Si8450/Si8451/Si8452/Si8455 Low-Power Five-Channel Digital Isolator

Si8450/51/52/55
L O W P O W E R F I V E - C H A N N E L D I G I TA L I S O L A T O R
Features

High-speed operation
DC

to 150 Mbps
Up to 2500 VRMS isolation
 60-year life at rated working
No start-up initialization required
voltage
 Wide Operating Supply Voltage:  Precise timing (typical)
2.70–5.5 V
<10 ns worst case
 Ultra-low-power (typical)
1.5 ns pulse width distortion
5 V Operation:
0.5 ns channel-channel skew
<
<
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d

2
1.6 mA per channel at 1 Mbps
6 mA per channel at 100 Mbps
2.70 V Operation:
6

ns propagation delay skew
ns minimum pulse width
Transient Immunity 25 kV/µs
1.4 mA per channel at 1 Mbps  Wide temperature range
< 4 mA per channel at 100 Mbps
–40 to 125 °C at 150 Mbps
<

High electromagnetic immunity

Ordering Information:
See page 29.
RoHS-compliant packages
SOIC-16
narrow body
Applications
Industrial automation systems
Hybrid electric vehicles
 Isolated switch mode supplies


Isolated ADC, DAC
Motor control
 Power inverters
 Communications systems


Safety Regulatory Approvals

UL 1577 recognized
Up

to 2500 VRMS for 1 minute
CSA component notice 5A
approval
IEC

VDE certification conformity
IEC
60747-5-2
(VDE0884 Part 2)
60950-1, 61010-1
(reinforced insulation)
Description
Silicon Lab's family of ultra-low-power digital isolators are CMOS
devices offering substantial data rate, propagation delay, power, size,
reliability, and external BOM advantages when compared to legacy
isolation technologies. The operating parameters of these products
remain stable across wide temperature ranges throughout their
service life. For ease of design, only VDD bypass capacitors are
required.
Data rates up to 150 Mbps are supported, and all devices achieve
worst-case propagation delays of less than 10 ns. All products are
safety certified by UL, CSA, and VDE and support withstand voltages
of up to 2.5 kVrms. These devices are available in a 16-pin narrowbody SOIC package.
Rev. 1.5 9/13
Copyright © 2013 by Silicon Laboratories
Si8450/51/52/55
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8450/51/52/55
2
Rev. 1.5
Si8450/51/52/55
TABLE O F C ONTENTS
Section
Page
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.1. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.2. Eye Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.4. Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.5. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3. Errata and Design Migration Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.1. Enable Pin Causes Outputs to Go Low (Revision A Only) . . . . . . . . . . . . . . . . . . . . 26
3.2. Power Supply Bypass Capacitors (Revision A and Revision B) . . . . . . . . . . . . . . . . 26
3.3. Latch Up Immunity (Revision A Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4. Pin Descriptions (Si8450/51/52) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5. Pin Descriptions (Si8455) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7. Package Outline: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9. Top Marking: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.1. 16-Pin Narrow Body SOIC Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Rev. 1.5
3
Si8450/51/52/55
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
TA
150 Mbps, 15 pF, 5 V
–40
25
125
°C
VDD1
2.70
—
5.5
V
VDD2
2.70
—
5.5
V
Ambient Operating Temperature*
Supply Voltage
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
*Note: The maximum ambient temperature is dependent on data frequency, output loading, number of operating channels,
and supply voltage.
Table 2. Absolute Maximum Ratings1
Parameter
Storage Temperature
Symbol
Min
Typ
Max
Unit
TSTG
–65
—
150
°C
2
Ambient Temperature Under Bias
TA
–40
—
125
°C
3
VDD1, VDD2
–0.5
—
5.75
V
Supply Voltage (Revision B)3
VDD1, VDD2
–0.5
—
6.0
V
Input Voltage
VI
–0.5
—
VDD + 0.5
V
Output Voltage
VO
–0.5
—
VDD + 0.5
V
Output Current Drive Channel
IO
—
—
10
mA
Lead Solder Temperature (10 s)
—
—
260
°C
Maximum Isolation Voltage (1 s)
—
—
3600
VRMS
Supply Voltage (Revision A)
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to conditions as specified in the operational sections of this data sheet.
2. VDE certifies storage temperature from –40 to 150 °C.
3. See "6. Ordering Guide" on page 29 for more information.
4
Rev. 1.5
Si8450/51/52/55
Table 3. Electrical Characteristics
(VDD1 =5 V±10%, VDD2 =5 V±10%, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
High Level Input Voltage
VIH
2.0
—
—
V
Low Level Input Voltage
VIL
—
—
0.8
V
High Level Output Voltage
VOH
loh = –4 mA
VDD1,VDD2 – 0.4
4.8
—
V
Low Level Output Voltage
VOL
lol = 4 mA
—
0.2
0.4
V
IL
—
—
±10
µA
ZO
—
85
—

Input Leakage Current
1
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Output Impedance
Enable Input High Current
IENH
VENx = VIH
—
2.0
—
µA
Enable Input Low Current
IENL
VENx = VIL
—
2.0
—
µA
DC Supply Current (All inputs 0 V or at Supply)
Si8450Ax, Bx, Si8455Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 DC
All inputs 0 DC
All inputs 1 DC
All inputs 1 DC
—
—
—
—
1.6
2.9
7.0
3.1
2.4
4.4
10.5
4.7
Si8451Ax, Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 DC
All inputs 0 DC
All inputs 1 DC
All inputs 1 DC
—
—
—
—
2.0
3.0
6.0
4.1
3.0
4.5
9.0
6.2
Si8452Ax, Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 DC
All inputs 0 DC
All inputs 1 DC
All inputs 1 DC
—
—
—
—
2.3
2.7
5.4
4.7
3.5
4.1
8.1
7.1
mA
mA
mA
1 Mbps Supply Current (All inputs = 500 kHz square wave, CI = 15 pF on all outputs)
Si8450Ax, Bx, Si8455Bx
VDD1
VDD2
—
—
4.3
3.5
6.5
5.3
mA
Si8451Ax, Bx
VDD1
VDD2
—
—
4.1
4.0
6.2
6.0
mA
Si8452Ax, Bx
VDD1
VDD2
—
—
4.1
4.0
6.2
6.0
mA
Notes:
1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of
the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at
the same supply voltages, load, and ambient temperature.
3. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
4. Start-up time is the time period from the application of power to valid data at the output.
Rev. 1.5
5
Si8450/51/52/55
Table 3. Electrical Characteristics (Continued)
(VDD1 =5 V±10%, VDD2 =5 V±10%, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
10 Mbps Supply Current (All inputs = 5 MHz square wave, CI = 15 pF on all outputs)
—
—
4.3
4.8
6.5
6.7
mA
Si8451Bx
VDD1
VDD2
—
—
4.4
5.0
6.2
7.0
mA
Si8452Bx
VDD1
VDD2
—
—
6.4
6.7
mA
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8450Bx, Si8455Bx
VDD1
VDD2
4.6
4.8
100 Mbps Supply Current (All inputs = 50 MHz square wave, CI = 15 pF on all outputs)
Si8450Bx, Si8455Bx
VDD1
VDD2
—
—
4.6
24
6.9
30
mA
Si8451Bx
VDD1
VDD2
—
—
8.6
20.4
10.8
25.5
mA
Si8452Bx
VDD1
VDD2
—
—
12.6
16.5
15.8
20.6
mA
Maximum Data Rate
0
—
1.0
Mbps
Minimum Pulse Width
—
—
250
ns
Timing Characteristics
Si845xAx
Propagation Delay
Pulse Width Distortion
|tPLH - tPHL|
Propagation Delay Skew2
Channel-Channel Skew
tPHL, tPLH
See Figure 2
—
—
35
ns
PWD
See Figure 2
—
—
25
ns
tPSK(P-P)
—
—
40
ns
tPSK
—
—
35
ns
Notes:
1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of
the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at
the same supply voltages, load, and ambient temperature.
3. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
4. Start-up time is the time period from the application of power to valid data at the output.
6
Rev. 1.5
Si8450/51/52/55
Table 3. Electrical Characteristics (Continued)
(VDD1 =5 V±10%, VDD2 =5 V±10%, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Maximum Data Rate
0
—
150
Mbps
Minimum Pulse Width
—
—
6.0
ns
Si845xBx
Propagation Delay
See Figure 2
3.0
6.0
9.5
ns
PWD
See Figure 2
—
1.5
2.5
ns
tPSK(P-P)
—
2.0
3.0
ns
tPSK
—
0.5
1.8
ns
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Pulse Width Distortion
|tPLH - tPHL|
Propagation Delay Skew2
tPHL, tPLH
Channel-Channel Skew
All Models
Output Rise Time
tr
CL = 15 pF
See Figure 2
—
3.8
5.0
ns
Output Fall Time
tf
CL = 15 pF
See Figure 2
—
2.8
3.7
ns
CMTI
VI = VDD or 0 V
—
25
—
kV/µs
ten1
See Figure 1
—
5.0
8.0
ns
ten2
See Figure 1
—
7.0
9.2
ns
—
15
40
µs
Common Mode Transient
Immunity
Enable to Data Valid3
3
Enable to Data Tri-State
3,4
Start-up Time
tSU
Notes:
1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of
the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at
the same supply voltages, load, and ambient temperature.
3. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
4. Start-up time is the time period from the application of power to valid data at the output.
Rev. 1.5
7
Si8450/51/52/55
ENABLE
OUTPUTS
ten1
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
ten2
Figure 1. ENABLE Timing Diagram
1.4 V
Typical
Input
tPLH
1.4 V
Typical
Output
tPHL
90%
90%
10%
10%
tr
tf
Figure 2. Propagation Delay Timing
8
Rev. 1.5
Si8450/51/52/55
Table 4. Electrical Characteristics
(VDD1 = 3.3 V±10%, VDD2 = 3.3 V±10%, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
High Level Input Voltage
VIH
2.0
—
—
V
Low Level Input Voltage
VIL
—
—
0.8
V
High Level Output Voltage
VOH
loh = –4 mA
VDD1,VDD2 – 0.4
3.1
—
V
Low Level Output Voltage
VOL
lol = 4 mA
—
0.2
0.4
V
IL
—
—
±10
µA
ZO
—
85
—

Input Leakage Current
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Output Impedance
1
Enable Input High Current
IENH
VENx = VIH
—
2.0
—
µA
Enable Input Low Current
IENL
VENx = VIL
—
2.0
—
µA
DC Supply Current (All inputs 0 V or at supply)
Si8450Ax, Bx, Si8455Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 dc
All inputs 0 dc
All inputs 1 dc
All inputs 1 dc
—
—
—
—
1.6
2.9
7.0
3.1
2.4
4.4
10.5
4.7
Si8451Ax, Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 dc
All inputs 0 dc
All inputs 1 dc
All inputs 1 dc
—
—
—
—
2.0
3.0
6.0
4.1
3.0
4.5
9.0
6.2
Si8452Ax, Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 DC
All inputs 0 DC
All inputs 1 DC
All inputs 1 DC
—
—
—
—
2.3
2.7
5.4
4.7
3.5
4.1
8.1
7.1
mA
mA
mA
1 Mbps Supply Current (All inputs = 500 kHz square wave, CI = 15 pF on all outputs)
Si8450Ax, Bx, Si8455Bx
VDD1
VDD2
—
—
4.3
3.5
6.5
5.3
mA
Si8451Ax, Bx
VDD1
VDD2
—
—
4.1
4.0
6.2
6.0
mA
Si8452Ax, Bx
VDD1
VDD2
—
—
4.1
4.0
6.2
6.0
mA
Notes:
1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the
value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at
the same supply voltages, load, and ambient temperature.
3. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
4. Start-up time is the time period from the application of power to valid data at the output.
Rev. 1.5
9
Si8450/51/52/55
Table 4. Electrical Characteristics (Continued)
(VDD1 = 3.3 V±10%, VDD2 = 3.3 V±10%, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
10 Mbps Supply Current (All inputs = 5 MHz square wave, CI = 15 pF on all outputs)
—
—
4.3
4.8
6.5
6.7
mA
Si8451Bx
VDD1
VDD2
—
—
4.4
5.0
6.2
7.0
mA
Si8452Bx
VDD1
VDD2
—
—
6.4
6.7
mA
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8450Bx, Si8455Bx
VDD1
VDD2
4.6
4.8
100 Mbps Supply Current (All inputs = 50 MHz square wave, CI = 15 pF on all outputs)
Si8450Bx, Si8455Bx
VDD1
VDD2
—
—
4.4
16.8
6.6
21
mA
Si8451Bx
VDD1
VDD2
—
—
6.9
14.5
8.6
18.1
mA
Si8452Bx
VDD1
VDD2
—
—
9.5
12
11.9
15
mA
Maximum Data Rate
0
—
1.0
Mbps
Minimum Pulse Width
—
—
250
ns
Timing Characteristics
Si845xAx
Propagation Delay
Pulse Width Distortion
|tPLH - tPHL|
Propagation Delay Skew2
Channel-Channel Skew
tPHL,tPLH
See Figure 2
—
—
35
ns
PWD
See Figure 2
—
—
25
ns
tPSK(P-P)
—
—
40
ns
tPSK
—
—
35
ns
Notes:
1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the
value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at
the same supply voltages, load, and ambient temperature.
3. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
4. Start-up time is the time period from the application of power to valid data at the output.
10
Rev. 1.5
Si8450/51/52/55
Table 4. Electrical Characteristics (Continued)
(VDD1 = 3.3 V±10%, VDD2 = 3.3 V±10%, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Maximum Data Rate
0
—
150
Mbps
Minimum Pulse Width
—
—
6.0
ns
Si845xBx
Propagation Delay
See Figure 2
3.0
6.0
9.5
ns
PWD
See Figure 2
—
1.5
2.5
ns
tPSK(P-P)
—
2.0
3.0
ns
tPSK
—
0.5
1.8
ns
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Pulse Width Distortion
|tPLH - tPHL|
Propagation Delay Skew2
tPHL, tPLH
Channel-Channel Skew
All Models
Output Rise Time
tr
CL = 15 pF
See Figure 2
—
4.3
6.1
ns
Output Fall Time
tf
CL = 15 pF
See Figure 2
—
3.0
4.3
ns
CMTI
VI = VDD or 0 V
—
25
—
kV/µs
ten1
See Figure 1
—
5.0
8.0
ns
ten2
See Figure 1
—
7.0
9.2
ns
—
15
40
µs
Common Mode Transient
Immunity
Enable to Data Valid3
Enable to Data Tri-State
Start-up Time
3,4
3
tSU
Notes:
1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the
value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at
the same supply voltages, load, and ambient temperature.
3. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
4. Start-up time is the time period from the application of power to valid data at the output.
Rev. 1.5
11
Si8450/51/52/55
Table 5. Electrical Characteristics1
(VDD1 = 2.70 V, VDD2 = 2.70 V, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
High Level Input Voltage
VIH
2.0
—
—
V
Low Level Input Voltage
VIL
—
—
0.8
V
High Level Output Voltage
VOH
lOH = –4 mA
VDD1,VDD2 – 0.4
2.3
—
V
Low Level Output Voltage
VOL
IOL = 4 mA
—
0.2
0.4
V
IL
—
—
±10
µA
ZO
—
85
—

Input Leakage Current
Output Impedance
2
IENH
VENx = VIH
—
2.0
—
µA
Enable Input Low Current
IENL
VENx = VIL
—
2.0
—
µA
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Enable Input High Current
DC Supply Current (All inputs 0 V or at supply)
Si8450Ax, Bx, Si8455Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 DC
All inputs 0 DC
All inputs 1 DC
All inputs 1 DC
—
—
—
—
1.6
2.9
7.0
3.1
2.4
4.4
10.5
4.7
Si8451Ax, Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 DC
All inputs 0 DC
All inputs 1 DC
All inputs 1 DC
—
—
—
—
2.0
3.0
6.0
4.1
3.0
4.5
9.0
6.2
Si8452Ax, Bx
VDD1
VDD2
VDD1
VDD2
All inputs 0 DC
All inputs 0 DC
All inputs 1 DC
All inputs 1 DC
—
—
—
—
2.3
2.7
5.4
4.7
3.5
4.1
8.1
7.1
mA
mA
mA
1 Mbps Supply Current (All inputs = 500 kHz square wave, CI = 15 pF on all outputs)
Si8450Ax, Bx, Si8455Bx
VDD1
VDD2
—
—
4.3
3.5
6.5
5.3
mA
Si8451Ax, Bx
VDD1
VDD2
—
—
4.1
4.0
6.2
6.0
mA
Si8452Ax, Bx
VDD1
VDD2
—
—
4.1
4.0
6.2
6.0
mA
Notes:
1. Specifications in this table are also valid at VDD1 = 2.6 V and VDD2 = 2.6 V when the operating temperature range is
constrained to TA = 0 to 85 °C.
2. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the
value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
3. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at the
same supply voltages, load, and ambient temperature.
4. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
5. Start-up time is the time period from the application of power to valid data at the output.
12
Rev. 1.5
Si8450/51/52/55
Table 5. Electrical Characteristics1 (Continued)
(VDD1 = 2.70 V, VDD2 = 2.70 V, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
10 Mbps Supply Current (All inputs = 5 MHz square wave, CI = 15 pF on all outputs)
—
—
4.3
4.8
6.5
6.7
mA
Si8451Bx
VDD1
VDD2
—
—
4.4
5.0
6.2
7.0
mA
Si8452Bx
VDD1
VDD2
—
—
6.4
6.7
mA
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8450Bx, Si8455Bx
VDD1
VDD2
4.6
4.8
100 Mbps Supply Current (All inputs = 50 MHz square wave, CI = 15 pF on all outputs)
Si8450Bx, Si8455Bx
VDD1
VDD2
—
—
4.3
13.3
6.5
16.6
mA
Si8451Bx
VDD1
VDD2
—
—
6.2
11.7
7.8
14.6
mA
Si8452Bx
VDD1
VDD2
—
—
8.0
9.9
10
12.4
mA
Maximum Data Rate
0
—
1.0
Mbps
Minimum Pulse Width
—
—
250
ns
Timing Characteristics
Si845xAx
Propagation Delay
Pulse Width Distortion
|tPLH - tPHL|
Propagation Delay Skew3
Channel-Channel Skew
tPHL,tPLH
See Figure 2
—
—
35
ns
PWD
See Figure 2
—
—
25
ns
tPSK(P-P)
—
—
40
ns
tPSK
—
—
35
ns
Notes:
1. Specifications in this table are also valid at VDD1 = 2.6 V and VDD2 = 2.6 V when the operating temperature range is
constrained to TA = 0 to 85 °C.
2. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the
value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
3. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at the
same supply voltages, load, and ambient temperature.
4. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
5. Start-up time is the time period from the application of power to valid data at the output.
Rev. 1.5
13
Si8450/51/52/55
Table 5. Electrical Characteristics1 (Continued)
(VDD1 = 2.70 V, VDD2 = 2.70 V, TA = –40 to 125 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Maximum Data Rate
0
—
150
Mbps
Minimum Pulse Width
—
—
6.0
ns
Si845xBx
Propagation Delay
See Figure 2
3.0
6.0
9.5
ns
PWD
See Figure 2
—
1.5
2.5
ns
tPSK(P-P)
—
2.0
3.0
ns
tPSK
—
0.5
1.8
ns
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Pulse Width Distortion
|tPLH - tPHL|
Propagation Delay Skew3
tPHL, tPLH
Channel-Channel Skew
All Models
Output Rise Time
tr
CL = 15 pF
See Figure 2
—
4.8
6.5
ns
Output Fall Time
tf
CL = 15 pF
See Figure 2
—
3.2
4.6
ns
CMTI
VI = VDD or 0 V
—
25
—
kV/µs
ten1
See Figure 1
—
5.0
8.0
ns
ten2
See Figure 1
—
7.0
9.2
ns
—
15
40
µs
Common Mode Transient
Immunity
Enable to Data Valid4
Enable to Data Tri-State
Start-up
Time4,5
4
tSU
Notes:
1. Specifications in this table are also valid at VDD1 = 2.6 V and VDD2 = 2.6 V when the operating temperature range is
constrained to TA = 0 to 85 °C.
2. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the
value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads
where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces.
3. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at the
same supply voltages, load, and ambient temperature.
4. See "3. Errata and Design Migration Guidelines" on page 26 for more details.
5. Start-up time is the time period from the application of power to valid data at the output.
14
Rev. 1.5
Si8450/51/52/55
Table 6. Regulatory Information*
CSA
The Si84xx is certified under CSA Component Acceptance Notice 5A. For more details, see File 232873.
61010-1: Up to 300 VRMS reinforced insulation working voltage; up to 600 VRMS basic insulation working voltage.
60950-1: Up to 130 VRMS reinforced insulation working voltage; up to 600 VRMS basic insulation working voltage.
VDE
The Si84xx is certified according to IEC 60747-5-2. For more details, see File 5006301-4880-0001.
UL
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
60747-5-2: Up to 560 Vpeak for basic insulation working voltage.
The Si84xx is certified under UL1577 component recognition program. For more details, see File E257455.
Rated up to 2500 VRMS isolation voltage for basic insulation.
*Note: Regulatory Certifications apply to 2.5 kVRMS rated devices which are production tested to 3.0 kVRMS for 1 sec.
For more information, see "6. Ordering Guide" on page 29.
Table 7. Insulation and Safety-Related Specifications
Parameter
Symbol
Test Condition
Value
NB SOIC-16
Unit
Nominal Air Gap (Clearance)1
L(IO1)
4.9
mm
Nominal External Tracking (Creepage)1
L(IO2)
4.01
mm
0.008
mm
600
VRMS
0.019
mm
Minimum Internal Gap (Internal Clearance)
Tracking Resistance
(Proof Tracking Index)
PTI
ED
Erosion Depth
2
Resistance (Input-Output)
RIO
Capacitance (Input-Output)2
CIO
Input Capacitance
IEC60112
3
CI
10
f = 1 MHz
12

2.0
pF
4.0
pF
Notes:
1. The values in this table correspond to the nominal creepage and clearance values as detailed in "7. Package Outline:
16-Pin Narrow Body SOIC" on page 31. VDE certifies the clearance and creepage limits as 4.7 mm minimum for the
NB SOIC-16 package. UL does not impose a clearance and creepage minimum for component level certifications. CSA
certifies the clearance and creepage limits as 3.9 mm minimum for the NB SOIC-16 package.
2. To determine resistance and capacitance, the Si84xx is converted into a 2-terminal device. Pins 1–8 are shorted
together to form the first terminal and pins 9–16 are shorted together to form the second terminal. The parameters are
then measured between these two terminals.
3. Measured from input pin to ground.
Rev. 1.5
15
Si8450/51/52/55
Table 8. IEC 60664-1 (VDE 0844 Part 2) Ratings
Parameter
Test Condition
Basic Isolation Group
Specification
Material Group
Rated Mains Voltages < 150 VRMS
I-IV
Rated Mains Voltages < 300 VRMS
I-III
Rated Mains Voltages < 400 VRMS
I-II
Rated Mains Voltages < 600 VRMS
I-II
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Installation Classification
I
Table 9. IEC 60747-5-2 Insulation Characteristics for Si84xxxB*
Parameter
Symbol
Test Condition
VIORM
Maximum Working Insulation Voltage
Input to Output Test Voltage
Transient Overvoltage
Unit
560
V peak
V peak
VPR
Method b1
(VIORM x 1.875 = VPR, 100%
Production Test, tm =1 sec,
Partial Discharge < 5 pC)
1050
VIOTM
t = 60 sec
4000
Pollution Degree (DIN VDE 0110, Table 1)
Insulation Resistance at TS, VIO = 500 V
Characteristic
V peak
2
>109
RS

*Note: Maintenance of the safety data is ensured by protective circuits. The Si84xx provides a climate classification of
40/125/21.
Table 10. IEC Safety Limiting Values1
Parameter
Symbol
Case Temperature
TS
Safety input, output, or
supply current
IS
Device Power Dissipation2
PD
Test Condition
JA = 105 °C/W (NB SOIC-16),
VI =5.5 V, TJ =150 °C, TA = 25 °C
Max
Unit
Min
Typ
—
—
150
°C
—
—
215
mA
—
—
415
mW
NB SOIC-16
Notes:
1. Maximum value allowed in the event of a failure; also see the thermal derating curve in Figure 3.
2. The Si845x is tested with VDD1 = VDD2 = 5.5 V, TJ = 150 ºC, CL = 15 pF, input a 150 Mbps 50% duty cycle square
wave.
16
Rev. 1.5
Si8450/51/52/55
Table 11. Thermal Characteristics
Parameter
Typ
Symbol
IC Junction-to-Air Thermal Resistance
NB SOIC-16
105
JA
Unit
°C/W
430
400
VDD1, VDD2 = 2.70 V
360
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Safety-Limiting Current (mA)
500
VDD1, VDD2 = 3.6 V
300
215
200
VDD1, VDD2 = 5.5 V
100
0
0
50
100
Temperature (ºC)
150
200
Figure 3. (NB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per DIN EN 60747-5-2
Rev. 1.5
17
Si8450/51/52/55
2. Functional Description
2.1. Theory of Operation
The operation of an Si845x channel is analogous to that of an opto coupler, except an RF carrier is modulated
instead of light. This simple architecture provides a robust isolated data path and requires no special
considerations or initialization at start-up. A simplified block diagram for a single Si845x channel is shown in
Figure 4.
Transmitter
Receiver
A
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
RF
OSCILLATOR
MODULATOR
SemiconductorBased Isolation
Barrier
DEMODULATOR
B
Figure 4. Simplified Channel Diagram
A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier.
Referring to the Transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The
Receiver contains a demodulator that decodes the input state according to its RF energy content and applies the
result to output B via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it
provides best-in-class noise immunity, low power consumption, and better immunity to magnetic fields. See
Figure 5 for more details.
Input Signal
Modulation Signal
Output Signal
Figure 5. Modulation Scheme
18
Rev. 1.5
Si8450/51/52/55
2.2. Eye Diagram
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Figure 6 illustrates an eye-diagram taken on an Si8450. For the data source, the test used an Anritsu (MP1763C)
Pulse Pattern Generator set to 1000 ns/div. The output of the generator's clock and data from an Si8450 were
captured on an oscilloscope. The results illustrate that data integrity was maintained even at the high data rate of
150 Mbps. The results also show that 2 ns pulse width distortion and 250 ps peak jitter were exhibited.
Figure 6. Eye Diagram
Rev. 1.5
19
Si8450/51/52/55
2.3. Device Operation
Device behavior during start-up, normal operation, and shutdown is shown in Table 12. Table 13 provides an
overview of the output states when the Enable pins are active.
Table 12. Si845x Logic Operation Table
VI
EN
1,2,3,4
1,2
Input
Input
VDDI
State1,5,6
VDDO
State1,5,6
VO Output1,2
H or NC
P
P
H
L
H or NC
P
P
L
X7
L
P
P
Hi-Z or L8
H or NC
UP
P
L
L
UP
P
Hi-Z or L8
P
UP
X7
X7
X
7
Enabled, normal operation.
Disabled.
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
H
Comments
X
7
Upon transition of VDDI from unpowered to powered, VO returns to the same state as VI in less
than 1 µs.
Disabled.
Undetermined Upon transition of VDDO from unpowered to powered, VO returns to the same state as VI within
1 µs, if EN is in either the H or NC state. Upon transition of VDDO from unpowered to powered, VO
returns to Hi-Z within 1 µs if EN is L.
Notes:
1. VDDI and VDDO are the input and output power supplies. VI and VO are the respective input and output terminals. EN
is the enable control input located on the same output side.
2. X = not applicable; H = Logic High; L = Logic Low; Hi-Z = High Impedance.
3. It is recommended that the enable inputs be connected to an external logic high or low level when the Si845x is
operating in noisy environments.
4. No Connect (NC) replaces EN1 on Si8450. No Connects are not internally connected and can be left floating, tied to
VDD, or tied to GND.
5. “Powered” state (P) is defined as 2.70 V < VDD < 5.5 V.
6. “Unpowered” state (UP) is defined as VDD = 0 V.
7. Note that an I/O can power the die for a given side through an internal diode if its source has adequate current.
8. When using the enable pin (EN) function, the output pin state is driven to a logic low state when the EN pin is disabled
(EN = 0) in Revision A. Revision B outputs go into a high-impedance state when the EN pin is disabled (EN = 0). See
"3. Errata and Design Migration Guidelines" on page 26 for more details.
20
Rev. 1.5
Si8450/51/52/55
Table 13. Enable Input Truth Table1
P/N
Operation
EN11,2 EN21,2
Si8450
H
Outputs B1, B2, B3, B4, B5 are enabled and follow input state.
—
L
Outputs B1, B2, B3, B4, B5 are disabled and Logic Low or in high impedance
state.3
H
X
Output A5 enabled and follow input state.
L
X
Output A5 disabled and Logic Low or in high impedance state.3
X
H
Outputs B1, B2, B3, B4 are enabled and follow input state.
X
L
Outputs B1, B2, B3, B4 are disabled and Logic Low or in high impedance state.3
H
X
Outputs A4 and A5 are enabled and follow input state.
L
X
Outputs A4 and A5 are disabled and Logic Low or in high impedance state.3
X
H
Outputs B1, B2, B3 are enabled and follow input state.
X
L
Outputs B1, B2, B3 are disabled and Logic Low or in high impedance state.3
—
—
Outputs B1, B2, B3, B4, B5 are enabled and follow input state.
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8451
—
Si8452
Si8455
Notes:
1. Enable inputs EN1 and EN2 can be used for multiplexing, for clock sync, or other output control. These inputs are
internally pulled-up to local VDD by a 3 µA current source allowing them to be connected to an external logic level (high
or low) or left floating. To minimize noise coupling, do not connect circuit traces to EN1 or EN2 if they are left floating. If
EN1, EN2 are unused, it is recommended they be connected to an external logic level, especially if the Si845x is
operating in a noisy environment.
2. X = not applicable; H = Logic High; L = Logic Low.
3. When using the enable pin (EN) function, the output pin state is driven to a logic low state when the EN pin is disabled
(EN = 0) in Revision A. Revision B outputs go into a high-impedance state when the EN pin is disabled (EN = 0). See
"3. Errata and Design Migration Guidelines" on page 26 for more details.
Rev. 1.5
21
Si8450/51/52/55
2.4. Layout Recommendations
To ensure safety in the end user application, high voltage circuits (i.e., circuits with >30 VAC) must be physically
separated from the safety extra-low voltage circuits (SELV is a circuit with <30 VAC) by a certain distance
(creepage/clearance). If a component, such as a digital isolator, straddles this isolation barrier, it must meet those
creepage/clearance requirements and also provide a sufficiently large high-voltage breakdown protection rating
(commonly referred to as working voltage protection). Table 6 on page 15 and Table 7 on page 15 detail the
working voltage and creepage/clearance capabilities of the Si84xx. These tables also detail the component
standards (UL1577, IEC60747, CSA 5A), which are readily accepted by certification bodies to provide proof for
end-system specifications requirements. Refer to the end-system specification (61010-1, 60950-1, etc.)
requirements before starting any design that uses a digital isolator.
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
The following sections detail the recommended bypass and decoupling components necessary to ensure robust
overall performance and reliability for systems using the Si84xx digital isolators.
2.4.1. Supply Bypass
Digital integrated circuit components typically require 0.1 µF (100 nF) bypass capacitors when used in electrically
quiet environments. However, digital isolators are commonly used in hazardous environments with excessively
noisy power supplies. To counteract these harsh conditions, it is recommended that an additional 1 µF bypass
capacitor be added between VDD and GND on both sides of the package. The capacitors should be placed as
close as possible to the package to minimize stray inductance. If the system is excessively noisy, it is
recommended that the designer add 50 to 100  resistors in series with the VDD supply voltage source and 50 to
300  resistors in series with the digital inputs/outputs (see Figure 7). For more details, see "3. Errata and Design
Migration Guidelines" on page 26.
All components upstream or downstream of the isolator should be properly decoupled as well. If these components
are not properly decoupled, their supply noise can couple to the isolator inputs and outputs, potentially causing
damage if spikes exceed the maximum ratings of the isolator (6 V). In this case, the 50 to 300  resistors protect
the isolator's inputs/outputs (note that permanent device damage may occur if the absolute maximum ratings are
exceeded). Functional operation should be restricted to the conditions specified in Table 1, “Recommended
Operating Conditions,” on page 4.
2.4.2. Pin Connections
No connect pins are not internally connected. They can be left floating, tied to VDD, or tied to GND.
2.4.3. Output Pin Termination
The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination
of the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving
loads where transmission line effects will be a factor, output pins should be appropriately terminated with controlled
impedance PCB traces. The series termination resistor values should be scaled appropriately while keeping in
mind the recommendations described in “2.4.1. Supply Bypass” above.
V Source 1
R1 (50 – 100 )
V Source 2
R2 (50 – 100 )
VDD1
C1
VDD2
50 – 300 
0.1 F
A1
0.1 F
B1
C2
1 F
C4
50 – 300 
C3
Input/Output
Input/Output
1 F
Bx
Ax
50 – 300 
50 – 300 
GND1
GND2
Figure 7. Recommended Bypass Components for the Si84xx Digital Isolator Family
22
Rev. 1.5
Si8450/51/52/55
2.5. Typical Performance Characteristics
The typical performance characteristics depicted in the following diagrams are for information purposes only. Refer
to Tables 3, 4, and 5 for actual specification limits.
35
35
30
5V
25
20
Current (mA)
Current (mA)
30
3.3V
15
2.70V
10
5V
25
3.3V
20
15
2.70V
10
5
5
0
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
0
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Figure 11. Si8450/55 Typical VDD2 Supply
Current vs. Data Rate 5, 3.3, and 2.70 V
Operation (15 pF Load)
Figure 8. Si8450/55 Typical VDD1 Supply
Current vs. Data Rate 5, 3.3, and 2.70 V
Operation
35
35
Current (mA)
25
Current (mA)
30
30
5V
20
3.3V
15
10
25
20
15
10
5V
3.3V
2.70V
5
2.70V
5
0
0
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Figure 9. Si8451 Typical VDD1 Supply Current
vs. Data Rate 5, 3.3, and 2.70 V Operation
(15 pF Load)
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Data Rate (Mbps)
Data Rate (Mbps)
Figure 12. Si8451 Typical VDD2 Supply Current
vs. Data Rate 5, 3.3, and 2.70 V Operation
(15 pF Load)
35
35
25
Current (mA)
30
30
Current (mA)
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Data Rate (Mbps)
Data Rate (Mbps)
5V
20
15
3.3V
10
2.70V
5
25
20
5V
3.3V
15
2.70V
10
5
0
0
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Data Rate (Mbps)
Data Rate (Mbps)
Figure 10. Si8452 Typical VDD1 Supply Current
vs. Data Rate 5, 3.3, and 2.70 V Operation
(15 pF Load)
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Figure 13. Si8452 Typical VDD2 Supply Current
vs. Data Rate 5, 3.3, and 2.70 V Operation
(15 pF Load)
Rev. 1.5
23
Si8450/51/52/55
10
Falling Edge
Delay (ns)
9
8
7
Rising Edge
6
5
-40
-20
0
20
40
60
80
100
120
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Temperature (Degrees C)
Figure 14. Propagation Delay
vs. Temperature
24
Rev. 1.5
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8450/51/52/55
Figure 15. Si84xx Time-Dependent Dielectric Breakdown
Rev. 1.5
25
Si8450/51/52/55
3. Errata and Design Migration Guidelines
The following errata apply to Revision A devices only. See "6. Ordering Guide" on page 29 for more details. No
errata exist for Revision B devices.
3.1. Enable Pin Causes Outputs to Go Low (Revision A Only)
When using the enable pin (EN1, EN2) function on the 5-channel (Si8450/1/2) isolators, the corresponding output
pin states (pin = An, Bn, where n can be 1…5) are driven to a logic low (to ground) when the enable pin is disabled
(EN1 or EN2 = 0). This functionality is different from the legacy 3-channel (Si8430/1) and 4-channel (Si8440/1/2)
isolators. On those devices, the isolator outputs go into a high-impedance state (Hi-Z) when the enable pin is
disabled (EN1 = 0 or EN2 = 0).
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
3.1.1. Resolution
The enable pin functionality causing the outputs to go low is supported in production for Revision A of the Si845x
devices. Revision B corrects the enable pin functionality (i.e., the outputs will go into the high-impedance state to
match the legacy isolator products). Refer to the Ordering Guide sections of the data sheet(s) for more information.
3.2. Power Supply Bypass Capacitors (Revision A and Revision B)
When using the Si845x isolators with power supplies > 4.5 V, sufficient VDD bypass capacitors must be present on
both the VDD1 and VDD2 pins to ensure the VDD rise time is less than 0.5 V/µs (which is > 9 µs for a > 4.5 V
supply). Although rise time is power supply dependent, > 1 µF capacitors are required on both power supply pins
(VDD1, VDD2) of the isolator device.
3.2.1. Resolution
For recommendations on resolving this issue, see "2.4.1. Supply Bypass" on page 22. Additionally, refer to "6.
Ordering Guide" on page 29 for current ordering information.
3.3. Latch Up Immunity (Revision A Only)
Latch up immunity generally exceeds ± 200 mA per pin. Exceptions: Certain pins provide < 100 mA of latch-up
immunity. To increase latch-up immunity on these pins, 100  of equivalent resistance must be included in series
with all of the pins listed in Table 14. The 100  equivalent resistance can be comprised of the source driver's
output resistance and a series termination resistor.
3.3.1. Resolution
This issue has been corrected with Revision B of the device. Refer to the Ordering Guide for more information.
Table 14. Affected Ordering Part Numbers (Revision A Only)
Affected Ordering Part Numbers*
SI8450SV-A-IS/IS1, SI8451SV-A-IS/IS1,
SI8452SV-A-IS/IS1
SI8455SV-A-IS/IS1
Device
Revision
A
A
*Note: SV = Speed Grade/Isolation Rating (AA, AB, BA, BB).
26
Rev. 1.5
Pin#
Name
Pin Type
2
A1
Input
6
A5
Input or Output
10
EN2
Input
14
B2
Output
2
A1
Input
6
A5
Input
14
B2
Output
Si8450/51/52/55
4. Pin Descriptions (Si8450/51/52)
VDD1
VDD2
RF
XMITR
A1
A3
RF
XMITR
A4
RF
XMITR
A5
RF
XMITR
NC
GND1
RF
RCVR
B1
RF
RCVR
B2
RF
RCVR
B3
VDD2
A1
RF
XMITR
A2
RF
XMITR
A3
RF
XMITR
RF
RCVR
B4
A4
RF
XMITR
RF
RCVR
B5
A5
RF
RCVR
I
s
o
l
a
t
i
o
n
RF
RCVR
RF
RCVR
RF
RCVR
VDD1
B1
B2
B3
VDD2
A1
RF
XMITR
A2
RF
XMITR
A3
RF
XMITR
RF
RCVR
B4
A4
RF
RCVR
RF
XMITR
B5
A5
RF
RCVR
I
s
o
l
a
t
i
o
n
RF
RCVR
B1
RF
RCVR
B2
RF
RCVR
B3
RF
RF
XMITR
RCVR
B4
RF
XMITR
B5
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
A2
RF
XMITR
I
s
o
l
a
t
i
o
n
VDD1
EN2/NC
GND2
Si8450
EN2
EN1
GND1
Si8451
GND2
EN1
GND1
Name
SOIC-16 Pin#
Type
VDD1
1
Supply
A1
2
Digital Input
Side 1 digital input.
A2
3
Digital Input
Side 1 digital input.
A3
4
Digital Input
Side 1 digital input.
A4
5
Digital I/O
Side 1 digital input or output.
A5
6
Digital I/O
Side 1 digital input or output.
EN1/NC*
7
Digital Input
GND1
8
Ground
Side 1 ground.
GND2
9
Ground
Side 2 ground.
EN2
10
Digital Input
B5
11
Digital I/O
Side 2 digital input or output.
B4
12
Digital I/O
Side 2 digital input or output.
B3
13
Digital Output
Side 2 digital output.
B2
14
Digital Output
Side 2 digital output.
B1
15
Digital Output
Side 2 digital output.
VDD2
16
Supply
Side 2 power supply.
Si8452
EN2
GND2
Description
Side 1 power supply.
Side 1 active high enable. NC on Si8450.
Side 2 active high enable.
*Note: No Connect. These pins are not internally connected. They can be left floating, tied to VDD or tied to GND.
Rev. 1.5
27
Si8450/51/52/55
5. Pin Descriptions (Si8455)
VDD1
VDD2
GND1
RF
XMITR
A2
RF
XMITR
A3
RF
XMITR
A4
RF
XMITR
GND2
RF
RCVR
B1
RF
RCVR
B2
RF
RCVR
B3
RF
RCVR
B4
RF
RCVR
B5
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
A1
I
s
o
l
a
t
i
o
n
A5
RF
XMITR
GND1
Si8455
GND2
Name
SOIC-16 Pin#
Type
Description*
VDD1
1
Supply
Side 1 power supply.
GND1
2
Ground
Side 1 ground.
A1
3
Digital Input
Side 1 digital input.
A2
4
Digital Input
Side 1 digital input.
A3
5
Digital Input
Side 1 digital input.
A4
6
Digital Input
Side 1 digital input.
A5
7
Digital Input
Side 1 digital input.
GND1
8
Ground
Side 1 ground.
GND2
9
Ground
Side 2 ground.
B5
10
Digital Output
Side 2 digital output.
B4
11
Digital Output
Side 2 digital output.
B3
12
Digital Output
Side 2 digital output.
B2
13
Digital Output
Side 2 digital output.
B1
14
Digital Output
Side 2 digital output.
GND2
15
Ground
Side 2 ground.
VDD2
16
Supply
Side 2 power supply.
*Note: For narrow-body devices, Pin 2 and Pin 8 GND must be externally connected to respective ground. Pin 9 and Pin 15
must also be connected to external ground.
28
Rev. 1.5
Si8450/51/52/55
6. Ordering Guide
These devices are not recommended for new designs. Please see the Si865x data sheet for replacement options.
Table 15. Ordering Guide for Valid OPNs1
Ordering Part
Number
(OPN)
Alternative Part Number of
Number of
Number
Inputs VDD1 Inputs VDD2
(APN)
Side
Side
Maximum
Data Rate
(Mbps)
Isolation Package Type
Rating
Revision B Devices2
Si8650AB-B-IS1
5
0
1
Si8450BA-B-IS1
Si8650BB-B-IS1
5
0
150
Si8451AA-B-IS1
Si8651AB-B-IS1
4
1
1
Si8451BA-B-IS1
Si8651BB-B-IS1
4
1
150
Si8452AA-B-IS1
Si8652AB-B-IS1
3
2
1
Si8452BA-B-IS1
Si8652BB-B-IS1
3
2
150
Si8455BA-B-IS1
Si8655BB-B-IS1
5
0
150
Si8450AB-B-IS1
Si8650AB-B-IS1
5
0
1
Si8450BB-B-IS1
Si8650BB-B-IS1
5
0
150
Si8451AB-B-IS1
Si8651AB-B-IS1
4
1
1
Si8451BB-B-IS1
Si8651BB-B-IS1
4
1
150
Si8452AB-B-IS1
Si8652AB-B-IS1
3
2
1
Si8452BB-B-IS1
Si8652BB-B-IS1
3
2
150
Si8455BB-B-IS1
Si8655BB-B-IS1
5
0
150
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8450AA-B-IS1
1 kVrms
NB SOIC-16
2.5 kVrms
NB SOIC-16
Notes:
1. All packages are RoHS-compliant. Moisture sensitivity level is MSL2A with peak reflow temperature of 260 °C
according to the JEDEC industry standard classifications and peak solder temperature.
2. Revision A and Revision B devices are supported for existing designs.
Rev. 1.5
29
Si8450/51/52/55
Table 15. Ordering Guide for Valid OPNs1 (Continued)
Ordering Part
Number
(OPN)
Alternative Part Number of
Number of
Number
Inputs VDD1 Inputs VDD2
(APN)
Side
Side
Maximum
Data Rate
(Mbps)
Isolation Package Type
Rating
Revision A Devices2
Si8650AB-B-IS1
5
0
1
Si8450BA-A-IS1
Si8650BB-B-IS1
5
0
150
Si8451AA-A-IS1
Si8651AB-B-IS1
4
1
1
Si8451BA-A-IS1
Si8651BB-B-IS1
4
1
150
1 kVrms
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Si8450AA-A-IS1
Si8452AA-A-IS1
Si8652AB-B-IS1
3
2
1
Si8452BA-A-IS1
Si8652BB-B-IS1
3
2
150
Si8455BA-A-IS1
Si8655BB-B-IS1
5
0
150
Si8450AB-A-IS1
Si8650AB-B-IS1
5
0
1
Si8450BB-A-IS1
Si8650BB-B-IS1
5
0
150
Si8451AB-A-IS1
Si8651AB-B-IS1
4
1
1
Si8451BB-A-IS1
Si8651BB-B-IS1
4
1
150
Si8452AB-A-IS1
Si8652AB-B-IS1
3
2
1
Si8452BB-A-IS1
Si8652BB-B-IS1
3
2
150
Si8455BB-A-IS1
Si8655BB-B-IS1
5
0
150
2.5 kVrms
NB SOIC-16
NB SOIC-16
Notes:
1. All packages are RoHS-compliant. Moisture sensitivity level is MSL2A with peak reflow temperature of 260 °C
according to the JEDEC industry standard classifications and peak solder temperature.
2. Revision A and Revision B devices are supported for existing designs.
30
Rev. 1.5
Si8450/51/52/55
7. Package Outline: 16-Pin Narrow Body SOIC
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Figure 16 illustrates the package details for the Si845x in a 16-pin narrow-body SOIC (SO-16). Table 16 lists the
values for the dimensions shown in the illustration.
Figure 16. 16-pin Small Outline Integrated Circuit (SOIC) Package
Table 16. Package Diagram Dimensions
Dimension
Min
Max
A
—
1.75
A1
0.10
0.25
A2
1.25
—
b
0.31
0.51
c
0.17
0.25
D
9.90 BSC
E
6.00 BSC
E1
3.90 BSC
e
1.27 BSC
L
0.40
L2
1.27
0.25 BSC
Rev. 1.5
31
Si8450/51/52/55
Table 16. Package Diagram Dimensions (Continued)
Dimension
Min
Max
h
0.25
0.50
θ
0°
8°
0.10
bbb
0.20
ccc
0.10
ddd
0.25
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
aaa
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MS-012,
Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
32
Rev. 1.5
Si8450/51/52/55
8. Land Pattern: 16-Pin Narrow Body SOIC
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
Figure 17 illustrates the recommended land pattern details for the Si845x in a 16-pin narrow-body SOIC. Table 17
lists the values for the dimensions shown in the illustration.
Figure 17. 16-Pin Narrow Body SOIC PCB Land Pattern
Table 17. 16-Pin Narrow Body SOIC Land Pattern Dimensions
Dimension
Feature
(mm)
C1
Pad Column Spacing
5.40
E
Pad Row Pitch
1.27
X1
Pad Width
0.60
Y1
Pad Length
1.55
Notes:
1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X165-16N
for Density Level B (Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card
fabrication tolerance of 0.05 mm is assumed.
Rev. 1.5
33
Si8450/51/52/55
9. Top Marking: 16-Pin Narrow Body SOIC
9.1. 16-Pin Narrow Body SOIC Top Marking
e3
Si84XYSV
YYWWTTTTTT
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d
9.2. Top Marking Explanation
Table 18. 16-Pin Narrow Body SOIC Top Marking Table
Line 1 Marking:
Line 2 Marking:
Base Part Number
Ordering Options
(See Ordering Guide for more
information).
Si84 = Isolator product series
XY = Channel Configuration
X = # of data channels (5, 4, 3, 2, 1)
Y = # of reverse channels (2, 1, 0)*
S = Speed Grade
A = 1 Mbps; B = 150 Mbps
V = Insulation rating
A =1 kV; B =2.5 kV
Circle = 1.2 mm Diameter
“e3” Pb-Free Symbol
YY = Year
WW = Work Week
Assigned by the Assembly House. Corresponds to the
year and work week of the mold date.
TTTTTT = Mfg code
Manufacturing Code from Assembly Purchase Order
form.
Circle = 1.2 mm diameter
“e3” Pb-Free Symbol.
*Note: Si8455 has 0 reverse channels.
34
Rev. 1.5
Si8450/51/52/55
DOCUMENT CHANGE LIST
Revision 1.3 to Revision 1.4
Revision 0.1 to Revision 0.2

Updated all specs to reflect latest silicon.
Added "3. Errata and Design Migration Guidelines"
on page 26.
 Added "9. Top Marking: 16-Pin Narrow Body SOIC"
on page 34.


Revision 0.2 to Revision 1.0
Updated document to reflect availability of Revision
B silicon.
 Updated Tables 3,4, and 5.




Revision 1.4 to Revision 1.5

Updated "6. Ordering Guide" on page 29 to include
new title note and “ Alternative Part Number (APN)”
column.
N
ot
fo R
r N ec
e w om
m
D e
e s nd
ig e
ns d

Removed wide-body SOIC-16 package information
and references throughout document.
 Updated "2.4.1. Supply Bypass" on page 22.
 Added Figure 7, “Recommended Bypass
Components for the Si84xx Digital Isolator Family,”
on page 22.
 Updated "3.2. Power Supply Bypass Capacitors
(Revision A and Revision B)" on page 26.
Updated
all supply currents and channel-channel skew.
Updated
absolute maximum supply voltage.
Updated
clearance and creepage dimensions.
Updated
Note 7.
Updated
Note 3.
Updated Table 2.
Updated Table 7.
Updated Table 12.
Updated Table 13.
Updated "3. Errata and Design Migration Guidelines"
on page 26.
 Updated "6. Ordering Guide" on page 29.

Revision 1.0 to Revision 1.1

Updated Tables 3, 4, and 5.
Updated
notes in both tables to reflect output
impedance of 85 .
Updated rise and fall time specifications.
Updated CMTI value.
Revision 1.1 to Revision 1.2
Updated document throughout to include MSL
improvements to MSL2A.
 Updated "6. Ordering Guide" on page 29.

Updated
Note 1 in ordering guide table to reflect
improvement and compliance to MSL2A moisture
sensitivity level.
Revision 1.2 to Revision 1.3
Updated " Features" on page 1.
Moved Tables 1 and 2 to page 4.
 Updated Tables 6, 7, 8, and 9.
 Updated Table 12 footnotes.
 Added Figure 15, “Si84xx Time-Dependent
Dielectric Breakdown,” on page 25.


Rev. 1.5
35
Smart.
Connected.
Energy-Friendly
Products
Quality
www.silabs.com/products
www.silabs.com/quality
Support and Community
community.silabs.com
Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific
written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected
to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations
thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®,
USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of
ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
USA
http://www.silabs.com