
deg
0.2
0.2
0.3
0.3
0.5
0.8
Amplitude Balance
dB
0.03
0.04
0.04
0.04
0.06
0.07
Without Back Side Ground Soldering
BeRex
Parameters
Unit
PCS, WCDMA & TD-SCDMA
Frequency Range
MHz
1700
1800
1900
1900
2075
2250
Insertion Loss
dB
0.38
0.40
0.43
0.43
0.54
0.75
Isolation
dB
20.0
21.9
24.1
24.1
25.4
18.1
IRL(S11)
dB
-22.0
-22.3
-20.3
-20.3
-16.0
-12.4
ORL(S22,S33)
dB
-26.4
-32.9
-29.5
-29.5
-23.8
-22.1
Phase Diff.
deg
1.0
1.0
1.0
1.0
0.9
0.8
Amplitude Balance
dB
0.06
0.06
0.06
0.06
0.05
0.04
●website: www.berex.com
●email: [email protected]
2
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
Rev. D
BD19B
Dual Band 2-Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD-SCDMA
Insertion Loss vs. Frequency
Isolation vs. Frequency
IRL vs. Frequency
ORL vs. Frequency
Notes)
- BG: Data taken with backside ground soldering
- NBG: Data taken without backside ground soldering
BeRex
●website: www.berex.com
●email: [email protected]
3
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
Rev. D
BD19B
Dual Band 2-Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD-SCDMA
Package Outline Drawing
BeRex
●website: www.berex.com
●email: [email protected]
4
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
Rev. D
BD19B
Dual Band 2-Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD-SCDMA
Suggested PCB Land Pattern and PAD Layout
PCB Land Pattern
RF In
0.047"(1.20)
PCB Mounting
0.018"(0.45)
0.076"(1.92)
0.157"(3.98)
0.040"(1.01)
RF Out1
RF Out2
0.030"(0.76)
0.198"(5.02)
Note : All dimension _ millimeters
PCB lay out _ on BeRex website
Package Marking
Tape & Reel
Packaging information:
SOIC8
SOIC8-Part orientation
Tape Width (mm): 12
YY = Year, WW = Working Week,
XX = Wafer No.
Reel Size (inches): 7
Device Cavity Pitch (mm): 8
Direction of feed
Devices Per Reel: 1000
Lead plating finish
100% Tin Matte finish
(All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin
whisker growth concerns.)
MSL / ESD Rating
MSL Rating:
Level 3 at +265°C convection reflow
Standard:
JEDEC Standard J-STD-020
NATO CAGE code:
2
BeRex
N
9
6
F
●website: www.berex.com
●email: [email protected]
5
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
All other trademarks are the property of their respective owners. © 2010 BeRex
Rev. D
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