BEREX BD19B

BeRex
BD19B
Dual Band 2-Way SMT Power Divider
1700~2300MHz PCS, WCDMA & TD-SCDMA
Device Features and Description
 23dB Typical Isolation
 0.4dB Typical Insertion Loss
 Small Size and Low Profile
 MSL 1 moisture rating
 Lead-free/Green/RoHS compliant package
 Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
 Chip is fully passivated for enhanced performance and reliability
 Can be used without back side ground soldering
(This may degrade the performance at the high frequency edge. Refer to the following
typical test data)
Electrical specifications
Parameters
Unit
Min
Typ
Max
Frequency Range
MHz
1700
Insertion Loss
dB
Isolation
dB
IRL(S11)
dB
-20
-15
ORL(S22,S33)
dB
-25
-15
Amplitude Balance
dB
1.0
2.0
2300
0.4
15
0.8
23
All specifications apply with the following test conditions,
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. Insertion Loss: Above 3.0dB
3. Back side ground was soldered
Absolute Maximum Ratings
Parameters
Input Power
Storage Temperature
Operating Temperature
Rating
1W CW
-55 to +155C
-40C to +85C
Operation of this device above any of these parameters may result in permanent damage.
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BeRex
BD19B
Evaluation Board Drawing
Function Block Diagram
Pins 1,3,4,6 and 7 must be DC and RF grounded.
Typical Test Data
With Back Side Ground Soldering
Parameters
Unit
PCS, WCDMA & TD-SCDMA
Frequency Range
MHz
1700
1800
1900
1900
2075
2250
Insertion Loss
dB
0.35
0.37
0.38
0.38
0.47
0.64
Isolation
dB
20.4
22.1
24.4
24.4
30.1
20.6
IRL(S11)
dB
-22.3
-24.4
-24.1
-24.1
-19.3
-15.1
ORL(S22,S33)
dB
-27.1
-36.4
-34.1
-34.1
-27.4
-26.4
Phase Diff.
deg
0.2
0.2
0.3
0.3
0.5
0.8
Amplitude Balance
dB
0.03
0.04
0.04
0.04
0.06
0.07
Without Back Side Ground Soldering
Parameters
Unit
PCS, WCDMA & TD-SCDMA
Frequency Range
MHz
1700
1800
1900
1900
2075
2250
Insertion Loss
dB
0.38
0.40
0.43
0.43
0.54
0.75
Isolation
dB
20.0
21.9
24.1
24.1
25.4
18.1
IRL(S11)
dB
-22.0
-22.3
-20.3
-20.3
-16.0
-12.4
ORL(S22,S33)
dB
-26.4
-32.9
-29.5
-29.5
-23.8
-22.1
Phase Diff.
deg
1.0
1.0
1.0
1.0
0.9
0.8
Amplitude Balance
dB
0.06
0.06
0.06
0.06
0.05
0.04
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BD19B
Insertion Loss vs. Frequency
Isolation vs. Frequency
BG
BG
NBG
0
0
-1
-5
-2
-10
Isolation [dB]
Insertion Loss [dB]
BeRex
-3
-4
-5
-15
-20
-25
-6
1700
1900
2100
-30
1700
2300
Freq [MHz]
BG
NBG
BG
-5.00
-5.00
-10.00
-10.00
ORL [dB]
0.00
-15.00
2300
-20.00
-25.00
-25.00
2100
2300
NBG
-15.00
-20.00
1900
2100
ORL vs. Frequency
0.00
-30.00
1700
1900
Freq [MHz]
IRL vs. Frequency
IRL [dB]
NBG
-30.00
1700
Freq [MHz]
1900
2100
2300
Freq [MHz]
Notes)
- BG: Data taken with backside ground soldering
- NBG: Data taken without backside ground soldering
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BeRex
BD19B
Package Drawing
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BeRex
BD19B
Suggested PCB Land Pattern and PAD Layout
PCB Land Pattern
PCB Mounting
RF In
0.047"(1.20)
0.018"(0.45)
0.076"(1.92)
0.157"(3.98)
0.040"(1.01)
RF Out1
RF Out2
0.030"(0.76)
0.198"(5.02)
Visit http://www.berex.com for PCB layout
Tape & Reel
Packaging information:
SOIC8
SOIC8-Part orientation
Tape Width (mm): 12
Reel Size (inches): 7
Device Cavity Pitch (mm): 8
Devices Per Reel: 1000
Direction of feed
Lead plating finish
100% Tin Matte finish.
(All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin
whisker growth concerns)
MSL / ESD Rating
MSL Rating:
Standard:
Level 3 at +265C convection reflow
JEDEC Standard J-STD-020
NATO CAGE code:
2
N
9
6
F
NOTICE
BeRex Corporation reserves the right to make changes of product specification or to
discontinue product at any time without notice.
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